IGBT용 Pin Fin 히트싱크 시장 규모는 2023년 25억 달러로 평가되며 2024년부터 2030년까지 연평균 복합 성장률(CAGR) 5.3%로 성장하여 2030년에는 61억 7,000만 달러에 달할 것으로 예측되고 있습니다. 모듈은 최근 현저하게 고도화·강력화하고 있습니다.이러한 모듈에는 전력을 필요로 하는 전자 부품이 대량으로 탑재되고 있어, 과열에 의한 손상이나 파괴를 막기 위해서 고성능의 히트 싱크가 필요합니다. 이것은 시장의 성장을 가속합니다.
세계의 IGBT용 Pin Fin 히트 싱크 시장 보고서는 시장의 전반적인 평가를 제공합니다.
IGBT용 Pin Fin 히트싱크 세계 시장 정의
핀 핀 히트 싱크는 평평한 베이스에 둥근 핀이 내장되어 있습니다. 에 효과적으로 되도록 기하학적으로 설계되고 구조화되어 있습니다. 다양한 대기 속도 환경에 적합한 핀 밀도가 있습니다. 히트싱크는 구리 또는 알루미늄의 단단한 블록으로 열전도가 가능한 표면적을 넓히는 핀이 반복적으로 붙어 있습니다. 소형 반도체에서 대형 파워 디바이스에 이르기까지 다양한 용도와 디바이스에 대응하는 다양한 크기가 있습니다.
IGBT용 Pin Fin 히트싱크 세계 시장 개요
적절한 방열 방법에 의한 소비자용 전자기기의 효과적인 냉각에 대한 요구 증가, 인구 증가 및 디지털화에 의한 대전력 공급에 대한 수요 증가가 세계의 Pin Fin 히트 싱크 IGBT 시장의 성장을 가속하는 주요 요인이 되었습니다 게다가 다른 유형의 히트싱크에 비해 체적 효율이 높고 저렴한 비용과 같은 여러 장점이 있기 때문입니다. Pin Fin 히트싱크 수요가 증가하고 있는 것도 IGBT용 Pin Fin 히트싱크 시장의 성장을 가속할 것으로 예상됩니다. 심지어 세계의 Pin Fin 히트싱크 IGBT 시장의 성장을 뒷받침할 것으로 기대됩니다.
시장 전체의 성장을 방해하는 특정 한계와 장벽이 있습니다.에서 IGBT 모듈의 사용 증가, 신흥 시장에서 미개척의 가능성은 유익한 성장 기회를 제공합니다.
Pin Fin Heat Sink For IGBT Market size was valued at USD 2.5 Billion in 2023 and is projected to reach USD 6.17 Billion by 2030 , growing at a CAGR of 5.3% from 2024 to 2030. The increasing trend of electric mobility, home remodeling, and kitchen updates is boosting the Pin Fin Heat Sink For IGBT Market. IGBT-based power modules have become significantly more advanced and powerful in recent times. These modules contain large arrays of power-hungry electronic components that require high-performance heat sinks to prevent them from overheating and being damaged or destroyed. This will foster market growth.
The Global Pin Fin Heat Sink For IGBT Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.
Global Pin Fin Heat Sink For IGBT Market Definition
Pin Fin Heat Sink is comprised of a flat base with a scale of round pins that are implanted into the base. It is a rectangular-shaped piece of metal that rises from a metal base, the fins are situated perpendicular to the metal base, but are parallel to one another. These heat sinks are designed and structured geometrically to make them highly effective. These are available in copper and aluminum material and comes in different pin densities, which are suitable for different airspeed environments. A heat sink is a solid block of copper or aluminum with recurring fins that expand the possible surface area for heat transfer. Pin fins concurrently increase both the heat transfer surface region and the heat transfer coefficient. These are available in different sizes with a wide array of applications and devices, ranging from miniature semiconductors to large power devices.
Our reports include actionable data and forward-looking analysis that help you craft pitches, create business plans, build presentations and write proposals.
Global Pin Fin Heat Sink For IGBT Market Overview
The increasing need for effective cooling of consumer electronics by proper heat dissipation method, supported by an escalation in demand for huge power supply due to growing population and digitization are some of the prime factors that drive the global pin fin heat sink IGBT market growth. Moreover, the rise in demand for pin fin heat sinks owing to its multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks is also expected to fuel the growth of pin fin heat sink for the IGBT market. Also, an increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sinks has positively anticipated in propelling the growth of the global pin fin heat sink IGBT market.
There are certain restrictions and barriers that will hinder the overall market growth. Factors such as low capacity utilization of pin fin heat sink manufacturers are limiting the market growth. Nevertheless, the advancements in technologies, the increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink, and untapped potential in emerging markets offer beneficial growth opportunities.
The Global Pin Fin Heat Sink For IGBT Market Segmented On The Basis Of Material Type, And Geography.
Based on Material Type, the market is bifurcated into Copper and Aluminium. The Aluminium segment holds the largest market share during the forecast period. The factors that can be attributed to the increasing need by electronic manufacturers owing to benefits such as high thermal performance and flexibility to fit into a variety of systems and designs are accelerating the demand for this segment.
Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis.