Global Low Temperature Co Fired Ceramic Substrate Market - Forecasts from 2024 to 2029
상품코드:1456985
리서치사:Knowledge Sourcing Intelligence
발행일:2024년 02월
페이지 정보:영문 114 Pages
라이선스 & 가격 (부가세 별도)
한글목차
세계 저온 공동 소성 세라믹 기판(LTCC) 시장은 복합 연간 성장률(CAGR) 7.87%로 성장할 전망이며 시장 규모는 2022년의 86억 8,000만 달러에서 2029년에는 147억 5,600만 달러에 이를 것으로 예측되고 있습니다.
저온 공동 소성 세라믹(LTCC)은 은이나 구리 등 저저항 금속 도체를 낮은 소성 온도(1,000℃ 이하)에서 코발트 소성한 다층 유리 세라믹 기판입니다. 소형,경량으로 고속 동작이 가능한 전자 부품이나 기판이 인기가 되고 있습니다.
시장 성장 촉진요인:
다양한 최종 용도 부문 수요 증가.
통신, 의료, 자동차, 산업, 방위, 항공우주는 코발트 소성 세라믹 수요를 견인하는 최종 이용 산업 중 하나입니다. 열 안정성의 향상과 화학적 불활성의 성질에 있어서, 공소성 세라믹이 종래의 프린트 회로 기판보다 우수하다는 것이, 이러한 업계가 LTCC나 HTCC를 선호하는 기본적인 요인이 되고 있습니다. 하이엔드 컴퓨팅 시스템과 나노기술에 대한 수요 증가는 새로운 산업의 전망을 열 것으로 예상됩니다.
다양한 장점
저손실 유전체 재료, 임베디드 수동 부품 통합의 용이성, 신뢰성 있는 다층 기능 등 LTCC의 장점은 그 수요를 높이고 있습니다. LTCC에 사용되는 세라믹 재료는 표준 PCB 재료보다 손실 탄젠트가 작습니다. 이러한 소형 디바이스는 LTCC를 사용함으로써 저비용으로 제조할 수 있기 때문에 스마트폰, PC, 휴대기기, AR/VR 용도로 널리 사용되고 있는 고주파 모듈에 대한 수요가 높아지고 있습니다.
시장 성장 억제요인
기술적 문제
LTCC의 성능에 영향을 미치는 수축 관련 문제와 LTCC의 낮은 열전도율은 예측 기간 동안 저온 공동 소성 세라믹 기판(LTCC) 시장의 확대를 방해할 것으로 예상됩니다.
목차
제1장 서론
시장 개요
시장의 정의
조사 범위
시장 세분화
통화
전제조건
기준년과 예측년의 타임라인
이해관계자에게 있어서의 주요 이점
제2장 조사 방법
조사 디자인
조사 과정
제3장 주요 요약
주요 조사 결과
애널리스트 보기
제4장 시장 역학
시장 성장 촉진요인
시장 성장 억제요인
Porter's Five Forces 분석
업계 밸류체인 분석
애널리스트 보기
제5장 세계 저온 공동 소성 세라믹 기판(LTCC) 시장 : 유형별
소개
RF 시스템 레벨 패키지
광전자 패키지
어레이 패키지
기타
제6장 세계 저온 공동 소성 세라믹 기판(LTCC) 시장 : 최종 사용자 산업별
소개
가전
자동차
항공우주와 군사
통신
기타
제7장 세계 저온 공동 소성 세라믹 기판(LTCC) 시장 :지역별
소개
북미
남미
유럽
중동 및 아프리카
아시아태평양
제8장 경쟁 환경과 분석
주요 기업과 전략 분석
시장 점유율 분석
합병, 인수, 합의 및 콜라보레이션
경쟁 대시보드
제9장 기업 프로파일
Kyocera Corporation
DowDuPont, Inc.
Koa Speer Electronics, Inc.
Murata Manufacturing Co., Ltd.
Selmic Oy
TDK Corporation
Yokowo Co., Ltd.
NGK SPARK PLUG CO., LTD.
Adamant Namiki
Apitech
BJH
영문 목차
영문목차
The global low temperature co-fired ceramic substrate market is expected to grow at a CAGR of 7.87%, reaching a market size of US$14.756 billion in 2029 from US$8.68 billion in 2022.
Low-temperature co-fired Ceramics (LTCC) are multilayer glass-ceramic substrates that are co-fired with low resistance metal conductors at a low firing temperature (less than 1000°C) such as silver or copper. Electronic components and substrates that are compact, light, and deliver high speed have become popular.
Market Drivers:
Rising demand from various end-use sectors-
Telecommunications, medical, automotive, industrial, defense, and aerospace are among the end-use industries driving demand for co-fired ceramics. The robust benefits profile that co-fired ceramics have over conventional printed circuit boards in terms of improved thermal stability and the nature of their chemical inactivity is a fundamental factor for these sectors preference for LTCC and HTCC. Increased demand for high-end computing systems and nanotechnology would open up new industry prospects.
Various advantages-
The advantages of LTCC, such as low-loss dielectric materials, ease of integrating embedded passive components, and reliable multilayer capabilities have increased their demand. Ceramic material utilized in LTCC has a lower loss tangent than standard PCB material. These small devices may be made using LTCC at a low cost, which has boosted demand for radiofrequency modules, which are widely used in smartphones, personal computers, portable devices, and AR/VR applications.
Market Restraint-
Technical Issue-
Shrinkage-related problems affecting LTCC Performance and the low thermal conductivity of LTCC are expected to stifle the expansion of the Low-Temperature Co-fired ceramics substrate market in the projected period.
Market Segmentation:
By type, the global Low-Temperature Co-Fired ceramic substrate market is segmented into RF System Level Package, Optoelectronic Packages, Array Packages, and others. By end-user industry, the global Low-Temperature Co-Fired ceramic substrate market is segmented into consumer electronics, automotive, aerospace and military, telecommunication, and others. Due to the incorporation of sensors in many elements of cars, such as engines and power transmissions, the automotive segment holds a significant share. The consumer electronics industry has been also employing LTCC technology due to miniaturization, causing smaller electronic circuit boards to overheat.
Geographical segments:
The Asia-Pacific market is expected to the significant growth in demand for electronic devices, combined with technological developments and improvements in electronics. The country has a large number of market participants at each stage of the supply chain and has been spending heavily on new inventions and research and development. During the projected period, North America is also expected to account for a significant portion of the global market. The expansion of the electronic and automotive industries and R&D investments in North America is a major driver of the low-temperature co-fired ceramic (LTCC) substrate industry.
Market Developments:
March 2023- TMY Technology Inc. (TMYTEK) and Celanese collaborated to showcase an innovative Ultra-Low Size, Weight, and Power (SWaP) Electronically Steered Antenna (ESA) solution featuring Antenna-on-Chip (AoC) technology at Satellite 2023. TMYTEK, a leading provider of millimeter-wave solutions, joined forces with Celanese, a global chemical and specialty materials company, to unveil their latest advancement. The dual-polarization AoC technology was crafted using Micromax(R) GreenTape(TM) low-temperature co-fired ceramic (LTCC).
Market Segmentation:
By Type
RF System Level Package
Optoelectronic Package
Array Package
Others
By End-User Industry
Consumer Electronics
Automotive
Aerospace and Military
Telecommunication
Others
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
UK
Germany
France
Others
Middle East and Africa
Saudi Arabia
Israel
Others
Asia Pacific
China
Japan
India
South Korea
Taiwan
Indonesia
Others
TABLE OF CONTENTS
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline
1.8. Key benefits to the stakeholder
2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Research Process
3. EXECUTIVE SUMMARY
3.1. Key Findings
3.2. Analyst View
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Porter's Five Forces Analysis
4.3.1. Bargaining Power of Suppliers
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis
4.5. Analyst View
5. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY TYPE
5.1. Introduction
5.2. RF System Level Package
5.2.1. Market opportunities and trends
5.2.2. Growth prospects
5.2.3. Geographic lucrativeness
5.3. Optoelectronic Package
5.3.1. Market opportunities and trends
5.3.2. Growth prospects
5.3.3. Geographic lucrativeness
5.4. Array Package
5.4.1. Market opportunities and trends
5.4.2. Growth prospects
5.4.3. Geographic lucrativeness
5.5. Others
5.5.1. Market opportunities and trends
5.5.2. Growth prospects
5.5.3. Geographic lucrativeness
6. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY END-USER INDUSTRY
6.1. Introduction
6.2. Consumer Electronics
6.2.1. Market opportunities and trends
6.2.2. Growth prospects
6.2.3. Geographic lucrativeness
6.3. Automotive
6.3.1. Market opportunities and trends
6.3.2. Growth prospects
6.3.3. Geographic lucrativeness
6.4. Aerospace and Military
6.4.1. Market opportunities and trends
6.4.2. Growth prospects
6.4.3. Geographic lucrativeness
6.5. Telecommunication
6.5.1. Market opportunities and trends
6.5.2. Growth prospects
6.5.3. Geographic lucrativeness
6.6. Others
6.6.1. Market opportunities and trends
6.6.2. Growth prospects
6.6.3. Geographic lucrativeness
7. GLOBAL LOW-TEMPERATURE CO-FIRED CERAMIC SUBSTRATE MARKET BY GEOGRAPHY
7.1. Introduction
7.2. North America
7.2.1. By Type
7.2.2. By End-user
7.2.3. By Country
7.2.3.1. United States
7.2.3.1.1. Market Trends and Opportunities
7.2.3.1.2. Growth Prospects
7.2.3.2. Canada
7.2.3.2.1. Market Trends and Opportunities
7.2.3.2.2. Growth Prospects
7.2.3.3. Mexico
7.2.3.3.1. Market Trends and Opportunities
7.2.3.3.2. Growth Prospects
7.3. South America
7.3.1. By Type
7.3.2. By End-user
7.3.3. By Country
7.3.3.1. Brazil
7.3.3.1.1. Market Trends and Opportunities
7.3.3.1.2. Growth Prospects
7.3.3.2. Argentina
7.3.3.2.1. Market Trends and Opportunities
7.3.3.2.2. Growth Prospects
7.3.3.3. Others
7.3.3.3.1. Market Trends and Opportunities
7.3.3.3.2. Growth Prospects
7.4. Europe
7.4.1. By Type
7.4.2. By End-user
7.4.3. By Country
7.4.3.1. Germany
7.4.3.1.1. Market Trends and Opportunities
7.4.3.1.2. Growth Prospects
7.4.3.2. France
7.4.3.2.1. Market Trends and Opportunities
7.4.3.2.2. Growth Prospects
7.4.3.3. United Kingdom
7.4.3.3.1. Market Trends and Opportunities
7.4.3.3.2. Growth Prospects
7.4.3.4. Others
7.4.3.4.1. Market Trends and Opportunities
7.4.3.4.2. Growth Prospects
7.5. Middle East and Africa
7.5.1. By Type
7.5.2. By End-user
7.5.3. By Country
7.5.3.1. Saudi Arabia
7.5.3.1.1. Market Trends and Opportunities
7.5.3.1.2. Growth Prospects
7.5.3.2. Israel
7.5.3.2.1. Market Trends and Opportunities
7.5.3.2.2. Growth Prospects
7.5.3.3. Others
7.5.3.3.1. Market Trends and Opportunities
7.5.3.3.2. Growth Prospects
7.6. Asia Pacific
7.6.1. By Type
7.6.2. By End-user
7.6.3. By Country
7.6.3.1. China
7.6.3.1.1. Market Trends and Opportunities
7.6.3.1.2. Growth Prospects
7.6.3.2. Japan
7.6.3.2.1. Market Trends and Opportunities
7.6.3.2.2. Growth Prospects
7.6.3.3. India
7.6.3.3.1. Market Trends and Opportunities
7.6.3.3.2. Growth Prospects
7.6.3.4. South Korea
7.6.3.4.1. Market Trends and Opportunities
7.6.3.4.2. Growth Prospects
7.6.3.5. Indonesia
7.6.3.5.1. Market Trends and Opportunities
7.6.3.5.2. Growth Prospects
7.6.3.6. Taiwan
7.6.3.6.1. Market Trends and Opportunities
7.6.3.6.2. Growth Prospects
7.6.3.7. Others
7.6.3.7.1. Market Trends and Opportunities
7.6.3.7.2. Growth Prospects
8. COMPETITIVE ENVIRONMENT AND ANALYSIS
8.1. Major Players and Strategy Analysis
8.2. Market Share Analysis
8.3. Mergers, Acquisition, Agreements, and Collaborations
