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¼¼°èÀÇ °íÀüÀÚ À̵¿µµ Æ®·£Áö½ºÅÍ ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

°íÀüÀÚ À̵¿µµ Æ®·£Áö½ºÅÍ(HEMT)°¡ Çö´ë ÀüÀÚÁ¦Ç°¿¡¼­ µÎµå·¯Áö´Â ÀÌÀ¯´Â ¹«¾ùÀϱî?

°íÀüÀÚ À̵¿µµ Æ®·£Áö½ºÅÍ(HEMT)´Â ´Ù¾çÇÑ ÀÀ¿ë ºÐ¾ß¿¡¼­ °í¼Ó, °íÁÖÆÄ, Àú¼ÒÀ½ ¼º´ÉÀ» ½ÇÇöÇÏ¿© ¹ÝµµÃ¼ »ê¾÷¿¡ Çõ¸íÀ» ÀÏÀ¸Ä×½À´Ï´Ù. ±âÁ¸ MOSFET°ú ´Þ¸® HEMT´Â ÁúÈ­°¥·ý(GaN)°ú ÁúÈ­¾Ë·ç¹Ì´½°¥·ý(AlGaN)°ú °°Àº µÎ °¡Áö ¹ÝµµÃ¼ Àç·áÀÇ ÀÌÁ¾Á¢ÇÕÀ» ÀÌ¿ëÇÏ¿© ¶Ù¾î³­ ÀüÀÚ À̵¿µµ¸¦ ±¸ÇöÇÕ´Ï´Ù. ÀÌ µ¶Æ¯ÇÑ ±¸Á¶´Â ij¸®¾î »ê¶õÀ» ÃÖ¼ÒÈ­ÇÏ°í ½ÅÈ£ ÁõÆø·üÀ» Çâ»ó½ÃÄÑ HEMT¸¦ ¹«¼± Á֯ļö(RF) ¹× ¸¶ÀÌÅ©·ÎÆÄ ¾ÖÇø®ÄÉÀ̼ǿ¡ ÇʼöÀûÀÎ ¿ä¼Ò·Î ¸¸µé°í ÀÖ½À´Ï´Ù. Ãʰí¼Ó ÀüÀÚºÎǰ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϸ鼭 HEMT´Â À§¼ºÅë½Å, ·¹ÀÌ´õ ½Ã½ºÅÛ, ½ÉÁö¾î 5G ÀÎÇÁ¶ó¿¡¼­µµ Àα⸦ ²ø°í ÀÖ½À´Ï´Ù. HEMTÀÇ ¶Ç ´Ù¸¥ Ư¡Àº ¿ì¼öÇÑ ¿­ ¾ÈÁ¤¼º°ú °íÀü¾Ð¿¡¼­ÀÇ ÀÛµ¿ ´É·ÂÀ¸·Î, Àü±âÀÚµ¿Â÷(EV) ÀιöÅÍ ¹× Àç»ý¿¡³ÊÁö ½Ã½ºÅÛ µîÀÇ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ÀûÇÕÇÕ´Ï´Ù. HEMTÀÇ ¼º´É ¿ìÀ§´Â ¿¡³ÊÁö ¼Õ½ÇÀ» ÁÙÀÌ´Â ´É·ÂÀ¸·Î ³ªÅ¸³ª¸ç, ÀÌ´Â È¿À²¼º°ú ½Å·Ú¼ºÀÌ °¡Àå Áß¿äÇÑ Ç×°ø¿ìÁÖ ¹× ¹æÀ§ »ê¾÷ ºÐ¾ß¿¡¼­ ¸Å¿ì Áß¿äÇÕ´Ï´Ù. ¶ÇÇÑ, Àç·á °úÇÐ, ƯÈ÷ ÁúÈ­°¥·ý(GaN)°ú źȭ±Ô¼Ò(SiC) µî ¿ÍÀÌµå ¹êµå°¸ ¹ÝµµÃ¼ÀÇ ¹ßÀüÀ¸·Î HEMTÀÇ ¼º´É º¥Ä¡¸¶Å©´Â ´õ¿í ³ô¾ÆÁ³½À´Ï´Ù. Àü ¼¼°è°¡ °íÁÖÆÄ µ¿ÀÛ°ú Àü·Â È¿À²ÀÌ ³ôÀº ±â¼ú·Î À̵¿ÇÔ¿¡ µû¶ó HEMTÀÇ ¿ªÇÒÀÌ È®´ëµÇ¾î ¹ÝµµÃ¼ ½ÃÀå¿¡¼­ Áß¿äÇÑ ºÎǰÀÌ µÇ°í ÀÖ½À´Ï´Ù. 6G ¹«¼± Åë½Å°ú ¹Ð¸®¹ÌÅÍÆÄ(mmWave) ±â¼úÀÇ Ã¤ÅÃÀÌ Áõ°¡ÇÔ¿¡ µû¶ó Â÷¼¼´ë ÀüÀÚÁ¦Ç°ÀÇ Àü¸Á¿¡¼­ HEMTÀÇ Á߿伺ÀÌ ´õ¿í ºÎ°¢µÇ°í ÀÖ½À´Ï´Ù.

¾÷°èÀÇ ¹ßÀüÀÌ HEMT¸¦ Çõ½ÅÀÇ ÃÖÀü¼±À¸·Î ¹Ð¾îºÙÀÌ´Â ÀÌÀ¯´Â ¹«¾ùÀϱî?

HEMT´Â µ¶º¸ÀûÀÎ ¼Óµµ¿Í È¿À²¼ºÀ¸·Î ÀÎÇØ ¹ÝµµÃ¼ ±â¼ú Çõ½ÅÀÇ ÃÊÁ¡ÀÌ µÇ°í ÀÖÀ¸¸ç, ´Ù¾çÇÑ ºÐ¾ß¿¡¼­ ¿¬±¸°³¹ß(R&D)ÀÌ °¡¼ÓÈ­µÇ°í ÀÖ½À´Ï´Ù. ÃÖ±Ù ¸î ³â µ¿¾È °¡Àå ´«¿¡ ¶ç´Â ¹ßÀü Áß Çϳª´Â GaAs ±â¹Ý HEMT¿¡¼­ ³»¾Ð°ú Àü·Â ¹Ðµµ°¡ ÈξÀ ³ôÀº GaN ±â¹Ý º¯Á¾À¸·Î ÀüȯÇÑ °ÍÀÔ´Ï´Ù. GaN HEMT´Â ½ÅÈ£ ¹«°á¼ºÀ» À¯ÁöÇϸ鼭 °í¿Â¿¡¼­ È¿À²ÀûÀ¸·Î ÀÛµ¿ÇÒ ¼ö Àֱ⠶§¹®¿¡ ±º»ç ¹× »ó¾÷¿ë ·¹ÀÌ´õ ½Ã½ºÅÛ¿¡¼­ Á¡Á¡ ´õ ¼±È£µÇ°í ÀÖ½À´Ï´Ù. ¶Ç ´Ù¸¥ Å« µ¹ÆÄ±¸´Â °­È­ ¸ðµå(E-mode) HEMTÀÇ °³¹ßÀÔ´Ï´Ù. ÀÌ HEMT´Â À½ÀÇ °ÔÀÌÆ® Àü¾ÐÀÌ ÇÊ¿äÇÏÁö ¾Ê±â ¶§¹®¿¡ ȸ·Î ¼³°è°¡ ´Ü¼øÈ­µÇ°í ½Å·Ú¼ºÀÌ Çâ»óµË´Ï´Ù. ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡¼­ HEMT´Â °íÈ¿À² Àü·Â º¯È¯ ½Ã½ºÅÛ¿¡ ÅëÇյǰí ÀÖÀ¸¸ç, ³·Àº ½ºÀ§Äª ¼Õ½ÇÀº »ó´çÇÑ ¿¡³ÊÁö Àý¾à¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ¿¬±¸ÁøÀº GaN°ú SiCÀÇ ÀåÁ¡À» °áÇÕÇÏ¿© ¼º´É ÁöÇ¥¸¦ ´õ¿í Çâ»ó½Ãų ¼ö ÀÖ´Â ÇÏÀ̺긮µå HEMT ¾ÆÅ°ÅØÃ³¸¦ ¸ð»öÇϰí ÀÖ½À´Ï´Ù. ¸ð³î¸®½Ä ¸¶ÀÌÅ©·Î¿þÀ̺ê ÁýÀûȸ·Î(MMIC)ÀÇ ºÎ»óµµ HEMTÀÇ ¼ö¿ä¸¦ Áõ°¡½Ã۰í ÀÖ½À´Ï´Ù. ÀÌ Æ®·£Áö½ºÅÍ´Â ¼ÒÇü °í¼º´É RF ÁõÆø±âÀÇ ÁßÃß ¿ªÇÒÀ» Çϱ⠶§¹®ÀÔ´Ï´Ù. Ãʰí¼Ó µ¥ÀÌÅÍ Àü¼ÛÀ» À§ÇÑ Å×¶óÇ츣Ã÷(THz) ±â¼ú¿¡ ´ëÇÑ °ü½ÉÀÌ ³ô¾ÆÁö´Â °¡¿îµ¥, HEMT´Â 100GHz ÀÌ»óÀÇ Á֯ļö¿¡ ÃÖÀûÈ­µÇ¾î ¹«¼± Åë½Å ¹× ¿µ»ó ó¸® ¾ÖÇø®ÄÉÀ̼ÇÀÇ »õ·Î¿î °¡´É¼ºÀ» À̲ø¾î³»°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, HEMTÀÇ ½Å·Ú¼º°ú ¼ö¸íÀ» Çâ»ó½Ã۱â À§ÇÑ ³ë·ÂÀº ÀåÄ¡ÀÇ ÆÐ½Ãº£ÀÌ¼Ç ±â¼ú ¹× ¿­ °ü¸® ¼Ö·ç¼ÇÀÇ Çõ½ÅÀ¸·Î À̾îÁö°í ÀÖ½À´Ï´Ù. HEMT°¡ °è¼Ó ¹ßÀüÇÔ¿¡ µû¶ó ±× ÀÀ¿ë ¹üÀ§°¡ ³Ð¾îÁö°í ´Ù¾çÇÑ »ê¾÷¿¡¼­ ¹ÝµµÃ¼ ¼º´ÉÀÌ Çâ»óµÉ ¼ö ÀÖ´Â ±æÀ» ¿­¾îÁÖ°í ÀÖ½À´Ï´Ù.

HEMT°¡ »ê¾÷ Àü¹Ý¿¡ °ÉÃÄ °¡Àå Å« ¿µÇâÀ» ¹ÌÄ¡´Â °÷Àº ¾îµðÀΰ¡?

HEMTÀÇ ¿µÇâ·ÂÀº ÀüÅëÀûÀÎ ¹ÝµµÃ¼ ÀÀ¿ë ºÐ¾ß¿¡ ±¹ÇѵÇÁö ¾Ê°í, ´Ù¾çÇÑ °í¼ºÀå »ê¾÷¿¡¼­ »õ·Î¿î ±âȸ¸¦ ¹ß°ßÇϰí ÀÖ½À´Ï´Ù. HEMTÀÇ ÇýÅÃÀ» ¹Þ´Â °¡Àå Áß¿äÇÑ ºÐ¾ß Áß Çϳª´Â 5G ±âÁö±¹, À§¼º ¸µÅ©, ±¤¼¶À¯ ³×Æ®¿öÅ©¸¦ À§ÇÑ ÃʰíÁÖÆÄ ½ÅÈ£ Àü¼ÛÀ» °¡´ÉÇÏ°Ô ÇÏ´Â Åë½Å »ê¾÷ÀÔ´Ï´Ù. ÀÚµ¿Â÷ ÀüÀå ºÐ¾ß¿¡¼­ HEMT´Â EV ÆÄ¿öÆ®·¹ÀÎÀÇ È¿À²À» ³ôÀÌ°í ±Þ¼Ó ÃæÀü ±â¼úÀ» °¡´ÉÇÏ°Ô ÇÏ´Â Àüµ¿È­ ¿òÁ÷ÀÓ¿¡¼­ Áß¿äÇÑ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù. Ç×°ø¿ìÁÖ ¹× ¹æÀ§ ºÐ¾ß´Â ¿©ÀüÈ÷ HEMTÀÇ ÁÖ¿ä ¼ö¿äó·Î ÀüÀÚÀü, ¹Ì»çÀÏ À¯µµ ½Ã½ºÅÛ, Â÷¼¼´ë ·¹ÀÌ´õ ±â¼ú¿¡ HEMTÀÇ ´É·ÂÀ» Ȱ¿ëÇϰí ÀÖ½À´Ï´Ù. ÀÇ·á¿ë ¿µ»ó ó¸® ¹× Áø´Ü ºÐ¾ß¿¡¼­µµ ¾çÀüÀÚ¹æ»ç¼±´ÜÃþÃÔ¿µ(PET) ½ºÄ³³Ê¿Í ÷´Ü ÃÊÀ½ÆÄ ½Ã½ºÅÛ¿¡¼­ HEMTÀÇ ÀÌÁ¡À» ¸ñ°ÝÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, HEMT´Â °í¼Ó ½ºÀ§Äª Ư¼ºÀÌ Ã·´Ü ÄÄÇ»ÆÃ ¾ÆÅ°ÅØÃ³¸¦ Áö¿øÇÏ´Â ¾çÀÚ ÄÄÇ»ÆÃ¿¡¼­µµ °¢±¤¹Þ°í ÀÖ½À´Ï´Ù. ½º¸¶Æ® ±×¸®µå ±â¼ú°ú Àç»ý¿¡³ÊÁö ¼Ö·ç¼ÇÀÇ È®´ë·Î ÀÎÇØ °íÀü¾Ð Àü·Â º¯È¯ ¾ÖÇø®ÄÉÀ̼ǿ¡¼­ HEMTÀÇ Ã¤ÅÃÀÌ ´õ¿í °¡¼ÓÈ­µÇ°í ÀÖ½À´Ï´Ù. ¼ÒºñÀÚ ÀüÀÚ±â±â¿¡¼­´Â ÀÌ Æ®·£Áö½ºÅͰ¡ °í¼º´É ¿Àµð¿À ¾ÚÇÁ¿Í ½º¸¶Æ®Æù¿ë RF ÇÁ·ÐÆ®¿£µå ¸ðµâ¿¡ ÁýÀûµÇ¾î ¶Ù¾î³­ ½ÅÈ£ ¼±¸íµµ¿Í È¿À²À» º¸ÀåÇÕ´Ï´Ù. ¶ÇÇÑ, ¹«ÀÎÇ×°ø±â(UAV) ¹× °í¼Óöµµ ½Ã½ºÅÛ°ú °°Àº ½ÅÈï ¾ÖÇø®ÄÉÀ̼ǿ¡¼­ HEMT ±â¹Ý Àü·Â ¼Ö·ç¼ÇÀº ¿î¿µ È¿À²¼º°ú ½Å·Ú¼ºÀ» ³ôÀ̱â À§ÇØ È°¿ëµÇ°í ÀÖ½À´Ï´Ù. ÀüÀÚÁ¦Ç°ÀÇ ¼ÒÇüÈ­ Ãß¼¼´Â ¼ÒÇü HEMT ¸ðµâÀÇ °³¹ß¿¡ ¹ÚÂ÷¸¦ °¡Çϰí ÀÖÀ¸¸ç, Â÷¼¼´ë µð¹ÙÀ̽º¿¡ÀÇ ÅëÇÕÀ» ´õ¿í Ä£¼÷ÇÏ°Ô ¸¸µé°í ÀÖ½À´Ï´Ù. ¾÷°èÀÇ ¿ä±¸»çÇ×ÀÌ °è¼Ó ÁøÈ­ÇÏ´Â °¡¿îµ¥, HEMTÀÇ ´ÙÀç´Ù´ÉÇÔ°ú ÀûÀÀ¼ºÀº ÀüÀÚÁ¦Ç° Çõ½ÅÀÇ ¹Ì·¡¸¦ Çü¼ºÇÏ´Â µ¥ Áß¿äÇÑ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù.

HEMT ½ÃÀåÀÇ ±Þ¼ºÀå ¿øµ¿·ÂÀº?

¼¼°è HEMT ½ÃÀåÀÇ ¼ºÀåÀº ¿©·¯ »ê¾÷ ºÐ¾ß¿¡¼­ °íÁÖÆÄ ¹× °íÀü·Â ÀüÀÚÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡ µî ¿©·¯ ¿äÀο¡ ÀÇÇØ ÁÖµµµÇ°í ÀÖ½À´Ï´Ù. HEMT´Â ¹Ð¸®¹ÌÅÍÆÄ Á֯ļö¿¡¼­ È¿À²ÀûÀÎ ½ÅÈ£ Àü¼Û ¹× ÁõÆøÀ» °¡´ÉÇÏ°Ô ÇÏ´Â µ¥ ÇʼöÀûÀ̱⠶§¹®¿¡ 5G ¹× ÇâÈÄ 6G ³×Æ®¿öÅ©ÀÇ È®ÀåÀÌ ÁÖ¿ä ÃËÁø¿äÀÎÀ¸·Î ÀÛ¿ëÇϰí ÀÖ½À´Ï´Ù. Àü±âÀÚµ¿Â÷ÀÇ º¸±Þ°ú ±Þ¼Ó ÃæÀü ÀÎÇÁ¶óÀÇ ¹ßÀüµµ Àü·Â º¯È¯ ¾ÖÇø®ÄÉÀ̼ǿ¡¼­ HEMT¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Á¤ºÎ ¹× ¹Î°£ ÅõÀÚ Áõ°¡·Î ÀÎÇÑ ¿ìÁÖ ¹× À§¼ºÅë½Å ½Ã½ºÅÛÀÇ ±Þ¼ÓÇÑ ¹ßÀüÀº ½ÃÀå ¼ºÀåÀ» ´õ¿í ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ±º ¹× ¹æÀ§ ¿ëµµ´Â ·¹ÀÌ´õ, °¨½Ã ¹× ÀüÀÚÀü ±â¼ú¿¡ ´ëÇÑ ÅõÀÚ°¡ Áõ°¡Çϰí ÀÖÀ¸¸ç, HEMT°¡ ŸÀÇ ÃßÁ¾À» ºÒÇãÇÏ´Â ¼º´ÉÀ» ¹ßÈÖÇÒ ¼ö ÀÖ´Â Áß¿äÇÑ ºÐ¾ßÀÓ¿¡´Â º¯ÇÔÀÌ ¾ø½À´Ï´Ù. »ê¾÷ ÀÚµ¿È­ ¹× ½º¸¶Æ® ±×¸®µå¿¡¼­ ¿¡³ÊÁö È¿À²ÀÌ ³ôÀº ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½ºÀÇ ÃßÁøÀº ¿¡³ÊÁö ¼Õ½ÇÀ» ÃÖ¼ÒÈ­ÇÏ°í ½Ã½ºÅÛ È¿À²À» Çâ»ó½Ã۱â À§ÇÑ ¾÷°èÀÇ ³ë·Â°ú ÇÔ²² Áß¿äÇÑ ÃËÁøÁ¦ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù. HEMT°¡ Ãʰí¼Ó ½ºÀ§Äª ¾ÖÇø®ÄÉÀ̼ǿ¡ »ç¿ëµÇ´Â °í¼º´É ÄÄÇ»ÆÃ°ú µ¥ÀÌÅͼ¾ÅͰ¡ °­Á¶µÇ°í ÀÖ´Â Á¡µµ ½ÃÀå È®´ë¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ÀΰøÁö´É(AI) ¹× ¸Ó½Å·¯´×(ML) ¿öÅ©·ÎµåÀÇ Áõ°¡·Î ÀÎÇØ Â÷¼¼´ë ÄÄÇ»ÆÃ Ç÷§ÆûÀÇ Ã³¸® ¿ä±¸»çÇ×À» ÃæÁ·Çϱâ À§ÇØ HEMT¸¦ Æ÷ÇÔÇÑ Ã·´Ü ¹ÝµµÃ¼ ºÎǰÀÇ Çʿ伺ÀÌ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÇ·á ºÐ¾ß¿¡¼­µµ °íÁ¤¹Ð À̹Ì¡ ±â¼ú¿¡ HEMTÀÇ Ã¤¿ëÀÌ Áõ°¡Çϰí ÀÖÀ¸¸ç, ±× Àû¿ë ¹üÀ§°¡ ´õ¿í ´Ù¾çÇØÁö°í ÀÖ½À´Ï´Ù. ¿¬±¸°³¹ß ÅõÀÚ Áõ°¡¿Í ¹ÝµµÃ¼ Á¦Á¶¾÷ü, ¿¬±¸±â°ü, Á¤ºÎ±â°üÀÇ Çù·ÂÀº HEMT ±â¼úÀÇ Áö¼ÓÀûÀÎ Çõ½ÅÀ» ÃËÁøÇÏ°í ½ÃÀåÀÇ ²ÙÁØÇÑ ¼ºÀåÀ» º¸ÀåÇϰí ÀÖ½À´Ï´Ù. Àç·á °úÇÐ, ƯÈ÷ GaN ¹× SiC ±â¹Ý HEMTÀÇ Áö¼ÓÀûÀÎ ¹ßÀüÀ¸·Î ÀÎÇØ °íÁÖÆÄ, °íÃâ·Â, ¿¡³ÊÁö È¿À²ÀûÀÎ ÀüÀÚ ¾ÖÇø®ÄÉÀ̼ǿ¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó ½ÃÀåÀº Áö¼ÓÀûÀ¸·Î È®´ëµÉ ż¼¸¦ °®Ãß°í ÀÖ½À´Ï´Ù.

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Global High Electron Mobility Transistor Market to Reach US$9.5 Billion by 2030

The global market for High Electron Mobility Transistor estimated at US$6.3 Billion in the year 2024, is expected to reach US$9.5 Billion by 2030, growing at a CAGR of 7.0% over the analysis period 2024-2030. Gallium Nitride Type, one of the segments analyzed in the report, is expected to record a 8.5% CAGR and reach US$4.4 Billion by the end of the analysis period. Growth in the Silicon Carbide Type segment is estimated at 4.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.7 Billion While China is Forecast to Grow at 11.2% CAGR

The High Electron Mobility Transistor market in the U.S. is estimated at US$1.7 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$2.0 Billion by the year 2030 trailing a CAGR of 11.2% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 3.4% and 6.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.6% CAGR.

Global High Electron Mobility Transistor Market - Key Trends & Drivers Summarized

What Makes High Electron Mobility Transistors (HEMTs) Stand Out in Modern Electronics?

High Electron Mobility Transistors (HEMTs) have revolutionized the semiconductor industry by enabling high-speed, high-frequency, and low-noise performance across various applications. Unlike conventional MOSFETs, HEMTs leverage the heterojunction between two semiconductor materials, such as gallium nitride (GaN) and aluminum gallium nitride (AlGaN), to achieve exceptional electron mobility. This unique structure minimizes carrier scattering and enhances signal amplification, making HEMTs indispensable in radio frequency (RF) and microwave applications. With increasing demand for ultra-fast electronic components, HEMTs are gaining traction in satellite communication, radar systems, and even 5G infrastructure. Another distinguishing feature of HEMTs is their superior thermal stability and ability to operate at high voltages, making them ideal for power electronics, including electric vehicle (EV) inverters and renewable energy systems. The performance advantage of HEMTs is also evident in their ability to reduce energy losses, which is crucial in aerospace and defense applications where efficiency and reliability are paramount. Moreover, advancements in material science, particularly in wide-bandgap semiconductors such as gallium nitride (GaN) and silicon carbide (SiC), have further elevated the performance benchmarks of HEMTs. As the world moves towards higher-frequency operations and power-efficient technologies, the role of HEMTs is expanding, making them a critical component in the semiconductor market. The increasing adoption of 6G wireless communication and millimeter-wave (mmWave) technologies further underscores the significance of HEMTs in the next-generation electronics landscape.

How Are Industry Advancements Pushing HEMTs to the Forefront of Innovation?

HEMTs have become a focal point of semiconductor innovation due to their unparalleled speed and efficiency, with research and development (R&D) efforts accelerating across multiple domains. One of the most notable advancements in recent years is the transition from GaAs-based HEMTs to GaN-based variants, which offer significantly higher breakdown voltage and power density. GaN HEMTs are increasingly preferred in military and commercial radar systems due to their ability to operate efficiently at high temperatures while maintaining signal integrity. Another major breakthrough is the development of enhancement-mode (E-mode) HEMTs, which eliminate the need for a negative gate voltage, simplifying circuit design and improving reliability. In power electronics, HEMTs are being integrated into high-efficiency power conversion systems, where their low switching losses contribute to substantial energy savings. Moreover, researchers are exploring hybrid HEMT architectures that combine the advantages of GaN and SiC to further enhance performance metrics. The rise of monolithic microwave integrated circuits (MMICs) has also driven demand for HEMTs, as these transistors serve as the backbone for compact, high-performance RF amplifiers. With increasing interest in terahertz (THz) technology for ultra-fast data transmission, HEMTs are being optimized for frequencies beyond 100 GHz, unlocking new possibilities in wireless communications and imaging applications. Additionally, efforts to improve HEMT reliability and longevity are leading to innovations in device passivation techniques and thermal management solutions. As HEMTs continue to evolve, their application scope is broadening, paving the way for enhanced semiconductor performance across multiple industries.

Where Are HEMTs Making the Biggest Impact Across Industries?

The influence of HEMTs extends beyond traditional semiconductor applications, finding new opportunities in various high-growth industries. One of the most significant sectors benefiting from HEMTs is the telecommunications industry, where they enable ultra-high-frequency signal transmission for 5G base stations, satellite links, and fiber-optic networks. In automotive electronics, HEMTs are playing a critical role in the electrification movement, where they enhance the efficiency of EV powertrains and enable fast-charging technologies. The aerospace and defense sector remains a major consumer of HEMTs, leveraging their capabilities for electronic warfare, missile guidance systems, and next-generation radar technologies. Medical imaging and diagnostics are also witnessing the advantages of HEMTs, particularly in positron emission tomography (PET) scanners and advanced ultrasound systems, where high-frequency signal processing is essential for precision imaging. Additionally, HEMTs are gaining traction in quantum computing, where their high-speed switching characteristics support advanced computing architectures. The expansion of smart grid technologies and renewable energy solutions has further accelerated the adoption of HEMTs in high-voltage power conversion applications. In consumer electronics, these transistors are being integrated into high-performance audio amplifiers and RF front-end modules for smartphones, ensuring superior signal clarity and efficiency. Furthermore, emerging applications such as unmanned aerial vehicles (UAVs) and high-speed rail systems are leveraging HEMT-based power solutions to enhance operational efficiency and reliability. The ongoing miniaturization trend in electronics has also spurred the development of compact HEMT modules, making them more accessible for integration into next-generation devices. As industry requirements continue to evolve, the versatility and adaptability of HEMTs are proving to be instrumental in shaping the future of electronic innovation.

What’s Driving the Rapid Growth of the HEMT Market?

The growth in the global HEMT market is driven by several factors, including the rising demand for high-frequency and high-power electronics across multiple industries. The expansion of 5G and upcoming 6G networks is a primary driver, as HEMTs are essential for enabling efficient signal transmission and amplification at millimeter-wave frequencies. The increasing adoption of electric vehicles and advancements in fast-charging infrastructure are also fueling demand for HEMTs in power conversion applications. Additionally, the rapid development of space and satellite communication systems, driven by increasing government and private investments, is further propelling market growth. Military and defense applications remain a crucial sector, with heightened investments in radar, surveillance, and electronic warfare technologies where HEMTs offer unmatched performance. The push for energy-efficient power electronics in industrial automation and smart grids is another critical growth driver, as industries strive to minimize energy losses and improve system efficiency. The growing emphasis on high-performance computing and data centers, where HEMTs are used for ultra-fast switching applications, is further contributing to market expansion. Additionally, the rise of artificial intelligence (AI) and machine learning (ML) workloads is driving the need for advanced semiconductor components, including HEMTs, to meet the processing demands of next-generation computing platforms. The medical sector is also experiencing increased adoption of HEMTs in high-precision imaging technologies, further diversifying their application scope. Increasing R&D investments and collaborations between semiconductor manufacturers, research institutions, and government agencies are fostering continuous innovation in HEMT technology, ensuring steady market growth. With ongoing advancements in material science, particularly in GaN and SiC-based HEMTs, the market is poised for sustained expansion, catering to the growing demands of high-frequency, high-power, and energy-efficient electronic applications.

SCOPE OF STUDY:

The report analyzes the High Electron Mobility Transistor market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Gallium Nitride Type, Silicon Carbide Type, Gallium Arsenide Type, Other Types); End-Use (Consumer Electronics End-Use, Automotive End-Use, Industrial End-Use, Aerospace & Defense End-Use, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

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TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

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