한글목차

DCB 및 AMB 기판 시장 규모는 2024년에 9억 9,600만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 12.2%로 성장하여 2031년까지 21억 4,800만 달러로 확대될 것으로 예측됩니다.

본 보고서는 DCB 및 AMB 기판에 대한 최근 관세 조정 및 국제적인 전략적 대응 조치에 대해 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구성 등의 관점에서 종합적인 평가를 제공합니다.

본 보고서에서는 DCB 기판과 AMB 기판에 대해 조사하였습니다.

DBC(Direct Bonded Copper) 기판은 세라믹 절연체(Al2O3 또는 AlN) 위에 고온 공융 용융 공정에 의해 순동 금속이 접합되어 세라믹과 견고하게 결합된 구조입니다.

액티브 메탈 브레이징(AMB)은 세라믹 기판의 최신 기술로, AlN(질화알루미늄) 또는 SiN(질화규소)을 사용하여 두꺼운 구리를 제조할 수 있는 기술입니다. 일반적인 금속화 공정을 사용하지 않습니다. AMB는 고온 진공 브레이징 공정을 통해 세라믹 기판 위에 순수 구리를 브레이징하는 기술입니다. 높은 신뢰성과 독자적인 방열성을 갖춘 기판을 제공할 뿐만 아니라, 0.25mm의 얇은 세라믹 기판에서 양면 총 800µm까지 구리 중량을 실현합니다.

세계 DBC 세라믹 기판 시장은 Rogers Corporation, Ferrotech, NGK Electronics Devices, KCC, Shengda Technology, BYD, Heraeus Electronics, Nanjing Zhongjiang New Materials 등 소수의 주요 기업이 주도하고 있습니다. 2024년 기준, 상위 5개사의 점유율은 79.8%를 넘어섰습니다. 최근 중국 시장의 신에너지 자동차의 급속한 성장을 배경으로 DBC 세라믹 기판 시장에 진출하는 중국 기업이 증가하고 있습니다. 앞으로 중국 기업은 전 세계적으로 더욱 중요한 역할을 담당할 것으로 예측됩니다.

AMB 세라믹 기판의 세계 주요 제조업체로는 Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials 등이 있습니다. 2023년 기준, 세계 상위 8개 기업의 매출 점유율은 약 85%를 차지했습니다.

현재 AMB 세라믹 기판은 주로 일본, 독일, 중국에서 생산되고 있으며, 2023년 시장 점유율은 각각 27.3%, 24.56%, 43.5%를 차지합니다. 2030년에는 중국의 생산 점유율이 57%를 보일 것으로 예측됩니다. NGK 일렉트로닉스 디바이스와 페로텍이 말레이시아에 AMB 생산 공장 건설을 시작함에 따라 향후 몇 년 동안 동남아시아가 생산 거점으로서 중요한 역할을 할 것으로 예측됩니다.

이 보고서는 DCB 및 AMB 기판 세계 시장에 대해 총 판매량, 매출, 가격, 주요 기업의 시장 점유율 및 순위를 중심으로 지역별, 국가별, 기판 유형별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

DCB 및 AMB 기판 시장 규모, 추정 및 예측은 판매량(평방미터)과 매출액(백만 달러)으로 제시되며, 2024년을 기준 연도로, 2020년에서 2031년까지의 과거 데이터와 예측 데이터를 포함합니다. 정량적, 정성적 분석을 통해 독자들이 비즈니스/성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 포지셔닝 분석, DCB 및 AMB 기판에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 도와드립니다.

시장 세분화

기업별

• Rogers Corporation
• Heraeus Electronics
• Kyocera
• NGK Electronics Devices
• Toshiba Materials
• Denka
• DOWA METALTECH
• KCC
• Proterial
• Mitsubishi Materials
• Jiangsu Fulehua Semiconductor Technology
• BYD
• Bomin Electronics
• Zhejiang TC Ceramic Electronic
• Shengda Tech
• Beijing Moshi Technology
• Nantong Winspower
• Wuxi Tianyang Electronics
• Fengpeng Electronics(Zhuhai)
• Guangzhou Xianyi Electronic Technology
• Fujian Huaqing Electronic Material Technology
• Konfoong Materials International
• Chengdu Wanshida Ceramic Industry
• Littelfuse IXYS
• Zhejiang Jingci Semiconductor
• Taotao Technology
• FJ Composite
• Anhui Taoxinke Semiconductor
• Guangde Dongfeng Semiconductor
• Suzhou Aicheng Technology

기판 유형별 부문

• AMB 세라믹 기판
• DBC 세라믹 기판

용도별 부문

• 자동차·EV/HEV
• 태양광발전 및 풍력발전
• 산업용 드라이브
• 민생 기기·백색가전(냉장고,세탁기등)
• 철도 운송
• 군·아비오닉스
• 기타

지역별

• 북미
  • 미국
  • 캐나다
• 아시아태평양
  • 중국
  • 일본
  • 한국
  • 동남아시아
  • 인도
  • 호주
  • 기타 아시아태평양
• 유럽
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 네덜란드
  • 북유럽 국가
  • 기타 유럽
• 라틴아메리카
  • 멕시코
  • 브라질
  • 기타 라틴아메리카
• 중동 및 아프리카
  • 튀르키예
  • 사우디아라비아
  • 아랍에미리트(UAE)
  • 기타 중동 및 아프리카

영문목차

The global market for DCB and AMB Substrates was estimated to be worth US$ 996 million in 2024 and is forecast to a readjusted size of US$ 2148 million by 2031 with a CAGR of 12.2% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on DCB and AMB Substrates cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

This report studies the DCB and AMB Substrates.

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.

Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.

The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.

Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.

This report aims to provide a comprehensive presentation of the global market for DCB and AMB Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of DCB and AMB Substrates by region & country, by Substrate Type, and by Application.

The DCB and AMB Substrates market size, estimations, and forecasts are provided in terms of sales volume (Sq.m) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding DCB and AMB Substrates.

Market Segmentation

By Company

• Rogers Corporation
• Heraeus Electronics
• Kyocera
• NGK Electronics Devices
• Toshiba Materials
• Denka
• DOWA METALTECH
• KCC
• Proterial
• Mitsubishi Materials
• Jiangsu Fulehua Semiconductor Technology
• BYD
• Bomin Electronics
• Zhejiang TC Ceramic Electronic
• Shengda Tech
• Beijing Moshi Technology
• Nantong Winspower
• Wuxi Tianyang Electronics
• Fengpeng Electronics (Zhuhai)
• Guangzhou Xianyi Electronic Technology
• Fujian Huaqing Electronic Material Technology
• Konfoong Materials International
• Chengdu Wanshida Ceramic Industry
• Littelfuse IXYS
• Zhejiang Jingci Semiconductor
• Taotao Technology
• FJ Composite
• Anhui Taoxinke Semiconductor
• Guangde Dongfeng Semiconductor
• Suzhou Aicheng Technology

Segment by Substrate Type

• AMB Ceramic Substrates
• DBC Ceramic Substrates

Segment by Application

• Automotive & EV/HEV
• PV and Wind Power
• Industrial Drives
• Consumer & White Goods
• Rail Transport
• Military & Avionics
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of DCB and AMB Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Substrate Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of DCB and AMB Substrates in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of DCB and AMB Substrates in country level. It provides sigmate data by Substrate Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 DCB and AMB Substrates Product Introduction
• 1.2 Global DCB and AMB Substrates Market Size Forecast
  • 1.2.1 Global DCB and AMB Substrates Sales Value (2020-2031)
  • 1.2.2 Global DCB and AMB Substrates Sales Volume (2020-2031)
  • 1.2.3 Global DCB and AMB Substrates Sales Price (2020-2031)
• 1.3 DCB and AMB Substrates Market Trends & Drivers
  • 1.3.1 DCB and AMB Substrates Industry Trends
  • 1.3.2 DCB and AMB Substrates Market Drivers & Opportunity
  • 1.3.3 DCB and AMB Substrates Market Challenges
  • 1.3.4 DCB and AMB Substrates Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global DCB and AMB Substrates Players Revenue Ranking (2024)
• 2.2 Global DCB and AMB Substrates Revenue by Company (2020-2025)
• 2.3 Global DCB and AMB Substrates Players Sales Volume Ranking (2024)
• 2.4 Global DCB and AMB Substrates Sales Volume by Company Players (2020-2025)
• 2.5 Global DCB and AMB Substrates Average Price by Company (2020-2025)
• 2.6 Key Manufacturers DCB and AMB Substrates Manufacturing Base and Headquarters
• 2.7 Key Manufacturers DCB and AMB Substrates Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of DCB and AMB Substrates
• 2.9 DCB and AMB Substrates Market Competitive Analysis
  • 2.9.1 DCB and AMB Substrates Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by DCB and AMB Substrates Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in DCB and AMB Substrates as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Substrate Type

• 3.1 Introduction by Substrate Type
  • 3.1.1 AMB Ceramic Substrates
  • 3.1.2 DBC Ceramic Substrates
• 3.2 Global DCB and AMB Substrates Sales Value by Substrate Type
  • 3.2.1 Global DCB and AMB Substrates Sales Value by Substrate Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global DCB and AMB Substrates Sales Value, by Substrate Type (2020-2031)
  • 3.2.3 Global DCB and AMB Substrates Sales Value, by Substrate Type (%) (2020-2031)
• 3.3 Global DCB and AMB Substrates Sales Volume by Substrate Type
  • 3.3.1 Global DCB and AMB Substrates Sales Volume by Substrate Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global DCB and AMB Substrates Sales Volume, by Substrate Type (2020-2031)
  • 3.3.3 Global DCB and AMB Substrates Sales Volume, by Substrate Type (%) (2020-2031)
• 3.4 Global DCB and AMB Substrates Average Price by Substrate Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Automotive & EV/HEV
  • 4.1.2 PV and Wind Power
  • 4.1.3 Industrial Drives
  • 4.1.4 Consumer & White Goods
  • 4.1.5 Rail Transport
  • 4.1.6 Military & Avionics
  • 4.1.7 Others
• 4.2 Global DCB and AMB Substrates Sales Value by Application
  • 4.2.1 Global DCB and AMB Substrates Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global DCB and AMB Substrates Sales Value, by Application (2020-2031)
  • 4.2.3 Global DCB and AMB Substrates Sales Value, by Application (%) (2020-2031)
• 4.3 Global DCB and AMB Substrates Sales Volume by Application
  • 4.3.1 Global DCB and AMB Substrates Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global DCB and AMB Substrates Sales Volume, by Application (2020-2031)
  • 4.3.3 Global DCB and AMB Substrates Sales Volume, by Application (%) (2020-2031)
• 4.4 Global DCB and AMB Substrates Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global DCB and AMB Substrates Sales Value by Region
  • 5.1.1 Global DCB and AMB Substrates Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global DCB and AMB Substrates Sales Value by Region (2020-2025)
  • 5.1.3 Global DCB and AMB Substrates Sales Value by Region (2026-2031)
  • 5.1.4 Global DCB and AMB Substrates Sales Value by Region (%), (2020-2031)
• 5.2 Global DCB and AMB Substrates Sales Volume by Region
  • 5.2.1 Global DCB and AMB Substrates Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global DCB and AMB Substrates Sales Volume by Region (2020-2025)
  • 5.2.3 Global DCB and AMB Substrates Sales Volume by Region (2026-2031)
  • 5.2.4 Global DCB and AMB Substrates Sales Volume by Region (%), (2020-2031)
• 5.3 Global DCB and AMB Substrates Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America DCB and AMB Substrates Sales Value, 2020-2031
  • 5.4.2 North America DCB and AMB Substrates Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe DCB and AMB Substrates Sales Value, 2020-2031
  • 5.5.2 Europe DCB and AMB Substrates Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific DCB and AMB Substrates Sales Value, 2020-2031
  • 5.6.2 Asia Pacific DCB and AMB Substrates Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America DCB and AMB Substrates Sales Value, 2020-2031
  • 5.7.2 South America DCB and AMB Substrates Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa DCB and AMB Substrates Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa DCB and AMB Substrates Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions DCB and AMB Substrates Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions DCB and AMB Substrates Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions DCB and AMB Substrates Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions DCB and AMB Substrates Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States DCB and AMB Substrates Sales Value, 2020-2031
  • 6.3.2 United States DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.3.3 United States DCB and AMB Substrates Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe DCB and AMB Substrates Sales Value, 2020-2031
  • 6.4.2 Europe DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.4.3 Europe DCB and AMB Substrates Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China DCB and AMB Substrates Sales Value, 2020-2031
  • 6.5.2 China DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.5.3 China DCB and AMB Substrates Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan DCB and AMB Substrates Sales Value, 2020-2031
  • 6.6.2 Japan DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.6.3 Japan DCB and AMB Substrates Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea DCB and AMB Substrates Sales Value, 2020-2031
  • 6.7.2 South Korea DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.7.3 South Korea DCB and AMB Substrates Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia DCB and AMB Substrates Sales Value, 2020-2031
  • 6.8.2 Southeast Asia DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia DCB and AMB Substrates Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India DCB and AMB Substrates Sales Value, 2020-2031
  • 6.9.2 India DCB and AMB Substrates Sales Value by Substrate Type (%), 2024 VS 2031
  • 6.9.3 India DCB and AMB Substrates Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Rogers Corporation
  • 7.1.1 Rogers Corporation Company Information
  • 7.1.2 Rogers Corporation Introduction and Business Overview
  • 7.1.3 Rogers Corporation DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Rogers Corporation DCB and AMB Substrates Product Offerings
  • 7.1.5 Rogers Corporation Recent Development
• 7.2 Heraeus Electronics
  • 7.2.1 Heraeus Electronics Company Information
  • 7.2.2 Heraeus Electronics Introduction and Business Overview
  • 7.2.3 Heraeus Electronics DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Heraeus Electronics DCB and AMB Substrates Product Offerings
  • 7.2.5 Heraeus Electronics Recent Development
• 7.3 Kyocera
  • 7.3.1 Kyocera Company Information
  • 7.3.2 Kyocera Introduction and Business Overview
  • 7.3.3 Kyocera DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 Kyocera DCB and AMB Substrates Product Offerings
  • 7.3.5 Kyocera Recent Development
• 7.4 NGK Electronics Devices
  • 7.4.1 NGK Electronics Devices Company Information
  • 7.4.2 NGK Electronics Devices Introduction and Business Overview
  • 7.4.3 NGK Electronics Devices DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 NGK Electronics Devices DCB and AMB Substrates Product Offerings
  • 7.4.5 NGK Electronics Devices Recent Development
• 7.5 Toshiba Materials
  • 7.5.1 Toshiba Materials Company Information
  • 7.5.2 Toshiba Materials Introduction and Business Overview
  • 7.5.3 Toshiba Materials DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Toshiba Materials DCB and AMB Substrates Product Offerings
  • 7.5.5 Toshiba Materials Recent Development
• 7.6 Denka
  • 7.6.1 Denka Company Information
  • 7.6.2 Denka Introduction and Business Overview
  • 7.6.3 Denka DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 Denka DCB and AMB Substrates Product Offerings
  • 7.6.5 Denka Recent Development
• 7.7 DOWA METALTECH
  • 7.7.1 DOWA METALTECH Company Information
  • 7.7.2 DOWA METALTECH Introduction and Business Overview
  • 7.7.3 DOWA METALTECH DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 DOWA METALTECH DCB and AMB Substrates Product Offerings
  • 7.7.5 DOWA METALTECH Recent Development
• 7.8 KCC
  • 7.8.1 KCC Company Information
  • 7.8.2 KCC Introduction and Business Overview
  • 7.8.3 KCC DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 KCC DCB and AMB Substrates Product Offerings
  • 7.8.5 KCC Recent Development
• 7.9 Proterial
  • 7.9.1 Proterial Company Information
  • 7.9.2 Proterial Introduction and Business Overview
  • 7.9.3 Proterial DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 Proterial DCB and AMB Substrates Product Offerings
  • 7.9.5 Proterial Recent Development
• 7.10 Mitsubishi Materials
  • 7.10.1 Mitsubishi Materials Company Information
  • 7.10.2 Mitsubishi Materials Introduction and Business Overview
  • 7.10.3 Mitsubishi Materials DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Mitsubishi Materials DCB and AMB Substrates Product Offerings
  • 7.10.5 Mitsubishi Materials Recent Development
• 7.11 Jiangsu Fulehua Semiconductor Technology
  • 7.11.1 Jiangsu Fulehua Semiconductor Technology Company Information
  • 7.11.2 Jiangsu Fulehua Semiconductor Technology Introduction and Business Overview
  • 7.11.3 Jiangsu Fulehua Semiconductor Technology DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Jiangsu Fulehua Semiconductor Technology DCB and AMB Substrates Product Offerings
  • 7.11.5 Jiangsu Fulehua Semiconductor Technology Recent Development
• 7.12 BYD
  • 7.12.1 BYD Company Information
  • 7.12.2 BYD Introduction and Business Overview
  • 7.12.3 BYD DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 BYD DCB and AMB Substrates Product Offerings
  • 7.12.5 BYD Recent Development
• 7.13 Bomin Electronics
  • 7.13.1 Bomin Electronics Company Information
  • 7.13.2 Bomin Electronics Introduction and Business Overview
  • 7.13.3 Bomin Electronics DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.13.4 Bomin Electronics DCB and AMB Substrates Product Offerings
  • 7.13.5 Bomin Electronics Recent Development
• 7.14 Zhejiang TC Ceramic Electronic
  • 7.14.1 Zhejiang TC Ceramic Electronic Company Information
  • 7.14.2 Zhejiang TC Ceramic Electronic Introduction and Business Overview
  • 7.14.3 Zhejiang TC Ceramic Electronic DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.14.4 Zhejiang TC Ceramic Electronic DCB and AMB Substrates Product Offerings
  • 7.14.5 Zhejiang TC Ceramic Electronic Recent Development
• 7.15 Shengda Tech
  • 7.15.1 Shengda Tech Company Information
  • 7.15.2 Shengda Tech Introduction and Business Overview
  • 7.15.3 Shengda Tech DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.15.4 Shengda Tech DCB and AMB Substrates Product Offerings
  • 7.15.5 Shengda Tech Recent Development
• 7.16 Beijing Moshi Technology
  • 7.16.1 Beijing Moshi Technology Company Information
  • 7.16.2 Beijing Moshi Technology Introduction and Business Overview
  • 7.16.3 Beijing Moshi Technology DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.16.4 Beijing Moshi Technology DCB and AMB Substrates Product Offerings
  • 7.16.5 Beijing Moshi Technology Recent Development
• 7.17 Nantong Winspower
  • 7.17.1 Nantong Winspower Company Information
  • 7.17.2 Nantong Winspower Introduction and Business Overview
  • 7.17.3 Nantong Winspower DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.17.4 Nantong Winspower DCB and AMB Substrates Product Offerings
  • 7.17.5 Nantong Winspower Recent Development
• 7.18 Wuxi Tianyang Electronics
  • 7.18.1 Wuxi Tianyang Electronics Company Information
  • 7.18.2 Wuxi Tianyang Electronics Introduction and Business Overview
  • 7.18.3 Wuxi Tianyang Electronics DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.18.4 Wuxi Tianyang Electronics DCB and AMB Substrates Product Offerings
  • 7.18.5 Wuxi Tianyang Electronics Recent Development
• 7.19 Fengpeng Electronics (Zhuhai)
  • 7.19.1 Fengpeng Electronics (Zhuhai) Company Information
  • 7.19.2 Fengpeng Electronics (Zhuhai) Introduction and Business Overview
  • 7.19.3 Fengpeng Electronics (Zhuhai) DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.19.4 Fengpeng Electronics (Zhuhai) DCB and AMB Substrates Product Offerings
  • 7.19.5 Fengpeng Electronics (Zhuhai) Recent Development
• 7.20 Guangzhou Xianyi Electronic Technology
  • 7.20.1 Guangzhou Xianyi Electronic Technology Company Information
  • 7.20.2 Guangzhou Xianyi Electronic Technology Introduction and Business Overview
  • 7.20.3 Guangzhou Xianyi Electronic Technology DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.20.4 Guangzhou Xianyi Electronic Technology DCB and AMB Substrates Product Offerings
  • 7.20.5 Guangzhou Xianyi Electronic Technology Recent Development
• 7.21 Fujian Huaqing Electronic Material Technology
  • 7.21.1 Fujian Huaqing Electronic Material Technology Company Information
  • 7.21.2 Fujian Huaqing Electronic Material Technology Introduction and Business Overview
  • 7.21.3 Fujian Huaqing Electronic Material Technology DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.21.4 Fujian Huaqing Electronic Material Technology DCB and AMB Substrates Product Offerings
  • 7.21.5 Fujian Huaqing Electronic Material Technology Recent Development
• 7.22 Konfoong Materials International
  • 7.22.1 Konfoong Materials International Company Information
  • 7.22.2 Konfoong Materials International Introduction and Business Overview
  • 7.22.3 Konfoong Materials International DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.22.4 Konfoong Materials International DCB and AMB Substrates Product Offerings
  • 7.22.5 Konfoong Materials International Recent Development
• 7.23 Chengdu Wanshida Ceramic Industry
  • 7.23.1 Chengdu Wanshida Ceramic Industry Company Information
  • 7.23.2 Chengdu Wanshida Ceramic Industry Introduction and Business Overview
  • 7.23.3 Chengdu Wanshida Ceramic Industry DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.23.4 Chengdu Wanshida Ceramic Industry DCB and AMB Substrates Product Offerings
  • 7.23.5 Chengdu Wanshida Ceramic Industry Recent Development
• 7.24 Littelfuse IXYS
  • 7.24.1 Littelfuse IXYS Company Information
  • 7.24.2 Littelfuse IXYS Introduction and Business Overview
  • 7.24.3 Littelfuse IXYS DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.24.4 Littelfuse IXYS DCB and AMB Substrates Product Offerings
  • 7.24.5 Littelfuse IXYS Recent Development
• 7.25 Zhejiang Jingci Semiconductor
  • 7.25.1 Zhejiang Jingci Semiconductor Company Information
  • 7.25.2 Zhejiang Jingci Semiconductor Introduction and Business Overview
  • 7.25.3 Zhejiang Jingci Semiconductor DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.25.4 Zhejiang Jingci Semiconductor DCB and AMB Substrates Product Offerings
  • 7.25.5 Zhejiang Jingci Semiconductor Recent Development
• 7.26 Taotao Technology
  • 7.26.1 Taotao Technology Company Information
  • 7.26.2 Taotao Technology Introduction and Business Overview
  • 7.26.3 Taotao Technology DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.26.4 Taotao Technology DCB and AMB Substrates Product Offerings
  • 7.26.5 Taotao Technology Recent Development
• 7.27 FJ Composite
  • 7.27.1 FJ Composite Company Information
  • 7.27.2 FJ Composite Introduction and Business Overview
  • 7.27.3 FJ Composite DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.27.4 FJ Composite DCB and AMB Substrates Product Offerings
  • 7.27.5 FJ Composite Recent Development
• 7.28 Anhui Taoxinke Semiconductor
  • 7.28.1 Anhui Taoxinke Semiconductor Company Information
  • 7.28.2 Anhui Taoxinke Semiconductor Introduction and Business Overview
  • 7.28.3 Anhui Taoxinke Semiconductor DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.28.4 Anhui Taoxinke Semiconductor DCB and AMB Substrates Product Offerings
  • 7.28.5 Anhui Taoxinke Semiconductor Recent Development
• 7.29 Guangde Dongfeng Semiconductor
  • 7.29.1 Guangde Dongfeng Semiconductor Company Information
  • 7.29.2 Guangde Dongfeng Semiconductor Introduction and Business Overview
  • 7.29.3 Guangde Dongfeng Semiconductor DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.29.4 Guangde Dongfeng Semiconductor DCB and AMB Substrates Product Offerings
  • 7.29.5 Guangde Dongfeng Semiconductor Recent Development
• 7.30 Suzhou Aicheng Technology
  • 7.30.1 Suzhou Aicheng Technology Company Information
  • 7.30.2 Suzhou Aicheng Technology Introduction and Business Overview
  • 7.30.3 Suzhou Aicheng Technology DCB and AMB Substrates Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.30.4 Suzhou Aicheng Technology DCB and AMB Substrates Product Offerings
  • 7.30.5 Suzhou Aicheng Technology Recent Development

8 Industry Chain Analysis

• 8.1 DCB and AMB Substrates Industrial Chain
• 8.2 DCB and AMB Substrates Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 DCB and AMB Substrates Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 DCB and AMB Substrates Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer