한글목차

이 보고서는 반도체 소자 제조에 사용되는 PVD 기술 중 스퍼터링을 중심으로 스퍼터링 타겟 시장을 조사하고, 특히 이 분야의 타겟 시장과 공급망에 대해 다루고 있습니다.

인포그래픽

목차

제1장 주요 요약

제2장 조사 범위, 목적, 방법

제3장 반도체 산업 시장 현황과 전망

• 세계 경제와 전망
• 전자제품 부문별 칩 매출
• 반도체 제조 성장과 확대
• 정책과 무역 동향과 영향
• 반도체 재료 개요

제4장 스퍼터링 타겟 시장 동향

• 스퍼터링 타겟 시장 동향 - 개요
• 스퍼터링 타겟 제조 거점과 투자 - 지역별
• 가격 동향
• 스퍼터링 타겟 기술 개요
• 지역적인 고려
• EHS와 무역/물류 문제
• 스퍼터링 타겟 시장 동향 평가

제5장 공급측 시장 상황

• 스퍼터링 타겟 시장 점유율
• M&A 활동과 파트너십
• 공장 폐쇄
• 신규 진출 기업
• 제조 중지 우려가 있는 공급업체 또는 부품/제품 라인
• 재료 공급업체 평가

제6장 서브 티어 공급망, 금속

• 서브 티어 공급망 : 공급원과 시장 개요
• 서브 티어 공급망 : 혼란
• 서브 티어 공급망 M&A 또는 파트너십 활동
• 서브 티어 공급망 EHS와 물류 문제
• 서브 티어 공급망 "신규" 참여자
• 서브 티어 공급망 공장 최신 정보
• 서브 티어 공급망 공장 폐쇄
• 서브 티어 공급망 평가

제7장 공급업체 개요

• ADVANCED TARGETS MATERIALS CO., LTD.
• AMERICAN ELEMENTS
• FURUYA METAL CO
• GO ELEMENT
• GRIKIN
• 기타 20개사 이상

제8장 부록

• PVD를 사용한 첨단 프로세스, 새로운 구조, 특수 필름

영문목차

This report addresses sputtering, the dominant PVD technique used in semiconductor device fabrication, and specifically covers the market and supply-chain for targets within that segment. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research.

INFOGRAPHICS

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

• 1.1 SPUTTERING TARGETS BUSINESS - MARKET OVERVIEW
• 1.2 MARKET TRENDS IMPACTING 2024 OUTLOOK
• 1.3 SPUTTER TARGETS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
• 1.4 SPUTTERING TARGETS 5-YEAR REVENUE FORECAST BY SEGMENT
• 1.5 SPUTTERING TARGETS SEGMENT TRENDS
• 1.6 TECHNOLOGY TRENDS
• 1.7 COMPETITIVE LANDSCAPE
• 1.8 MOST RECENTLY REPORTED QUARTERLY FINANCIALS OF TOP-5 SUPPLIERS
• 1.9 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
• 1.10 ANALYST ASSESSMENT OF SPUTTERING TARGETS

2 SCOPE, PURPOSE AND METHODOLOGY

• 2.1 SCOPE
• 2.2 PURPOSE & METHODOLOGY
• 2.3 OVERVIEW OF OTHER TECHCET CMRTM OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

• 3.1 WORLDWIDE ECONOMY AND OUTLOOK
  • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2 SEMICONDUCTOR SALES GROWTH
  • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
• 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
  • 3.2.1 ELECTRONICS OUTLOOK
  • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
    • 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
    • 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
  • 3.2.3 SMARTPHONE OUTLOOK
  • 3.2.4 PC OUTLOOK
  • 3.2.5 SERVERS / IT MARKET
• 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
  • 3.3.2 NEW FABS IN THE US
  • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
  • 3.3.4 EQUIPMENT SPENDING TRENDS
  • 3.3.5 TECHNOLOGY ROADMAPS
  • 3.3.6 FAB INVESTMENT ASSESSMENT
• 3.4 POLICY & TRADE TRENDS AND IMPACT
• 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
  • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
  • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 SPUTTERING TARGETS MARKET TRENDS

• 4.1 SPUTTERING TARGETS MARKET TRENDS - OUTLINE
  • 4.1.1 2023 SPUTTERING TARGETS MARKET LEADING INTO 2024
  • 4.1.2 SPUTTERING TARGETS MARKET OUTLOOK
  • 4.1.3 SPUTTERING TARGETS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
  • 4.1.4 SPUTTERING TARGETS 5-YEAR REVENUE FORECAST BY SEGMENT
• 4.2 SPUTTERING TARGETS MANUFACTURING LOCATIONS AND INVESTMENTS - BY REGION
  • 4.2.1 SPUTTERING TARGETS MANUFACTURING LOCATIONS AND INVESTMENTS - CAPACITY EXPANSIONS
• 4.3 PRICING TRENDS
• 4.4 SPUTTERING TARGET TECHNOLOGY OVERVIEW
  • 4.4.1 SPUTTERING TARGET TECHNOLOGY- Trends
  • 4.4.2 SPUTTERING TARGET technology- DRIVERS BY DIAMETER
  • 4.4.3 SPUTTERING TARGET technology- SPECIALTY/ EMERGING MATERIALS APPLICATIONS
• 4.5 REGIONAL CONSIDERATIONS
  • 4.5.1 REGIONAL ASPECTS AND DRIVERS
• 4.6 EHS AND TRADE/LOGISTICS ISSUES
  • 4.6.1 EHS ISSUES
  • 4.6.2 TRADE/LOGISTICS ISSUES
• 4.7 TECHCET ANALYST ASSESSMENT OF SPUTTERING TARGETS MARKET TRENDS

5 SUPPLY-SIDE MARKET LANDSCAPE

• 5.1 SPUTTERING TARGETS MARKET SHARE
  • 5.2.1 CURRENT QUARTER - SUPPLIERS' ACTIVITIES & REPORTED EVENUES
  • 5.2.2 CURRENT QUARTER REPORTING - JX ADVANCED METALS
  • 5.2.3 CURRENT QUARTER REPORTING - HONEYWELL
  • 5.2.4 CURRENT QUARTER REPORTING - KFMI
  • 5.2.5 CURRENT QUARTER REPORTING - LINDE
  • 5.2.6 CURRENT QUARTER REPORTING - TOSOH
• 5.3 M&A ACTIVITY AND PARTNERSHIPS
• 5.4 PLANT CLOSURES
• 5.5 NEW ENTRANTS
  • 5.5.1 NEW ENTRANTS- BARRIERS TO ENTRY
  • 5.5.2 NEW ENTRANTS- COMPANIES
• 5.6 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
• 5.7 TECHCET ANALYST ASSESSMENT OF MATERIAL SUPPLIERS

6 SUB-TIER SUPPLY-CHAIN, METALS

• 6.1 SUB-TIER SUPPLY-CHAIN: SOURCES & MARKETS OVERVIEW
  • 6.1.1 SUB-TIER Metals MARKET BACKGROUND
  • 6.1.2 SUB-TIER Metals MARKET TRENDS
  • 6.1.3 SUB-TIER METALS MARKET STATISTICS
  • 6.1.4 SUB-TIER METALS SUPPLY CHAIN MANAGEMENT CONSIDERATIONS
  • 6.1.5 SUB-TIER METALS SUPPLY CHAIN SUPPLY SIDE OVERVIEW
  • 6.1.6 SUB-TIER METALS SUPPLIER NEWS
• 6.2 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS
• 6.3 SUB-TIER SUPPLY-CHAIN M&A OR PARTNERSHIP ACTIVITY
• 6.4 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
• 6.5 SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS
• 6.6 SUB-TIER SUPPLY-CHAIN PLANT UPDATES
• 6.7 SUB-TIER SUPPLY-CHAIN PLANT CLOSURES
• 6.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 SUPPLIER PROFILES

• ADVANCED TARGETS MATERIALS CO., LTD.
• AMERICAN ELEMENTS
• FURUYA METAL CO
• GO ELEMENT
• GRIKIN
• ...AND 20+ MORE

8 APPENDIX

• 8.1 ADVANCED PROCESSES, EMERGING STRUCTURES, AND SPECIALTY FILMS USING PVD
  • 8.1.1 LOGIC, 10 NM & BELOW
  • 8.1.2 DRAM - PVD VERSUS OTHER DEPOSITIONS
  • 8.1.3 3D NAND - PVD VERSUS OTHER DEPOSITIONS
  • 8.1.4 NEW DEVELOPMENTS IN THE TECHNOLOGY OR MARKETS: UNIVERSITY AND SUPPLIER R&D IN 5-7 YEARS
  • 8.1.5 BPR ARCHITECTURE
  • 8.1.6 SPECIALTY (STT MRAM, FE RAM, OTHER) MEMORY PVD MATERIALS