Autonomous Driving Domain Controller and Central Control Unit (CCU) Industry Report, 2024-2025
상품코드:1628696
리서치사:ResearchInChina
발행일:2024년 12월
페이지 정보:영문 500 Pages
라이선스 & 가격 (부가세 별도)
한글목차
자율주행 도메인 컨트롤러 조사 : 원보드/원칩 솔루션이 자동차 공급망에 큰 영향을 미칠 것입니다.
자율주행 도메인 컨트롤러의 세 가지 개발 단계 : 멀티보드, 원보드, 원칩
ResearchInChina에 따르면, 2024년 1월부터 9월까지 중국 시장 승용차(수출입 제외)에 탑재된 OEM 지능형 주행 도메인 컨트롤러는 225만 4,000세트에 달했으며, 2023년 이후 자율주행 도메인 컨트롤러의 보급률은 월별로 급증하여 2024년 9월에는 전년 동기 8.61% 대비 17.4%에 달했습니다.
주요 OEM의 경우, 자율주행 도메인 컨트롤러의 개발 및 적용이 확산되고 있으며, 다음 단계는 중앙제어장치(CCU)로 진화할 것입니다. 본 보고서에서는 자율주행 도메인 컨트롤러의 개발을 3단계로 나누어 설명합니다.
1단계 : 멀티/원박스, 멀티보드, 멀티칩
멀티 박스 솔루션에서 각 도메인 컨트롤러는 독립적인 회로 기판을 가지고 있으며, 데이터는 이더넷을 통해 도메인 간에 전송됩니다. 이는 성숙한 기술과 제어 가능한 비용을 가지고 있지만 이더넷 전송 속도(주로 100-1000Mb/s)에 제한이 있는 현재의 일반적인 도메인 중앙 집중형 EEA를 반영합니다.
2단계 : 원박스, 원보드, 멀티칩
차량 내 서로 다른 도메인 간의 인코딩 및 디코딩이 필요하지 않으므로 인코딩 및 디코딩을 위한 칩, 전원 공급 장치, 방열 및 배선 하네스를 절약하고 비용을 절감할 수 있습니다. 칩은 PCIe 인터페이스를 통해 데이터를 전송합니다. 현재 자동차 시스템에서 PCIe 4세대는 16GT/s, 레인당 1.97Gb/s의 전송 속도로 널리 사용되고 있습니다. 멀티 레인 집적화를 통해 PCIe 4세대 전송 속도는 일반적으로 10Gb/s 이상으로 이더넷의 전송 속도를 훨씬 능가합니다.
이 단계에서는 바디 도메인과 게이트웨이 기능이 통합되고 NXP S32G, SemiDrive G9H, RenesasRH850과 같은 중앙 게이트웨이 칩이 탑재됩니다.
3단계 : 원박스, 원칩
도메인 컨트롤러 SoC는 칩 간 통신으로 상호연결된 여러 IP 코어를 갖추고 있습니다. 향후 많은 고성능 전기자동차는 Transformer, 대규모 언어 모델(LLM) 및 생성형 AI 워크로드를 위해 설계된 NVIDIA Blackwell 아키텍처 기반의 차세대 자율주행차(AV) 프로세서인 DRIVE Thor를 탑재하게 될 것입니다. 엔비디아는 차세대 토르에 NVLink 5 인터커넥트(NVLink 5 Interconnect) 기술을 탑재했습니다. 칩 메모리의 대역폭은 초당 100Gb를 초과할 수도 있습니다.
전체적으로 1단계의 멀티보드 솔루션은 기본적으로 실현되고 있으며, NIO와 Xpeng 등 주요 신흥 OEM은 2단계로 진입하여 원보드 솔루션을 대량 생산하여 제공하고 있습니다. 일부 OEM은 3단계인 원칩 솔루션으로 바로 넘어갈 수 있으며, 2025년은 원칩 솔루션이 탄생하는 첫 해가 될 것으로 예상됩니다. 이 과정에서 일반적으로 섀시 및 전원 공급 장치 도메인은 원칩 솔루션과 통합되지 않습니다. 이는 주로 공급업체가 상대적으로 폐쇄적 인 솔루션을 제공하고 OEM에 권한을 부여 할 가능성이 낮기 때문입니다.
AI 기반 모델은 OEM 간의 경쟁의 초점이 되고 있습니다. 고대역폭 기능을 갖춘 원칩 솔루션은 모든 소프트웨어가 데이터와 계산 능력을 공유하여 엔드투엔드 기반 모델, LLM 등의 구현을 지원합니다.
이 보고서는 중국의 자율주행 도메인 컨트롤러 및 중앙제어장치(CCU) 산업에 대해 조사 분석했으며, 시장 규모와 보급률 예측, 국내외 벤더 및 솔루션 정보 등을 제공합니다.
목차
제1장 자율주행 도메인 컨트롤러 및 중앙제어장치(CCU)의 정의와 시장
정의
중국의 승용차용 자율주행 시스템 시장 규모와 보급률 예측
중국의 승용차용 자율주행 도메인 컨트롤러 시장 규모와 보급률 예측
중국의 승용차용 자율주행 도메인 컨트롤러와 메인 컨트롤 SoC 벤더의 시장 점유율 : 가격대별
중국의 승용차용 자율주행 도메인 컨트롤러 비용
제2장 Tier 1 각사와 OEM 각사의 자율주행 도메인 컨트롤러 및 CCU 요약
중국의 초고연산 능력 승용차용 자율주행 도메인 컨트롤러 비교
중국의 고연산 능력 승용차용 자율주행 도메인 컨트롤러 비교
중국의 중연산 능력 승용차용 자율주행 도메인 컨트롤러 비교
중국의 중-저연산 능력 승용차용 자율주행 도메인 컨트롤러 비교
중국의 저연산 능력 승용차용 자율주행 도메인 컨트롤러 비교
Tier 1 각사의 자율주행 도메인 컨트롤러와 시스템 솔루션 요약
OEM 각사의 자율주행 도메인 컨트롤러와 시스템 솔루션
제3장 국외 칩 플랫폼용 자율주행 도메인 컨트롤러 솔루션
NVIDIA Thor
ORIN-X/Y/N
NVIDIA Xavier
Qualcomm Snapdragon Ride/Flex
Mobileye EyeQ6
Mobileye EyeQ5
TI TDA4
Renesas R-Car
Ambarella CV
제4장 국내 칩 플랫폼용 자율주행 도메인 컨트롤러 솔루션
Horizon J6
Horizon J5
Horizon J3
Horizon J2
SemiDrive V9/X9
Black Sesame A1000
Black Sesame C1000
Huawei Ascend
제5장 중국의 자율주행 도메인 컨트롤러 벤더
ECARX
Desay SV
Huawei
DJI Automotive(Zhuoyu)
Neusoft Reach
Freetech
iMotion
Lenovo Vehicle Computing
Z-ONE Tech
Technomous
Hong Jing Drive
Motovis
MINIEYE
MAXIEYE
ZongMu Technology
Baidu Apollo
Joynext
Yihang.AI
Jingwei Hirain
NavInfo
G-Pulse
CICTCI
ThunderX
ADAYO Group
Lan-You Technology
Nullmax
Nanjing SD
TZTEK
Haomo.AI
제6장 국외의 자율주행 도메인 컨트롤러 벤더
Tesla
Bosch
Continental
ZF
Aptiv
Magna
Valeo
제7장 자율주행 도메인 컨트롤러 EMS 기업
도메인 컨트롤러 EMS 모델
대표적인 자율주행 도메인 컨트롤러 EMS 기업
ksm
영문 목차
영문목차
Autonomous Driving Domain Controller Research: One Board/One Chip Solution Will Have Profound Impacts on the Automotive Supply Chain
Three development stages of autonomous driving domain controller: Multi-Board, One Board, One Chip
As per ResearchInChina, passenger cars (excluding imports and exports) in the Chinese market were installed with 2.254 million sets of OEM intelligent driving domain controllers as standard from January to September 2024. Since 2023, the penetration rate of autonomous driving domain controllers has surged month by month, hitting 17.4% in September 2024, compared with only 8.61% in the same period last year.
For major OEMs, the development and application of autonomous driving domain controllers have become widespread, and they will evolve towards central control units (CCUs) in the next stage. This report divides the development of autonomous driving domain controllers into three stages:
Stage 1: Multi/One Box, Multi-Board, Multi-Chip
In a Multi-Box solution, each domain controller has a separate circuit board, and data is transmitted between domains via Ethernet. This reflects the current popular domain-centralized EEA with mature technology and controllable cost but limited Ethernet transmission rate (mostly 100-1000Mb/s).
Stage 2: One Box, One Board, Multi-Chip
Encoding and decoding are no longer needed between different domains in the vehicle, so that the chips, power supplies, heat dissipation and wiring harnesses for encoding and decoding can be saved, which reduces costs. Chips transmit data through the PCIe interface. Currently, PCIe Gen 4 is widely used in automotive systems, with 16 GT/s, and a transfer rate of 1.97 Gb/s per lane. Through multi-lane aggregation, the transfer rate of PCIe Gen 4 is generally 10Gb/s+, much higher than that of Ethernet.
At this stage, body domain and gateway functions are integrated and equipped with central gateway chips such as NXP S32G, SemiDrive G9H, and Renesas RH850.
Stage 3: One Box, One Chip
A domain controller SoC has multiple IP cores which are interconnected by inter-chip communication. Many high-performance electric vehicles in the future will pack DRIVE Thor, NVIDIA's next-generation autonomous vehicle (AV) processor based on the NVIDIA Blackwell architecture which is designed for Transformer, Large Language Models (LLM) and generative AI workloads. NVIDIA has equipped the next-generation Thor with NVLink 5 interconnect technology. The chip memory bandwidth can reach over 100 Gb/s.
On the whole, the Multi-Board solution in Stage 1 has been basically realized. Leading emerging OEMs, such as NIO and Xpeng, have entered Stage 2, and have mass-produced and delivered the One Board solution. Some OEMs may directly jump to Stage 3 - the One Chip solution. It is expected that 2025 will be the first year for the One Chip solution to be spawned. In this process, generally the chassis and power domains will not be integrated with the One Chip solution, mainly because suppliers offer relatively closed solutions and it is unlikely that they will grant OEMs permissions.
AI foundation models are the focus of competition among OEMs. The One Chip solution with high bandwidth capabilities allows all software to share data and computing power, and supports the implementation of end-to-end foundation models, LLMs, etc.
In addition, the One Chip solution makes the free combination of IP cores a possibility, and chips designed based on the Chiplet architecture will become one of the important directions for the development of automotive chips in the next decade.
Autonomous driving domain controller development strategy - the industry is rapidly deploying One Board and One Chip solutions.
In 2024, the industry is rapidly deploying One Board and One Chip intelligent driving domain controller solutions under the pressure to further reduce costs.
ECARX's Layout of "One Board" and "One Chip"
"One board": In the design of the "One Board" solution, ECARX focuses on the domestic production-ready chip strategy. In terms of hardware, it adopts the "one board and dual chip" architecture design, and uses the domestic mature 7nm automotive-grade chip (Longying No.1) and intelligent driving SoC (Huashan A1000) as two master SoCs for high-speed interconnect via PCIe. As for software, the highly standardized and modular "Cloudpeak" cross-domain software platform enables the interconnection and interoperability of functional domains, thereby realizing the mass production of "One Board and Multi-Chip" domain controller/central computing platforms.
Wherein, ECARX Skyland Pro, an intelligent driving computing platform equipped with two "Huashan A1000" chips and the ECARX Antora(R) 1000 Pro computing platform fitted with two "Longying No.1" chips, have been spawned and delivered for Lynk & Co. 08 EM-P and Lynk & Co 07 EM-P.
"One Chip": ECARX has created two "cockpit-parking integration" One Chip products based on China's first 7nm automotive-grade SoC "Longying No.1" (8 TOPS): "ECARX Antora(R) 1000 Computing Platform (AI Enhanced Version)" and "ECARX Super Brain" (R) Antora 1000 Plus Computing Platform". The two products have been mass-produced and installed in Geely Galaxy E5 and Lynk & Co Z20 respectively. Galaxy E5 enjoys good reputation in terms of intelligence and performs well in the market, and it has received good market feedback at the mass production level.
The more integrated "cockpit-driving-parking integration" version can support the development of cockpit-driving-parking integration functions including L2 ADAS, automated parking, and mainstream cockpit functions. It is extremely cost-effective and is expected to be available to vehicles in 2025. It is reported that ECARX may develop a cockpit-driving-parking integration solution based on the upgraded "Longying No.1 Pro" (56 TOPS) to support higher-level cockpit-driving-parking integration functions.
Desay SV's Layout of "One Chip" - IPU14 & ICPS01E
IPU14: In October 2024, Desay SV publicly exhibited IPU14, its next-generation high-performance intelligent driving domain controller, for the first time. Equipped with NVIDIA's most powerful intelligent driving chip - Thor-U, IPU14 supports one-chip cockpit-driving integration, L3 conditional autonomous driving, and L4 autonomous driving in some scenarios;
ICPS01E: In October 2024, the "8775 cockpit-driving integrated central computing platform" co-developed by Desay SV and Chery made a debut. In the joint development process, Chery provided vehicle resources, and Desay SV undertook specific product development.
Z-One's "One Board" Product - ZXD2
In September 2024, Z-One officially announced that the prototype of ZXD2 (Z-ONE X Device), Z-One's second-generation central brain based on Horizon Journey(R) 6 and Qualcomm's latest cockpit SoC, was lighted up.
ZXD2 realizes the cross-domain integration of intelligent driving, intelligent cockpit, intelligent computing and other systems.
ZXD2 also adopts the One Box software and hardware integrated design, which reduces the weight of the computing platform by 40%, downsizes the volume by 30%, improves computing power and storage efficiency by 30%, increases data communication bandwidth by 30 times, and shortens the vehicle OTA update time to 30 minutes.
Some OEMs like Xpeng and NIO have implemented mass production of "One Board and Multi-Chip" domain controller computing platforms.
Xpeng's "One Board" Product - XCCP
It combines C-DCU and XPU, and enables integration of such functions as intelligent driving, cockpit, cluster, gateway, IMU, and power amplifier. Compared with the previous central computing architecture, XCCP saves costs by 40% and improves performance by 50%.
Xpeng X9 has achieved cockpit-driving integration. The communication between the two chips on the same circuit board lies in PCIe, with the rate up to 10 Gb/s;
NIO's "One Board" Product - ADAM
The cockpit-driving integration solution involves a Qualcomm Snapdragon 8295 intelligent cockpit chip and 4 NVIDIA Orin X intelligent driving chips. The new central computing platform integrates more than 12,000 devices, solving technical challenges such as PI/SI, EMC and Thermal posed by high integration. It is 40% smaller and 20% lighter than a cockpit-driving separation domain controller.
The central computing platform ADAM can eliminate the need for encoding and decoding between different domains in the vehicle, saving the chips, power supplies, heat dissipation and wiring harnesses for encoding and decoding. The etched circuit on the circuit board directly replaces Gigabit Ethernet, and the data bandwidth between the intelligent driving domain and the cockpit domain is greatly increased from Gigabit to 16Gbps, realizing a more than 10-fold increase in transfer rate.
Cross-domain computing power sharing can call up to 256TOPS computing power for intelligent driving, intelligent cockpit and vehicle control. Cross-domain computing power sharing also allows for more reasonable allocation of computing power, rather than completely limits it to either of the intelligent driving domain or the intelligent cockpit domain.
The One Chip solution will have profound impacts on the automotive domain controller and chip supply chain.
The One Chip solution may be the ultimate form of "cockpit-driving integration", and its advantages lie in:
1) Lower system cost: the one SoC solution is more integrated, and enables material sharing, with lower BOM costs.
2) Quicker system response: compared with inter-board Switch communication or inter-chip PCIe communication, intra-chip communication features shorter delay, higher bandwidth, and quicker system response.
3) Software shares data and computing power: a unified vehicle operating system supports end-to-end foundation models, language large models, etc.
Under the One Chip solution, typical multi-domain fusion SoCs include NVIDIA Drive Thor, Qualcomm Snapdragon Ride Flex SA8775 and SA8795, Black Sesame "Wudang" C1200 and the latest Renesas R- Car X5.
In November 2024, Renesas was the first in the industry to launch a multi-domain fusion SoC family using an automotive-grade 3nm process - the R-Car X5 Series. A single chip can support multiple vehicle functional domains at the same time, including ADAS, IVI and gateway applications. The SoC offers the option to expand AI and graphics processing performance using chiplet technology. The R-Car X5 Series is scheduled to be mass-produced in 2027.
Key features of the R-Car X5 Series include:
TSMC's most advanced 3nm process consumes 30-35% less power than the 5nm process under the same performance.
400TOPS AI compute supports expansion through chiplets, and can improve AI processing performance by 3-4 times or more.
A total of 32 Arm(R) Cortex(R)-A720AE CPU cores have 1,000K DMIPS CPU compute.
6 Arm Cortex-R52 dual lockstep CPU cores achieve over 60K DMIPS and support ASIL D without external MCUs.
4TFLOPS GPU processing power
Chiplet technology offers the standard UCle (Universal Chiplet Interconnect Express) die-to-die interconnect and APIs.
It supports virtual ECU development and allows for use of the Renesas RoX SDV platform to shorten the time to market for the automotive industry.
It is foreseeable that the One Chip solution will have profound influence on automotive domain controller hardware, vehicle operating systems, and automotive SoC design and manufacturing. OEMs, Tier1 suppliers and chip vendors will compete fiercely around new technology fields such as multi-domain fusion, chiplets, and inter-chip interconnect (PCIe, NVLink, etc.).
Table of Contents
1 Definition and Market of Autonomous Driving Domain Controller and Central Control Unit (CCU)
1.1 Definition
Five Dimensions of Automotive EEA
EEA Deployment and Trends in the Next Five Years
As EEA Evolves, Autonomous Driving Domain Controllers Evolve to Automotive Computing Platforms
Three Development Stages of Autonomous Driving Domain Controllers amid EEA Evolution: Multi-Board, One Board, One Chip (1)
Three Development Stages of Autonomous Driving Domain Controllers amid EEA Evolution: Multi-Board, One Board, One Chip (2)
