세계의 WLCSP 무전해 도금 시장 보고서(2025년)
WLCSP Electroless Plating Global Market Report 2025
상품코드 : 1802632
리서치사 : The Business Research Company
발행일 : On Demand Report
페이지 정보 : 영문 250 Pages
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한글목차

WLCSP 무전해 도금 시장 규모는 향후 수년간 강력한 성장이 예상됩니다. 2029년에는 CAGR 9.6%를 나타내 37억 5,000만 달러로 성장할 전망입니다. 예측기간의 성장은 차량용 전자기술의 발전, 5G 기술의 통합, IoT의 성장, 웨어러블 수요 증가, AI 디바이스의 확대, 에너지 효율적인 전자기술에 기인한다고 생각됩니다. 예측기간의 주요 동향으로는 고속·고주파 용도에 대한 주력, 열 관리 강화 수요, 5G 기술 도입 증가, 특정의 산업 요건에 맞춘 커스터마이즈, 환경 지속가능성에 대한 주력 등이 있습니다.

향후 5년간의 성장률 9.6%라고 하는 예측은 이 시장에 관한 전회의 예측으로부터 0.6%의 소폭의 감소를 반영하고 있습니다. 이 감소는 주로 미국과 다른 국가 간의 관세의 영향 때문입니다. 주로 싱가포르와 독일에서 조달하고 있는 니켈·린 도금액과 웨이퍼 레벨의 패키징 장치에 대한 관세가 상승하고, 반도체 패키징 비용이 상승하는 것으로, 미국에 직접 영향이 미칠 가능성이 높습니다. 또한 상호관세와 무역의 긴장과 한계 증가로 인한 세계경제와 무역에 대한 악영향으로 인해 영향이 보다 광범위해질 것으로 보입니다.

5G 네트워크의 성장은 향후 수년간 WLCSP 무전해 도금 시장 확대를 견인할 것으로 예측됩니다. 이러한 성장은 주로 보다 빠른 데이터 통신, 네트워크 신뢰성 향상, 사물 인터넷(IoT) 연결성 향상, 증강현실(AR), 가상현실(VR), 자율 주행 차량 등 신기술을 지원할 필요성이 높아졌기 때문입니다. 5G 네트워크의 개발로 고성능으로 소형화된 부품이 필요하고, 소형 기기에서의 데이터 처리의 고속화와 접속성의 향상을 촉진하기 위해 정밀하고 신뢰성 높은 도금 솔루션이 필요하기 때문에 WLCSP 무전해 도금 수요가 높아집니다. 예를 들어, 2023년 2월 독일에 본사를 둔 이동통신사인 T-Mobile International AG는 50억 건이 50억 건을 능가하는 5G계약이 10억 건을 넘었다고 보고했으며, 2028년 말까지 50억명이 5G계약을 맺을 것으로 예측했습니다. 따라서 5G 네트워크의 확대가 WLCSP 무전해 도금 시장을 크게 견인하고 있습니다.

목차

제1장 주요 요약

제2장 시장 특징

제3장 시장 동향과 전략

제4장 시장 - 거시경제 시나리오 금리, 인플레이션, 지정학, 무역전쟁과 관세, 그리고 코로나 및 회복이 시장에 미치는 영향을 포함한 거시경제 시나리오

제5장 세계의 성장 분석과 전략 분석 프레임워크

제6장 시장 세분화

제7장 지역별/국가별 분석

제8장 아시아태평양 시장

제9장 중국 시장

제10장 인도 시장

제11장 일본 시장

제12장 호주 시장

제13장 인도네시아 시장

제14장 한국 시장

제15장 서유럽 시장

제16장 영국 시장

제17장 독일 시장

제18장 프랑스 시장

제19장 이탈리아 시장

제20장 스페인 시장

제21장 동유럽 시장

제22장 러시아 시장

제23장 북미 시장

제24장 미국 시장

제25장 캐나다 시장

제26장 남미 시장

제27장 브라질 시장

제28장 중동 시장

제29장 아프리카 시장

제30장 경쟁 구도와 기업 프로파일

제31장 기타 주요 기업 및 혁신 기업

제32장 세계 시장 경쟁 벤치마킹과 대시보드

제33장 주요 인수합병(M&A)

제34장 최근 시장 동향

제35장 시장의 잠재력이 높은 국가, 부문, 전략

제36장 부록

KTH
영문 목차

영문목차

WLCSP electroless plating is a true chip-scale packaging technology that minimizes package size and enhances thermal conduction in chips, connecting the printed circuit board using solder balls.

In the WLCSP (wafer-level chip-scale packaging) electroless plating market, the main types of plating are nickel, copper, composites, and others. Nickel is a lustrous silvery-white metal used to protect parts from natural wear, abrasion, and corrosion. It finds applications in corrosion resistance, wear resistance, appearance enhancement, solderability improvement, and other areas requiring enhanced conductivity. Industries that utilize nickel electroless plating include automotive, electronics, aerospace, machinery, and others.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The sharp escalation of U.S. tariffs and resulting trade tensions in spring 2025 are significantly affecting the electrical and electronics sector. Key components such as semiconductors, display panels, and rare-earth metals crucial for batteries and motors are now facing heavy duties. Consumer electronics companies are seeing profit margins shrink, as fierce competition makes it difficult to pass on rising costs to consumers. At the same time, industrial electronics firms are experiencing project delays due to shortages of tariff-impacted parts like printed circuit boards. In response, businesses are shifting assembly operations to tariff-exempt nations, building up inventory reserves, and redesigning products to reduce reliance on restricted materials.

The WLCSP electroless plating market research report is one of a series of new reports from The Business Research Company that provides WLCSP electroless plating market statistics, including WLCSP electroless plating industry global market size, regional shares, competitors with a WLCSP electroless plating market share, detailed WLCSP electroless plating market segments, market trends and opportunities, and any further data you may need to thrive in the WLCSP electroless plating industry. This WLCSP electroless plating market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The wlcsp electroless plating market size has grown strongly in recent years. It will grow from $2.41 billion in 2024 to $2.59 billion in 2025 at a compound annual growth rate (CAGR) of 7.7%. The growth in the historic period can be attributed to semiconductor industry growth, miniaturization trends, consumer electronics demand, automotive electronics, high-performance computing.

The wlcsp electroless plating market size is expected to see strong growth in the next few years. It will grow to $3.75 billion in 2029 at a compound annual growth rate (CAGR) of 9.6%. The growth in the forecast period can be attributed to advancements in automotive electronics, 5G technology integration, IoT growth, rising demand for wearables, expansion of AI devices, energy-efficient electronics. Major trends in the forecast period include focus on high-speed and high-frequency applications, demand for enhanced thermal management, rise in 5G technology implementation, customization for specific industry requirements, focus on environmental sustainability.

The forecast of 9.6% growth over the next five years reflects a modest reduction of 0.6% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through higher tariffs on nickel-phosphorus plating solutions and wafer-level packaging equipment, predominantly sourced from Singapore and Germany, increasing semiconductor packaging costs. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

The growth of 5G networks is anticipated to drive the expansion of the WLCSP electroless plating market in the coming years. This growth is primarily due to the rising demand for higher data speeds, enhanced network reliability, improved connectivity for the Internet of Things (IoT), and the necessity to support emerging technologies like augmented reality (AR), virtual reality (VR), and autonomous vehicles. The development of 5G networks boosts the demand for WLCSP electroless plating by necessitating high-performance, miniaturized components that require precise and reliable plating solutions to facilitate faster data processing and improved connectivity in compact devices. For instance, in February 2023, T-Mobile International AG, a Germany-based mobile telecommunications company, reported that there were over 1 billion active 5G subscriptions, with projections indicating that 5 billion individuals will have 5G subscriptions by the end of 2028. Hence, the expansion of 5G networks is significantly driving the WLCSP electroless plating market.

The anticipated surge in the WLCSP (wafer-level chip-scale package) electroless plating market is propelled by the global escalation in electronics manufacturing. Electronics manufacturing involves the large-scale production of electronic components, devices, and systems. The heightened global activity in electronics manufacturing, driven by consumer electronics, communication devices, and industrial applications, finds support in electroless plating. This process facilitates precise bump formation, underfill encapsulation, and passivation, enabling the creation of dependable, high-performance WLCSP packages for a diverse array of electronic applications. For example, as reported by Earthweb Inc. in February 2023, Lenovo, the world's largest PC seller, recorded sales of approximately 17 million computers in the third quarter of 2022. This figure surpasses HP's 12.71 million, Apple's 5.80 million, and Dell's 12.02 million shipments. Hence, the global upswing in electronics manufacturing remains the driving force behind the growth of the WLCSP electroless plating market.

Product innovation is a significant trend in the WLCSP (Wafer-Level Chip Scale Package) electroless plating market, with major players focusing on developing new products to enhance their position. For example, in January 2023, TWI Ltd., a UK-based technology engineering company, introduced an electroless nickel-phosphorus plating (ENP) composite coating. ENP coating finds applications in various sectors such as aviation, oil and gas, geothermal energy, construction, and electronics due to its exceptional mechanical and tribological properties, including high hardness, wear resistance, and corrosion resistance. The resilience to damage and deterioration, as well as antifouling and anti-scaling properties of ENP coatings, can be controlled by modifying the microstructure through methods such as altering the alloy chemistry (e.g., phosphorus concentration, including nanoparticles) and post-plating heat treatment. Additionally, nanoparticles can enhance coating properties such as hydrophobicity, hardness, wear resistance, and low coefficient of friction (CTE).

Leading companies in the WLCSP (wafer-level chip scale package) electroless plating market are concentrating on expanding their facilities to better cater to the needs of their existing consumers. A manufacturing facility is a building or complex where raw materials are transformed into finished goods. For example, in October 2023, Amkor Technology, Inc., a US-based company specializing in WLCSP electroless plating, revealed plans for the construction of a new facility in Vietnam. This Vietnam campus is set to become Amkor's largest factory, covering an extensive 57-acre area within the Yen Phong 2C Industrial Park. Amkor has allocated an investment of US$1.6 billion for the first two phases of the project, which includes facilities, machinery, and equipment. This significant investment in manufacturing in Vietnam will enable Amkor to offer an unparalleled geographic footprint to its clients, serving both global and regional supply chains. It will provide the secure and reliable supply chain that clients in communications, automotive, high-performance computing, and other critical sectors seek.

In January 2023, LB Semicon, a South Korea-based semiconductor chip manufacturing company, acquired the VertaCure XP G2 system from Yield Engineering Systems, Inc. for an undisclosed sum. This acquisition was aimed at enhancing LB Semicon's capabilities in the bump/RDL application for wafer-level chip-scale packaging (WLCSP). The VertaCure XP G2 system is known for its improved throughput, excellent particle performance, and comprehensive PI/PBO curing capabilities, all of which are attributed to its established vacuum-based method. Yield Engineering Systems, Inc., based in the US, specializes in manufacturing equipment that supports wafer-level chip-scale packaging.

Major companies operating in the WLCSP electroless plating market include Heraeus Holding GmbH, DuPont de Nemours Inc., Olin Corporation, Rockwell Automation Inc., Shanghai Aiko Chemical Co Ltd., MKS Instruments Inc., MacDermid Inc., Shikoku Chemicals Corporation, Atotech Deutschland GmbH, Nihon Parkerizing Co Ltd., C. Uyemura & Co Ltd., Enthone Inc., Nippon Seisen Kogyo Co Ltd., Coventya International GmbH, Park Chemical Corporation, Allied Finishing Inc., Nanophase Technologies Corporation, Precision Plating Co, ERIE PLATING COMPANY, Harwick Standard Distributors Inc., KC Jones Plating Company, ARC Technologies Inc., Klein Plating Works Inc., Bales Metal Surface Solutions, Peninsula Metal Finishing Inc., Okuno Chemical Industries Co Ltd., Bajaj Electroplaters Private Limited, Electroless Nickel Inc., Plating Specialties Inc., Surface Technology Inc., Umicore N.V., Uyemura Kogyo Co Ltd., VATEC Co Ltd.

Europe was the largest region in the WLCSP electroless plating market in 2024. Asia-Pacific is expected to be the fastest-growing region in the WLCSP electroless plating market report during the forecast period. The regions covered in the wlcsp electroless plating market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the wlcsp electroless plating market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The WLCSP electroless plating market consists of revenues earned by entities by providing WLCSP electroless plating services such as layout & mask tooling, wafer RDL patterning and bumping (ball sphere loaded or plated), automated optical inspection (AOI) for quality assurance and wafer map generation. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

WLCSP Electroless Plating Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on wlcsp electroless plating market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

Where is the largest and fastest growing market for wlcsp electroless plating ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The wlcsp electroless plating market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

Scope

Table of Contents

1. Executive Summary

2. WLCSP Electroless Plating Market Characteristics

3. WLCSP Electroless Plating Market Trends And Strategies

4. WLCSP Electroless Plating Market - Macro Economic Scenario Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

5. Global WLCSP Electroless Plating Growth Analysis And Strategic Analysis Framework

6. WLCSP Electroless Plating Market Segmentation

7. WLCSP Electroless Plating Market Regional And Country Analysis

8. Asia-Pacific WLCSP Electroless Plating Market

9. China WLCSP Electroless Plating Market

10. India WLCSP Electroless Plating Market

11. Japan WLCSP Electroless Plating Market

12. Australia WLCSP Electroless Plating Market

13. Indonesia WLCSP Electroless Plating Market

14. South Korea WLCSP Electroless Plating Market

15. Western Europe WLCSP Electroless Plating Market

16. UK WLCSP Electroless Plating Market

17. Germany WLCSP Electroless Plating Market

18. France WLCSP Electroless Plating Market

19. Italy WLCSP Electroless Plating Market

20. Spain WLCSP Electroless Plating Market

21. Eastern Europe WLCSP Electroless Plating Market

22. Russia WLCSP Electroless Plating Market

23. North America WLCSP Electroless Plating Market

24. USA WLCSP Electroless Plating Market

25. Canada WLCSP Electroless Plating Market

26. South America WLCSP Electroless Plating Market

27. Brazil WLCSP Electroless Plating Market

28. Middle East WLCSP Electroless Plating Market

29. Africa WLCSP Electroless Plating Market

30. WLCSP Electroless Plating Market Competitive Landscape And Company Profiles

31. WLCSP Electroless Plating Market Other Major And Innovative Companies

32. Global WLCSP Electroless Plating Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The WLCSP Electroless Plating Market

34. Recent Developments In The WLCSP Electroless Plating Market

35. WLCSP Electroless Plating Market High Potential Countries, Segments and Strategies

36. Appendix

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