[시장보고서]고밀도 배선 기판(HDI PCB) 시장 : 세계 산업 규모, 점유율, 동향, 기회, 예측 - 배선 층수별(1층 HDI, 2층 이상 HDI, 전층 HDI), 용도별, 지역별, 경쟁별(2020-2030년)

고밀도 배선 기판(HDI PCB) 시장 : 세계 산업 규모, 점유율, 동향, 기회, 예측 - 배선 층수별(1층 HDI, 2층 이상 HDI, 전층 HDI), 용도별, 지역별, 경쟁별(2020-2030년)

High Density Interconnect PCB Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Interconnection Layers (1 Layer HDI, 2 or more layers HDI, and All Layers HDI), By Application, By Region and Competition, 2020-2030F

상품코드 : 1881561

리서치사 : TechSci Research

발행일 : 2025년 11월

페이지 정보 : 영문 180 Pages

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한글목차

샘플 요청 목록에 추가

세계의 고밀도 배선 기판(HDI PCB) 시장은 2024년에 78억 2,000만 달러로 평가되었으며, 2030년까지 CAGR 17.92%로 성장하여 210억 2,000만 달러에 달할 것으로 예측됩니다.

고밀도 배선 기판(HDI PCB)은 기존 기판보다 단위 면적당 배선 밀도가 높고, 마이크로 비아, 더 미세한 선폭과 간격, 블라인드 비아 및 매립 비아 등의 특징을 가지고 있어 전기적 성능 향상과 소형화를 실현하는 인쇄회로기판입니다. 시장 성장은 주로 소형 및 경량 전자기기에 대한 수요 증가, 첨단 소비자 전자기기의 보급, 자율주행 및 첨단 운전자 보조 시스템(ADAS)을 위한 자동차 분야의 첨단 시스템 통합 확대에 의해 주도되고 있습니다.

시장 개요
예측 기간	2026-2030년
시장 규모 : 2024년	78억 2,000만 달러
시장 규모 : 2030년	210억 2,000만 달러
CAGR : 2025-2030년	17.92%
가장 빠르게 성장하는 부문	소비자 전자제품
최대 시장	아시아태평양

주요 시장 촉진요인

전 세계 고밀도 인터커넥트 인쇄회로기판(HDI PCB) 시장은 전자기기의 지속적인 소형화를 배경으로 크게 확대되고 있습니다. 소형, 경량, 고성능 전자기기에 대한 수요가 증가함에 따라 첨단 인쇄회로기판 솔루션이 요구되고 있습니다.

주요 시장 과제

고밀도 인터커넥트(HDI) 인쇄회로기판 고유의 제조상의 복잡성과 치솟는 생산 비용은 세계 시장 성장에 큰 장벽이 되고 있습니다. 마이크로 비아 및 미세 배선 기술 등 HDI 인쇄기판의 복잡한 설계 요건에는 특수 장비와 고정밀 공정이 필수적입니다.

주요 시장 동향

세계 고밀도 인터커넥트 인쇄회로기판 시장은 플렉서블 및 리지드 플렉스 HDI 폼팩터의 보급에 의해 크게 영향을 받고 있습니다. 이러한 추세는 리지드 기판과 플렉서블 기판을 하나의 상호연결 구조로 통합하여 소형, 경량, 고적응성을 갖춘 전자기기에 대한 진화하는 수요에 대응하기 위한 것입니다.

영문목차

The Global High Density Interconnect PCB Market, valued at USD 7.82 Billion in 2024, is projected to experience a CAGR of 17.92% to reach USD 21.02 Billion by 2030. High Density Interconnect (HDI) PCBs are printed circuit boards characterized by a higher wiring density per unit area than conventional boards, incorporating features such as microvias, finer lines and spaces, and blind or buried vias to achieve enhanced electrical performance and miniaturization. The market's growth is primarily driven by the escalating demand for compact and lightweight electronic devices, the proliferation of advanced consumer electronics, and the expanding integration of sophisticated systems in the automotive sector for autonomous driving and advanced driver-assistance systems.

Market Overview
Forecast Period	2026-2030
Market Size 2024	USD 7.82 Billion
Market Size 2030	USD 21.02 Billion
CAGR 2025-2030	17.92%
Fastest Growing Segment	Consumer Electronics
Largest Market	Asia Pacific

Key Market Drivers

The global High Density Interconnect PCB Market experiences significant expansion driven by the continuous miniaturization of electronic devices. Demand for compact, lighter, and higher-performing electronics necessitates advanced printed circuit board solutions. HDI technology directly facilitates this trend by enabling finer lines, smaller vias, and greater connection densities, crucial for integrating advanced functionalities within reduced device dimensions. For example, according to Apple's announcement, in June 2023, the company planned to introduce resin-coated copper materials in its iPhone models in 2024, replacing some copper-clad laminates, a strategic shift underscoring commitment to space-efficient designs.

Key Market Challenges

The inherent manufacturing complexity and elevated production costs associated with High Density Interconnect (HDI) PCBs present a significant impediment to the growth of the global market. The intricate design requirements for HDI PCBs, including microvias and fine line technology, necessitate specialized equipment and highly precise processes. This directly contributes to higher unit costs, which can constrain broader adoption in various cost-sensitive applications. For instance, establishing a single high-end HDI PCB production line requires an investment exceeding $7 million, according to Revista Espanola de Electronica in 2025.

Key Market Trends

The Global High Density Interconnect PCB Market is significantly influenced by the proliferation of flexible and rigid-flex HDI form factors. This trend addresses the evolving demand for compact, lightweight, and highly adaptable electronic devices by integrating rigid and flexible substrates into a single, interconnected structure. Such designs minimize the need for traditional connectors, consequently reducing overall assembly size, weight, and potential points of failure, while simultaneously enhancing signal integrity. These advantages are crucial for modern applications such as wearables, medical devices, and advanced automotive systems that require complex circuitry in constrained spaces.

Key Market Players

Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
Samsung Electronics Co., Ltd.
GlobalFoundries Inc.
United Microelectronics Corporation
Applied Materials, Inc.
Cadence Design Systems, Inc..
Synopsys, Inc.
Advanced Micro Devices Inc.
Lam Research Corporation

Report Scope:

In this report, the Global High Density Interconnect PCB Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

High Density Interconnect PCB Market, By Interconnection Layers:

1 Layer (1+N+1) HDI
2 or more layers (2+N+2) HDI
All Layers HD

High Density Interconnect PCB Market, By Application:

Consumer Electronics
Automotive
Military and Defense
Healthcare
Industrial/ Manufacturing
Others

High Density Interconnect PCB Market, By Region:

North America
- United States
- Canada
- Mexico
Europe
- France
- United Kingdom
- Italy
- Germany
- Spain
Asia Pacific
- China
- India
- Japan
- Australia
- South Korea
South America
- Brazil
- Argentina
- Colombia
Middle East & Africa
- South Africa
- Saudi Arabia
- UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global High Density Interconnect PCB Market.

Available Customizations:

Global High Density Interconnect PCB Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

1. Product Overview

1.1. Market Definition
1.2. Scope of the Market
- 1.2.1. Markets Covered
- 1.2.2. Years Considered for Study
- 1.2.3. Key Market Segmentations

2. Research Methodology

2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations

3. Executive Summary

3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global High Density Interconnect PCB Market Outlook

5.1. Market Size & Forecast
- 5.1.1. By Value
5.2. Market Share & Forecast
- 5.2.1. By Interconnection Layers (1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, All Layers HD)
- 5.2.2. By Application (Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, Others)
- 5.2.3. By Region
- 5.2.4. By Company (2024)
5.3. Market Map

6. North America High Density Interconnect PCB Market Outlook

6.1. Market Size & Forecast
- 6.1.1. By Value
6.2. Market Share & Forecast
- 6.2.1. By Interconnection Layers
- 6.2.2. By Application
- 6.2.3. By Country
6.3. North America: Country Analysis
- 6.3.1. United States High Density Interconnect PCB Market Outlook
  - 6.3.1.1. Market Size & Forecast
    - 6.3.1.1.1. By Value
  - 6.3.1.2. Market Share & Forecast
    - 6.3.1.2.1. By Interconnection Layers
    - 6.3.1.2.2. By Application
- 6.3.2. Canada High Density Interconnect PCB Market Outlook
  - 6.3.2.1. Market Size & Forecast
    - 6.3.2.1.1. By Value
  - 6.3.2.2. Market Share & Forecast
    - 6.3.2.2.1. By Interconnection Layers
    - 6.3.2.2.2. By Application
- 6.3.3. Mexico High Density Interconnect PCB Market Outlook
  - 6.3.3.1. Market Size & Forecast
    - 6.3.3.1.1. By Value
  - 6.3.3.2. Market Share & Forecast
    - 6.3.3.2.1. By Interconnection Layers
    - 6.3.3.2.2. By Application

7. Europe High Density Interconnect PCB Market Outlook

7.1. Market Size & Forecast
- 7.1.1. By Value
7.2. Market Share & Forecast
- 7.2.1. By Interconnection Layers
- 7.2.2. By Application
- 7.2.3. By Country
7.3. Europe: Country Analysis
- 7.3.1. Germany High Density Interconnect PCB Market Outlook
  - 7.3.1.1. Market Size & Forecast
    - 7.3.1.1.1. By Value
  - 7.3.1.2. Market Share & Forecast
    - 7.3.1.2.1. By Interconnection Layers
    - 7.3.1.2.2. By Application
- 7.3.2. France High Density Interconnect PCB Market Outlook
  - 7.3.2.1. Market Size & Forecast
    - 7.3.2.1.1. By Value
  - 7.3.2.2. Market Share & Forecast
    - 7.3.2.2.1. By Interconnection Layers
    - 7.3.2.2.2. By Application
- 7.3.3. United Kingdom High Density Interconnect PCB Market Outlook
  - 7.3.3.1. Market Size & Forecast
    - 7.3.3.1.1. By Value
  - 7.3.3.2. Market Share & Forecast
    - 7.3.3.2.1. By Interconnection Layers
    - 7.3.3.2.2. By Application
- 7.3.4. Italy High Density Interconnect PCB Market Outlook
  - 7.3.4.1. Market Size & Forecast
    - 7.3.4.1.1. By Value
  - 7.3.4.2. Market Share & Forecast
    - 7.3.4.2.1. By Interconnection Layers
    - 7.3.4.2.2. By Application
- 7.3.5. Spain High Density Interconnect PCB Market Outlook
  - 7.3.5.1. Market Size & Forecast
    - 7.3.5.1.1. By Value
  - 7.3.5.2. Market Share & Forecast
    - 7.3.5.2.1. By Interconnection Layers
    - 7.3.5.2.2. By Application

8. Asia Pacific High Density Interconnect PCB Market Outlook

8.1. Market Size & Forecast
- 8.1.1. By Value
8.2. Market Share & Forecast
- 8.2.1. By Interconnection Layers
- 8.2.2. By Application
- 8.2.3. By Country
8.3. Asia Pacific: Country Analysis
- 8.3.1. China High Density Interconnect PCB Market Outlook
  - 8.3.1.1. Market Size & Forecast
    - 8.3.1.1.1. By Value
  - 8.3.1.2. Market Share & Forecast
    - 8.3.1.2.1. By Interconnection Layers
    - 8.3.1.2.2. By Application
- 8.3.2. India High Density Interconnect PCB Market Outlook
  - 8.3.2.1. Market Size & Forecast
    - 8.3.2.1.1. By Value
  - 8.3.2.2. Market Share & Forecast
    - 8.3.2.2.1. By Interconnection Layers
    - 8.3.2.2.2. By Application
- 8.3.3. Japan High Density Interconnect PCB Market Outlook
  - 8.3.3.1. Market Size & Forecast
    - 8.3.3.1.1. By Value
  - 8.3.3.2. Market Share & Forecast
    - 8.3.3.2.1. By Interconnection Layers
    - 8.3.3.2.2. By Application
- 8.3.4. South Korea High Density Interconnect PCB Market Outlook
  - 8.3.4.1. Market Size & Forecast
    - 8.3.4.1.1. By Value
  - 8.3.4.2. Market Share & Forecast
    - 8.3.4.2.1. By Interconnection Layers
    - 8.3.4.2.2. By Application
- 8.3.5. Australia High Density Interconnect PCB Market Outlook
  - 8.3.5.1. Market Size & Forecast
    - 8.3.5.1.1. By Value
  - 8.3.5.2. Market Share & Forecast
    - 8.3.5.2.1. By Interconnection Layers
    - 8.3.5.2.2. By Application

9. Middle East & Africa High Density Interconnect PCB Market Outlook

9.1. Market Size & Forecast
- 9.1.1. By Value
9.2. Market Share & Forecast
- 9.2.1. By Interconnection Layers
- 9.2.2. By Application
- 9.2.3. By Country
9.3. Middle East & Africa: Country Analysis
- 9.3.1. Saudi Arabia High Density Interconnect PCB Market Outlook
  - 9.3.1.1. Market Size & Forecast
    - 9.3.1.1.1. By Value
  - 9.3.1.2. Market Share & Forecast
    - 9.3.1.2.1. By Interconnection Layers
    - 9.3.1.2.2. By Application
- 9.3.2. UAE High Density Interconnect PCB Market Outlook
  - 9.3.2.1. Market Size & Forecast
    - 9.3.2.1.1. By Value
  - 9.3.2.2. Market Share & Forecast
    - 9.3.2.2.1. By Interconnection Layers
    - 9.3.2.2.2. By Application
- 9.3.3. South Africa High Density Interconnect PCB Market Outlook
  - 9.3.3.1. Market Size & Forecast
    - 9.3.3.1.1. By Value
  - 9.3.3.2. Market Share & Forecast
    - 9.3.3.2.1. By Interconnection Layers
    - 9.3.3.2.2. By Application

10. South America High Density Interconnect PCB Market Outlook

10.1. Market Size & Forecast
- 10.1.1. By Value
10.2. Market Share & Forecast
- 10.2.1. By Interconnection Layers
- 10.2.2. By Application
- 10.2.3. By Country
10.3. South America: Country Analysis
- 10.3.1. Brazil High Density Interconnect PCB Market Outlook
  - 10.3.1.1. Market Size & Forecast
    - 10.3.1.1.1. By Value
  - 10.3.1.2. Market Share & Forecast
    - 10.3.1.2.1. By Interconnection Layers
    - 10.3.1.2.2. By Application
- 10.3.2. Colombia High Density Interconnect PCB Market Outlook
  - 10.3.2.1. Market Size & Forecast
    - 10.3.2.1.1. By Value
  - 10.3.2.2. Market Share & Forecast
    - 10.3.2.2.1. By Interconnection Layers
    - 10.3.2.2.2. By Application
- 10.3.3. Argentina High Density Interconnect PCB Market Outlook
  - 10.3.3.1. Market Size & Forecast
    - 10.3.3.1.1. By Value
  - 10.3.3.2. Market Share & Forecast
    - 10.3.3.2.1. By Interconnection Layers
    - 10.3.3.2.2. By Application

11. Market Dynamics

11.1. Drivers
11.2. Challenges

12. Market Trends & Developments

12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments

13. Global High Density Interconnect PCB Market: SWOT Analysis

14. Porter's Five Forces Analysis

14.1. Competition in the Industry
14.2. Potential of New Entrants
14.3. Power of Suppliers
14.4. Power of Customers
14.5. Threat of Substitute Products

15. Competitive Landscape

15.1. Taiwan Semiconductor Manufacturing Company Limited
- 15.1.1. Business Overview
- 15.1.2. Products & Services
- 15.1.3. Recent Developments
- 15.1.4. Key Personnel
- 15.1.5. SWOT Analysis
15.2. Intel Corporation
15.3. Samsung Electronics Co., Ltd.
15.4. GlobalFoundries Inc.
15.5. United Microelectronics Corporation
15.6. Applied Materials, Inc.
15.7. Cadence Design Systems, Inc..
15.8. Synopsys, Inc.
15.9. Advanced Micro Devices Inc.
15.10. Lam Research Corporation

한글목차

주요 시장 촉진요인

주요 시장 과제

주요 시장 동향

목차

제1장 개요

제2장 조사 방법

제3장 주요 요약

제4장 고객의 소리

제5장 세계의 고밀도 배선 기판(HDI PCB) 시장 전망

제6장 북미의 고밀도 배선 기판(HDI PCB) 시장 전망

제7장 유럽의 고밀도 배선 기판(HDI PCB) 시장 전망

제8장 아시아태평양의 고밀도 배선 기판(HDI PCB) 시장 전망

제9장 중동 및 아프리카의 고밀도 배선 기판(HDI PCB) 시장 전망

제10장 남미의 고밀도 배선 기판(HDI PCB) 시장 전망

제11장 시장 역학

제12장 시장 동향과 발전

제13장 세계의 고밀도 배선 기판(HDI PCB) 시장 : SWOT 분석

제14장 Porter's Five Forces 분석

제15장 경쟁 구도

제16장 전략적 제안

제17장 조사 회사 소개 및 면책사항