한글목차

세계의 하이엔드 PCB 시장 규모는 2024년에 683억 4,700만 달러로 추정되며, 2025년부터 2031년까지 예측 기간 동안 CAGR 4.9%로 성장하여 2031년까지 957억 8,000만 달러로 확대될 것으로 예측됩니다.

본 보고서는 하이엔드 PCB의 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축, 최근 관세 조정 및 국제적인 전략적 대응 조치에 대한 종합적인 평가를 제공합니다.

인쇄회로기판(PCB)은 전자회로기판이라고도 불리며, 우리의 일상을 지탱하는 다양한 전자기기에 없어서는 안 될 구성요소입니다. 인쇄기판의 역할은 부품을 장착할 수 있는 기반 역할을 하며, 부품들 사이에 전기적 연결을 통해 전기신호를 전송할 수 있도록 하는 것입니다.

비유하자면, 인쇄기판은 인체의 골격이나 신경계와 같은 기능을 수행하며, 전기제품의 핵심 장치로서 매우 중요한 역할을 담당하고 있습니다.

인쇄회로기판은 다양한 응용 분야에서 중요한 역할을 수행하며 우리의 삶을 연결하고 미래를 형성하고 있습니다.

본 보고서에서는 다층 기판, HDI 기판, IC 기판, FPC를 포함한 하이엔드 PCB를 조사 대상으로 합니다.

하이엔드 PCB의 주요 세계 제조업체로는 Unimicron, DSBJ(Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, Gul Technologies Group 등이 있습니다. 2024년 기준, 세계 상위 20개 제조업체의 매출 점유율은 약 54.12%를 차지했습니다.

하이엔드 PCB 산업의 가치사슬은 업스트림 공정에서 동박, 적층판(고속/저손실 재료 포함), 특수 수지 등의 원재료에서 시작됩니다. 이러한 원료는 Shengyi, Isola, Panasonic 등의 기업에서 공급하고 있습니다. 미드스티림 공정에서 PCB 제조업체는 포토리소그래피, 드릴링, 도금, 표면처리 등의 공정을 통해 재료를 고급 다층 기판 및 HDI 구조로 가공합니다. 다운스트림에서는 통신, 자동차, 항공우주, 반도체 분야의 OEM 제조업체가 하이엔드 PCB를 전자 시스템에 통합합니다. 주요 업체로는 Ibiden, Unimicron, Compeq, Zhen Ding Tech, TTM Technologies, Shennan Circuits, AT&S 등이 있습니다. 현재, 5G 전개, 클라우드 컴퓨팅, 전기자동차, 반도체 미세화 추세에 힘입어 시장은 강력한 성장세를 보이고 있습니다. 향후 발전은 더 미세한 배선(5μm 미만), 고주파 재료, 모바일 기기용 기판 유사 PCB(SLP) 및 첨단 패키징을 위한 IC 기판과의 긴밀한 통합에 중점을 둘 것입니다. AI 컴퓨팅, EV 전자기기, 차세대 통신 인프라의 수요에 힘입어 세계 하이엔드 PCB 부문은 향후 5-7년 동안 꾸준히 확대될 것으로 예상됩니다.

이 보고서는 세계 하이엔드 PCB 시장에 대해 총 판매량, 매출액, 가격, 주요 기업의 시장 점유율 및 순위를 중심으로 지역별, 국가별, 유형별, 용도별 분석을 종합적으로 제시하는 것을 목표로 합니다.

하이엔드 PCB 시장 규모, 추정 및 예측은 판매량(천 평방미터)과 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로 하여 2020년부터 2031년까지의 과거 데이터와 예측 데이터를 포함합니다. 정량적, 정성적 분석을 통해 독자들이 하이엔드 PCB 관련 사업 전략 및 성장 전략 수립, 시장 경쟁 평가, 현재 시장 내 자사 포지셔닝 분석, 정보에 입각한 비즈니스 판단을 할 수 있도록 지원합니다.

시장 세분화

기업별

• Unimicron
• DSBJ(Dongshan Precision)
• Zhen Ding Technology
• Kinwong
• Shennan Circuit
• Tripod Technology
• Suntak Technology
• Shenzhen Fastprint Circuit Tech
• Gul Technologies Group
• Nippon Mektron
• Compeq Manufacturing
• TTM Technologies, Inc
• Ibiden
• HannStar Board Corporation
• AT&S
• Nan Ya PCB
• Kingboard Holdings
• SEMCO
• Shinko Electric Industries
• Yougn Poong Electronics
• WUS Printed Circuit(Kunshan)
• Meiko Electronics
• LG Innotek
• Kinsus Interconnect Technology
• Kyocera
• Toppan
• Daeduck Electronics
• Zhuhai Access Semiconductor
• Simmtech
• Flexium Interconnect.Inc
• Victory Giant Technology
• AKM Meadville
• Gold Circuit Electronics
• Fujikura Printed Circuits
• CMK Corporation
• Aoshikang Technology
• CHIN POON Industrial
• Murata Manufacturing
• Olympic Circuit
• Dongguan Shengyi Electronics
• Dynamic Electronics
• Sumitomo Electric Printed Circuits, Inc.
• Bomin Electronics
• Apex International
• Career Technology
• Founder PCB
• Hongxin Electronics
• TPT
• BH Co., Ltd
• Nitto Denko
• KCE GROUP
• Shenzhen Sun & Lynn Circuits
• Guangdong Ellington Electronic Technology
• Huizhou China Eagle Electronic Technology
• CCTC
• Guangdong Kingshine Electronics
• Guangdong Champion Asia
• Sunshine Global Circuits
• Delton Techology Inc
• JOVEPCB Enterprise

유형별 부문

• 다층 인쇄회로기판
• HDI PCB
• IC 기판
• 연성 인쇄회로기판(FPC)

용도별 부문

• 스마트폰
• PC
• 가전제품
• 통신
• 자동차용 전자기기
• 산업·의료
• 군·항공우주
• 기타

지역별

• 북미
  • 미국
  • 캐나다
• 아시아태평양
  • 중국
  • 일본
  • 한국
  • 동남아시아
  • 인도
  • 호주
  • 기타 아시아태평양
• 유럽
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 네덜란드
  • 북유럽 국가
  • 기타 유럽
• 라틴아메리카
  • 멕시코
  • 브라질
  • 기타 라틴아메리카
• 중동 및 아프리카
  • 튀르키예
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동 및 아프리카

영문목차

The global market for High End PCB was estimated to be worth US$ 68347 million in 2024 and is forecast to a readjusted size of US$ 95780 million by 2031 with a CAGR of 4.9% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on High End PCB cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Printed circuit boards (PCBs), also known as electronic circuit boards, are essential components found in various electronic devices that support our daily lives. The role of a printed circuit board is to serve as a foundation for mounting components and to establish electrical connections between them, allowing the transmission of electrical signals.

To draw an analogy, a printed circuit board functions as the skeletal and nervous system of the human body, playing a crucial role as the core device in electrical products.

Printed circuit boards play a vital role in various applications, bridging our lives and shaping the future.

This report studies the High End PCBs, include Multi-layer PCB, HDI PCB, IC Substrate, and FPC.

The major global manufacturers of High End PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.

The high-end PCB industry value chain begins upstream with raw materials such as copper foils, laminates (including high-speed/low-loss materials), and specialty resins, provided by companies like Shengyi, Isola, and Panasonic. Midstream, PCB fabricators process materials into advanced multilayer and HDI structures through photolithography, drilling, plating, and surface treatments. Downstream, high-end PCBs are integrated into electronic systems by OEMs in telecommunications, automotive, aerospace, and semiconductor sectors. Leading players include Ibiden, Unimicron, Compeq, Zhen Ding Tech, TTM Technologies, Shennan Circuits, and AT&S. Currently, the market is experiencing strong growth driven by 5G deployment, cloud computing, electric vehicles, and semiconductor miniaturization trends. Future development will emphasize finer lines (<5 μm), higher frequency materials, substrate-like PCB (SLP) for mobile devices, and closer integration with IC substrates for advanced packaging. The global high-end PCB sector is expected to expand steadily over the next 5-7 years, supported by demand from AI computing, EV electronics, and next-generation communication infrastructure.

This report aims to provide a comprehensive presentation of the global market for High End PCB, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of High End PCB by region & country, by Type, and by Application.

The High End PCB market size, estimations, and forecasts are provided in terms of sales volume (K Sq.m) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High End PCB.

Market Segmentation

By Company

• Unimicron
• DSBJ (Dongshan Precision)
• Zhen Ding Technology
• Kinwong
• Shennan Circuit
• Tripod Technology
• Suntak Technology
• Shenzhen Fastprint Circuit Tech
• Gul Technologies Group
• Nippon Mektron
• Compeq Manufacturing
• TTM Technologies, Inc
• Ibiden
• HannStar Board Corporation
• AT&S
• Nan Ya PCB
• Kingboard Holdings
• SEMCO
• Shinko Electric Industries
• Yougn Poong Electronics
• WUS Printed Circuit (Kunshan)
• Meiko Electronics
• LG Innotek
• Kinsus Interconnect Technology
• Kyocera
• Toppan
• Daeduck Electronics
• Zhuhai Access Semiconductor
• Simmtech
• Flexium Interconnect.Inc
• Victory Giant Technology
• AKM Meadville
• Gold Circuit Electronics
• Fujikura Printed Circuits
• CMK Corporation
• Aoshikang Technology
• CHIN POON Industrial
• Murata Manufacturing
• Olympic Circuit
• Dongguan Shengyi Electronics
• Dynamic Electronics
• Sumitomo Electric Printed Circuits, Inc.
• Bomin Electronics
• Apex International
• Career Technology
• Founder PCB
• Hongxin Electronics
• TPT
• BH Co., Ltd
• Nitto Denko
• KCE GROUP
• Shenzhen Sun & Lynn Circuits
• Guangdong Ellington Electronic Technology
• Huizhou China Eagle Electronic Technology
• CCTC
• Guangdong Kingshine Electronics
• Guangdong Champion Asia
• Sunshine Global Circuits
• Delton Techology Inc
• JOVEPCB Enterprise

Segment by Type

• Multi-layer PCB
• HDI PCBs
• IC Substrates
• Flexible Printed Circuit (FPC)

Segment by Application

• Smart Phones
• PC
• Consumer Electronics
• Communications
• Automotive Electronics
• Industrial & Medical
• Military and Aerospace
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of High End PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of High End PCB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of High End PCB in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 High End PCB Product Introduction
• 1.2 Global High End PCB Market Size Forecast
  • 1.2.1 Global High End PCB Sales Value (2020-2031)
  • 1.2.2 Global High End PCB Sales Volume (2020-2031)
  • 1.2.3 Global High End PCB Sales Price (2020-2031)
• 1.3 High End PCB Market Trends & Drivers
  • 1.3.1 High End PCB Industry Trends
  • 1.3.2 High End PCB Market Drivers & Opportunity
  • 1.3.3 High End PCB Market Challenges
  • 1.3.4 High End PCB Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global High End PCB Players Revenue Ranking (2024)
• 2.2 Global High End PCB Revenue by Company (2020-2025)
• 2.3 Global High End PCB Players Sales Volume Ranking (2024)
• 2.4 Global High End PCB Sales Volume by Company Players (2020-2025)
• 2.5 Global High End PCB Average Price by Company (2020-2025)
• 2.6 Key Manufacturers High End PCB Manufacturing Base and Headquarters
• 2.7 Key Manufacturers High End PCB Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of High End PCB
• 2.9 High End PCB Market Competitive Analysis
  • 2.9.1 High End PCB Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by High End PCB Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in High End PCB as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Multi-layer PCB
  • 3.1.2 HDI PCBs
  • 3.1.3 IC Substrates
  • 3.1.4 Flexible Printed Circuit (FPC)
• 3.2 Global High End PCB Sales Value by Type
  • 3.2.1 Global High End PCB Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global High End PCB Sales Value, by Type (2020-2031)
  • 3.2.3 Global High End PCB Sales Value, by Type (%) (2020-2031)
• 3.3 Global High End PCB Sales Volume by Type
  • 3.3.1 Global High End PCB Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global High End PCB Sales Volume, by Type (2020-2031)
  • 3.3.3 Global High End PCB Sales Volume, by Type (%) (2020-2031)
• 3.4 Global High End PCB Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Smart Phones
  • 4.1.2 PC
  • 4.1.3 Consumer Electronics
  • 4.1.4 Communications
  • 4.1.5 Automotive Electronics
  • 4.1.6 Industrial & Medical
  • 4.1.7 Military and Aerospace
  • 4.1.8 Others
• 4.2 Global High End PCB Sales Value by Application
  • 4.2.1 Global High End PCB Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global High End PCB Sales Value, by Application (2020-2031)
  • 4.2.3 Global High End PCB Sales Value, by Application (%) (2020-2031)
• 4.3 Global High End PCB Sales Volume by Application
  • 4.3.1 Global High End PCB Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global High End PCB Sales Volume, by Application (2020-2031)
  • 4.3.3 Global High End PCB Sales Volume, by Application (%) (2020-2031)
• 4.4 Global High End PCB Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global High End PCB Sales Value by Region
  • 5.1.1 Global High End PCB Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global High End PCB Sales Value by Region (2020-2025)
  • 5.1.3 Global High End PCB Sales Value by Region (2026-2031)
  • 5.1.4 Global High End PCB Sales Value by Region (%), (2020-2031)
• 5.2 Global High End PCB Sales Volume by Region
  • 5.2.1 Global High End PCB Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global High End PCB Sales Volume by Region (2020-2025)
  • 5.2.3 Global High End PCB Sales Volume by Region (2026-2031)
  • 5.2.4 Global High End PCB Sales Volume by Region (%), (2020-2031)
• 5.3 Global High End PCB Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America High End PCB Sales Value, 2020-2031
  • 5.4.2 North America High End PCB Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe High End PCB Sales Value, 2020-2031
  • 5.5.2 Europe High End PCB Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific High End PCB Sales Value, 2020-2031
  • 5.6.2 Asia Pacific High End PCB Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America High End PCB Sales Value, 2020-2031
  • 5.7.2 South America High End PCB Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa High End PCB Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa High End PCB Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions High End PCB Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions High End PCB Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions High End PCB Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions High End PCB Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States High End PCB Sales Value, 2020-2031
  • 6.3.2 United States High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States High End PCB Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe High End PCB Sales Value, 2020-2031
  • 6.4.2 Europe High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe High End PCB Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China High End PCB Sales Value, 2020-2031
  • 6.5.2 China High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China High End PCB Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan High End PCB Sales Value, 2020-2031
  • 6.6.2 Japan High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan High End PCB Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea High End PCB Sales Value, 2020-2031
  • 6.7.2 South Korea High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea High End PCB Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia High End PCB Sales Value, 2020-2031
  • 6.8.2 Southeast Asia High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia High End PCB Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India High End PCB Sales Value, 2020-2031
  • 6.9.2 India High End PCB Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India High End PCB Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Unimicron
  • 7.1.1 Unimicron Company Information
  • 7.1.2 Unimicron Introduction and Business Overview
  • 7.1.3 Unimicron High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Unimicron High End PCB Product Offerings
  • 7.1.5 Unimicron Recent Development
• 7.2 DSBJ (Dongshan Precision)
  • 7.2.1 DSBJ (Dongshan Precision) Company Information
  • 7.2.2 DSBJ (Dongshan Precision) Introduction and Business Overview
  • 7.2.3 DSBJ (Dongshan Precision) High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 DSBJ (Dongshan Precision) High End PCB Product Offerings
  • 7.2.5 DSBJ (Dongshan Precision) Recent Development
• 7.3 Zhen Ding Technology
  • 7.3.1 Zhen Ding Technology Company Information
  • 7.3.2 Zhen Ding Technology Introduction and Business Overview
  • 7.3.3 Zhen Ding Technology High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 Zhen Ding Technology High End PCB Product Offerings
  • 7.3.5 Zhen Ding Technology Recent Development
• 7.4 Kinwong
  • 7.4.1 Kinwong Company Information
  • 7.4.2 Kinwong Introduction and Business Overview
  • 7.4.3 Kinwong High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 Kinwong High End PCB Product Offerings
  • 7.4.5 Kinwong Recent Development
• 7.5 Shennan Circuit
  • 7.5.1 Shennan Circuit Company Information
  • 7.5.2 Shennan Circuit Introduction and Business Overview
  • 7.5.3 Shennan Circuit High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Shennan Circuit High End PCB Product Offerings
  • 7.5.5 Shennan Circuit Recent Development
• 7.6 Tripod Technology
  • 7.6.1 Tripod Technology Company Information
  • 7.6.2 Tripod Technology Introduction and Business Overview
  • 7.6.3 Tripod Technology High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 Tripod Technology High End PCB Product Offerings
  • 7.6.5 Tripod Technology Recent Development
• 7.7 Suntak Technology
  • 7.7.1 Suntak Technology Company Information
  • 7.7.2 Suntak Technology Introduction and Business Overview
  • 7.7.3 Suntak Technology High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 Suntak Technology High End PCB Product Offerings
  • 7.7.5 Suntak Technology Recent Development
• 7.8 Shenzhen Fastprint Circuit Tech
  • 7.8.1 Shenzhen Fastprint Circuit Tech Company Information
  • 7.8.2 Shenzhen Fastprint Circuit Tech Introduction and Business Overview
  • 7.8.3 Shenzhen Fastprint Circuit Tech High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 Shenzhen Fastprint Circuit Tech High End PCB Product Offerings
  • 7.8.5 Shenzhen Fastprint Circuit Tech Recent Development
• 7.9 Gul Technologies Group
  • 7.9.1 Gul Technologies Group Company Information
  • 7.9.2 Gul Technologies Group Introduction and Business Overview
  • 7.9.3 Gul Technologies Group High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 Gul Technologies Group High End PCB Product Offerings
  • 7.9.5 Gul Technologies Group Recent Development
• 7.10 Nippon Mektron
  • 7.10.1 Nippon Mektron Company Information
  • 7.10.2 Nippon Mektron Introduction and Business Overview
  • 7.10.3 Nippon Mektron High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Nippon Mektron High End PCB Product Offerings
  • 7.10.5 Nippon Mektron Recent Development
• 7.11 Compeq Manufacturing
  • 7.11.1 Compeq Manufacturing Company Information
  • 7.11.2 Compeq Manufacturing Introduction and Business Overview
  • 7.11.3 Compeq Manufacturing High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Compeq Manufacturing High End PCB Product Offerings
  • 7.11.5 Compeq Manufacturing Recent Development
• 7.12 TTM Technologies, Inc
  • 7.12.1 TTM Technologies, Inc Company Information
  • 7.12.2 TTM Technologies, Inc Introduction and Business Overview
  • 7.12.3 TTM Technologies, Inc High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 TTM Technologies, Inc High End PCB Product Offerings
  • 7.12.5 TTM Technologies, Inc Recent Development
• 7.13 Ibiden
  • 7.13.1 Ibiden Company Information
  • 7.13.2 Ibiden Introduction and Business Overview
  • 7.13.3 Ibiden High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.13.4 Ibiden High End PCB Product Offerings
  • 7.13.5 Ibiden Recent Development
• 7.14 HannStar Board Corporation
  • 7.14.1 HannStar Board Corporation Company Information
  • 7.14.2 HannStar Board Corporation Introduction and Business Overview
  • 7.14.3 HannStar Board Corporation High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.14.4 HannStar Board Corporation High End PCB Product Offerings
  • 7.14.5 HannStar Board Corporation Recent Development
• 7.15 AT&S
  • 7.15.1 AT&S Company Information
  • 7.15.2 AT&S Introduction and Business Overview
  • 7.15.3 AT&S High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.15.4 AT&S High End PCB Product Offerings
  • 7.15.5 AT&S Recent Development
• 7.16 Nan Ya PCB
  • 7.16.1 Nan Ya PCB Company Information
  • 7.16.2 Nan Ya PCB Introduction and Business Overview
  • 7.16.3 Nan Ya PCB High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.16.4 Nan Ya PCB High End PCB Product Offerings
  • 7.16.5 Nan Ya PCB Recent Development
• 7.17 Kingboard Holdings
  • 7.17.1 Kingboard Holdings Company Information
  • 7.17.2 Kingboard Holdings Introduction and Business Overview
  • 7.17.3 Kingboard Holdings High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.17.4 Kingboard Holdings High End PCB Product Offerings
  • 7.17.5 Kingboard Holdings Recent Development
• 7.18 SEMCO
  • 7.18.1 SEMCO Company Information
  • 7.18.2 SEMCO Introduction and Business Overview
  • 7.18.3 SEMCO High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.18.4 SEMCO High End PCB Product Offerings
  • 7.18.5 SEMCO Recent Development
• 7.19 Shinko Electric Industries
  • 7.19.1 Shinko Electric Industries Company Information
  • 7.19.2 Shinko Electric Industries Introduction and Business Overview
  • 7.19.3 Shinko Electric Industries High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.19.4 Shinko Electric Industries High End PCB Product Offerings
  • 7.19.5 Shinko Electric Industries Recent Development
• 7.20 Yougn Poong Electronics
  • 7.20.1 Yougn Poong Electronics Company Information
  • 7.20.2 Yougn Poong Electronics Introduction and Business Overview
  • 7.20.3 Yougn Poong Electronics High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.20.4 Yougn Poong Electronics High End PCB Product Offerings
  • 7.20.5 Yougn Poong Electronics Recent Development
• 7.21 WUS Printed Circuit (Kunshan)
  • 7.21.1 WUS Printed Circuit (Kunshan) Company Information
  • 7.21.2 WUS Printed Circuit (Kunshan) Introduction and Business Overview
  • 7.21.3 WUS Printed Circuit (Kunshan) High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.21.4 WUS Printed Circuit (Kunshan) High End PCB Product Offerings
  • 7.21.5 WUS Printed Circuit (Kunshan) Recent Development
• 7.22 Meiko Electronics
  • 7.22.1 Meiko Electronics Company Information
  • 7.22.2 Meiko Electronics Introduction and Business Overview
  • 7.22.3 Meiko Electronics High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.22.4 Meiko Electronics High End PCB Product Offerings
  • 7.22.5 Meiko Electronics Recent Development
• 7.23 LG Innotek
  • 7.23.1 LG Innotek Company Information
  • 7.23.2 LG Innotek Introduction and Business Overview
  • 7.23.3 LG Innotek High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.23.4 LG Innotek High End PCB Product Offerings
  • 7.23.5 LG Innotek Recent Development
• 7.24 Kinsus Interconnect Technology
  • 7.24.1 Kinsus Interconnect Technology Company Information
  • 7.24.2 Kinsus Interconnect Technology Introduction and Business Overview
  • 7.24.3 Kinsus Interconnect Technology High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.24.4 Kinsus Interconnect Technology High End PCB Product Offerings
  • 7.24.5 Kinsus Interconnect Technology Recent Development
• 7.25 Kyocera
  • 7.25.1 Kyocera Company Information
  • 7.25.2 Kyocera Introduction and Business Overview
  • 7.25.3 Kyocera High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.25.4 Kyocera High End PCB Product Offerings
  • 7.25.5 Kyocera Recent Development
• 7.26 Toppan
  • 7.26.1 Toppan Company Information
  • 7.26.2 Toppan Introduction and Business Overview
  • 7.26.3 Toppan High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.26.4 Toppan High End PCB Product Offerings
  • 7.26.5 Toppan Recent Development
• 7.27 Daeduck Electronics
  • 7.27.1 Daeduck Electronics Company Information
  • 7.27.2 Daeduck Electronics Introduction and Business Overview
  • 7.27.3 Daeduck Electronics High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.27.4 Daeduck Electronics High End PCB Product Offerings
  • 7.27.5 Daeduck Electronics Recent Development
• 7.28 Zhuhai Access Semiconductor
  • 7.28.1 Zhuhai Access Semiconductor Company Information
  • 7.28.2 Zhuhai Access Semiconductor Introduction and Business Overview
  • 7.28.3 Zhuhai Access Semiconductor High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.28.4 Zhuhai Access Semiconductor High End PCB Product Offerings
  • 7.28.5 Zhuhai Access Semiconductor Recent Development
• 7.29 Simmtech
  • 7.29.1 Simmtech Company Information
  • 7.29.2 Simmtech Introduction and Business Overview
  • 7.29.3 Simmtech High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.29.4 Simmtech High End PCB Product Offerings
  • 7.29.5 Simmtech Recent Development
• 7.30 Flexium Interconnect.Inc
  • 7.30.1 Flexium Interconnect.Inc Company Information
  • 7.30.2 Flexium Interconnect.Inc Introduction and Business Overview
  • 7.30.3 Flexium Interconnect.Inc High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.30.4 Flexium Interconnect.Inc High End PCB Product Offerings
  • 7.30.5 Flexium Interconnect.Inc Recent Development
• 7.31 Victory Giant Technology
  • 7.31.1 Victory Giant Technology Company Information
  • 7.31.2 Victory Giant Technology Introduction and Business Overview
  • 7.31.3 Victory Giant Technology High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.31.4 Victory Giant Technology High End PCB Product Offerings
  • 7.31.5 Victory Giant Technology Recent Development
• 7.32 AKM Meadville
  • 7.32.1 AKM Meadville Company Information
  • 7.32.2 AKM Meadville Introduction and Business Overview
  • 7.32.3 AKM Meadville High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.32.4 AKM Meadville High End PCB Product Offerings
  • 7.32.5 AKM Meadville Recent Development
• 7.33 Gold Circuit Electronics
  • 7.33.1 Gold Circuit Electronics Company Information
  • 7.33.2 Gold Circuit Electronics Introduction and Business Overview
  • 7.33.3 Gold Circuit Electronics High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.33.4 Gold Circuit Electronics High End PCB Product Offerings
  • 7.33.5 Gold Circuit Electronics Recent Development
• 7.34 Fujikura Printed Circuits
  • 7.34.1 Fujikura Printed Circuits Company Information
  • 7.34.2 Fujikura Printed Circuits Introduction and Business Overview
  • 7.34.3 Fujikura Printed Circuits High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.34.4 Fujikura Printed Circuits High End PCB Product Offerings
  • 7.34.5 Fujikura Printed Circuits Recent Development
• 7.35 CMK Corporation
  • 7.35.1 CMK Corporation Company Information
  • 7.35.2 CMK Corporation Introduction and Business Overview
  • 7.35.3 CMK Corporation High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.35.4 CMK Corporation High End PCB Product Offerings
  • 7.35.5 CMK Corporation Recent Development
• 7.36 Aoshikang Technology
  • 7.36.1 Aoshikang Technology Company Information
  • 7.36.2 Aoshikang Technology Introduction and Business Overview
  • 7.36.3 Aoshikang Technology High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.36.4 Aoshikang Technology High End PCB Product Offerings
  • 7.36.5 Aoshikang Technology Recent Development
• 7.37 CHIN POON Industrial
  • 7.37.1 CHIN POON Industrial Company Information
  • 7.37.2 CHIN POON Industrial Introduction and Business Overview
  • 7.37.3 CHIN POON Industrial High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.37.4 CHIN POON Industrial High End PCB Product Offerings
  • 7.37.5 CHIN POON Industrial Recent Development
• 7.38 Murata Manufacturing
  • 7.38.1 Murata Manufacturing Company Information
  • 7.38.2 Murata Manufacturing Introduction and Business Overview
  • 7.38.3 Murata Manufacturing High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.38.4 Murata Manufacturing High End PCB Product Offerings
  • 7.38.5 Murata Manufacturing Recent Development
• 7.39 Olympic Circuit
  • 7.39.1 Olympic Circuit Company Information
  • 7.39.2 Olympic Circuit Introduction and Business Overview
  • 7.39.3 Olympic Circuit High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.39.4 Olympic Circuit High End PCB Product Offerings
  • 7.39.5 Olympic Circuit Recent Development
• 7.40 Dongguan Shengyi Electronics
  • 7.40.1 Dongguan Shengyi Electronics Company Information
  • 7.40.2 Dongguan Shengyi Electronics Introduction and Business Overview
  • 7.40.3 Dongguan Shengyi Electronics High End PCB Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.40.4 Dongguan Shengyi Electronics High End PCB Product Offerings
  • 7.40.5 Dongguan Shengyi Electronics Recent Development

8 Industry Chain Analysis

• 8.1 High End PCB Industrial Chain
• 8.2 High End PCB Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 High End PCB Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 High End PCB Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer