ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
ㅁ 보고서에 따라 최신 정보로 업데이트하여 보내드립니다. 배송기일은 문의해 주시기 바랍니다.
한글목차
세계 하이엔드 PCB 시장 규모는 2024년 683억 달러에 달했습니다.
이 시장은 2031년에는 984억 달러에 달할 것으로 예상되며, 예측 기간인 2025-2031년 동안 4.86% CAGR을 기록할 것으로 예상됩니다. 아시아태평양이 시장을 독점하고 있으며, 중국 본토, 중국 대만, 한국이 전 세계 PCB 생산량의 85% 이상을 차지하고 있습니다.
북미 하이엔드 PCB 생산액은 2024년 28억 달러로 2025-2031년 예측 기간 동안 3.64%의 CAGR로 확대되어 2031년에는 37억 달러에 달했습니다.
유럽의 하이엔드 PCB 생산액은 2024년 14억 달러에서 2025년부터 2031년까지 예측 기간 동안 3.55%의 CAGR로 확대되어 2031년에는 18억 달러에 달할 것으로 예측됩니다.
중국 본토의 고급 PCB 생산액은 2024년 362억 달러에서 2025년부터 2031년까지 예측 기간 동안 5.34%의 CAGR로 확대되어 2031년에는 539억 달러에 달했습니다.
일본의 하이엔드 PCB 생산액은 2024년 69억 달러에서 2025년부터 2031년까지 예측 기간 동안 4.13%의 CAGR로 확대되어 2031년에는 95억 달러에 달했습니다.
한국의 하이엔드 PCB 생산액은 2024년 56억 달러로 2025-2031년 예측 기간 동안 4.35%의 CAGR로 확대되어 2031년에는 79억 달러에 달했습니다.
중국 대만의 하이엔드 PCB 생산액은 2024년 96억 달러에서 2025-2031년 예측 기간 동안 3.77%의 CAGR로 확대되어 2031년까지 128억 달러에 달했습니다.
하이 엔드 PCB의 주요 세계 제조업체에는 Unimicron, DSBJ(Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, Gul Technologies Group 등이 있습니다. Shenzhen Fastprint Circuit Tech, Gul Technologies Group 등이 있으며, 2024년에는 세계 상위 20개 기업이 매출액의 약 54.12%를 차지했습니다.
세계의 하이엔드 PCB 시장에 대해 조사했으며, 시장 개요, 제품별-용도별 - 지역별 동향, 시장 진입 기업 프로파일 등의 정보를 전해드립니다.
목차
제1장 하이엔드 PCB 시장 개요
제품 정의
하이엔드 PCB, 제품별
하이엔드 PCB, 용도별
세계 시장 성장 전망
가정과 제한
제2장 제조업체에 의한 시장 경쟁
제3장 하이엔드 PCB 생산, 지역별
세계의 하이엔드 PCB 생산액 예측 : 2020년 VS 2024년 VS 2031년, 지역별
세계의 하이엔드 PCB 생산액 : 2020-2031년, 지역별
세계의 하이엔드 PCB 생산량 예측 : 2020년 VS 2024년 VS 2031년, 지역별
세계의 하이엔드 PCB 생산량 : 2020-2031년, 지역별
세계의 하이엔드 PCB 시장 가격 분석 : 2020-2025, 지역별
세계의 하이엔드 PCB 생산량과 가치, 전년비 성장률
제4장 하이엔드 PCB 소비량, 지역별
세계의 하이엔드 PC B소비량 예측 : 2020년 VS 2024년 VS 2031년, 지역별
세계의 하이엔드 PCB 소비량 : 2020-2031년, 지역별
북미
유럽
아시아태평양
남미
중동 및 아프리카
제5장 제품별 부문
세계의 하이엔드 PCB 생산량, 제품별(2020-2031년)
세계의 하이엔드 PCB 생산액, 제품별(2020-2031년)
세계의 하이엔드 PCB 가격, 제품별(2020-2031년)
제6장 용도별 부문
세계의 하이엔드 PCB 생산량, 용도별(2020-2031년)
세계의 하이엔드 PCB 생산액, 용도품별(2020-2031년)
세계의 하이엔드 PCB 가격, 용도별(2020-2031년)
제7장 주요 기업 개요
Unimicron
DSBJ(Dongshan Precision)
Zhen Ding Technology
Kinwong
Shennan Circuit
Tripod Technology
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Nippon Mektron
Compeq Manufacturing
TTM Technologies, Inc
Ibiden
HannStar Board Corporation
AT&S
Nan Ya PCB
Kingboard Holdings
SEMCO
Shinko Electric Industries
Yougn Poong Electronics
WUS Printed Circuit
Meiko Electronics
LG Innotek
Kinsus Interconnect Technology
Kyocera
Toppan
Daeduck Electronics
Zhuhai Access Semiconductor
Simmtech
Flexium Interconnect.Inc
Victory Giant Technology
AKM Meadville
Gold Circuit Electronics
Fujikura Printed Circuits
CMK Corporation
Aoshikang Technology
CHIN POON Industrial
Murata Manufacturing
Olympic Circuit
Dongguan Shengyi Electronics
제8장 산업 체인과 판매 채널 분석
하이엔드 PCB 업계 체인 분석
하이엔드 PCB 원자재 공급 분석
하이엔드 PCB 생산 모드와 프로세스 분석
하이엔드 PCB 판매와 마케팅
하이엔드 PCB 고객 분석
제9장 하이엔드 PCB 시장 역학
제10장 조사 결과와 결론
제11장 조사 방법과 정보 출처
ksm
영문 목차
영문목차
The global High End PCB market was valued at US$ 68.3 billion in 2024 and is anticipated to reach US$ 98.4 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea.
North America production value of High End PCB was $ 2.8 billion in 2024 to reach $ 3.7 billion by 2031, at a CAGR of 3.64% during the forecast period of 2025 through 2031.
Europe production value of High End PCB was $ 1.4 billion in 2024 to reach $ 1.8 billion by 2031, at a CAGR of 3.55% during the forecast period of 2025 through 2031.
China Mainland production value of High End PCB was $ 36.2 billion in 2024 to reach $ 53.9 billion by 2031, at a CAGR of 5.34% during the forecast period of 2025 through 2031.
Japan production value of High End PCB was $ 6.9 billion in 2024 to reach $ 9.5 billion by 2031, at a CAGR of 4.13% during the forecast period of 2025 through 2031.
South Korea production value of High End PCB was $ 5.6 billion in 2024 to reach $ 7.9 billion by 2031, at a CAGR of 4.35% during the forecast period of 2025 through 2031.
China Taiwan production value of High End PCB was $ 9.6 billion in 2024 to reach $ 12.8 billion by 2031, at a CAGR of 3.77% during the forecast period of 2025 through 2031.
The major global manufacturers of High End PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.
Key Drivers:
5G and AI Infrastructure: Demand for high-frequency PCBs and HDI (High-Density Interconnect) boards for 5G base stations and AI servers.
Automotive Electrification: High End PCBs for EVs, ADAS, and infotainment systems are driving growth, with the automotive PCB market expected to reach $12.2 billion by 2031.
Miniaturization: Consumer electronics (e.g., foldable phones, wearables) require flexible and rigid-flex PCBs, projected to grow at 4.09% CAGR.
The PCB market is segmented by type, with key categories including:
Multilayer PCBs: Largest segment (43.79% share), used in communications and computing.
HDI/Microvia/Build-Up PCBs: Critical for compact, high-performance devices (e.g., smartphones, AI servers), growing at 4.8% CAGR through 2031.
Flexible and Rigid-Flex PCBs: Driven by wearables and automotive applications (e.g., foldable displays, sensors).
IC Substrates: High-growth segment for advanced packaging in semiconductors.
Application Trend Analysis:
Consumer Electronics: Largest application (9.6% share), driven by smartphones, laptops, and IoT devices.
Automotive: Fastest-growing sector due to EVs and autonomous driving. Multi-layer PCBs dominate, supporting ADAS, battery management, and infotainment.
Communications: 5G infrastructure and data centers require high-speed, low-loss PCBs (e.g., PTFE laminates).
Industrial/Medical: Demand for reliable PCBs in automation, robotics, and medical imaging systems.
The PCB market is poised for steady growth, fueled by 5G, AI, and automotive electrification. Companies must prioritize R&D in HDI and flexible PCBs, adopt sustainable practices, and diversify supply chains to navigate geopolitical risks. Investors should monitor Asia-Pacific's dominance and emerging opportunities in high-growth sectors like BEVs and industrial automation. For granular insights, refer to detailed reports from BCC Research, Global Info Research, and MarketsandMarkets.
Report Scope
This report aims to provide a comprehensive presentation of the global market for High End PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High End PCB.
The High End PCB market size, estimations, and forecasts are provided in terms of output/shipments (K Square Meters) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global High End PCB market comprehensively. Regional market sizes, concerning products by Product, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High End PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Product, by Application, and by regions.
Market Segmentation
By Company
Zhen Ding Technology
Unimicron
DSBJ (Dongshan Precision)
Nippon Mektron
TTM Technologies, Inc
Tripod Technology
AT&S
Shennan Circuit
Compeq Manufacturing
SEMCO
Ibiden
Kinwong
Nan Ya PCB
Gold Circuit Electronics
WUS Printed Circuit (Kunshan)
Victory Giant Technology
Meiko Electronics
Kingboard Holdings
LG Innotek
BH Co., Ltd
Yougn Poong Electronics
AKM Meadville
Simmtech
Shinko Electric Industries
Flexium Interconnect.Inc
Kinsus Interconnect Technology
HannStar Board Corporation
Shenzhen Fastprint Circuit Tech
Fujikura Printed Circuits
CMK Corporation
Dongguan Shengyi Electronics
Daeduck Electronics
Sumitomo Electric Printed Circuits, Inc.
Kyocera
Suntak Technology
TPT
Guangdong Ellington Electronic Technology
Aoshikang Technology
KCE GROUP
Olympic Circuit
Dynamic Electronics
Founder PCB
Gul Technologies Group
Shenzhen Sun & Lynn Circuits
CHIN POON Industrial
Delton Techology Inc
Huizhou China Eagle Electronic Technology
Hongxin Electronics
Career Technology
Murata Manufacturing
Zhuhai Access Semiconductor
Bomin Electronics
Apex International
Guangdong Champion Asia
Guangdong Kingshine Electronics
CCTC
Nitto Denko
Sunshine Global Circuits
Toppan
JOVEPCB Enterprise
Segment by Product
Multi-layer PCB
HDI PCB
IC Substrate
FPC
Segment by Application
Mobile Phones
PC
Consumer Electronics
Communications
Automotive Electronics
Industrial & Medical
Military/Aerospace
Server/Data Storage
Others
Production by Region
Japan
South Korea
China Taiwan
China Mainland
Southeast Asia
North America
Europe
Consumption by Region
North America
U.S.
Canada
Mexico
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Netherlands
Rest of Europe
South America
Brazil
Turkey
Middle East & Africa
Chapter Outline:
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Product, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of High End PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of High End PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of High End PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Product, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Table of Contents
1 High End PCB Market Overview
1.1 Product Definition
1.2 High End PCB by Product
1.2.1 Global High End PCB Market Value Growth Rate Analysis by Product: 2024 VS 2031
1.2.2 Multi-layer PCB
1.2.3 HDI PCB
1.2.4 IC Substrate
1.2.5 FPC
1.3 High End PCB by Application
1.3.1 Global High End PCB Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phones PCB
1.3.3 PC PCB
1.3.4 Consumer Electronics
1.3.5 Communications
1.3.6 Automotive Electronics PCB
1.3.7 Industrial & Medical
1.3.8 Server/Data Storage
1.3.9 Military and Aerospace
1.3.10 Others
1.4 Global Market Growth Prospects
1.4.1 Global High End PCB Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global High End PCB Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global High End PCB Production Estimates and Forecasts (2020-2031)
1.4.4 Global High End PCB Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global High End PCB Production Market Share by Manufacturers (2020-2025)
2.2 Global High End PCB Production Value Market Share by Manufacturers (2020-2025)
2.3 Global High End PCB Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.4 Global High End PCB Average Price by Manufacturers (2020-2025)
2.5 Global Key Manufacturers of High End PCB, Manufacturing Sites & Headquarters
2.6 Global Key Manufacturers of High End PCB, Product Type
2.7 Global Key Manufacturers of High End PCB, Date of Enter into This Industry
2.8 Global High End PCB Market Competitive Situation and Trends
2.8.1 Global High End PCB Market Concentration Rate
2.8.2 Global 5 and 10 Largest High End PCB Players Market Share by Revenue
2.9 Mergers & Acquisitions, Expansion
3 High End PCB Production by Region
3.1 Global High End PCB Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global High End PCB Production Value by Region (2020-2031)
3.2.1 Global High End PCB Production Value Market Share by Region (2020-2025)
3.2.2 Global Forecasted Production Value of High End PCB by Region (2026-2031)
3.3 Global High End PCB Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global High End PCB Production by Region (2020-2031)
3.4.1 Global High End PCB Production Market Share by Region (2020-2025)
3.4.2 Global Forecasted Production of High End PCB by Region (2026-2031)
3.5 Global High End PCB Market Price Analysis by Region (2020-2025)
3.6 Global High End PCB Production and Value, Year-over-Year Growth
3.6.1 Japan High End PCB Production Value Estimates and Forecasts (2020-2031)
3.6.2 South Korea High End PCB Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Taiwan High End PCB Production Value Estimates and Forecasts (2020-2031)
3.6.4 China Mainland High End PCB Production Value Estimates and Forecasts (2020-2031)
3.6.5 Southeast Asia High End PCB Production Value Estimates and Forecasts (2020-2031)
3.6.6 North America High End PCB Production Value Estimates and Forecasts (2020-2031)
3.6.7 Europe High End PCB Production Value Estimates and Forecasts (2020-2031)
4 High End PCB Consumption by Region
4.1 Global High End PCB Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global High End PCB Consumption by Region (2020-2031)
4.2.1 Global High End PCB Consumption by Region (2020-2031)
4.2.2 Global High End PCB Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America High End PCB Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America High End PCB Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe High End PCB Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe High End PCB Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific High End PCB Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific High End PCB Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 South America
4.6.1 South America High End PCB Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 South America High End PCB Consumption by Country (2020-2031)
4.6.3 Brazil
4.7 Middle East & Africa
5 Segment by Product
5.1 Global High End PCB Production by Product (2020-2031)
5.1.1 Global High End PCB Production by Product (2020-2025)
5.1.2 Global High End PCB Production by Product (2026-2031)
5.1.3 Global High End PCB Production Market Share by Product (2020-2031)
5.2 Global High End PCB Production Value by Product (2020-2031)
5.2.1 Global High End PCB Production Value by Product (2020-2025)
5.2.2 Global High End PCB Production Value by Product (2026-2031)
5.2.3 Global High End PCB Production Value Market Share by Product (2020-2031)
5.3 Global High End PCB Price by Product (2020-2031)
6 Segment by Application
6.1 Global High End PCB Production by Application (2020-2031)
6.1.1 Global High End PCB Production by Application (2020-2025)
6.1.2 Global High End PCB Production by Application (2026-2031)
6.1.3 Global High End PCB Production Market Share by Application (2020-2031)
6.2 Global High End PCB Production Value by Application (2020-2031)
6.2.1 Global High End PCB Production Value by Application (2020-2025)
6.2.2 Global High End PCB Production Value by Application (2026-2031)
6.2.3 Global High End PCB Production Value Market Share by Application (2020-2031)
6.3 Global High End PCB Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron High End PCB Company Information
7.1.2 Unimicron High End PCB Product Portfolio
7.1.3 Unimicron High End PCB Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 DSBJ (Dongshan Precision)
7.2.1 DSBJ (Dongshan Precision) High End PCB Company Information
7.2.2 DSBJ (Dongshan Precision) High End PCB Product Portfolio
7.2.3 DSBJ (Dongshan Precision) High End PCB Production, Value, Price and Gross Margin (2020-2025)
7.2.4 DSBJ (Dongshan Precision) Main Business and Markets Served
7.3 Zhen Ding Technology
7.3.1 Zhen Ding Technology High End PCB Company Information
7.3.2 Zhen Ding Technology High End PCB Product Portfolio
7.3.3 Zhen Ding Technology High End PCB Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Zhen Ding Technology Main Business and Markets Served
