세계의 열전도성 필러 분산제 시장 : 산업 규모, 점유율, 동향, 기회, 예측 - 분산제 구조 유형별, 필러 재료별, 최종 용도별, 지역별, 경쟁 구도(2020-2030년)
Thermally Conductive Filler Dispersants Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Dispersant Structure Type, By Filler Material, By End Use, By Region and Competition, 2020-2030F
상품코드:1796943
리서치사:TechSci Research
발행일:2025년 08월
페이지 정보:영문 183 Pages
라이선스 & 가격 (부가세 별도)
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
한글목차
세계의 열전도성 필러 분산제 시장은 2024년에 2억 8,916만 달러로 평가되었고, 예측 기간 중 CAGR 6.96%로 성장할 전망이며, 2030년에는 4억 2,816만 달러에 이를 것으로 예측되고 있습니다.
열전도성 필러 분산제는 일반적으로 필러 분산제 또는 열 필러 분산제로 알려져 있으며 다양한 재료의 열전도성을 높이기 위해 다양한 산업에서 사용되는 중요한 첨가제입니다. 이러한 재료에는 폴리머, 접착제, 수지, 다양한 복합재료가 포함됩니다. 이러한 첨가제의 주요 기능은 금속 입자 및 세라믹을 포함한 열전도성 필러의 매트릭스 재료 내에서 균일한 분산을 촉진하는 것입니다. 이 필러의 균일한 분산은 재료의 열전도성을 전반적으로 향상시켜 효율적인 열 전달을 가능하게 합니다.
시장 개요
예측 기간
2026-2030년
시장 규모(2024년)
2억 8,916만 달러
시장 규모(2030년)
4억 2,816만 달러
CAGR(2025-2030년)
6.96%
급성장 부문
탄소 베이스
최대 시장
북미
시장 성장 촉진요인
전자 산업에서 열전도성 필러 분산제 수요 증가
주요 시장 과제
전자 제품의 열 수요 증가 및 나노 기술의 복잡성
주요 시장 동향
전자 냉각 수요 증가
목차
제1장 개요
제2장 분석 방법
제3장 주요 요약
제4장 COVID-19가 세계의 열전도성 필러 분산제 시장에 미치는 영향
제5장 고객의 목소리
제6장 세계의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
금액 기준
시장 점유율 및 예측
분산제 구조 유형별(실리콘계, 비실리콘계)
필러 재료별(세라믹, 금속, 탄소계)
용도별(전자기기, 자동차, 에너지, 공업, 건축 및 건설, 기타)
지역별
기업별(2024년)
시장 맵
제7장 아시아태평양의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
시장 점유율 및 예측
아시아태평양 : 국가별 분석
중국
인도
호주
일본
한국
제8장 유럽의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
시장 점유율 및 예측
유럽 : 국가별 분석
프랑스
독일
스페인
이탈리아
영국
제9장 북미의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
시장 점유율 및 예측
북미 : 국가별 분석
미국
멕시코
캐나다
제10장 남미의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
시장 점유율 및 예측
남미 : 국가별 분석
브라질
아르헨티나
콜롬비아
제11장 중동 및 아프리카의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
시장 점유율 및 예측
중동 및 아프리카 : 국가별 분석
남아프리카
사우디아라비아
UAE의 열전도성 필러 분산제 시장 전망
시장 규모 및 예측
금액 기준
시장 점유율 및 예측
분산제 구조 유형별
최종 용도별
필러 재료별
제12장 시장 역학
성장 촉진요인
과제
제13장 시장 동향 및 발전
최근 동향
제품 출시
기업 합병 및 인수(M&A)
제14장 세계의 열전도성 필러 분산제 시장 : SWOT 분석
제15장 Porter's Five Forces 분석
업계 내 경쟁
신규 진입의 가능성
공급자의 힘
고객의 힘
대체품의 위협
제16장 경쟁 구도
BYK-Chemie GmbH
Shin-Etsu Chemical Co., Ltd.
Dow Inc.
JNC Corporation
Momentive Performance Materials, Inc.
Kusumoto Chemicals, Ltd.
Evonik Industries AG
Croda International plc
Lubrizol Corporation
Wacker Chemie AG
제17장 전략적 제안
제18장 기업 소개 및 면책사항
AJY
영문 목차
영문목차
Global Thermally Conductive Filler Dispersants Market was valued at USD 289.16 Million in 2024 and is expected to reach USD 428.16 Million by 2030 with a CAGR of 6.96% during the forecast period. Thermally conductive filler dispersants, commonly known as filler dispersants or thermal filler dispersants, represent essential additives applied across diverse industries to augment the thermal conductivity of a range of materials. These materials encompass polymers, adhesives, resins, and various composite materials. The primary function of these additives is to enhance the even distribution of thermally conductive fillers, which may include metal particles or ceramics, within the matrix material. This uniform dispersion of fillers results in an overall enhancement of the material's thermal conductivity, enabling efficient heat transfer.
Market Overview
Forecast Period
2026-2030
Market Size 2024
USD 289.16 Million
Market Size 2030
USD 428.16 Million
CAGR 2025-2030
6.96%
Fastest Growing Segment
Carbon-Based
Largest Market
North America
Key Market Drivers
Rising Demand of Thermally Conductive Filler Dispersants in Electronics Industry
In the rapidly evolving landscape of electronics, where miniaturization and performance enhancement are constant goals, efficient thermal management has become paramount. As electronic devices become increasingly compact and powerful, they generate more heat, making effective heat dissipation a critical concern. In this quest for enhanced thermal management solutions, thermally conductive filler dispersants have emerged as a fundamental component. These materials play a pivotal role in optimizing heat transfer, ensuring the reliability and longevity of electronic devices. Modern electronic devices, from smartphones to high-performance computing servers, are continually pushing the boundaries of what is technologically possible. However, this progress comes with a significant challenge: the efficient management of heat generated by these devices. As electronic components shrink in size and become more densely packed, they produce more heat per unit volume. This escalating heat generation can lead to thermal issues such as overheating, reduced performance, and even device failure. Thermally conductive filler dispersants, often incorporated into thermal interface materials (TIMs), offer a powerful solution to these thermal challenges. These materials are designed to improve the thermal conductivity of polymers and adhesives without compromising other essential properties. By adding thermally conductive fillers like ceramics, metal particles, or carbon-based materials to a polymer matrix, dispersants enable efficient heat dissipation from electronic components to heatsinks or other cooling systems.
Key Market Challenges
Increasing Thermal Demands in Electronics and Nanotechnology Complexity
Electronics are becoming more compact and powerful, generating higher heat loads. This trend presents a significant challenge for thermally conductive filler dispersants as they need to keep pace with the escalating thermal demands of advanced electronic components. The challenge lies in developing dispersants that can efficiently dissipate heat while maintaining electrical insulation, stability, and compatibility with a wide range of substrates.
Moreover, nanotechnology offers exciting opportunities for enhancing thermal conductivity, it also introduces complexities in terms of material handling, dispersion, and safety. Nanoparticles, such as graphene and carbon nanotubes, are being incorporated into dispersants to boost their thermal performance. However, the uniform dispersion of nanoparticles and the prevention of aggregation pose significant challenges. Moreover, safety concerns related to nanoparticle exposure need to be addressed in research and manufacturing environments.
Furthermore, the thermally conductive filler dispersants market is highly competitive, with numerous players vying for market share. This competition can lead to price wars and margin pressures, affecting profitability. Companies must continually innovate to differentiate their products and maintain a competitive edge.
Key Market Trends
Rising Demand for Electronics Cooling
The electronics industry continues to evolve rapidly, with devices becoming smaller and more powerful. As a result, effective thermal management is essential to prevent overheating and maintain optimal performance. Thermally conductive filler dispersants are being increasingly used in electronic components such as microprocessors, LEDs, and power modules. The market is witnessing a surge in demand for high-performance dispersants that can efficiently dissipate heat and improve the reliability of electronic devices. The global Internet of Things (IoT) ecosystem continues to expand rapidly, driving the need for robust, compact, and reliable electronics infrastructure. According to IoT Analytics' Summer 2024 report, the number of connected IoT devices reached 16.6 billion by the end of 2023, marking a 15% increase over 2022. This figure is expected to grow an additional 13% in 2024, reaching 18.8 billion devices globally. On the enterprise side, investment momentum remains strong, 51% of IoT-adopting organizations plan to increase their IoT budgets in 2024, with 22% anticipating budget growth of more than 10% year-over-year. This signals a strong push toward scaling IoT deployment across industrial, commercial, and consumer sectors. Meanwhile, the technological foundation of connected devices is evolving rapidly. In 2023, 75% of all Wi-Fi-enabled devices shipped worldwide were based on Wi-Fi 6 and Wi-Fi 6E standards, which offer faster speeds, lower latency, and higher device density support than previous generations. As IoT devices become more compact and powerful, thermal management becomes increasingly critical. Devices equipped with advanced wireless protocols and high-performance chipsets generate more heat, especially in applications like smart home systems, industrial sensors, medical wearables, edge computing nodes, and connected vehicles. This is driving demand for thermal interface materials, such as gap fillers, potting compounds, and adhesives, many of which rely on thermally conductive filler dispersants for enhanced heat dissipation, consistent performance, and miniaturized designs. Moreover, silicone-based thermally conductive filler dispersants are currently the most widely used in the market. They offer excellent thermal stability, electrical insulation, and compatibility with various substrates. Manufacturers are investing in the development of innovative silicone-based formulations to cater to specific industry requirements. These dispersants are extensively used in applications such as thermal interface materials, potting compounds, and adhesives.
Key Market Players
BYK-Chemie GmbH
Shin-Etsu Chemical Co., Ltd.
Dow Inc.
JNC Corporation
Momentive Performance Materials, Inc.
Kusumoto Chemicals, Ltd.
Evonik Industries AG
Croda International plc
Lubrizol Corporation
Wacker Chemie AG
Report Scope:
In this report, the Global Thermally Conductive Filler Dispersants Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Thermally Conductive Filler Dispersants Market, By Dispersant Structure Type:
Silicone-Based
Non-Silicone Based
Thermally Conductive Filler Dispersants Market, By End Use:
Electronics
Automotive
Energy
Industrial
Building & Construction
Others
Thermally Conductive Filler Dispersants Market, By Filler Material:
Ceramic
Metal
Carbon-Based
Thermally Conductive Filler Dispersants Market, By Region:
North America
United States
Canada
Mexico
Europe
France
United Kingdom
Italy
Germany
Spain
Asia Pacific
China
India
Japan
Australia
South Korea
South America
Brazil
Argentina
Colombia
Middle East & Africa
South Africa
Saudi Arabia
UAE
Competitive Landscape
Company Profiles: Detailed analysis of the major companies present in the Global Thermally Conductive Filler Dispersants Market.
Available Customizations:
Global Thermally Conductive Filler Dispersants Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:
Company Information
Detailed analysis and profiling of additional market players (up to five).
Table of Contents
1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations
3. Executive Summary
3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends
4. Impact of COVID-19 on Global Thermally Conductive Filler Dispersants Market
5. Voice of Customer
6. Global Thermally Conductive Filler Dispersants Market Outlook
6.1. Market Size & Forecast
6.1.1. By Value
6.2. Market Share & Forecast
6.2.1. By Dispersant Structure Type (Silicone-Based, Non-Silicone Based)
6.2.2. By Filler Material (Ceramic, Metal, Carbon-Based)
6.2.3. By End Use (Electronics, Automotive, Energy, Industrial, Building & Construction, Others)
6.2.4. By Region
6.2.5. By Company (2024)
6.3. Market Map
7. Asia Pacific Thermally Conductive Filler Dispersants Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Dispersant Structure Type
7.2.2. By End Use
7.2.3. By Filler Material
7.2.4. By Country
7.3. Asia Pacific: Country Analysis
7.3.1. China Thermally Conductive Filler Dispersants Market Outlook
7.3.1.1. Market Size & Forecast
7.3.1.1.1. By Value
7.3.1.2. Market Share & Forecast
7.3.1.2.1. By Dispersant Structure Type
7.3.1.2.2. By End Use
7.3.1.2.3. By Filler Material
7.3.2. India Thermally Conductive Filler Dispersants Market Outlook
7.3.2.1. Market Size & Forecast
7.3.2.1.1. By Value
7.3.2.2. Market Share & Forecast
7.3.2.2.1. By Dispersant Structure Type
7.3.2.2.2. By End Use
7.3.2.2.3. By Filler Material
7.3.3. Australia Thermally Conductive Filler Dispersants Market Outlook
7.3.3.1. Market Size & Forecast
7.3.3.1.1. By Value
7.3.3.2. Market Share & Forecast
7.3.3.2.1. By Dispersant Structure Type
7.3.3.2.2. By End Use
7.3.3.2.3. By Filler Material
7.3.4. Japan Thermally Conductive Filler Dispersants Market Outlook
7.3.4.1. Market Size & Forecast
7.3.4.1.1. By Value
7.3.4.2. Market Share & Forecast
7.3.4.2.1. By Dispersant Structure Type
7.3.4.2.2. By End Use
7.3.4.2.3. By Filler Material
7.3.5. South Korea Thermally Conductive Filler Dispersants Market Outlook
7.3.5.1. Market Size & Forecast
7.3.5.1.1. By Value
7.3.5.2. Market Share & Forecast
7.3.5.2.1. By Dispersant Structure Type
7.3.5.2.2. By End Use
7.3.5.2.3. By Filler Material
8. Europe Thermally Conductive Filler Dispersants Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Dispersant Structure Type
8.2.2. By End Use
8.2.3. By Filler Material
8.2.4. By Country
8.3. Europe: Country Analysis
8.3.1. France Thermally Conductive Filler Dispersants Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Dispersant Structure Type
8.3.1.2.2. By End Use
8.3.1.2.3. By Filler Material
8.3.2. Germany Thermally Conductive Filler Dispersants Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Dispersant Structure Type
8.3.2.2.2. By End Use
8.3.2.2.3. By Filler Material
8.3.3. Spain Thermally Conductive Filler Dispersants Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Dispersant Structure Type
8.3.3.2.2. By End Use
8.3.3.2.3. By Filler Material
8.3.4. Italy Thermally Conductive Filler Dispersants Market Outlook
8.3.4.1. Market Size & Forecast
8.3.4.1.1. By Value
8.3.4.2. Market Share & Forecast
8.3.4.2.1. By Dispersant Structure Type
8.3.4.2.2. By End Use
8.3.4.2.3. By Filler Material
8.3.5. United Kingdom Thermally Conductive Filler Dispersants Market Outlook
8.3.5.1. Market Size & Forecast
8.3.5.1.1. By Value
8.3.5.2. Market Share & Forecast
8.3.5.2.1. By Dispersant Structure Type
8.3.5.2.2. By End Use
8.3.5.2.3. By Filler Material
9. North America Thermally Conductive Filler Dispersants Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Dispersant Structure Type
9.2.2. By End Use
9.2.3. By Filler Material
9.2.4. By Country
9.3. North America: Country Analysis
9.3.1. United States Thermally Conductive Filler Dispersants Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Dispersant Structure Type
9.3.1.2.2. By End Use
9.3.1.2.3. By Filler Material
9.3.2. Mexico Thermally Conductive Filler Dispersants Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Dispersant Structure Type
9.3.2.2.2. By End Use
9.3.2.2.3. By Filler Material
9.3.3. Canada Thermally Conductive Filler Dispersants Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Dispersant Structure Type
9.3.3.2.2. By End Use
9.3.3.2.3. By Filler Material
10. South America Thermally Conductive Filler Dispersants Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Dispersant Structure Type
10.2.2. By End Use
10.2.3. By Filler Material
10.2.4. By Country
10.3. South America: Country Analysis
10.3.1. Brazil Thermally Conductive Filler Dispersants Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Dispersant Structure Type
10.3.1.2.2. By End Use
10.3.1.2.3. By Filler Material
10.3.2. Argentina Thermally Conductive Filler Dispersants Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Dispersant Structure Type
10.3.2.2.2. By End Use
10.3.2.2.3. By Filler Material
10.3.3. Colombia Thermally Conductive Filler Dispersants Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Dispersant Structure Type
10.3.3.2.2. By End Use
10.3.3.2.3. By Filler Material
11. Middle East and Africa Thermally Conductive Filler Dispersants Market Outlook
11.1. Market Size & Forecast
11.1.1. By Value
11.2. Market Share & Forecast
11.2.1. By Dispersant Structure Type
11.2.2. By End Use
11.2.3. By Filler Material
11.2.4. By Country
11.3. MEA: Country Analysis
11.3.1. South Africa Thermally Conductive Filler Dispersants Market Outlook
11.3.1.1. Market Size & Forecast
11.3.1.1.1. By Value
11.3.1.2. Market Share & Forecast
11.3.1.2.1. By Dispersant Structure Type
11.3.1.2.2. By End Use
11.3.1.2.3. By Filler Material
11.3.2. Saudi Arabia Thermally Conductive Filler Dispersants Market Outlook
11.3.2.1.1. By Value
11.3.2.2. Market Share & Forecast
11.3.2.2.1. By Dispersant Structure Type
11.3.2.2.2. By End Use
11.3.2.2.3. By Filler Material
11.3.3. UAE Thermally Conductive Filler Dispersants Market Outlook
11.3.3.1. Market Size & Forecast
11.3.3.1.1. By Value
11.3.3.2. Market Share & Forecast
11.3.3.2.1. By Dispersant Structure Type
11.3.3.2.2. By End Use
11.3.3.2.3. By Filler Material
12. Market Dynamics
12.1. Drivers
12.2. Challenges
13. Market Trends & Developments
13.1. Recent Developments
13.2. Product Launches
13.3. Mergers & Acquisitions
14. Global Thermally Conductive Filler Dispersants Market: SWOT Analysis
