¼¼°èÀÇ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀå
Metal Core PCB
»óǰÄÚµå : 1782898
¸®¼­Ä¡»ç : Global Industry Analysts, Inc.
¹ßÇàÀÏ : 2025³â 08¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 385 Pages
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 5,850 £Ü 8,180,000
PDF (Single User License) help
PDF º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â °¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 17,550 £Ü 24,541,000
PDF (Global License to Company and its Fully-owned Subsidiaries) help
PDF º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â °¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


Çѱ۸ñÂ÷

¸ÞÅ» ÄÚ¾î PCB ¼¼°è ½ÃÀåÀº 2030³â±îÁö 317¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸Á

2024³â¿¡ 276¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â ¸ÞÅ» ÄÚ¾î PCB ¼¼°è ½ÃÀåÀº 2024³âºÎÅÍ 2030³â±îÁö CAGR 2.3%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 317¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ º¸°í¼­¿¡¼­ ºÐ¼®ÇÑ ºÎ¹® Áß ÇϳªÀÎ ¾Ë·ç¹Ì´½ ÄÚ¾î PCB´Â CAGR 2.3%¸¦ ±â·ÏÇÏ¸ç ºÐ¼® ±â°£ Á¾·á±îÁö 170¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀÔ´Ï´Ù. ±¸¸® ÄÚ¾î PCB ºÎ¹®ÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£ µ¿¾È CAGR 2.2%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº 75¾ï ´Þ·¯, Áß±¹Àº CAGR 4.5%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀº 2024³â¿¡ 75¾ï ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦ ´ë±¹ÀÎ Áß±¹Àº 2030³â±îÁö 60¾ï ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, ºÐ¼® ±â°£ÀÎ 2024-2030³â CAGRÀº 4.5%¸¦ ±â·ÏÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ±âŸ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖ°í, ºÐ¼® ±â°£ µ¿¾È CAGRÀº °¢°¢ 0.8%¿Í 1.7%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR 1.2%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

¸ÞÅ» ÄÚ¾î PCB¶õ ¹«¾ùÀΰ¡?

±Ý¼Ó ÄÚ¾î Àμâȸ·Î±âÆÇ(PCB)Àº Ç¥ÁØ PCB¿¡ »ç¿ëµÇ´Â ±âÁ¸ÀÇ À¯¸®¼¶À¯ ¶Ç´Â ¿¡Æø½Ã ¼öÁö ±âÆÇ ´ë½Å ±Ý¼Ó ±â¹Ý ±âÆÇ(ÀϹÝÀûÀ¸·Î ¾Ë·ç¹Ì´½, ±¸¸®, ÇÕ±Ý)À» ÄÚ¾î ÃþÀ¸·Î ÅëÇÕÇÑ PCBÀÇ ÀÏÁ¾ÀÔ´Ï´Ù. ±Ý¼Ó ÄÚ¾î´Â ¸î °¡Áö Áß¿äÇÑ ÀåÁ¡À» °¡Áö°í ÀÖÀ¸¸ç, ƯÈ÷ ¿ì¼öÇÑ ¿­ °ü¸® Ư¼ºÀ» °¡Áö°í ÀÖ½À´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ƯÈ÷ ¹æ¿­ È¿°ú°¡ ³ô°í, ÀüÀÚºÎǰÀÌ ÀÛµ¿ Áß¿¡ »ó´çÇÑ ¿­À» ¹ß»ý½ÃŰ´Â °íÃâ·Â, °í¼º´É ¾ÖÇø®ÄÉÀ̼ǿ¡ ÇʼöÀûÀÔ´Ï´Ù. PCB¿¡ ±Ý¼ÓÀ» ÅëÇÕÇÔÀ¸·Î½á ÀÌ·¯ÇÑ ±âÆÇÀº ¿­ÆØÃ¢À» º¸´Ù È¿°úÀûÀ¸·Î °ü¸®ÇÏ°í ¼¶¼¼ÇÑ ºÎǰÀÇ ¼Õ»óÀ» ¹æÁöÇÏ¿© ÀåÄ¡ÀÇ Àå±âÀûÀÎ ½Å·Ú¼ºÀ» º¸ÀåÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ PCB´Â ÀÚµ¿Â÷, LED Á¶¸í, Åë½Å, Àü·Â ÀüÀÚ µî ¹æ¿­ÀÌ Áß¿äÇÑ »ê¾÷¿¡¼­ ³Î¸® »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ±Ý¼Ó ÄÚ¾î´Â ºÎǰ¿¡¼­ ¿­À» ¹æÃâÇÏ´Â ¹æ¿­ÆÇ ¿ªÇÒÀ» ÇÏ¿© °ú¿­À» ¹æÁöÇϰí ÀåÄ¡°¡ ÃÖÀûÀ¸·Î ÀÛµ¿ÇÒ ¼ö ÀÖµµ·Ï º¸ÀåÇÕ´Ï´Ù. ¶ÇÇÑ, ¸ÞÅ» ÄÚ¾î PCB´Â ±âÁ¸ ±âÆÇº¸´Ù ¾ã°í °¡º­¿öÁú ¼ö Àֱ⠶§¹®¿¡ ¼º´É ÀúÇÏ ¾øÀÌ ÀüÀÚ ½Ã½ºÅÛÀÇ Àüü ¹«°Ô¿Í Å©±â¸¦ ÁÙÀÌ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌó·³ ¸ÞÅ» ÄÚ¾î PCB´Â ¿¡³ÊÁö È¿À²ÀÌ ³ô°í ³»±¸¼ºÀÌ ¶Ù¾î³­ ÀüÀÚ±â±â Á¦Á¶¿¡ ÀÖ¾î Áß¿äÇÑ ±â¼ú·Î ¿©°ÜÁö°í ÀÖ½À´Ï´Ù.

¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀÇ ÁÖ¿ä µ¿ÇâÀº?

¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀÇ ÁÖ¿ä Æ®·»µå Áß Çϳª´Â LED Á¶¸í »ê¾÷¿¡¼­ÀÇ Ã¤Åà Áõ°¡ÀÔ´Ï´Ù. ¼ÒºñÀÚ¿Í »ê¾÷°è°¡ ¿¡³ÊÁö È¿À²À» ¿ì¼±½ÃÇÏ´Â °¡¿îµ¥, ¸ÞÅ» ÄÚ¾î PCB´Â °í¼º´É LED Á¶¸í ½Ã½ºÅÛ ¼³°è¿¡ ÇʼöÀûÀÎ ±¸¼º¿ä¼Ò·Î ÀÚ¸® Àâ¾Ò½À´Ï´Ù. LED´Â ´Ù·®ÀÇ ¿­À» ¹ß»ý½Ã۱⠶§¹®¿¡ ±âÁ¸ PCB´Â ¿­ ºÎÇϸ¦ ó¸®ÇÏ´Â µ¥ ¾î·Á¿òÀ» °Þ´Â °æ¿ì°¡ ¸¹½À´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ¿­ÀüµµÀ²ÀÌ Çâ»óµÇ¾î ¹æ¿­À» °ü¸®Çϰí LED°¡ ÃÖÀûÀÇ ¿Âµµ¿¡¼­ ÀÛµ¿ÇÏ°í ¼ö¸íÀ» ¿¬ÀåÇÒ ¼ö ÀÖµµ·Ï º¸ÀåÇÕ´Ï´Ù. ÀÌ ¶§¹®¿¡ ÁÖ°Å¿ë, »ó¾÷¿ë, »ê¾÷¿ë Á¶¸í ¾ÖÇø®ÄÉÀ̼ǿ¡¼­ ¸ÞÅ» ÄÚ¾î PCB¿¡ ´ëÇÑ ¼ö¿ä°¡ ±ÞÁõÇϰí ÀÖ½À´Ï´Ù.

¶Ç ´Ù¸¥ ¼ºÀå Ãß¼¼´Â Àü±âÀÚµ¿Â÷(EV)·ÎÀÇ Àüȯ°ú È¿À²ÀûÀÎ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ´ëÇÑ Çʿ伺ÀÌ Áõ°¡Çϰí ÀÖ´Ù´Â Á¡ÀÔ´Ï´Ù. Àü±âÀÚµ¿Â÷, ÀÚµ¿Â÷ Á¶¸í, Àü·Â °ü¸® ½Ã½ºÅÛ µîÀÇ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º´Â ¾ÈÁ¤ÀûÀÎ ÀÛµ¿À» À§ÇØ È¿À²ÀûÀÎ ¹æ¿­ÀÌ ÇÊ¿äÇÕ´Ï´Ù. ÀÌ PCBÀÇ ±Ý¼Ó ÄÚ¾î´Â ÀιöÅÍ ¹× ¹èÅ͸® °ü¸® ½Ã½ºÅÛ°ú °°Àº Àü·Â Áý¾àÀû ±¸¼º¿ä¼Ò¿¡¼­ ¹ß»ýÇÏ´Â ¿­À» ¹æÃâÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÷´Ü ÀüÀÚ ½Ã½ºÅÛ¿¡ Å©°Ô ÀÇÁ¸ÇÏ´Â Àü±âÀÚµ¿Â÷ ¹× ÇÏÀ̺긮µå ¸ðµ¨·ÎÀÇ ÀÚµ¿Â÷ »ê¾÷ÀÇ ÀüȯÀº ƯÈ÷ Àü±â ¸ðÅÍ, ÀιöÅÍ, ¿¡³ÊÁö ÀúÀå ½Ã½ºÅÛ°ú °ü·ÃµÈ ¾ÖÇø®ÄÉÀ̼ǿ¡ ´ëÇÑ ¸ÞÅ» ÄÚ¾î PCB¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù. EV¿Í Áö¼Ó°¡´ÉÇÑ ¿î¼Û¿¡ ´ëÇÑ °ü½ÉÀÌ ³ô¾ÆÁü¿¡ µû¶ó ¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀº °­·ÂÇÑ ¼ºÀåÀÌ ¿¹»óµË´Ï´Ù.

¶ÇÇÑ, ƯÈ÷ °¡ÀüÁ¦Ç°°ú ÀÇ·á±â±âÀÇ °æ¿ì ÀüÀÚºÎǰ ¹× ÀüÀÚ±â±âÀÇ ¼ÒÇüÈ­ Ãß¼¼°¡ °­È­µÇ°í ÀÖ½À´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ¿ì¼öÇÑ ¿­ ¼º´É°ú ÄÄÆÑÆ®ÇÑ ¼³°è·Î ¿­À» ó¸®ÇÒ ¼ö Àֱ⠶§¹®¿¡ È¿À²ÀûÀÎ ¹æ¿­°ú ÄÄÆÑÆ®ÇÑ ÆûÆÑÅͰ¡ ¸ðµÎ ÇÊ¿äÇÑ ¼ÒÇü °íÀü·Â ÀåÄ¡¿¡ ÀûÇÕÇÕ´Ï´Ù. Á¦Á¶¾÷üµéÀÌ ÀüÀÚÁ¦Ç°ÀÇ ¼ÒÇüÈ­, °æ·®È­, °í¼º´ÉÈ­¸¦ À§ÇØ ³ë·ÂÇÏ´Â °¡¿îµ¥, ¸ÞÅ» ÄÚ¾î PCB´Â Á¡Á¡ ´õ Á¦ÇÑµÈ °ø°£¿¡¼­ °í¼º´É ºÎǰÀ» ±¸ÇöÇÒ ¼ö ÀÖ´Â ¼Ö·ç¼ÇÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ·¯ÇÑ »ê¾÷ Àü¹ÝÀÇ ¼ÒÇüÈ­ Ãß¼¼´Â ¾ÕÀ¸·Îµµ ¸ÞÅ» ÄÚ¾î PCBÀÇ ¼ö¿ä¸¦ °ßÀÎÇÒ °ÍÀÔ´Ï´Ù.

¸ÞÅ» ÄÚ¾î PCBÀÇ ¼ö¿ä°¡ Áõ°¡ÇÏ´Â ÀÌÀ¯´Â ¹«¾ùÀΰ¡?

¸ÞÅ» ÄÚ¾î PCB¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÏ´Â ÀÌÀ¯´Â ÁÖ·Î °íÃâ·Â ÀüÀÚ ½Ã½ºÅÛ¿¡¼­ È¿À²ÀûÀÎ ¿­ °ü¸®ÀÇ Çʿ伺ÀÌ Áõ°¡Çϰí Àֱ⠶§¹®ÀÔ´Ï´Ù. LED Á¶¸í, ÀÚµ¿Â÷, Åë½Å, ½ÅÀç»ý¿¡³ÊÁö ¹ßÀü µîÀÇ »ê¾÷¿¡¼­ ¹ß¿­Àº ƯÈ÷ µð¹ÙÀ̽ºÀÇ ¼ÒÇüÈ­ ¹× °í¼º´ÉÈ­¿¡ µû¶ó °øÅëÀûÀÎ ¹®Á¦·Î ´ëµÎµÇ°í ÀÖ½À´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ±âÁ¸ PCB¿¡ ºñÇØ ¹æ¿­¼ºÀÌ ¶Ù¾î³ª °ú¿­ÀÌ ÀüÀÚºÎǰÀÇ ¼º´É ÀúÇÏ ¹× °íÀåÀ¸·Î À̾îÁú ¼ö ÀÖ´Â ¾ÖÇø®ÄÉÀ̼ǿ¡ ƯÈ÷ À¯¿ëÇÕ´Ï´Ù. ÀüÀÚ±â±âÀÇ °í¼º´ÉÈ­¿¡ µû¶ó ¿­À» È¿À²ÀûÀ¸·Î °ü¸®ÇÒ ¼ö ÀÖ´Â ´É·ÂÀÌ ´õ¿í Áß¿äÇØÁö¸é¼­ ¸ÞÅ» ÄÚ¾î PCB´Â ¸¹Àº Ãֽбâ±â¿¡ ÇʼöÀûÀÎ ºÎǰÀÌ µÇ¾ú½À´Ï´Ù.

¼ö¿ä¸¦ ÃËÁøÇÏ´Â ¶Ç ´Ù¸¥ ¿äÀÎÀº ¿¡³ÊÁö È¿À²ÀÌ ³ôÀº ¼Ö·ç¼Ç¿¡ ´ëÇÑ Æ®·»µå°¡ Áõ°¡Çϰí ÀÖ´Ù´Â Á¡ÀÔ´Ï´Ù. Àü ¼¼°èÀûÀ¸·Î ¿¡³ÊÁö ¼Òºñ°¡ Áõ°¡Çϰí Áö¼Ó°¡´É¼º¿¡ ´ëÇÑ °ü½ÉÀÌ ³ô¾ÆÁü¿¡ µû¶ó »ê¾÷°è´Â ¿¡³ÊÁö ³¶ºñ¸¦ ÁÙÀ̰í ÀåÄ¡ È¿À²À» ³ôÀÌ´Â ÀüÀÚºÎǰÀ» ¿ä±¸Çϰí ÀÖ½À´Ï´Ù. ´õ ³ªÀº ¿­ °ü¸®¸¦ Á¦°øÇÏ´Â ¸ÞÅ» ÄÚ¾î PCB´Â Àü·Â ¼Õ½ÇÀ» ÁÙÀÌ°í ºÎǰÀÇ ¼ö¸íÀ» Çâ»ó½ÃÄÑ ÀüÀÚ ½Ã½ºÅÛÀÇ Àü¹ÝÀûÀÎ ¿¡³ÊÁö È¿À²¿¡ ±â¿©ÇÕ´Ï´Ù. ¼ÒºñÀÚ ÀüÀÚÁ¦Ç°, Àç»ý¿¡³ÊÁö ½Ã½ºÅÛ, »ê¾÷¿ë ¾ÖÇø®ÄÉÀ̼ǿ¡¼­ ¿¡³ÊÁö È¿À²ÀÌ ³ôÀº ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä·Î ÀÎÇØ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀÌ Å©°Ô ¼ºÀåÇϰí ÀÖ½À´Ï´Ù.

¶ÇÇÑ Àü±âÀÚµ¿Â÷(EV) ½ÃÀåÀÇ È®´ë´Â ¸ÞÅ» ÄÚ¾î PCB ¼ö¿ä Áõ°¡¿¡ Áß¿äÇÑ ¿ªÇÒÀ»Çϰí ÀÖ½À´Ï´Ù. EV¿¡´Â ÀιöÅÍ, ¹èÅ͸® °ü¸® ½Ã½ºÅÛ, Àü·Â º¯È¯±â µî ´Ù¾çÇÑ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º°¡ ÇÊ¿äÇϸç, ÀÌ ¸ðµç °ÍÀÌ »ó´çÇÑ ¿­À» ¹ß»ý½Ãŵ´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡¼­ ¹ß»ýÇÏ´Â ³ôÀº ¿­ ºÎÇϸ¦ °ü¸®ÇÒ ¼ö ÀÖ´Â È¿°úÀûÀÎ ¼Ö·ç¼ÇÀ» Á¦°øÇϱ⠶§¹®¿¡ ÀÌ·¯ÇÑ ¾ÖÇø®ÄÉÀ̼ǿ¡ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ȯ°æ ¹®Á¦¿Í ±ÔÁ¦Àû Àμ¾Æ¼ºê¿¡ ÈûÀÔ¾î Àü ¼¼°èÀûÀ¸·Î Àü±âÀÚµ¿Â÷ÀÇ Ã¤ÅÃÀÌ °è¼Ó Áõ°¡ÇÔ¿¡ µû¶ó, ¸ÞÅ» ÄÚ¾î PCB¿Í °°Àº ½Å·ÚÇÒ ¼ö ÀÖ°í È¿À²ÀûÀÎ ÀüÀÚºÎǰ¿¡ ´ëÇÑ ¼ö¿ä´Â °è¼Ó Áõ°¡ÇÒ °ÍÀÔ´Ï´Ù.

¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀÇ ÁÖ¿ä ¼ºÀå ÃËÁø¿äÀÎÀº ¹«¾ùÀΰ¡?

¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀÇ ¼ºÀåÀº ¿¡³ÊÁö È¿À²ÀûÀÎ ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, Àü±âÀÚµ¿Â÷ ½ÃÀå È®´ë, ÀüÀÚ ÀåÄ¡ÀÇ ±â¼ú ¹ßÀü µî ¿©·¯ °¡Áö ¿äÀο¡ ÀÇÇØ ÀÌ·ç¾îÁý´Ï´Ù. »ê¾÷°è°¡ ´õ ³ôÀº ¿¡³ÊÁö È¿À²À» Ãß±¸ÇÔ¿¡ µû¶ó ¿­À» È¿°úÀûÀ¸·Î ¹æÃâÇÒ ¼ö ÀÖ´Â ºÎǰ¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡Çϰí ÀÖÀ¸¸ç, ¸ÞÅ» ÄÚ¾î PCB°¡ µîÀåÇϰí ÀÖ½À´Ï´Ù. ¿­ÀüµµÀ²ÀÌ ¿ì¼öÇÑ ¸ÞÅ» ÄÚ¾î PCB´Â Àü·Â ¼Õ½Ç °¨¼Ò ¹× °ú¿­ ¹æÁö¿¡ µµ¿òÀ» ÁÖ¾î ÀüÀÚ±â±â ÀüüÀÇ È¿À² Çâ»ó¿¡ ±â¿©ÇÕ´Ï´Ù. ÀÌ´Â LED Á¶¸í°ú °°ÀÌ ¿­°ü¸®°¡ Á¦Ç°ÀÇ ¼º´É°ú ¼ö¸í¿¡ Áß¿äÇÑ ¿ä¼ÒÀÎ ºÐ¾ß¿¡¼­ ƯÈ÷ Áß¿äÇÕ´Ï´Ù. ¿¡³ÊÁö È¿À²ÀÌ ³ôÀº ±â¼úÀ» äÅÃÇÏ´Â »ê¾÷ÀÌ Áõ°¡ÇÔ¿¡ µû¶ó ¸ÞÅ» ÄÚ¾î PCB¿¡ ´ëÇÑ ¼ö¿ä´Â Áö¼ÓÀûÀ¸·Î Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

Àü±âÀÚµ¿Â÷ ½ÃÀåÀÇ ±Þ°ÝÇÑ ¼ºÀåµµ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀå È®´ëÀÇ Áß¿äÇÑ ¿øµ¿·ÂÀÔ´Ï´Ù. EV¿Í ÇÏÀ̺긮µå ÀÚµ¿Â÷¿¡´Â ´Ù¾çÇÑ Ã·´Ü ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º°¡ ÇÊ¿äÇϸç, ±× Áß »ó´ç¼ö´Â ÀÛµ¿ Áß¿¡ ¸¹Àº ¾çÀÇ ¿­À» ¹ß»ý½Ãŵ´Ï´Ù. ÀÌ·¯ÇÑ ½Ã½ºÅÛÀÇ ¼ö¸í°ú È¿À²¼ºÀ» º¸ÀåÇϱâ À§Çؼ­´Â ½Å·ÚÇÒ ¼ö ÀÖ´Â ¿­ °ü¸® ¼Ö·ç¼ÇÀÌ ÇʼöÀûÀÔ´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ³ôÀº ¿­ ºÎÇϸ¦ °ßµô ¼ö Àֱ⠶§¹®¿¡ ¹èÅ͸® °ü¸® ½Ã½ºÅÛ, ÀιöÅÍ, Àü·Â º¯È¯±â µî EV ¾ÖÇø®ÄÉÀ̼ǿ¡ Á¡Á¡ ´õ ¸¹ÀÌ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. EV ½ÃÀåÀÌ Àü ¼¼°èÀûÀ¸·Î È®´ëµÊ¿¡ µû¶ó ¸ÞÅ» ÄÚ¾î PCBÀÇ ¼ö¿äµµ ÀÌ¿¡ ¿¬µ¿ÇÏ¿© Áõ°¡ÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¶ÇÇÑ, ÀüÀÚºÎǰÀÇ ¼ÒÇüÈ­°¡ ¸ÞÅ» ÄÚ¾î PCBÀÇ ¼ºÀå¿¡ ÀÏÁ¶Çϰí ÀÖ½À´Ï´Ù. ¼ÒºñÀÚ ÀüÀÚÁ¦Ç°, ÀÇ·á±â±â ¹× ±âŸ ÇÏÀÌÅ×Å© Á¦Ç°ÀÌ ¼ÒÇüÈ­µÊ¿¡ µû¶ó ÄÄÆÑÆ®ÇÑ µðÀÚÀο¡¼­ È¿°úÀûÀÎ ¹æ¿­¿¡ ´ëÇÑ Çʿ伺ÀÌ ´õ¿í Ä¿Áö°í ÀÖ½À´Ï´Ù. ¸ÞÅ» ÄÚ¾î PCB´Â ÀÌ·¯ÇÑ ¼ÒÇü, °íÃâ·Â ÀåÄ¡¿¡ ÇÊ¿äÇÑ ¿­ °ü¸®¸¦ Á¦°øÇÒ ¼ö ÀÖÀ¸¸ç, Á¦ÇÑµÈ °ø°£¿¡¼­ È¿À²ÀûÀ¸·Î ÀÛµ¿ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ´Ù¾çÇÑ »ê¾÷ÀÇ ¼ÒÇüÈ­ Ãß¼¼´Â Çö´ë ÀüÀÚ±â±âÀÇ º¹À⼺ ¹× ¼º´É ¿ä±¸ÀÇ Áõ°¡¿Í ÇÔ²² ¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀ» ÁÖµµÇϰí ÀÖ½À´Ï´Ù.

¶ÇÇÑ, Àç·á ¹× Á¦Á¶ ±â¼ú Çõ½ÅÀ» Æ÷ÇÔÇÑ PCB Á¦Á¶ÀÇ ±â¼ú ¹ßÀüÀº ¸ÞÅ» ÄÚ¾î PCB¸¦ º¸´Ù ºñ¿ë È¿À²ÀûÀÌ°í ½±°Ô »ç¿ëÇÒ ¼ö ÀÖµµ·Ï µ½°í ÀÖ½À´Ï´Ù. Àç·á °úÇÐÀÇ ¹ß´Þ·Î ¿­ÀüµµÀ²ÀÌ °³¼±µÈ »õ·Î¿î Çձݰú ±Ý¼Ó ±âÆÇÀÌ °³¹ßµÇ¾ú°í, PCB Á¦Á¶ ¹æ¹ýÀÇ °³¼±À¸·Î ÀÌ·¯ÇÑ ±âÆÇÀ» º¸´Ù È¿À²ÀûÀ¸·Î Á¦Á¶ÇÒ ¼ö ÀÖ°Ô µÇ¾ú½À´Ï´Ù. ÀÌ·¯ÇÑ ±â¼úÀÌ °è¼Ó ¹ßÀüÇÔ¿¡ µû¶ó °í¼º´É ¿­ °ü¸® ¼Ö·ç¼ÇÀÌ º¸´Ù Àú·ÅÇÑ °¡°ÝÀ¸·Î ´Ù¾çÇÑ ¿ëµµ·Î È®ÀåÇÒ ¼ö ÀÖ°Ô µÇ¸é¼­ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀÇ ¼ºÀåÀ» ÁÖµµÇϰí ÀÖ½À´Ï´Ù.

ÀÌ·¯ÇÑ ¿äÀεéÀÌ ½ÃÀå È®´ë¿¡ ±â¿©Çϰí Àֱ⠶§¹®¿¡ ¸ÞÅ» ÄÚ¾î PCB ½ÃÀåÀº Áö¼ÓÀûÀÎ ¼ºÀåÀ» ÀÌ·ê Áغñ°¡ µÇ¾î ÀÖ½À´Ï´Ù. »ê¾÷°è°¡ ¿¡³ÊÁö È¿À², ¼ÒÇüÈ­, ÷´Ü ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ´ëÇÑ ¿ì¼±¼øÀ§°¡ °è¼Ó ³ô¾ÆÁü¿¡ µû¶ó, ¿ì¼öÇÑ ¿­ °ü¸®¿Í ½Å·Ú¼ºÀ» Á¦°øÇÏ´Â ¸ÞÅ» ÄÚ¾î PCB¿¡ ´ëÇÑ ¼ö¿ä´Â °è¼Ó Áõ°¡ÇÏ¿© Á¦Á¶¾÷ü¿¡ »õ·Î¿î ±âȸ¸¦ âÃâÇϰí PCB ¼³°è ¹× Á¦Á¶ Çõ½ÅÀ» ÃËÁøÇÒ °ÍÀÔ´Ï´Ù.

ºÎ¹®

À¯Çü(¾Ë·ç¹Ì´½ ÄÚ¾î PCB, ±¸¸® ÄÚ¾î PCB, ±âŸ ¸ÞÅ» ÄÚ¾î PCB), Ãþ À¯Çü(´ÜÃþ MCPCB, 2Ãþ MCPCB, ´ÙÃþ MCPCB), ¿ëµµ(LED Á¶¸í, Àü·Â º¯È¯±â, Àü±âÀÚµ¿Â÷, žçÀüÁöÆÇ, Åë½Å Àåºñ, ÀÚµ¿Â÷¿ë ÀüÀÚ±â±â, °¡ÀüÁ¦Ç°, Ç×°ø¿ìÁÖ ¹× ¹æÀ§, ÀÇ·á±â±â, ±âŸ)

Á¶»ç ´ë»ó ±â¾÷ »ç·Ê

AI ÅëÇÕ

Global Industry Analysts´Â °ËÁõµÈ Àü¹®°¡ ÄÁÅÙÃ÷¿Í AI ÅøÀ» ÅëÇØ ½ÃÀå Á¤º¸¿Í °æÀï Á¤º¸¸¦ Çõ½ÅÇϰí ÀÖ½À´Ï´Ù.

Global Industry Analysts´Â ÀϹÝÀûÀÎ LLM ¹× ¾÷°èº° SLM Äõ¸®¸¦ µû¸£´Â ´ë½Å ºñµð¿À ±â·Ï, ºí·Î±×, °Ë»ö ¿£Áø Á¶»ç, ¹æ´ëÇÑ ¾çÀÇ ±â¾÷, Á¦Ç°/¼­ºñ½º, ½ÃÀå µ¥ÀÌÅÍ µî ¼¼°è Àü¹®°¡·ÎºÎÅÍ ¼öÁýÇÑ ÄÁÅÙÃ÷ ¸®Æ÷ÁöÅ丮¸¦ ±¸ÃàÇß½À´Ï´Ù.

°ü¼¼ ¿µÇâ °è¼ö

Global Industry Analysts´Â º»»ç ¼ÒÀçÁö, Á¦Á¶°ÅÁ¡, ¼öÃâÀÔ(¿ÏÁ¦Ç° ¹× OEM)À» ±âÁØÀ¸·Î ±â¾÷ÀÇ °æÀï·Â º¯È­¸¦ ¿¹ÃøÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ º¹ÀâÇÏ°í ´Ù¸éÀûÀÎ ½ÃÀå ¿ªÇÐÀº ¸ÅÃâ¿ø°¡(COGS) Áõ°¡, ¼öÀͼº Ç϶ô, °ø±Þ¸Á ÀçÆí µî ¹Ì½ÃÀû, °Å½ÃÀû ½ÃÀå ¿ªÇÐ Áß¿¡¼­µµ ƯÈ÷ °æÀï»çµé¿¡°Ô ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¸ñÂ÷

Á¦1Àå Á¶»ç ¹æ¹ý

Á¦2Àå ÁÖ¿ä ¿ä¾à

Á¦3Àå ½ÃÀå ºÐ¼®

Á¦4Àå °æÀï

ksm
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

Global Metal Core PCB Market to Reach US$31.7 Billion by 2030

The global market for Metal Core PCB estimated at US$27.6 Billion in the year 2024, is expected to reach US$31.7 Billion by 2030, growing at a CAGR of 2.3% over the analysis period 2024-2030. Aluminum Core PCBs, one of the segments analyzed in the report, is expected to record a 2.3% CAGR and reach US$17.0 Billion by the end of the analysis period. Growth in the Copper Core PCBs segment is estimated at 2.2% CAGR over the analysis period.

The U.S. Market is Estimated at US$7.5 Billion While China is Forecast to Grow at 4.5% CAGR

The Metal Core PCB market in the U.S. is estimated at US$7.5 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$6.0 Billion by the year 2030 trailing a CAGR of 4.5% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 0.8% and 1.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 1.2% CAGR.

Global Metal Core PCB Market - Key Trends & Drivers Summarized

What Is Metal Core PCB and How Does It Function?

A Metal Core Printed Circuit Board (PCB) is a type of PCB that incorporates a metal-based substrate (usually aluminum, copper, or an alloy) as its core layer, instead of the traditional fiberglass or epoxy resin substrates used in standard PCBs. The metal core offers several key advantages, most notably its superior thermal management properties. Metal Core PCBs are particularly effective at dissipating heat, which is essential for high-power, high-performance applications where the electronic components generate significant heat during operation. By integrating metal into the PCB, these boards can manage thermal expansion more effectively, preventing damage to sensitive components and ensuring the long-term reliability of the device.

These PCBs are widely used in industries where heat dissipation is critical, such as automotive, LED lighting, telecommunications, and power electronics. The metal core serves as a heat sink that channels heat away from the components, preventing overheating and ensuring that the device performs optimally. Metal Core PCBs can also be thinner and lighter than traditional boards, which can be beneficial for reducing the overall weight and size of the electronic systems they are used in, without compromising on performance. As such, Metal Core PCBs are seen as a key technology in the production of energy-efficient and durable electronics.

What Are the Key Trends in the Metal Core PCB Market?

One of the major trends in the Metal Core PCB market is the increasing adoption of these boards in the LED lighting industry. As energy efficiency becomes a priority for consumers and industries alike, Metal Core PCBs have become an essential component in the design of high-performance LED lighting systems. LEDs generate significant amounts of heat, and traditional PCBs often struggle to handle the thermal load. Metal Core PCBs, with their enhanced thermal conductivity, help manage heat dissipation, ensuring the LEDs operate at optimal temperatures and extend their lifespan. This has led to a surge in demand for Metal Core PCBs in residential, commercial, and industrial lighting applications.

Another growing trend is the shift toward electric vehicles (EVs) and the increasing need for efficient power electronics. Power electronics, including those used in electric vehicles, automotive lighting, and power management systems, require efficient heat dissipation to function reliably. The metal core in these PCBs helps to dissipate the heat generated by power-intensive components like inverters and battery management systems. The automotive industry’s shift toward electric vehicles and hybrid models, which rely heavily on advanced electronic systems, is driving the demand for Metal Core PCBs, especially for applications related to electric motors, inverters, and energy storage systems. With the growing emphasis on EVs and sustainable transportation, the Metal Core PCB market is expected to see robust growth.

Additionally, there has been a growing trend toward miniaturization of electronic components and devices, especially in consumer electronics and medical devices. Metal Core PCBs, due to their superior thermal performance and ability to handle heat in compact designs, are well-suited for smaller, high-power devices that require both efficient heat dissipation and compact form factors. As manufacturers strive to make electronics smaller, lighter, and more powerful, Metal Core PCBs offer a solution that enables high-performance components in increasingly confined spaces. This trend toward miniaturization across industries will likely continue to drive demand for Metal Core PCBs in the coming years.

Why Is the Demand for Metal Core PCBs Growing?

The growing demand for Metal Core PCBs is primarily driven by the increasing need for efficient thermal management in high-power electronic systems. In industries like LED lighting, automotive, telecommunications, and renewable energy, heat generation is a common issue, particularly as devices become more compact and powerful. Metal Core PCBs offer superior heat dissipation compared to traditional PCBs, which makes them particularly valuable in applications where overheating can lead to reduced performance or failure of electronic components. As electronics continue to get more powerful, the ability to manage heat effectively becomes even more critical, making Metal Core PCBs an essential component in many modern devices.

Another factor driving the demand is the growing trend towards energy-efficient solutions. With rising global energy consumption and the increasing focus on sustainability, industries are seeking electronic components that can reduce energy waste and enhance the efficiency of their devices. Metal Core PCBs, which provide better thermal management, contribute to the overall energy efficiency of electronic systems by reducing power losses and improving the lifespan of components. The demand for energy-efficient solutions in consumer electronics, renewable energy systems, and industrial applications is thus significantly boosting the Metal Core PCB market.

Moreover, the expansion of the electric vehicle (EV) market is playing a critical role in the increasing demand for Metal Core PCBs. EVs require a range of power electronics, including inverters, battery management systems, and power converters, all of which generate substantial heat. Metal Core PCBs are used in these applications because they provide an effective solution for managing the high thermal loads generated by power electronics. As the adoption of electric vehicles continues to rise globally, driven by environmental concerns and regulatory incentives, the need for reliable and efficient electronic components, such as Metal Core PCBs, will continue to grow.

What Are the Key Growth Drivers in the Metal Core PCB Market?

The growth in the Metal Core PCB market is driven by several factors, including the increasing demand for energy-efficient solutions, the expansion of the electric vehicle market, and technological advancements in electronic devices. As industries continue to push for higher energy efficiency, there is an increasing need for components that can effectively dissipate heat, which is where Metal Core PCBs come in. With their superior thermal conductivity, Metal Core PCBs help reduce power loss and prevent overheating, which in turn contributes to the overall efficiency of electronic devices. This is particularly important in sectors such as LED lighting, where heat management is a critical factor in product performance and lifespan. As more industries adopt energy-efficient technologies, the demand for Metal Core PCBs continues to rise.

The rapid growth of the electric vehicle market is another key driver behind the expansion of the Metal Core PCB market. EVs and hybrid vehicles require a range of advanced power electronics, many of which generate significant amounts of heat during operation. To ensure the longevity and efficiency of these systems, reliable heat management solutions are essential. Metal Core PCBs, with their ability to handle high thermal loads, are increasingly being used in EV applications, such as battery management systems, inverters, and power converters. As the EV market expands globally, the demand for Metal Core PCBs is expected to increase in tandem.

In addition, the miniaturization of electronic components is playing a role in the growth of Metal Core PCBs. As consumer electronics, medical devices, and other high-tech products become smaller, the need for effective heat dissipation in compact designs becomes even more important. Metal Core PCBs are able to offer the thermal management necessary for these smaller, high-power devices, allowing them to operate efficiently in limited spaces. This trend toward miniaturization across various industries, combined with the increasing complexity and performance demands of modern electronics, is driving the market for Metal Core PCBs.

Furthermore, technological advancements in PCB manufacturing, including innovations in materials and production techniques, are helping to make Metal Core PCBs more cost-effective and accessible. Advances in materials science have led to the development of new alloys and metal substrates that offer improved thermal conductivity, while improvements in PCB fabrication methods have made it possible to produce these boards more efficiently. As these technologies continue to evolve, they are driving the growth of the Metal Core PCB market by making high-performance thermal management solutions more affordable and scalable for a broader range of applications.

With these factors contributing to the market's expansion, the Metal Core PCB market is poised for sustained growth. As industries continue to prioritize energy efficiency, miniaturization, and advanced power electronics, the demand for Metal Core PCBs, which offer superior thermal management and reliability, will continue to rise, creating new opportunities for manufacturers and driving innovation in PCB design and production.

SCOPE OF STUDY:

The report analyzes the Metal Core PCB market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Aluminum Core PCBs, Copper Core PCBs, Other Metal Core PCBs); Layer Type (Single-Layer MCPCBs, Double-Layer MCPCBs Multi-layer MCPCBs); Application (LED lighting, Power converters, Electric vehicles, Solar panels, Telecommunications equipment, Automotive electronics, Consumer electronics, Aerospace & Defense, Medical devices, Others)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 34 Featured) -

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â