¼¼°èÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ °Ë»ç Àåºñ ½ÃÀå(2025-2029³â)
Global Semiconductor Wafer Inspection Equipment 2025-2029
»óǰÄÚµå : 1666728
¸®¼­Ä¡»ç : TechNavio
¹ßÇàÀÏ : 2025³â 02¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 221 Pages
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 2,500 £Ü 3,617,000
PDF (Single User License) help
PDF º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 4,000 £Ü 5,787,000
PDF (Enterprise License) help
PDF º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â °¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


¤± Add-on °¡´É: °í°´ÀÇ ¿äû¿¡ µû¶ó ÀÏÁ¤ÇÑ ¹üÀ§ ³»¿¡¼­ CustomizationÀÌ °¡´ÉÇÕ´Ï´Ù. ÀÚ¼¼ÇÑ »çÇ×Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

Çѱ۸ñÂ÷

¹ÝµµÃ¼ ¿þÀÌÆÛ °Ë»ç Àåºñ ½ÃÀåÀº 2024³âºÎÅÍ 2029³â±îÁö 37¾ï 8,060¸¸ ´Þ·¯ Áõ°¡Çϰí, ¿¹Ãø ±â°£ µ¿¾È ¿¬Æò±Õ ¼ºÀå·ü(CAGR) 8.9%¸¦ ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

ÀÌ Á¶»ç º¸°í¼­´Â ¹ÝµµÃ¼ ¿þÀÌÆÛ °Ë»ç Àåºñ ½ÃÀåÀÇ Àüü ºÐ¼®, ½ÃÀå ±Ô¸ð¿Í ¿¹Ãø, µ¿Çâ, ¼ºÀå ÃËÁø¿äÀÎ, ¾à 25°³ÀÇ º¥´õ¸¦ Æ÷ÇÔÇÑ º¥´õ ºÐ¼® µîÀÇ Á¤º¸¸¦ Á¦°øÇÕ´Ï´Ù.

ÇöÀçÀÇ ½ÃÀå ½Ã³ª¸®¿À, Ãֽе¿Çâ ¹× ¼ºÀå¿äÀÎ ¹× Àüü ½ÃÀå ȯ°æ¿¡ ´ëÇÑ ÃֽŠºÐ¼®À» Á¦°øÇÕ´Ï´Ù. ½ÃÀåÀº IoT µð¹ÙÀ̽º ¼ö¿ä Áõ°¡, Â÷·®¿ë ÀüÀÚ Á¦Ç°ÀÇ Ã¤¿ë È®´ë, µ¥ÀÌÅͼ¾ÅÍ Áõ°¡¿¡ ÀÇÇØ °ßÀεǰí ÀÖ½À´Ï´Ù.

½ÃÀå ¹üÀ§
±âÁØ¿¬µµ 2025³â
Á¾·á¿¬µµ 2029³â
¿¹Ãø ±â°£ 2025-2029³â
¼ºÀå ¸ð¸àÅÒ °¡¼Ó
YOY 2025 8.6%
CAGR 8.9%
Áõ°¡¾× 37¾ï 8,060¸¸ ´Þ·¯

º» Á¶»ç´Â ¾÷°èÀÇ ÁÖ¿ä Âü°¡ÀڷκÎÅÍÀÇ ÀÔ·ÂÀ» Æ÷ÇÔÇÏ¿© 1Â÷ Á¤º¸¿Í 2Â÷ Á¤º¸¸¦ °´°üÀûÀ¸·Î Á¶ÇÕÇÏ¿© ½Ç½ÃÇÏ¿´½À´Ï´Ù. º¸°í¼­¿¡´Â ÁÖ¿ä ±â¾÷ ºÐ¼® ¿Ü¿¡µµ Á¾ÇÕÀûÀÎ ½ÃÀå ±Ô¸ð µ¥ÀÌÅÍ, Áö¿ª ºÐ¼® ºÎ¹®, °ø±Þ¾÷ü »óȲÀÌ Æ÷ÇԵ˴ϴÙ. º¸°í¼­¿¡´Â °ú°Å µ¥ÀÌÅÍ¿Í ¿¹Ãø µ¥ÀÌÅͰ¡ ÀÖ½À´Ï´Ù.

º» Á¶»ç¿¡¼­´Â ´ë±¸°æ ¿þÀÌÆÛ Å©±â¿¡ ´ëÇÑ ÁÖ¸ñÀÌ ³ô¾ÆÁö°í ÀÖ´Â °ÍÀÌ ÇâÈÄ ¸î ³â°£ÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ °Ë»ç Àåºñ ½ÃÀåÀÇ ¼ºÀåÀ» °ßÀÎÇÏ´Â ÁÖ¿äÀÎÀÇ Çϳª¶ó°í ÁöÀûÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ Àú±â¼ú ³ëµå¿¡ ´ëÇÑ ÅõÀÚ Áõ°¡, 3D NAND ¹× FinFET ±â¼ú ÅõÀÚ Áõ°¡´Â ½ÃÀåÀÇ Å« ¼ö¿ä·Î À̾îÁý´Ï´Ù.

¸ñÂ÷

Á¦1Àå ÁÖ¿ä ¿ä¾à

Á¦2Àå Technavioº° ºÐ¼®

Á¦3Àå ½ÃÀå »óȲ

Á¦4Àå ½ÃÀå ±Ô¸ð

Á¦5Àå ½ÃÀå ±Ô¸ð ½ÇÀû

Á¦6Àå Á¤¼º ºÐ¼®

Á¦7Àå Five Forces ºÐ¼®

Á¦8Àå ½ÃÀå ¼¼ºÐÈ­ : À¯Çüº°

Á¦9Àå ½ÃÀå ¼¼ºÐÈ­ : ¿ëµµº°

Á¦10Àå ½ÃÀå ¼¼ºÐÈ­ : ÃÖÁ¾ »ç¿ëÀÚº°

Á¦11Àå °í°´ »óȲ

Á¦12Àå Áö¿ªº° »óȲ

Á¦13Àå ÃËÁø¿äÀÎ, °úÁ¦, ±âȸ, ¾ïÁ¦¿äÀÎ

Á¦14Àå °æÀï ±¸µµ

Á¦15Àå °æÀï ºÐ¼®

Á¦16Àå ºÎ·Ï

SHW
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

The semiconductor wafer inspection equipment market is forecasted to grow by USD 3780.6 million during 2024-2029, accelerating at a CAGR of 8.9% during the forecast period. The report on the semiconductor wafer inspection equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for IOT devices, growth in adoption of in-vehicle electronics, and increasing number of data centers.

Market Scope
Base Year2025
End Year2029
Series Year2025-2029
Growth MomentumAccelerate
YOY 20258.6%
CAGR8.9%
Incremental Value$3780.6 mn

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's semiconductor wafer inspection equipment market is segmented as below:

By Type

By Application

By End-user

By Geographical Landscape

This study identifies the increasing focus on large-diameter wafer size as one of the prime reasons driving the semiconductor wafer inspection equipment market growth during the next few years. Also, growing investments in lower technology node and growing investment in 3d nand and finfet technologies will lead to sizable demand in the market.

The report on the semiconductor wafer inspection equipment market covers the following areas:

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor wafer inspection equipment market vendors that include Applied Materials Inc., ASML, Bruker Corp., Camtek Ltd., Carl Zeiss AG, Cognex Corp., Hitachi Ltd., JEOL Ltd., KLA Corp., Lam Research Corp., Lasertec Corp, Nanometrics Inc., Nikon Corp., Nova Measuring Instruments Ltd, NXP Semiconductors NV, Onto Innovation Inc., Synopsys Inc., Teradyne Inc., Toray Industries Inc., and TSI Inc.. Also, the semiconductor wafer inspection equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

2 Technavio Analysis

3 Market Landscape

4 Market Sizing

5 Historic Market Size

6 Qualitative Analysis

7 Five Forces Analysis

8 Market Segmentation by Type

9 Market Segmentation by Application

10 Market Segmentation by End-user

11 Customer Landscape

12 Geographic Landscape

13 Drivers, Challenges, and Opportunity/Restraints

14 Competitive Landscape

15 Competitive Analysis

16 Appendix

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â