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Digital Integrated Circuit (IC)
»óǰÄÚµå : 1534001
¸®¼­Ä¡»ç : Global Industry Analysts, Inc.
¹ßÇàÀÏ : 2024³â 08¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 250 Pages
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Global Digital Integrated Circuit (IC) Market to Reach US$415.4 Billion by 2030

The global market for Digital Integrated Circuit (IC) estimated at US$267.8 Billion in the year 2023, is expected to reach US$415.4 Billion by 2030, growing at a CAGR of 6.5% over the analysis period 2023-2030. Logic Integrated Circuits, one of the segments analyzed in the report, is expected to record a 7.7% CAGR and reach US$222.0 Billion by the end of the analysis period. Growth in the Memory Chips segment is estimated at 4.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$73.0 Billion While China is Forecast to Grow at 10.6% CAGR

The Digital Integrated Circuit (IC) market in the U.S. is estimated at US$73.0 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$91.1 Billion by the year 2030 trailing a CAGR of 10.6% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.7% and 6.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.1% CAGR.

Global Digital Integrated Circuit (IC) Market - Key Trends and Drivers Summarized

Digital Integrated Circuits (ICs) are fundamental components in modern electronic devices, playing a critical role in the processing, storage, and transmission of digital information. These circuits are composed of numerous transistors, resistors, and capacitors, all miniaturized and integrated onto a single silicon chip. The primary function of digital ICs is to perform logical operations and data processing tasks, which are essential for the operation of computers, smartphones, digital cameras, and various other digital devices. Over the years, advancements in semiconductor technology have led to significant improvements in the performance, power efficiency, and miniaturization of digital ICs, enabling the development of more powerful and compact electronic devices.

Recent trends in digital IC technology have been driven by the demand for higher processing power and efficiency, spurred by the increasing complexity of applications in areas such as artificial intelligence, machine learning, and the Internet of Things (IoT). The transition to smaller process nodes, such as 7nm and 5nm technology, has allowed for more transistors to be packed into a single chip, enhancing performance while reducing power consumption. Additionally, the development of new materials and manufacturing techniques, such as FinFET and gate-all-around (GAA) transistors, has further pushed the boundaries of what is possible with digital ICs. These advancements are critical in meeting the needs of next-generation applications that require rapid data processing and low power consumption.

The growth in the digital IC market is driven by several factors, including the rapid expansion of consumer electronics, the proliferation of connected devices, and the increasing adoption of advanced technologies in various industries. The demand for more powerful and energy-efficient chips is propelled by the continuous evolution of smartphones, tablets, and other portable devices that require robust performance and longer battery life. The rise of IoT devices, which integrate digital ICs for connectivity and data processing, is expanding the market's addressable base. Additionally, the automotive industry's shift towards advanced driver-assistance systems (ADAS) and autonomous vehicles is generating significant demand for high-performance digital ICs. The growing implementation of AI and machine learning in sectors such as healthcare, finance, and manufacturing is also driving the need for specialized digital ICs that can handle complex computations efficiently. As these trends continue, the digital IC market is expected to experience robust growth, fueled by ongoing technological innovations and increasing integration into a wide range of applications.

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TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

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