[시장보고서]세계의 석영 장비 부품 시장 : 2024-2025년(Critical Materials Report)

세계의 석영 장비 부품 시장 : 2024-2025년(Critical Materials Report)

Quartz Equipment Components Market Report 2024-2025 (Critical Materials Report)

상품코드 : 1542848

리서치사 : TECHCET

발행일 : 2024년 08월

페이지 정보 : 영문 241 Pages

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한글목차

샘플 요청 목록에 추가

반도체 디바이스 제조에 사용되는 석영 가공 부품 시장과 이를 지원하는 공급망을 분석하고 있습니다. 이 보고서에는 TECHCET의 데이터베이스와 시니어 애널리스트의 경험 및 1차 조사와 2차 조사에서 얻은 데이터와 분석이 포함되어 있습니다. 토픽에는 고순도 석영 가공 부품 시장, 생사/분말로부터의 공급망, 기재 등이 포함됩니다. 또한 공급업체별·지역별 공급·시장 동향 전망도 포함되어 있습니다. 예측은 반도체 웨이퍼의 성장, 장비 시스템 예측, 기술개발, 지역별 동향에 기반한 것입니다.

인포그래픽스

세계 경제와 산업 전체의 전망
- 반도체 산업과 세계 경제 연동
- 반도체의 판매 증가율
- 대만 아웃소싱 제조업체의 월간 판매 동향
칩 판매 : 전자 제품 부문별
- 일렉트로닉스 전망
- 자동차 산업 전망
- 스마트폰 전망
- PC 전망
- 서버/IT 시장
반도체 제조의 성장과 확대
- 칩 확장에 대한 거액 투자의 한가운데
- 미국의 새로운 공장
- 세계 각국에서의 공장 확대가 성장을 촉진
- 설비 투자 동향
- 첨단 로직 기술 로드맵
- 공장 투자 평가
정책·무역 동향과 영향
반도체 재료의 개요
- TECHCET 웨이퍼 투입 매수 예측(-2028년)
- TECHCET 재료 시장 예측(-2028년)

제4장 석영 부품 시장의 동향

석영 가공 부품 사업 : 시장 개요
- 석영 가공 부품 시장 동향(2023년) : 2024년까지 움직임
- 석영 가공 부품 시장 전망
- 석영 가공 부품의 매출 예측 : 부문별( 5년간)
- 석영 가공 부품 생산능력 : 주요 공급업체별
- 석영 가공 부품 생산량 : 지역별
- 석영 가공 부품 생산능력의 확대
- 투자 발표 : 개요
- 석영 가공 부품 수급 균형 : 개요
가격 수준 동향
석영 가공 부품의 일반적인 기술 개요
- 석영 가공 부품의 일반적인 기술 개요
- 석영 가공 부품의 용도
- 석영 가공 부품의 개요
- 석영 가공 부품 : 웨이퍼 사이즈와 석영 요건에 대한 영향
- 석영 가공 부품의 기술 동향
석영 가공 부품 : 지역적인 고려사항
- 지역적 측면과 촉진요인
EHS(환경·위생·안전)와 무역/물류 문제
- 러시아의 우크라이나 침공
- 예멘 후티 반군에 의한 홍해·아덴만에서의 공격이 세계의 해운을 혼란시킨다.
- 새로운 중동 분쟁은 세계의 기술 공급망과 인텔의 확장 계획을 혼란시킬 가능성이 있다.
- 파나마 운하의 역사적인 가뭄
- EHS 문제 : 환경에 대한 영향
- 무역/물류 문제
석영 가공 부품 시장 동향에 관한 애널리스트 평가

제5장 공급측 시장 구도

석영 가공 부품 시장 점유율 : 가공 시장
- 석영 가공 부품 시장 점유율 : 냉간 가공(기계 가공)
- 석영 가공 부품 시장 점유율 : 열간 가공(용해)
- 현재 공급업체의 현재 활동과 보고 매출 : 석영(분기 기반)
- 주요 공급업체 4사의 재무 상황(2024년 1분기)
- 최근 분기 활동 : SHIN-ETSU
- 최근 분기 활동 : TOSOH QUARTZ
- 최근 분기 활동 : FERROTEC
- 최근 분기 활동 : WONIK
- 바로 옆 활동 : HERAEUS
기업인수합병(M&A) 활동과 파트너십
공장 폐쇄 - 없음
신규 참여자
제조 중지 우려가 있는 석영 또는 부품/제품 라인
TECHCET 애널리스트에 의한 석영 공급업체 평가

제6장 서브 티어 공급망, 석영

서브 티어 공급망 : 공급원과 시장의 개요
- 석영 서브 티어 공급망 : 시장의 배경
- 석영 서브 티어 공급망 : 시장 동향
- 석영 기재의 매출 예측 : 부문별(5년간)
- 서브 티어 공급망 : 석영 유리 기재 시장 점유율
- 서브 티어 공급망 : 석영 유리 기재 - 튜브·로드 시장 점유율
- 서브 티어 공급망 : 석영 유리 기재 - 잉곳·불 시장 점유율
- 서브 티어 공급망 : 석영 기재 - 모래/분말 시장 점유율
- 반도체 등급 석영 서브 티어·공급업체의 최신 정보
서브 티어 공급망 : 파괴적 변화(파괴)
서브 티어 공급망 M&A 또는 파트너십 활동
서브 티어 공급망 EHS와 물류 문제
서브 티어 공급망 ' 신규 ' 참여자 - 없음
서브 티어 공급망 공장의 최신 정보
하위 공급망 공장 폐쇄 - 보고 없음
서브 티어 공급망 동향
TECHCET 애널리스트에 의한 서브 티어 공급망 평가

제7장 공급업체 개요(제조업체)

APPLIED CERAMICS, INC.
BEIJING KAIDE QUARTZ CO., LTD
DONGHAI HONGWEI QUARTZ PRODUCTS CO., LTD.
DS TECHNO CO., LTD.
FERROTEC HOLDINGS CORPORATION
……기타 20건 이상

제8장 부록

기술 동향/기술 촉진요인 - 개요
3D NAND 프로세스의 진보 필요성

KSA

영문 목차

영문목차

This report covers the market and supply-chain for Quartz Fabricated Parts used in semiconductor device fabrication, and the supporting supply chain. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. Topics include High Purity Fabricated Quartz Parts market, supply chain from raw sand/powder, and base materials. Effort has been made to provide breakdown of the supply and market by supplier as well as region. Forecasts are based on semiconductor wafer starts growth and equipment systems forecast as well as technology developments and regional dynamics.

INFOGRAPHICS

1. EXECUTIVE SUMMARY

1.1. QUARTZ FABRICATED PARTS BUSINESS - MARKET OVERVIEW
- 1.1.1. QUARTZ FABRICATED PARTS BUSINESS - MARKET STRUCTURAL OVERVIEW
1.2. MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3. QUARTZ FABRICATED PARTS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
1.4. QUARTZ FABRICATED PARTS SEGMENT TRENDS
1.5. TECHNOLOGY TRENDS - QUARTZ FABRICATED PARTS
1.6. COMPETITIVE LANDSCAPE - QUARTZ FABRICATED PARTS
1.7. FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS
1.8. EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS - QUARTZ FABRICATED PARTS
1.9. ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS

2. SCOPE, PURPOSE AND METHODOLOGY

2.1. SCOPE
2.2. PURPOSE & METHODOLOGY
2.3. OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1. WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK
- 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2. SEMICONDUCTOR SALES GROWTH
- 3.1.3. TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1. ELECTRONICS OUTLOOK
- 3.2.2. AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1. ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2. INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3. SMARTPHONE OUTLOOK
- 3.2.4. PC OUTLOOK
- 3.2.5. SERVERS / IT MARKET
3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1. IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2. NEW FABS IN THE US
- 3.3.3. WW FAB EXPANSION DRIVING GROWTH
- 3.3.4. EQUIPMENT SPENDING TRENDS
- 3.3.5. ADVANCED LOGIC TECHNOLOGY ROADMAPS
  - 3.3.5.1. DRAM TECHNOLOGY ROADMAPS
  - 3.3.5.2. 3D NAND TECHNOLOGY ROADMAPS
- 3.3.6. FAB INVESTMENT ASSESSMENT
3.4. POLICY & TRADE TRENDS AND IMPACT
3.5. SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1. TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2. TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4. QUARTZ PARTS MARKET TRENDS

4.1. QUARTZ FABRICATED PARTS BUSINESS - MARKET OVERVIEW
- 4.1.1. 2023 QUARTZ FABRICATED PARTS MARKET LEADING INTO 2024
- 4.1.2. QUARTZ FABRICATED PARTS MARKET OUTLOOK
- 4.1.3. QUARTZ FABRICATED PARTS 5-YEAR REVENUE FORECAST BY SEGMENT
- 4.1.4. QUARTZ FABRICATED PARTS PRODUCTION CAPACITY OF TOP SUPPLIERS
- 4.1.5. QUARTZ FABRICATED PARTS PRODUCTION BY REGION
- 4.1.6. QUARTZ FABRICATED PARTS PRODUCTION CAPACITY EXPANSIONS
- 4.1.7. INVESTMENT ANNOUNCEMENTS OVERVIEW
- 4.1.8. QUARTZ FABRICATED PARTS SUPPLY VS. DEMAND BALANCE - OVERVIEW
  - 4.1.8.1. SUPPLY VS. DEMAND BALANCE - QUARTZ FABRICATED PARTS
4.2. PRICING TRENDS
4.3. QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW
- 4.3.1. QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW
- 4.3.2. QUARTZ FABRICATED PARTS APPLICATIONS
- 4.3.3. QUARTZ FABRICATED PARTS GENERAL DESCRIPTION
- 4.3.4. QUARTZ FABRICATED PARTS - WAFER SIZE AND EFFECT ON QUARTZ REQUIREMENTS
- 4.3.5. QUARTZ FABRICATED PARTS TECHNOLOGY TRENDS
4.4. REGIONAL CONSIDERATIONS - QUARTZ FABRICATED PARTS
- 4.4.1. REGIONAL ASPECTS AND DRIVERS
4.5. EHS AND TRADE/LOGISTIC ISSUES
- 4.5.1. RUSSIA INVASION OF UKRAINE
- 4.5.2. YEMEN'S HOUTHI ATTACKS IN THE RED SEA AND GULF OF ADEN DISRUPT GLOBAL SHIPPING
- 4.5.3. NEW MIDDLE EAST CONFLICT COULD DISRUPT GLOBAL TECH SUPPLY CHAIN AND INTEL'S EXPANSION PLANS
- 4.5.4. PANAMA CANAL HISTORIC DROUGHT
- 4.5.5. EHS ISSUES - ENVIRONMENTAL IMPACT
- 4.5.6. TRADE/LOGISTICS ISSUES
4.6. ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS MARKET TRENDS

5. SUPPLY-SIDE MARKET LANDSCAPE

5.1. QUARTZ FABRICATED PARTS MARKET SHARE - FABRICATION MARKET
- 5.1.1. QUARTZ FABRICATED PARTS MARKET SHARE - COLD FABRICATION (MACHINING)
- 5.1.2. QUARTZ FABRICATED PARTS MARKET SHARE - HOT FABRICATION (FUSED)
- 5.1.3. CURRENT QUARTER - SUPPLIERS' ACTIVITIES & REPORTED REVENUES - QUARTZ
- 5.1.4. FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS
- 5.1.5. CURRENT QUARTER ACTIVITY - SHIN-ETSU
- 5.1.6. CURRENT QUARTER ACTIVITY - TOSOH QUARTZ
- 5.1.7. CURRENT QUARTER ACTIVITY - FERROTEC
- 5.1.8. CURRENT QUARTER ACTIVITY - WONIK
- 5.1.9. CURRENT ACTIVITY - HERAEUS
5.2. M&A ACTIVITY AND PARTNERSHIPS
5.3. PLANT CLOSURES - NONE
5.4. NEW ENTRANTS
5.5. SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.6. TECHCET ANALYST ASSESSMENT OF QUARTZ SUPPLIERS

6. SUB-TIER SUPPLY-CHAIN, QUARTZ

6.1. SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1. QUARTZ SUB-TIER SUPPLY-CHAIN MARKET BACKGROUND
- 6.1.2. QUARTZ SUB-TIER SUPPLY-CHAIN MARKET TRENDS
- 6.1.3. QUARTZ BASE MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT
- 6.1.4. SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS MARKET SHARE
- 6.1.5. SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS - TUBES AND RODS MARKET SHARE
- 6.1.6. SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS - INGOTS AND BOULES MARKET SHARE
- 6.1.7. SUB-TIER SUPPLY CHAIN: QUARTZ BASE MATERIALS - SAND/POWDER MARKET SHARE
- 6.1.8. SEMICONDUCTOR-GRADE QUARTZ SUB-TIER SUPPLIER NEWS
6.2. SUB-TIER SUPPLY-CHAIN - DISRUPTIONS
6.3. SUB-TIER SUPPLY-CHAIN M&A OR PARTNERSHIP ACTIVITY
6.4. SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES - SEE SECTION 4.5
6.5. SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS - NONE
6.6. SUB-TIER SUPPLY-CHAIN PLANT UPDATES
6.7. SUB-TIER SUPPLY-CHAIN PLANT CLOSURES - NONE REPORTED
6.8. SUB-TIER SUPPLY-CHAIN PRICING TRENDS
6.9. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7. SUPPLIER PROFILES (FABRICATORS)

APPLIED CERAMICS, INC.
BEIJING KAIDE QUARTZ CO., LTD
DONGHAI HONGWEI QUARTZ PRODUCTS CO., LTD.
DS TECHNO CO., LTD.
FERROTEC HOLDINGS CORPORATION
...AND 20+ MORE

8. APPENDIX

8.1. TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
- 8.1.1. QUARTZ GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS
- 8.1.2. CUSTOMER DRIVEN TECHNOLOGIES
- 8.1.3. NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
8.1.4 3D NAND PROCESS ADVANCES REQUIRED
- 8.1.5. MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
- 8.1.6. ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
- 8.1.7. ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
  - 8.1.7.1. THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
- 8.1.8. ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
- 8.1.9. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
  - 8.1.9.1. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
  - 8.1.9.2. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
  - 8.1.9.3. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
- 8.1.10. CFET ARCHITECTURE: CFET SCALING ADVANTAGE
  - 8.1.10.1. CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
  - 8.1.10.2. CFET ARCHITECTURE: CFET FUTURE PROSPECTS
- 8.1.11. INORGANIC EUV RESIST - SPIN ON DEPOSITION
  - 8.1.11.1. INORGANIC EUV RESIST - ALD DEPOSITED
- 8.1.12. SELF ALIGNED MULTI PATTERNING - SADP
  - 8.1.12.1. SELF ALIGNED MULTI PATTERNING - SAQP
  - 8.1.12.2. SELF ALIGNED MULTI PATTERNING - PEALD EQUIPMENT
  - 8.1.12.3. SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM?
- 8.1.13. EUV, MULTI PATTERNING AND GEOPOLITICS
- 8.1.14. AREA SELECTIVE DEPOSITION (ASD)
  - 8.1.14.1. AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
- 8.1.15. SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS

FIGURES

FIGURE 1.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT
FIGURE 1.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE
FIGURE 1.3: TOP-4 QUARTZ MAKERS' QUARTERLY COMBINED SALES (US$M)
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY HAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000'S OF NTD
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT
FIGURE 4.2: FABRICATED QUARTZ COMPONENTS MARKET SHARE % BY SUPPLIER
FIGURE 4.3: 2023 FABRICATED QUARTZ COMPONENTS BY REGION
FIGURE 4.4: QUARTZ FABRICATED PARTS CAPACITY/DEMAND FORECAST
FIGURE 4.5: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS
FIGURE 4.6: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS
FIGURE 4.7: QUARTZ PRODUCTS FOR DRY ETCH APPLICATIONS
FIGURE 4.8: QUARTZ PRODUCTS FOR EPI APPLICATIONS
FIGURE 4.9: 2023 QUARTZ FABRICATED PARTS REVENUE SHARE BY REGION
FIGURE 4.10: ASSESSED CONTROL OF TERRAIN AROUND DONETSK
FIGURE 4.11: YEMEN'S HOUTHI ATTACKS DISRUPTING GLOBAL SHIPPING
FIGURE 4.12: MIDDLE EAST CONFLICT
FIGURE 4.13: PANAMA CANAL SHIPPING
FIGURE 4.14: GREENHOUSE GAS PROTOCOL, DETAILED CATEGORIES
FIGURE 4.15: SCOPE 3 EMISSIONS FOR SEMICONDUCTOR COMPANIES
FIGURE 5.1: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE (HOT & COLD)
FIGURE 5.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.3: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.4: TOP-4 QUARTZ MAKERS' QUARTERLY COMBINED SALES (US$M)
FIGURE 5.5: TOSS CORP 2024 FINANCIALS
FIGURE 5.6: WONIK CURRENT QUARTER FINANCIALS
FIGURE 5.7: #2 HERAEUS CONSOLIDATED 2023 FINANCIALS
FIGURE 6.1: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS
FIGURE 6.2: QUARTZ BASE MATERIALS REVENUE FORECAST BY SEGMENT
FIGURE 6.3: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS UPPLIER RANKING- BASE MATERIAL
FIGURE 6.4: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- TUBES AND RODS
FIGURE 6.5: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- INGOT/BOULE
FIGURE 6.6: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 2023 QUARTZ POWDER
FIGURE 8.1: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
FIGURE 8.2: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
FIGURE 8.3: 3D NAND PROGRESSION
FIGURE 8.4: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
FIGURE 8.5: GATE STRUCTURE ROADMAP
FIGURE 8.6: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
FIGURE 8.7: RIBBON FET
FIGURE 8.8: MONO LAYER NANO SHEETS CHANNELS
FIGURE 8.9: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
FIGURE 8.10: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
FIGURE 8.11: DIRECTED SELF-ASSEMBLY
FIGURE 8.12: DSA PATENT FILING BY COMPANY
FIGURE 8.13: DSA PATEN FILING SINCE 2023
FIGURE 8.14: WHAT IS PATTERN SHAPING?
FIGURE 8.15: REFINING EUV PATTERNING BY APPLIED MATERIALS
FIGURE 8.16: COMPLEMENTARY FET (CFET)
FIGURE 8.17: CFET IMPROVES PERFORMANCE IN TRACK SCALING
FIGURE 8.18: MONOLITHIC CFET PROCESS FLOW EXAMPLE
FIGURE 8.19: MCFET NEW FEATURE- MIDDLE DIELECTRIC ISOLATION
FIGURE 8.20: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
FIGURE 8.21: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
FIGURE 8.22: BSPDN ADVANTAGE- IR DROP REDUCTION
FIGURE 8.23: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
FIGURE 8.24: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
FIGURE 8.25: INPRIA EUV MOR
FIGURE 8.26: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST
FIGURE 8.27: PATENT FILING FOR MLD DEPOSITED EUV RESIST SEARCH PERFORMED IN PATBASE
FIGURE 8.28: SADP PROCESS FLOW USING ALD SPACER
FIGURE 8.29: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW
FIGURE 8.30: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
FIGURE 8.31: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS)

TABLES

TABLE 1.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
TABLE 4.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION
TABLE 4.2: ESTIMATED FABRICATED QUARTZ COMPONENTS SHARE BY SUPPLIER
TABLE 4.3: QUARTZ FABRICATED PARTS SUPPLIER MANUFACTURING LOCATIONS
TABLE 4.4: OVERVIEW OF ANNOUNCED 2023/2024 QUARTZ FABRICATED PARTS SUPPLIER INVESTMENTS
TABLE 4.5: COMPARISON OF TUBES AND BOATS ATTRIBUTES FOR 200MM AND 300MM PROCESSES
TABLE 4.6: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (1 OF 2)
TABLE 4.7: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (2 OF 2)
TABLE 5.1: MOST RECENT QUARTERLY QUARTZ SUPPLIER SALES (IN US$M)
TABLE 5.2: SHIN-ETSU CURRENT QUARTER FINANCIALS (ANNUAL RESULTS)
TABLE 5.3: FERROTEC YOY FINANCIALS
TABLE 5.4: FERROTEC ANNUAL (ENDING 3/2024) FINANCIALS
TABLE 8.1: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL)
TABLE 8.2: MULTIPATTERNING AT 7NM BY TSMC
TABLE 8.3: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS