임베디드 보드, 모듈 및 시스템

Embedded Boards, Modules & Systems

US $ 10,950 ￦ 15,390,000

Web Access - PDF & Excel (Standard Team License 1-5 Users)

US $ 13,688 ￦ 19,238,000

Web Access - PDF & Excel (Corporate License)

한글목차

임베디드 하드웨어 시장은 제품 폼 팩터, 고객 프로파일, 최종 사용자 산업/용도 및 경쟁 구도의 구성에서 고도로 세분화되어 있습니다. OEM/ODM, 시스템 통합자, 서비스 제공업체, 기업/산업 최종 사용자 자체를 포함한 엔지니어링 조직은 제품 개발에 사용되는 임베디드 하드웨어 플랫폼에 대해 서로 다른 요구사항과 선호도를 가지고 있습니다.

본 보고서에서는 컴퓨터 온 모듈, 시스템 온 모듈, 마더보드, 싱글 보드 컴퓨터, 통합 컴퓨팅 시스템, 서버 등 다양한 임베디드 구성 요소 및 시스템 시장을 조사했으며, 경쟁 요인 및 수익 기회에 영향을 미치는 주요 시장 동향을 분석했습니다. 이 보고서는 상용 임베디드 하드웨어 시장과 미래공급업체 생태계에 영향을 미치는 가장 큰 개발과 기업에 대한 조사 중심의 해설을 제공합니다. 이 보고서에는 조사 대상인 각 폼 팩터와 수직 시장별로 분할된 통합 컴퓨팅 시스템 및 서버 시장의 주요 공급업체의 시장 점유율 데이터, Voice of the Engineer 조사의 데이터가 첨부되어 있습니다.

조사 대상

• 임베디드 보드, 모듈, 통합 시스템, 임베디드/OEM 서버 시장 규모는?
• 임베디드 모듈, 마더보드, 싱글 보드 컴퓨터, 통합 시스템, 임베디드/OEM 서버 폼 팩터 다른 주요 공급업체는?
• 이 시장에서 주요 공급자의 주요 제품, 서비스, 차별화 요인은 무엇이며, 향후 5년간 점유율을 얻기 위해 가장 중요한 것은 무엇인가?
• 다양한 유형의 엔지니어링 조직이 다양한 내장 하드웨어 폼 팩터를 조달할 때 어떤 선택 기준이 가장 중요한가?

이 보고서의 기술 공급업체

주요 조사 결과

• 세계의 상용 임베디드 보드, 모듈, 시스템/서버 시장 규모는 2023년 360억 달러 이상으로 평가되었습니다.
• 모든 폼 팩터의 내장 하드웨어 시장은 특정의 타겟 시스템 유형이나 OT 용도의 개발 지원에 주력하는 소규모 공급자의 롱테일에 의해 고도로 단편화되고 있습니다.
• 소수의 기업이 여러 임베디드 하드웨어 시장의 폼 팩터로 리더십을 확립하고 있습니다 : Advantech, ADLINK, Kontron, Mercury Systems, Supermicro 등
• Dell Technologies, HPE, IBM, Lenovo, Supermicro 등 임베디드/OEM 시스템 및 서버의 선도적인 공급업체는 엔터프라이즈/HPC 영역에서 에지 컴퓨팅 솔루션으로 제품과 기술의 진보를 계속하고 있습니다.
• VDC의 Voice of the Engineer 조사 결과에 따르면 소프트웨어 지원/호환성, 제품 가용성, 네트워크 기능, 프로세스 기술의 중요성은 엔지니어링 커뮤니티나 폼 팩터에 따라 크게 다른 것으로 나타났습니다.

목차

이 보고서의 기술 공급업체

수요 측면 조사 : 개요

주요 요약

• 주요 조사 결과

세계 시장 개요

• 엣지 컴퓨팅이 하드웨어 수요를 폭넓게 촉진
• 용도의 최적화와 지원 강화
• 다양한 임베디드 업계에서 규제 확대
• 개발자 지원에 대한 기대 증가
• 워크로드 가속기가 추가 단편화를 촉진
• 실리콘 기술 공급자가 영향력을 확대
• 최근 M&A

경쟁 구도

• 임베디드 마더보드와 싱글 보드 컴퓨터
• 임베디드 컴퓨팅 모듈
• 임베디드 통합 컴퓨터 시스템 및 서버
• 공급업체 인사이트

최종 사용자 인사이트

• 프로세서 아키텍처에 따라 크게 달라지는 임베디드 보드와 모듈의 선택 기준
• 다양한 시스템 기준의 중요성에 큰 영향을 미치는 업계와 프로젝트 유형
• 많은 사람에게 선호되고 있는 표준 하드웨어 플랫폼

공급업체 프로파일

저자 정보

VDC Research 정보

KTH

영문 목차

영문목차

Inside this Report

The embedded hardware market is extremely fragmented in its composition of product form factors, customer profiles/demographics, end user industries/applications, and competitive landscape. Engineering organizations, including OEMs/ODMs, system integrators, service providers, and enterprise/industrial end users themselves, all have different requirements and preferences for embedded hardware platforms used for their product development. As a result, the embedded boards, modules, and integrated systems markets each feature distinct growth opportunities addressing the evolving nature of embedded and edge computing architectures as well as rosters of competing vendors vying for new designs and engineering projects.

This market research study examines the leading market trends impacting the total revenue opportunity as well as the competitive landscape for a wide variety of embedded component and system form factors, including computer- on-modules, system-on-modules, motherboards, single-board computers, integrated computing systems and servers, and others. This report delivers research-driven commentary on the biggest developments and players influencing the commercial embedded hardware market and its future supplier ecosystem. The report is accompanied by leading vendor market share data for each form factor under study and for the integrated computing systems and server market segmented by vertical market as well as Voice of the Engineer survey data.

What Questions are Addressed?

• How large is the total addressable market opportunity and outlook for merchant embedded boards, modules, integrated systems, and embedded/OEM servers?
• Who are the leading suppliers for different form factors of merchant embedded modules, motherboards, single-board computers, integrated systems, and embedded/OEM servers?
• What are the key product, service, and corporate differentiators of leading providers in the market and which will be most important for gaining share over the next five years?
• Which selection criteria are most important to engineering organizations of different types when sourcing different embedded hardware form factors?

Who Should Read this Report?

This report was written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing, or are a part of the ecosystem of, IoT, embedded, and/or edge computing solutions, including:

Technology Suppliers in this Report:

... and many others.

Demand-side Research Overview

VDC launches numerous surveys of the IoT and embedded engineering ecosystem every year using an online survey platform. Our global Voice of the Engineer survey in 2024 captured insights from a total of 600 qualified respondents. To support this research, VDC leverages its in-house panel of over 30,000 individuals from various roles and industries across the world. This survey was used to inform our insight into key trends, preferences, and predictions within the engineering community.

Executive Summary

The embedded hardware market is hotly contested with a variety of established players and new organizations joining the fray to diversify their businesses via access to a healthy marketspace that features strong long-term growth prospects. Edge computing, the Internet of Things (IoT), computer vision, operational AI, and machine learning will remain critical market growth drivers over the next several years, enabling highly valuable solution capabilities and services for end users in operational environments. Although embedded hardware deployment lifetimes remain protracted and still extend beyond a decade (or even a few decades) in some safety-/mission- critical applications, the pace of innovation in the market has accelerated on the back of rapid advancements in processor technology, edge AI models, workload optimization, and cloud-native software development. Engineering organizations of various origins, types, sizes, and target markets will continue to demand a wide range of hardware platforms and development solutions that no single vendor can completely satisfy on their own.

Competition in the embedded boards, modules, and integrated systems market is multi-dimensional, with several different technical and business elements separating the market leaders from the rest. From a technical perspective, embedded hardware providers continue to compete on core metrics such as performance, power consumption, size/weight/area, pre-certification, and price. However, new considerations related to dedicated workload performance, accelerator integration/support, embedded security, connectivity enablement, and a growing list of other factors are changing the status quo. On the business/strategic side, a trusted supply chain extending from embedded hardware inception to deployment is crucial for preserving the integrity of the final deployed systems or infrastructure. Many engineering organizations also require the tier 1 business services commonly associated with leading enterprise/IT technology suppliers that are also serving the embedded/OEM market.

The embedded hardware space and its competitive landscape are changing at an unprecedented rate in response to the rapid evolution of developer/engineer requirements, device/system stacks, and the associated large and growing revenue opportunity enabling IoT, embedded, and edge computing solutions.

Key Findings:

• The total addressable market for merchant embedded boards, modules, and system/servers worldwide amounted to more than $36B in 2023.
• The embedded hardware market for all form factors is highly fragmented with a long tail of smaller suppliers focused on supporting the development of specific target system types or OT applications.
• Only a few organizations have established leadership across multiple embedded hardware market form factors, such as Advantech, ADLINK, Kontron, Mercury Systems, and Supermicro.
• Several leading embedded/OEM system and server providers, such as Dell Technologies, HPE, IBM, Lenovo, and Supermicro, continue to bring product and technology advancements from the enterprise/HPC domains to their edge computing solutions.
• VDC's Voice of the Engineer survey results indicate that the importance of software support/compatibility, product availability, networking capabilities, and process technology vary considerably between different engineering communities and form factors.

Table of Contents

Technology Suppliers in this Report

Demand-side Research Overview

Executive Summary

• Key Findings

Global Market Overview

• Edge Computing Drives Widespread Hardware Demand
• Application Optimization and Support Gets Deeper
• Regulations are Expanding in Different Embedded Industries
• Expectations for Developer Support are Higher than Ever
• Workload Accelerators Drive Further Fragmentation
• Silicon Technology Providers are Expanding Their Influence
• Recent Acquisitions & Mergers

Competitive Landscape

• Embedded Motherboards & Single-board Computers
• Embedded Computing Modules
• Embedded Integrated Computer Systems & Servers
• Vendor Insights

End-user Insights

• Embedded Board & Modules Selection Criteria Vary Considerably by Processor Architecture
• Industry & Project Type Have a Major Impact on the Importance of Different Systems Criteria
• Standard Hardware Platforms are Preferred by Many

Vendor Profiles

About the Authors

About VDC Research

List of Report Exhibits*

• Exhibit 1: Global Market for Embedded Boards and Modules Segmented by Form Factor, 2023-2028 Exhibit 2 Global Market for Embedded Systems & Servers Segmented by Form Factor, 2023-2028
• Exhibit 3: Leading Embedded Motherboard Vendor Shares Segmented by Form Factor, 2023
• Exhibit 4: Leading Embedded Computing Module & Card Vendor Shares Segmented by Form Factor, 2023
• Exhibit 5: Leading Embedded Integrated Computer System & Server Vendor Shares Segmented by Vertical Market, 2023
• Exhibit 6: Most Important Selection Criteria for Embedded Computing Modules, Motherboards, and Single-board Computers Exhibit 7 Most Important Selection Criteria for Embedded Integrated Computer Systems & Servers
• Exhibit 8: Primary Configuration of the Embedded Systems/Subsystems Purchased/Sourced

List of Market Data Exhibits*

• Exhibit 1: Desktop Class Motherboards, Vendor Shares, Revenue, 2023 Exhibit 2 ITX Class Motherboards, Vendor Shares, Revenue, 2023
• Exhibit 3: Embedded/Stackable Class Motherboards, Vendor Shares, Revenue, 2023 Exhibit 4 Slot Single Board Computers & CPU Blades, Vendor Shares, Revenue, 2023 Exhibit 5 PC/104 Family Modules, Vendor Shares, Revenue, 2023
• Exhibit 6: Mezzanine Cards, Vendor Shares, Revenue, 2023
• Exhibit 7: Computer-on-Modules, Vendor Shares, Revenue, 2023 Exhibit 8 System-on-Modules, Vendor Shares, Revenue, 2023
• Exhibit 9: Embedded Integrated Computer Systems & Servers (EICSS), Vendor Shares, Revenue, 2023 Exhibit 10 EICSS in Aerospace & Defense, Vendor Shares, Revenue, 2023
• Exhibit 11: EICSS in Communications & Networking, Vendor Shares, Revenue, 2023 Exhibit 12 EICSS in Digital Security & Surveillance, Vendor Shares, Revenue, 2023 Exhibit 13 EICSS in Digital Signage, Vendor Shares, Revenue, 2023
• Exhibit 14: EICSS in Energy & Power, Vendor Shares, Revenue, 2023 Exhibit 15 EICSS in Gaming, Vendor Shares, Revenue, 2023
• Exhibit 16: EICSS in Industrial Automation & Control, Vendor Shares, Revenue, 2023 Exhibit 17 EICSS in Instrumentation, Vendor Shares, Revenue, 2023
• Exhibit 18: EICSS in Medical, Vendor Shares, Revenue, 2023 Exhibit 19 EICSS in Retail, Vendor Shares, Revenue, 2023
• Exhibit 20: EICSS in Transportation, Vendor Shares, Revenue, 2023

IoT & Embedded Engineering Survey*

• Exhibit 1: Primary Role Within Company/Organization Exhibit 2 Respondent's Organization's Primary Industry
• Exhibit 3: Total Number of Employees at Respondent's Organization Exhibit 4 Primary Region of Residence
• Exhibit 5: Primary Country of Residence
• Exhibit 6: Type of Most Current or Recent Project Exhibit 7 Involvement with Engineering
• Exhibit 8: Type of Purchase by Respondent's Organization Exhibit 9 Primary Industry Classification of Project
• Exhibit 10: Type of Aerospace & Defense Application for Most Recent Project Exhibit 11 Type of Automotive In-Vehicle Application for Most Recent Project
• Exhibit 12: Type of Communications & Networking Application for Most Recent Project Exhibit 13 Type of Consumer Electronics Application for Most Recent Project
• Exhibit 14: Type of Digital Security Application for Most Recent Project

* Partial list of the 416 IoT & Embedded Technology Voice of the Engineer Survey Exhibits.

관련자료