한글목차

CMP(화학 기계 연마) 슬러리 패드는 반도체 제조에 매우 중요합니다. 프로세스 통합은 반도체 웨이퍼 상에 디바이스 구조를 구축하기 위해 얇고 균일한 평탄층을 제조해야 하기 때문입니다. CMP 프로세스의 공정 수는 새로운 디바이스 기술이 등장할 때마다 계속 증가하고 있습니다. 새로운 디바이스 기술은 더 많은 레이어, 새로운 재료, 보다 엄격한 공정 제어 요구 사항, 고급 패키지를 위한 새로운 기술 등의 특징이 있습니다. 이러한 제조 과제를 해결하려면 새로운 CMP 슬러리 및 패드를 개발해야 합니다.

SAMPLE VIEW

본 보고서는 반도체 디바이스 제조에 사용되는 CMP 소모품(특히 CMP 슬러리 및 패드) 시장과 공급망에 대해 분석하고, 시장의 기본 구조 및 주요 촉진요인, 슬러리 패드의 용도별 예측, 시장 점유율, 연마제 공급업체를 고려하고 특히 고급 패키지에 중점을 둡니다.

목차

제1장 주요 요약

제2장 분석 범위, 목적 및 수법

제3장 업계 및 시장의 현상과 전망

• 세계 경제 및 전망
  • 반도체 산업과 세계 경제의 연결
  • 반도체 매출의 성장
  • 대만 아웃소싱 제조업체의 월간 매출 동향
• 칩 매출 : 전자 제품의 부문별
  • 일렉트로닉스의 전망
  • 자동차 산업의 전망
  • 스마트폰의 전망
  • PC의 전망
  • 서버 및 IT 시장
• 반도체 제조의 성장 및 확대
  • 칩 확장에의 거액 투자의 한가운데
  • 미국의 새로운 공장
  • 세계 각지에서의 제조 공장 확대가 성장 견인
  • 설비투자 동향
  • 제조공장에 대한 투자 평가
• 정책 및 무역 동향과 영향
• 반도체 재료의 개요
  • 웨이퍼 투입 매수의 예측(-2028년)
  • 재료 시장 예측(-2028년)

제4장 CMP 소모품 동향

• CMP 슬러리 및 패드(소모품) 시장 동향 : 개요
• 지역별 동향
  • 지역별 동향 및 촉진요인
• CMP 소모품 시장 동향
  • 기술적 촉진요인 : 재료의 변경 및 이행-고도 로직
  • 기술적 촉진요인 : 재료의 변경 및 이행-메모리
  • 기술적 촉진요인 : 재료의 변경 및 이행
  • 고도 패키지의 기술 동향
  • 고도 패키지의 기술 동향(계속)
  • 화합물 반도체의 기술 동향
• 신소재의 EHS(환경, 건강 및 안전) 문제
  • 슬러리의 폐기, 리사이클 및 재생에 관한 EHS 문제
• 물류상의 문제

제5장 CMP 슬러리 공급업체 시장

• CMP 슬러리의 수익 예측(5년분)
• CMP 슬러리 예측(수량 기준, 5년간)
• CMP 슬러리 시장의 리더
  • 슬러리 시장 점유율 : 지역별
  • 슬러리 시장 점유율
• CMP 슬러리 시장에서의 기업 합병, 인수(M&A) 활동, 투자, 발표 및 파트너십
• CMP 슬러리 공장 폐쇄-없음
• 신규 진출기업
• 제조 중단의 우려가 있는 공급자 또는 부품 및 제품 라인
• CMP 슬러리의 가격 동향
• CMP 슬러리 시장에 대한 분석가의 평가

제6장 CMP 패드 시장 통계 및 예측

• CMP 패드의 수익 예측(5년간)
• CMP 패드의 수익 예측(5년간)
  • CMP 패드 예측(수량 기준, 5년간)
• 패드 공급자 경쟁 구도
• 신규 진출기업
• CMP 패드 물류 문제, 기업 합병, 인수(M&A) 활동, 발표, 파트너십
• CMP 패드의 동향
• 애널리스트의 평가

제7장 재료의 하위층(가상 부문)에 공급

• 연마재 공급자
• 수직 통합형 공급자
• 원재료 공급망의 파괴자
• 원재료 분야의 M&A 활동
• 연마제 공급망의 EHS 및 물류 문제
• 연마재 공급망의 「신규」참가 기업-없음
• 연마재 공급망의 동향
• 서브티어 공급망 : 애널리스트의 평가

제8장 공급자 프로파일

• 3M Company
• Abrasive Technology
• Ace NanoChem
• Anji Micro Shanghai
• Asahi Glass
• 기타 40건 이상

제9장 부록

영문목차

This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers.

SAMPLE VIEW

The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

• 1.1 CMP CONSUMABLES MARKET OVERVIEW
• 1.2 CMP CONSUMABLES REVENUE TRENDS
• 1.3 MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK
• 1.4 YEAR 2023 IN REVIEW
• 1.5 CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT
  • 1.5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST
  • 1.5.2 CMP PADS 5-YEAR REVENUE FORECAST
• 1.6 TECHNOLOGY TRENDS
• 1.7 SLURRY SUPPLIER COMPETITIVE LANDSCAPE
• 1.8 PAD SUPPLIER COMPETITIVE LANDSCAPE
• 1.9 ANALYST ASSESSMENT
  • 1.9.1 ANALYST ASSESSMENT CONTINUED SEMICONDUCTOR

2 SCOPE, PURPOSE AND METHODOLOGY

• 2.1 SCOPE
• 2.2 PURPOSE
• 2.3 METHODOLOGY
• 2.4 OVERVIEW OF OTHER TECHCET CMR OFFERINGS

3 INDUSTRY MARKET STATUS & OUTLOOK

• 3.1 WORLDWIDE ECONOMY AND OUTLOOK
  • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2 SEMICONDUCTOR SALES GROWTH
  • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
• 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
  • 3.2.1 ELECTRONICS OUTLOOK
  • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
    • 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
    • 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
  • 3.2.3 SMARTPHONE OUTLOOK
  • 3.2.4 PC OUTLOOK
  • 3.2.5 SERVERS / IT MARKET
• 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
  • 3.3.2 NEW FABS IN THE US
  • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
  • 3.3.4 EQUIPMENT SPENDING TRENDS
    • 3.3.4.1 ADVANCED LOGIC TECHNOLOGY ROADMAPS
    • 3.3.4.2 DRAM TECHNOLOGY ROADMAPS
    • 3.3.4.3 3D NAND TECHNOLOGY ROADMAPS
  • 3.3.5 FAB INVESTMENT ASSESSMENT
• 3.4 POLICY - TRADE TRENDS AND IMPACT
• 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
  • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
  • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 CMP CONSUMABLES TRENDS

• 4.1 CMP PADS AND SLURRIES (CONSUMABLES) MARKET TRENDS - OUTLINE
• 4.2 REGIONAL TRENDS
  • 4.2.1 REGIONAL TRENDS AND DRIVERS
• 4.3 CMP CONSUMABLES MARKET TRENDS
  • 4.3.1 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS - ADVANCED LOGIC
    • 4.3.1.1 ADVANCED LOGIC TRANSISTOR EST. ROADMAP
  • 4.3.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS - MEMORY
    • 4.3.2.1 3D NAND ROADMAP
    • 4.3.2.2 3D NAND STACKING
  • 4.3.3 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
  • 4.3.4 TECHNICAL TRENDS IN ADVANCED PACKAGING
  • 4.3.5 TECHNICAL TRENDS IN ADVANCED PACKAGING, CONTINUED
    • 4.3.5.1 CMP FOR TSV - GAA BACKSIDE POWER
  • 4.3.6 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
• 4.4 EHS ISSUES FOR NEW MATERIALS
  • 4.4.1 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
• 4.5 LOGISTIC ISSUES

5 CMP SLURRY SUPPLIER MARKET

• 5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST
• 5.2 CMP SLURRIES 5-YEAR FORECAST BY UNITS
• 5.3 CMP SLURRY MARKET LEADERS
  • 5.3.1 TOTAL SLURRY MARKET SHARE BY REGION
  • 5.3.2 TOTAL SLURRY MARKET SHARE
    • 5.3.2.1 OXIDE (CERIA) SLURRY MARKET
    • 5.3.2.2 HKMG SLURRY MARKET
    • 5.3.2.3 POLYSILICON SLURRY MARKET
    • 5.3.2.4 OXIDE (SILICA) SLURRY MARKET
    • 5.3.2.5 TUNGSTEN SLURRY MARKET
    • 5.3.2.6 CU BULK SLURRY MARKET
    • 5.3.2.7 COPPER BARRIER SLURRY MARKET
    • 5.3.2.8 NEW METALS (CO, MO, RU, ETC.) SLURRY MARKET
    • 5.3.2.9 CU BACKSIDE POWER SLURRY MARKET
• 5.4 CMP SLURRY M-A ACTIVITY, INVESTMENTS, ANNOUNCEMENTS AND PARTNERSHIPS
• 5.5 CMP SLURRY PLANT CLOSURES - NONE
• 5.6 NEW ENTRANTS
• 5.7 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF DISCONTINUATIONS
• 5.8 CMP SLURRY PRICING TRENDS
• 5.9 TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET

6 CMP PAD MARKET STATISTICS & FORECASTS

• 6.1 CMP PADS 5-YEAR REVENUE FORECAST
• 6.2 CMP PADS 5-YEAR REVENUE FORECAST
  • 6.2.1 CMP PADS 5-YEAR FORECAST BY UNITS
• 6.3 PAD SUPPLIER COMPETITIVE LANDSCAPE
• 6.4 NEW ENTRANTS
• 6.5 CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
• 6.6 CMP PAD PRICING TRENDS
• 6.7 TECHCET ANALYST ASSESSMENT

7 MATERIAL SUB-TIER SUPPLY

• 7.1 ABRASIVE SUPPLIERS
• 7.2 VERTICALLY INTEGRATED SUPPLIERS
• 7.3 RAW SUPPLY CHAIN DISRUPTORS
• 7.4 RAW MATERIALS M-A ACTIVITY
• 7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
• 7.6 ABRASIVE SUPPLY-CHAIN "NEW" ENTRANTS - NONE
• 7.7 ABRASIVE SUPPLY-CHAIN PRICING TRENDS
• 7.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

8 SUPPLIER PROFILES

• 3M Company
• Abrasive Technology
• Ace NanoChem
• Anji Micro Shanghai
• Asahi Glass
• ...and 40+ more

9 APPENDIX

• 9.1 BACKSIDE TECHNOLOGY TRENDS
• 9.2 CMP OF SILICON CARBIDE
  • 9.2.1 SILICON CARBIDE DEFECTS
  • 9.2.2 CMP CHALLENGES IN SILICON CARBIDE
• 9.3 OXIDE (CERIA) SLURRY USES
• 9.4 HKMG SLURRY MARKET
• 9.5 POLYSILICON SLURRY FOR MEMS

TABLE OF FIGURES

• FIGURE 1.1: FORECASTED 2024 MARKET SIZE
• FIGURE 1.2: CMP CONSUMABLES FORECAST
• FIGURE 1.3: CMP STEPS FOR ADVANCED DEVICES
• FIGURE 1.4: 2023 CMP CONSUMABLES REVENUE
• FIGURE 1.5: CMP CONSUMABLES REVENUE BY APPLICATION
• FIGURE 1.6: CMP SLURRY REVENUE BY APPLICATION
• FIGURE 1.7: CMP PAD REVENUE BY APPLICATION
• FIGURE 1.8: CMOS TECHNOLOGY ROADMAP
• FIGURE 1.9: 2023 SLURRY SUPPLIER MARKET SHARES
• FIGURE 1.10: 2023 PAD SUPPLIER MARKET SHARES
• FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
• FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
• FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
• FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
• FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
• FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
• FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
• FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
• FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
• FIGURE 3.10: TSMC PHOENIX INVESTMENT ESTIMATED TO BE US $40 B
• FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2022-2027
• FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
• FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
• FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
• FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
• FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
• FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
• FIGURE 3.18: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
• FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
• FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
• FIGURE 4.1: SLURRY AND PAD REVENUE BY HQ REGION
• FIGURE 4.2: CMP SLURRIES AND PADS REVENUE
• FIGURE 4.3: CMP STEPS FOR LOGIC NODES
• FIGURE 4.4: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
• FIGURE 4.5: 3D NAND ROADMAP BY NODE
• FIGURE 4.6: STACKING FOR 3D NAND
• FIGURE 4.7: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
• FIGURE 4.8: ADV LOGIC TRANSITION TO BACKSIDE POWER
• FIGURE 4.9: CMP OPPORTUNITIES IN ADVANCED PACKAGING
• FIGURE 4.10: KEY TRENDS IN ADVANCED PACKAGING
• FIGURE 4.11: CMP OPPORTUNITIES IN ADVANCED PACKAGING
• FIGURE 5.1: CMP SLURRY REVENUE BY APPLICATION
• FIGURE 5.2: FORECASTED SLURRY VOLUME DEMAND
• FIGURE 5.3: SLURRY REGIONAL MARKET SHARES IN 2023- $2B
• FIGURE 5.4: SLURRY SUPPLIER MARKET SHARES IN 2023- $2B
• FIGURE 5.5: OXIDE (CERIA) CMP SLURRY 2023 - $399M MARKET SHARE
• FIGURE 5.6: HKMG/FRONT-END CMP SLURRY 2023 - $67M MARKET SHARE
• FIGURE 5.7: POLYSILICON CMP SLURRY 2023 - $40M MARKET SHARE
• FIGURE 5.8: OXIDE (SILICA) CMP SLURRY 2023 - $236M MARKET SHARE
• FIGURE 5.9: TUNGSTEN CMP SLURRY 2023 - $429M MARKET SHARE
• FIGURE 5.10: CU-BULK CMP SLURRY 2023 - $302M MARKET SHARE
• FIGURE 5.11: CU-BARRIER CMP SLURRY 2023 SUPPLIER MARKET SHARE
• FIGURE 5.12: NEW METALS CMP SLURRY 2023 MARKET SHARE - $3M
• FIGURE 5.13: CU BACKSIDE POWER CMP SLURRY 2023 MARKET SHARE - $1M
• FIGURE 6.1: CMP PAD REVENUE FORECAST BY APPLICATION
• FIGURE 6.2: CMP PAD REVENUE BY WAFER SIZE
• FIGURE 6.3: FORECASTED QUANTITY PAD USAGE
• FIGURE 6.4: 2022 PAD SUPPLIER MARKET SHARES
• FIGURE 9.1: LIMITATIONS OF FS-PDN
• FIGURE 9.2: 2D DEVICE ARCHITECTURE EVOLUTION
• FIGURE 9.3: SILICON CARBIDE-BASED POWER DEVICE
• FIGURE 9.4: DEFECTS IN SILICON CARBIDE SUBSTRATES AND EPI WAFERS
• FIGURE 9.5: SILICON CARBIDE DEFECTS
• FIGURE 9.6: BATCH POLISH VS. CMP
• FIGURE 9.7: STI CMP PROCESS
• FIGURE 9.8: MEMS CMP CROSS SECTION

TABLES

• TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
• TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024)
• TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
• TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
• TABLE 4.1: REGIONAL WAFER MARKETS
• TABLE 4.2: REGIONAL WAFER MARKETS BY SUPPLIER HEADQUARTER REGION
• TABLE 4.3: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
• TABLE 5.1: 2023 SLURRY MARKET LEADERS AND TAM BY APPLICATION
• TABLE 7.1: ABRASIVE SUPPLIERS
• TABLE 7.2: VERTICALLY INTEGRATED SUPPLIERS