Global Ceramic Wire Wound Chip Inductor Market Report, History and Forecast 2019-2030
상품코드:1572649
리서치사:QYResearch
발행일:2024년 10월
페이지 정보:영문
라이선스 & 가격 (부가세 별도)
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한글목차
세계 세라믹 권선 칩 인덕터 시장 규모는 2023년 1억 1,788만 달러에 달했습니다.
이 시장은 2024년부터 2030년까지 4.93%의 CAGR로 성장하여 2030년 말에는 1억 6,410만 달러에 달할 것으로 예상됩니다.
이 보고서는 세계 세라믹 권선 칩 인덕터 시장에 대해 조사했으며, 시장 개요와 함께 유형별, 용도별, 지역별 동향, 시장 진입 기업 개요 등을 제공합니다.
목차
제1장 세라믹 권선 칩 인덕터 시장 개요
세라믹 권선 칩 인덕터 제품 개요
세라믹 권선 칩 인덕터 시장(유형별)
세계의 세라믹 권선 칩 인덕터 시장 규모(유형별)
주요 지역의 시장 규모(유형별)
제2장 세라믹 권선 칩 인덕터 시장의 경쟁
제3장 세라믹 권선 칩 인덕터 현황과 전망, 지역별
세계의 세라믹 권선 칩 인덕터 시장 규모와 CAGR : 2019년 대 2023년 대 2030년, 지역별
세계의 세라믹 권선 칩 인덕터 시장 규모 실적, 지역별
세계의 세라믹 권선 칩 인덕터 시장 규모 예측, 지역별
제4장 세라믹 권선 칩 인덕터, 용도별
세라믹 권선 칩 인덕터 시장, 용도별
세계의 세라믹 권선 칩 인덕터 시장 규모, 용도별
주요 지역의 시장 규모, 용도별
제5장 북미의 세라믹 권선 칩 인덕터, 국가별
제6장 유럽의 세라믹 권선 칩 인덕터, 국가별
제7장 아시아태평양의 세라믹 권선 칩 인덕터, 지역별
제8장 남미의 세라믹 권선 칩 인덕터, 국가별
제9장 중동 및 아프리카의 세라믹 권선 칩 인덕터, 국가별
제10장 기업 개요
Murata
Coilcraft
Sumida
Shenzhen Sunlord Electronics
Sagami
Laird IWC
Wurth Electronics
KYOCERA AVX
Eaton
Bourns
Fenghua
ABC ATEC
Erocore
Shenzhen Zhenhua
ZenithTek
Johanson Technology
제11장 업스트림, 기회, 과제, 리스크, 영향요인 분석
세라믹 권선 칩 인덕터의 주요 원자재
제조 비용 구조
세라믹 권선 칩 인덕터 산업 체인 분석
세라믹 권선 칩 인덕터 시장 역학
제12장 마케팅 전략 분석, 판매대리점
제13장 조사 결과와 결론
제14장 부록
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영문 목차
영문목차
The global Ceramic Wire Wound Chip Power Inductor market was valued at US$ 117.88 million in 2023 and will reach US$ 164.10million by the end of 2030, growing at a CAGR of 4.93% during 2024-2030.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Ceramic Wire Wound Chip Power Inductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ceramic Wire Wound Chip Power Inductor.
The Ceramic Wire Wound Chip Power Inductor market size, estimations, and forecasts are provided in terms of sales volume (Million PCS) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Ceramic Wire Wound Chip Power Inductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Ceramic Wire Wound Chip Power Inductor market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
Market Segmentation
This report covers the Ceramic Wire Wound Chip Power Inductor segments by manufacturers, by Type, by Application, by region and country, and provides market size (value, volume and average price) and CAGR for the history and forecast period (2019-2023, 2024-2030), considering 2023 as the base year. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
By Company
Murata
Coilcraft
Sumida
Shenzhen Sunlord Electronics
Sagami
Laird IWC
Wurth Electronics
KYOCERA AVX
Eaton
Bourns
Fenghua
ABC ATEC
Erocore
Shenzhen Zhenhua
ZenithTek
Johanson Technology
Segment by Type
High Frequency Inductor
Low Frequency Inductor
Segment by Application
RF and Communication Devices
Consumer Electronics
Industrial Equipment
Medical
Others
By Region
North America
United States
Canada
Mexico
Asia-Pacific
China
Japan
South Korea
India
Southeast Asia
Europe
Germany
France
U.K.
Italy
Benelux
Latin America
Brazil
Argentina
Middle East & Africa
Chapter Outline
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, Latin America, Middle East & Africa.
Chapter Two: Detailed analysis of Ceramic Wire Wound Chip Power Inductor manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Ceramic Wire Wound Chip Power Inductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, Latin America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Table of Contents
1 Ceramic Wire Wound Chip Power Inductor Market Overview
1.1 Ceramic Wire Wound Chip Power Inductor Product Overview
1.2 Ceramic Wire Wound Chip Inductor Market by Type
1.2.1 High Frequency Inductor
1.2.2 Low Frequency Inductor
1.3 Global Ceramic Wire Wound Chip Power Inductor Market Size by Type
1.3.1 Global Ceramic Wire Wound Chip Power Inductor Market Size Overview by Type (2019-2030)
1.3.2 Global Ceramic Wire Wound Chip Power Inductor Historic Market Size Review by Type (2019-2024)
1.3.3 Global Ceramic Wire Wound Chip Power Inductor Forecasted Market Size by Type (2025-2030)
1.4 Key Regions Market Size by Type
1.4.1 North America Ceramic Wire Wound Chip Power Inductor Sales Breakdown by Type (2019-2024)
1.4.2 Europe Ceramic Wire Wound Chip Power Inductor Sales Breakdown by Type (2019-2024)
1.4.3 Asia-Pacific Ceramic Wire Wound Chip Power Inductor Sales Breakdown by Type (2019-2024)
1.4.4 Latin America Ceramic Wire Wound Chip Power Inductor Sales Breakdown by Type (2019-2024)
1.4.5 Middle East and Africa Ceramic Wire Wound Chip Power Inductor Sales Breakdown by Type (2019-2024)
2 Ceramic Wire Wound Chip Inductor Market Competition by Company
2.1 Global Top Players by Ceramic Wire Wound Chip Inductor Sales (2019-2024)
2.2 Global Top Players by Ceramic Wire Wound Chip Inductor Revenue (2019-2024)
2.3 Global Top Players by Ceramic Wire Wound Chip Inductor Price (2019-2024)
2.4 Global Top Manufacturers Ceramic Wire Wound Chip Inductor Area Served Distribution and Headquarters
