E-Beam Wafer Inspection System Market Report by Resolution, Application, End Use, and Region 2024-2032
전자빔 웨이퍼 검사 시스템 시장 세계 시장 규모는 2023년 7억 5,990만 달러에 달했습니다. 앞으로 IMARC Group은 시장이 2032년까지 34억 5,960만 달러에 이르고, 2024년과 2032년 사이에 17.8%의 성장률(CAGR)을 나타낼 것으로 예측했습니다.
전자 빔 웨이퍼 검사 시스템은 집적 회로(IC) 부품 및 웨이퍼의 전자 빔 스캐닝에 기반한 반도체 제조 툴을 말합니다. 최종 패키징 전에 웨이퍼의 결함을 감지하는 데 사용되며 다이의 작은 섹션을 스캔하여 탐지하기 어려운 특정 체계적 결함과 무작위 결함을 식별하는 데 이상적입니다. 검사 시스템은 웨이퍼를 스캔하고 인접한 다이의 이미지와 비교하여 결함의 좌표를 결정합니다. 이 기술은 소형 가젯, 스마트폰, 노트북, 태블릿 제조 시 일반적으로 사용됩니다. 또한 리소그래피 인증, 웨이퍼 배치 및 레티클 품질 최적화에 사용됩니다.
전자 산업의 현저한 성장은 급속한 산업화와 함께 시장의 밝은 전망을 창출하는 중요한 요소 중 하나입니다. 반도체 웨이퍼는 특수 디바이스 및 가전제품의 제조에 널리 사용되고 있으며, 효율적인 검사 시스템에 대한 수요가 증가하고 있습니다. 게다가 자동차의 전동화와 자동화도 시장 성장의 원동력이 되고 있습니다. 자동차 부품에는 에어백 제어, GPS, 안티록 브레이크 시스템(ABS), 네비게이션 디스플레이 시스템, 파워다운 윈도우 제어 등 수많은 웨이퍼가 사용되고 있습니다. 또한 자율주행과 충돌 감지 기술의 향상에도 사용되어 웨이퍼 검사 시스템 수요를 높이고 있습니다. 또한, 보다 효율적이고 대량생산에 필요한 전체 시간을 최소화하는 멀티빔 전자빔 검사 시스템의 개발 등 다양한 기술의 진보가 시장을 더욱 견인할 것으로 예측되고 있습니다.
이 보고서에서 다루는 주요 질문
- 세계의 전자빔 웨이퍼 검사 시스템 시장은 지금까지 어떻게 추이하고 향후 어떻게 추이해 나갈 것인가?
- COVID-19는 세계 전자빔 웨이퍼 검사 시스템 시장에 어떤 영향을 미쳤는가?
- 주요 지역 시장은?
- 해상도별 시장 분석은?
- 용도별 시장 분석은?
- 최종 용도별 시장 분석은?
- 업계의 밸류체인의 다양한 단계란?
- 업계의 주요 촉진요인과 도전은 무엇인가?
- 세계의 전자빔 웨이퍼 검사 시스템 시장의 구조와 주요 기업은?
- 업계 경쟁도는?
목차
제1장 서문
제2장 조사 범위와 조사 방법
- 조사의 목적
- 이해관계자
- 데이터 소스
- 시장 추정
- 조사 방법
제3장 주요 요약
제4장 소개
제5장 세계의 전자빔 웨이퍼 검사 시스템 시장
- 시장 개요
- 시장 실적
- COVID-19의 영향
- 시장 예측
제6장 시장 분석 : 해상도별
제7장 시장 분석 : 용도별
- 결함 이미지
- 리소그래피 자격
- 베어 웨이퍼 OQC/IQC
- 웨이퍼 처리
- 레티클 품질 검사
- 인스펙터 레시피 최적화
제8장 시장 내역: 최종 용도별
- 통신 기기
- 소비자용 전자 기기
- 자동차 부품
- 기타
제9장 시장 분석 : 지역별
- 북미
- 아시아태평양
- 유럽
- 독일
- 프랑스
- 영국
- 이탈리아
- 스페인
- 러시아
- 기타
- 라틴아메리카
- 중동 및 아프리카
제10장 SWOT 분석
제11장 밸류체인 분석
제12장 Porter's Five Forces 분석
- 개요
- 구매자의 협상력
- 공급기업의 협상력
- 경쟁도
- 신규 진입업자의 위협
- 대체품의 위협
제13장 가격 분석
제14장 경쟁 구도
- 시장 구조
- 주요 기업
- 주요 기업 프로파일
- Aerotech Inc.
- Applied Materials Inc.
- ASML Holding NV
- Hitachi Ltd.
- KLA-Tener Corporation
- Lam Research Corporation
- Nanotronics Imaging Inc.
- NXP Semiconductors NV(Qualcomm Incorporated)
- Renesas Electronics Corporation
- Synopsys Inc.
- Taiwan Semiconductor
- Teledyne Technologies
JHS
The global e-beam wafer inspection system market size reached US$ 759.9 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 3,459.6 Million by 2032, exhibiting a growth rate (CAGR) of 17.8% during 2024-2032.
E-beam wafer inspection system refers to a semiconductor fabrication tool based on electron beam scanning of integrated circuit (IC) components or wafers. It is used for detecting any defects in the wafers before final packaging and is ideal for scanning small sections of a die to identify specific hard-to-detect systematic and random defects. The inspection system scans the wafer and determines coordinates of the defects by comparing it to the image of the adjacent dies. This technique is commonly used while manufacturing compact gadgets, smartphones, laptops and tablets. It is also used for lithographic qualification, wafer dispositioning and reticle quality optimization.
Significant growth in the electronics industry, along with rapid industrialization, is one of the key factors creating a positive outlook for the market. Semiconductor wafers are widely used for manufacturing specialized devices and consumer electronics, thereby increasing the demand for efficient inspection systems. Furthermore, the electrification and automation in automobiles is also driving the market growth. Numerous kinds of wafers are used in automobile components, such as airbag controls, global positioning systems (GPS), anti-lock braking systems (ABS), navigation and display systems and power down and window controls. They are also used for improving automated driving and collision detection technologies, which, in turn, have increased the demand for wafer inspection systems. Moreover, various technological advancements, such as the development of multi-beam e-beam inspection systems that are more efficient and minimize the overall time required for mass production, are projected to drive the market further.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global e-beam wafer inspection system market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on resolution, application and end use.
Breakup by Resolution:
Less than 1 nm
1 nm to 10 nm
More than 10 nm
Breakup by Application:
Defect Imaging
Lithographic Qualification
Bare Wafer OQC/IQC
Wafer Dispositioning
Reticle Quality Inspection
Inspector Recipe Optimization
Breakup by End Use:
Communication Devices
Consumer Electronic Equipments
Automotive Parts
Others
Breakup by Region:
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The report has also analysed the competitive landscape of the market with some of the key players being Aerotech Inc., Applied Materials Inc., ASML Holding N.V., Hitachi Ltd., KLA-Tener Corporation, Lam Research Corporation, Nanotronics Imaging Inc., NXP Semiconductors N.V. (Qualcomm Incorporated), Renesas Electronics Corporation, Synopsys Inc., Taiwan Semiconductor and Teledyne Technologies.
Key Questions Answered in This Report:
- How has the global e-beam wafer inspection system market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global e-beam wafer inspection system market?
- What are the key regional markets?
- What is the breakup of the market based on the resolution?
- What is the breakup of the market based on the application?
- What is the breakup of the market based on the end use?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global e-beam wafer inspection system market and who are the key players?
- What is the degree of competition in the industry?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global E-Beam Wafer Inspection System Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Resolution
- 6.1 Less than 1 nm
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 1 nm to 10 nm
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 More than 10 nm
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
7 Market Breakup by Application
- 7.1 Defect Imaging
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Lithographic Qualification
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 Bare Wafer OQC/IQC
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Wafer Dispositioning
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
- 7.5 Reticle Quality Inspection
- 7.5.1 Market Trends
- 7.5.2 Market Forecast
- 7.6 Inspector Recipe Optimization
- 7.6.1 Market Trends
- 7.6.2 Market Forecast
8 Market Breakup by End Use
- 8.1 Communication Devices
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
- 8.2 Consumer Electronic Equipments
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
- 8.3 Automotive Parts
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
- 8.4 Others
- 8.4.1 Market Trends
- 8.4.2 Market Forecast
9 Market Breakup by Region
- 9.1 North America
- 9.1.1 United States
- 9.1.1.1 Market Trends
- 9.1.1.2 Market Forecast
- 9.1.2 Canada
- 9.1.2.1 Market Trends
- 9.1.2.2 Market Forecast
- 9.2 Asia Pacific
- 9.2.1 China
- 9.2.1.1 Market Trends
- 9.2.1.2 Market Forecast
- 9.2.2 Japan
- 9.2.2.1 Market Trends
- 9.2.2.2 Market Forecast
- 9.2.3 India
- 9.2.3.1 Market Trends
- 9.2.3.2 Market Forecast
- 9.2.4 South Korea
- 9.2.4.1 Market Trends
- 9.2.4.2 Market Forecast
- 9.2.5 Australia
- 9.2.5.1 Market Trends
- 9.2.5.2 Market Forecast
- 9.2.6 Indonesia
- 9.2.6.1 Market Trends
- 9.2.6.2 Market Forecast
- 9.2.7 Others
- 9.2.7.1 Market Trends
- 9.2.7.2 Market Forecast
- 9.3 Europe
- 9.3.1 Germany
- 9.3.1.1 Market Trends
- 9.3.1.2 Market Forecast
- 9.3.2 France
- 9.3.2.1 Market Trends
- 9.3.2.2 Market Forecast
- 9.3.3 United Kingdom
- 9.3.3.1 Market Trends
- 9.3.3.2 Market Forecast
- 9.3.4 Italy
- 9.3.4.1 Market Trends
- 9.3.4.2 Market Forecast
- 9.3.5 Spain
- 9.3.5.1 Market Trends
- 9.3.5.2 Market Forecast
- 9.3.6 Russia
- 9.3.6.1 Market Trends
- 9.3.6.2 Market Forecast
- 9.3.7 Others
- 9.3.7.1 Market Trends
- 9.3.7.2 Market Forecast
- 9.4 Latin America
- 9.4.1 Brazil
- 9.4.1.1 Market Trends
- 9.4.1.2 Market Forecast
- 9.4.2 Mexico
- 9.4.2.1 Market Trends
- 9.4.2.2 Market Forecast
- 9.4.3 Others
- 9.4.3.1 Market Trends
- 9.4.3.2 Market Forecast
- 9.5 Middle East and Africa
- 9.5.1 Market Trends
- 9.5.2 Market Breakup by Country
- 9.5.3 Market Forecast
10 SWOT Analysis
- 10.1 Overview
- 10.2 Strengths
- 10.3 Weaknesses
- 10.4 Opportunities
- 10.5 Threats
11 Value Chain Analysis
12 Porters Five Forces Analysis
- 12.1 Overview
- 12.2 Bargaining Power of Buyers
- 12.3 Bargaining Power of Suppliers
- 12.4 Degree of Competition
- 12.5 Threat of New Entrants
- 12.6 Threat of Substitutes
13 Price Analysis
14 Competitive Landscape
- 14.1 Market Structure
- 14.2 Key Players
- 14.3 Profiles of Key Players
- 14.3.1 Aerotech Inc.
- 14.3.1.1 Company Overview
- 14.3.1.2 Product Portfolio
- 14.3.2 Applied Materials Inc.
- 14.3.2.1 Company Overview
- 14.3.2.2 Product Portfolio
- 14.3.2.3 Financials
- 14.3.2.4 SWOT Analysis
- 14.3.3 ASML Holding N.V.
- 14.3.3.1 Company Overview
- 14.3.3.2 Product Portfolio
- 14.3.3.3 Financials
- 14.3.3.4 SWOT Analysis
- 14.3.4 Hitachi Ltd.
- 14.3.4.1 Company Overview
- 14.3.4.2 Product Portfolio
- 14.3.4.3 Financials
- 14.3.4.4 SWOT Analysis
- 14.3.5 KLA-Tener Corporation
- 14.3.5.1 Company Overview
- 14.3.5.2 Product Portfolio
- 14.3.5.3 Financials
- 14.3.5.4 SWOT Analysis
- 14.3.6 Lam Research Corporation
- 14.3.6.1 Company Overview
- 14.3.6.2 Product Portfolio
- 14.3.6.3 Financials
- 14.3.6.4 SWOT Analysis
- 14.3.7 Nanotronics Imaging Inc.
- 14.3.7.1 Company Overview
- 14.3.7.2 Product Portfolio
- 14.3.8 NXP Semiconductors N.V. (Qualcomm Incorporated)
- 14.3.8.1 Company Overview
- 14.3.8.2 Product Portfolio
- 14.3.8.3 Financials
- 14.3.8.4 SWOT Analysis
- 14.3.9 Renesas Electronics Corporation
- 14.3.9.1 Company Overview
- 14.3.9.2 Product Portfolio
- 14.3.9.3 Financials
- 14.3.9.4 SWOT Analysis
- 14.3.10 Synopsys Inc.
- 14.3.10.1 Company Overview
- 14.3.10.2 Product Portfolio
- 14.3.10.3 Financials
- 14.3.10.4 SWOT Analysis
- 14.3.11 Taiwan Semiconductor
- 14.3.11.1 Company Overview
- 14.3.11.2 Product Portfolio
- 14.3.11.3 Financials
- 14.3.11.4 SWOT Analysis
- 14.3.12 Teledyne Technologies
- 14.3.12.1 Company Overview
- 14.3.12.2 Product Portfolio
- 14.3.12.3 Financials
- 14.3.12.4 SWOT Analysis
