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Automotive Flexible Printed Circuit (FPC)
»óǰÄÚµå : 1747689
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¹ßÇàÀÏ : 2025³â 06¿ù
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¼¼°èÀÇ Â÷·®¿ë ¿¬¼ºÈ¸·Î±âÆÇ(FPC) ½ÃÀåÀº 2030³â±îÁö 11¾ï ´Þ·¯¿¡ À̸¦ Àü¸Á

2024³â¿¡ 7¾ï 7,180¸¸ ´Þ·¯·Î ÃßÁ¤µÇ´Â Â÷·®¿ë ¿¬¼ºÈ¸·Î±âÆÇ(FPC) ¼¼°è ½ÃÀåÀº2024-2030³â ºÐ¼® ±â°£¿¡ CAGR 6.8%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 11¾ï ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. º» º¸°í¼­¿¡¼­ ºÐ¼®ÇÑ ºÎ¹® Áß ÇϳªÀÎ Double-Sided FPC´Â CAGR 7.5%¸¦ ³ªÅ¸³»°í, ºÐ¼® ±â°£ Á¾·á½Ã¿¡´Â 7¾ï 2,360¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. Multi-Layer FPC ºÎ¹®ÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£¿¡ CAGR 6.0%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº ¾à 2¾ï 290¸¸ ´Þ·¯, Áß±¹Àº CAGR 6.6%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ Â÷·®¿ë ¿¬¼ºÈ¸·Î±âÆÇ(FPC) ½ÃÀåÀº 2024³â¿¡ 2¾ï 290¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦´ë±¹ÀÎ Áß±¹Àº ºÐ¼® ±â°£ÀÎ 2024-2030³â CAGR 6.6%·Î ¼ºÀåÇÏ¿© 2030³â±îÁö 1¾ï 8,400¸¸ ´Þ·¯ ±Ô¸ð¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ±âŸ ÁÖ¸ñÇØ¾ß ÇÒ Áö¿ªº° ½ÃÀåÀ¸·Î¼­´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖÀ¸¸ç, ºÐ¼® ±â°£Áß CAGRÀº °¢°¢ 6.4%¿Í 5.7%¸¦ º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR 5.4%¸¦ º¸ÀÏ Àü¸ÁÀÔ´Ï´Ù.

¼¼°èÀÇ Â÷·®¿ë ¿¬¼ºÈ¸·Î±âÆÇ(FPC) ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

ÀÚµ¿Â÷ ÀüÀå ¾ÆÅ°ÅØÃ³¿¡¼­ Ç÷º¼­ºí Àμâ ȸ·Î°¡ Àü·«ÀûÀ¸·Î Áß¿äÇÑ ÀÌÀ¯´Â ¹«¾ùÀΰ¡?

¿¬¼ºÈ¸·Î±âÆÇ(FPC)´Â °æ·®È­, ¼ÒÇüÈ­, °í¹Ðµµ »óÈ£¿¬°á¿¡ ´ëÇÑ ¾÷°èÀÇ ÃàÀ» ¹è°æÀ¸·Î ÁøÈ­ÇÏ´Â ÀÚµ¿Â÷ ÀüÀå ¾ÆÅ°ÅØÃ³ÀÇ ±â¹ÝÀÌ µÇ°í ÀÖ½À´Ï´Ù. FPC´Â ±âÁ¸ÀÇ ¿ÍÀ̾î Çϳ׽º ¹× ¸®Áöµå PCB¿¡ ºñÇØ À¯¿¬¼º, °æ·®È­ ¹× °ø°£ Àý¾àÇü ÅëÇÕÀ» ½ÇÇöÇÕ´Ï´Ù. FPC´Â º¹ÀâÇÑ Çü»óÀ» ±¸ÇöÇÒ ¼ö Àֱ⠶§¹®¿¡ ÀÎÆ÷Å×ÀÎ¸ÕÆ® ½Ã½ºÅÛ, ADAS ¸ðµâ, Â÷·® ³» Á¶¸í, ÆÄ¿öÆ®·¹ÀÎ Á¦¾î µî Á¼Àº ½Ç³» °ø°£¿¡¼­ ¿øÈ°ÇÑ ¹è¼±À» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù.

Àü±âÀÚµ¿Â÷ ¹× ¼ÒÇÁÆ®¿þ¾î Á¤ÀÇ ÀÚµ¿Â÷·ÎÀÇ ÀüȯÀº FPCÀÇ Ã¤ÅÃÀ» ´õ¿í °¡¼ÓÈ­Çϰí ÀÖÀ¸¸ç, EV Ç÷§ÆûÀº ȸ·ÎÀÇ º¹À⼺°ú ¿­ È¿À²À» Çâ»ó½ÃÄÑ¾ß Çϱ⠶§¹®¿¡ FPC´Â ºÎÇǸ¦ ÁÙÀÌ°í ½Å·Ú¼ºÀ» Çâ»ó½ÃŰ´Â µ¥ ÇÊ¿äÇÑ ¼º´ÉÀ» Á¦°øÇÕ´Ï´Ù. ¶ÇÇÑ, FPC´Â Áøµ¿, ±ÁÈû, °í¿Â ȯ°æ¿¡ °­ÇØ ¹èÅ͸® °ü¸® ½Ã½ºÅÛ(BMS)¿¡¼­ ÷´Ü ¾ÈÀü ÄÁÆ®·Ñ·¯¿¡ À̸£±â±îÁö ÃֽŠÀÚµ¿Â÷ ¿ëµµÀÇ ¹Ì¼Ç Å©¸®Æ¼ÄÃÇÑ ±â´É¿¡ ÀÌ»óÀûÀÔ´Ï´Ù.

Àç·á Çõ½Å, HDI ¼³°è, °øÁ¤ ÀÚµ¿È­°¡ FPCÀÇ ¼º´ÉÀ» ¾î¶»°Ô Çâ»ó½Ã۰í Àִ°¡?

Æú¸®ÀÌ¹Ìµå ±âÆÇ, ÀúÀ¯ÀüÀ² Çʸ§, ¿­Àüµµ¼º Á¢ÂøÁ¦¿Í °°Àº ±âº» Àç·áÀÇ ¹ßÀüÀ¸·Î Â÷·®¿ë FPCÀÇ ±â°èÀû ¹× Àü±âÀû ¼º´ÉÀÌ Çâ»óµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¼ÒÀç´Â ´õ ³ôÀº Àü·ù Àü´Þ ¿ë·®, ¿­ °ü¸® ¹× EMI Â÷Æó¸¦ °¡´ÉÇÏ°Ô ÇÏ¿© FPC¸¦ Àü·Â Áý¾àÀûÀÌ°í ½ÅÈ£¿¡ ¹Î°¨ÇÑ Â÷·®¿ë ½Ã½ºÅÛ¿¡ ÀûÇÕÇÏ°Ô ¸¸µì´Ï´Ù. °í¹Ðµµ ÀÎÅÍÄ¿³ØÆ®(HDI)¸¦ »ç¿ëÇÑ 2Ãþ ¹× ´ÙÃþ FPC ¼³°è´Â °ø°£°ú ÆûÆÑÅ͸¦ Èñ»ýÇÏÁö ¾Ê°íµµ ´õ º¹ÀâÇÑ È¸·Î¸¦ ±¸ÇöÇÒ ¼ö ÀÖ½À´Ï´Ù.

FPC Á¦Á¶ °øÁ¤ ÀÚµ¿È­·Î Àϰü¼º, 󸮷®, ºñ¿ë È¿À²¼ºÀÌ Çâ»óµÇ°í ÀÖ½À´Ï´Ù. ·¹ÀÌÀú Á÷Á¢ À̹Ì¡(LDI), ·ÑÅõ·Ñ Á¦Á¶, ÀÚµ¿ ±¤ÇÐ °Ë»ç(AOI) ½Ã½ºÅÛÀº Á¦Á¶¾÷ü°¡ ÀÚµ¿Â÷ Tier 1 °ø±Þ¾÷üÀÇ ±î´Ù·Î¿î ǰÁú ¹× È®À强 ¿ä±¸ »çÇ×À» ÃæÁ·ÇÏ´Â µ¥ µµ¿òÀ» ÁÖ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, SMT(Ç¥¸é½ÇÀå±â¼ú) ¹× ¸ðµâ½Ä Á¶¸³ °øÁ¤°úÀÇ ÅëÇÕÀº ƯÈ÷ ÅÍÄ¡½ºÅ©¸°, ¼¾¼­, µðÁöÅÐ °è·®±â Ŭ·¯½ºÅÍ¿Í °°Àº ´ë·® »ý»ê ¿ëµµ¿¡¼­ ÃÖÁ¾ ¿ëµµ¿¡ ´ëÇÑ ÀûÀÀ¼ºÀ» °£¼ÒÈ­ÇÕ´Ï´Ù.

Ç÷º¼­ºí Àμâ ȸ·ÎÀÇ È°¿ëÀÌ °¡¼ÓÈ­µÇ°í ÀÖ´Â ÀÚµ¿Â÷ ½Ã½ºÅÛ ¹× Ç÷§ÆûÀº ¹«¾ùÀΰ¡?

ÀÎÆ÷Å×ÀÎ¸ÕÆ® ¹× HMI(ÈÞ¸Õ ¸Ó½Å ÀÎÅÍÆäÀ̽º) ¸ðµâÀº FPCÀÇ ÁÖ¿ä ä¿ë »ç·Ê·Î, À¯¿¬ÇÑ È¸·Î´Â ¹è¼± Àå¾Ö¸¦ ÃÖ¼ÒÈ­Çϸ鼭 ÅÍÄ¡ ½ºÅ©¸°, Á¶ÀÛ ¹öư, Á¶¸í ¿ä¼Ò, µð½ºÇ÷¹ÀÌ ¿¬°áÀ» Áö¿øÇÕ´Ï´Ù. °è±âÆÇ Ŭ·¯½ºÅÍ¿Í Çìµå¾÷ µð½ºÇ÷¹ÀÌ(HUD)µµ ¾î¼Àºí¸®ÀÇ ¹«°Ô¸¦ ÁÙÀ̰í ÀÏÁ¤ÇÑ ¿­ »çÀÌŬ ÇÏ¿¡¼­ ½Ã½ºÅÛÀÇ ³»±¸¼ºÀ» ³ôÀ̱â À§ÇØ FPC¿¡ Å©°Ô ÀÇÁ¸Çϰí ÀÖ½À´Ï´Ù.

ÀüÀÚÁ¦¾îÀåÄ¡(ECU), ADAS ¸ðµâ, EV ¹èÅ͸® ÆÑ µî ÆÄ¿öÆ®·¹ÀÎ ¹× ¾ÈÀü¿¡ Áß¿äÇÑ ½Ã½ºÅÛ¿¡¼­ FPC´Â ¼³°èÀÇ À¯¿¬¼º°ú ½Å·Ú¼ºÀ» ³ôÀ̱â À§ÇØ Á¡Á¡ ´õ ¸¹ÀÌ »ç¿ëµÇ°í ÀÖÀ¸¸ç, EV¿¡¼­´Â ¹èÅ͸® ÀÎŬ·ÎÀú ³»ÀÇ BMS, ¿Âµµ ¸ð´ÏÅ͸µ, »óÈ£ ¿¬°á ¸ðµâ ¿¡ FPC°¡ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, LED Çìµå¶óÀÌÆ®, ȯ°æ Á¶¸í, ¹ÌµîÀ» Æ÷ÇÔÇÑ ÀÚµ¿Â÷ Á¶¸í ½Ã½ºÅÛÀº Á¦ÇÑµÈ ÆûÆÑÅÍ¿¡¼­ ÄÄÆÑÆ®ÇÑ ¹è¼± ¹× ¿­ °ü¸®¸¦ À§ÇØ FPC¸¦ äÅÃÇϰí ÀÖ½À´Ï´Ù.

Áö¿ª Á¦Á¶ °ÅÁ¡ ¹× ÀÚµ¿Â÷ Àüµ¿È­ Ãß¼¼´Â FPC ¼ö¿ä¿¡ ¾î¶² ¿µÇâÀ» ¹ÌÄ¡°í Àִ°¡?

¾Æ½Ã¾ÆÅÂÆò¾çÀº Áß±¹, ÀϺ», Çѱ¹, ´ë¸¸À» Áß½ÉÀ¸·Î FPC »ý»êÀ» ÁÖµµÇϰí ÀÖ½À´Ï´Ù. ÀÌµé ±¹°¡´Â Â÷·®¿ë FPC »ý»ê¿¡ ÇÊ¿äÇÑ ´ë·® »ý»ê°ú °íÁ¤¹Ð Á¦Á¶ ´É·ÂÀ» Á¦°øÇÕ´Ï´Ù. Áö¿ª ³» Àü±âÂ÷ Àǹ«È­, ±¹³» Àü±âÂ÷ ºê·£µåÀÇ ¼ºÀå, ÀüÀÚºÎǰ °ø±Þ¾÷üÀÇ ÅºÅºÇÑ ±â¹ÝÀÌ FPC ¼ö¿äÀÇ Áö¼ÓÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù.

À¯·´Àº ÀÚµ¿Â÷ÀÇ Àüµ¿È­, °æ·®È­ ±ÔÁ¦, ÇÁ¸®¹Ì¾ö OEMÀÇ ¿£Áö´Ï¾î¸µ ¿ì¼ö¼ºÀ¸·Î ÀÎÇØ äÅÃÀÌ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ºÏ¹ÌÀÇ ¼ºÀåÀº EV ½ºÅ¸Æ®¾÷, ÀüÀÚÁ¦Ç° Á¦Á¶ÀÇ ÇöÁöÈ­ Áõ°¡, ¼ÒÇÁÆ®¿þ¾î Á¤ÀÇ Â÷·® ¾ÆÅ°ÅØÃ³¿¡ FPCÀÇ ÅëÇÕÀ¸·Î ÀÎÇØ ¼ºÀåÇϰí ÀÖ½À´Ï´Ù. ¶óƾ¾Æ¸Þ¸®Ä«¿Í µ¿³²¾Æ½Ã¾ÆÀÇ ½ÅÈï ½ÃÀåÀº ÇöÁö ÀüÀÚÁ¦Ç° Á¶¸³ÀÇ ¼ºÀå°ú ÀÚµ¿Â÷ ±â´É Áõ°¡¿¡ ¿µÇâÀ» ¹Þ¾Æ FPC¸¦ º¸´Ù ¿Ï¸¸ÇÏ°Ô Ã¤ÅÃÇϰí ÀÖ½À´Ï´Ù.

½ÃÀå °³Ã´¿¡¼­ OEM°ú 1´Ü°è Çù¾÷, °ø±Þ¸Á ÇöÁöÈ­, ¼öÁ÷Àû ÅëÇÕÀº ¾î¶² ¿ªÇÒÀ» Çϴ°¡?

ÀÚµ¿Â÷ Á¦Á¶¾÷ü¿Í Tier 1 °ø±Þ¾÷ü´Â ±â°èÀû ȣȯ¼º, Àå±â ³»±¸¼º ¹× Á¦Á¶ È¿À²¼ºÀ» º¸ÀåÇϱâ À§ÇØ FPC ±â¹Ý ¸ðµâÀÇ Á¶±â °øµ¿ °³¹ß¿¡ Èû¾²°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ °øµ¿ °³¹ßÀ» ÅëÇØ FPC ·¹À̾ƿô, ½ÅÈ£ ¹è¼±, ¿­ ÇÁ·ÎÆÄÀÏÀÌ Æ¯Á¤ Â÷·® ¾ÆÅ°ÅØÃ³¿¡ µû¶ó ÃÖÀûÈ­µÇ°í ÀÖ½À´Ï´Ù. ºÎǰ ÅëÇÕ, ÄÁÆ÷¸Ö ÄÚÆÃ, ¿­ ½Ã¹Ä·¹À̼ǰú °°Àº ºÎ°¡°¡Ä¡ ¼­ºñ½º¸¦ Á¦°øÇÏ¿© ÅÏŰ Ç÷º¼­ºí ȸ·Î ¼Ö·ç¼ÇÀ» Á¦°øÇÏ´Â °ø±Þ¾÷üµµ Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

°ø±Þ¸Á ÇöÁöÈ­´Â ¸®µåŸÀÓ ´ÜÃà, ÁöÁ¤ÇÐÀû ¸®½ºÅ© °ü¸®, Áö¿ª Á¶´Þ Àǹ«¿¡ ´ëÀÀÇϱâ À§ÇÑ Àü·«Àû ¿ì¼±¼øÀ§°¡ µÇ°í ÀÖ½À´Ï´Ù. ÀϺΠFPC Á¦Á¶¾÷ü´Â Àû½Ã ³³Ç° ¹× ¸ÂÃãÈ­¸¦ Áö¿øÇϱâ À§ÇØ ÀÚµ¿Â÷ OEM ÁýÀûÁö ±Ùó¿¡ Áö¿ª °øÀåÀ̳ª ÇÕÀÛȸ»ç¸¦ ¼³¸³Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ±âÆÇ »ý»ê, ȸ·Î ¼³°è, Á¦Á¶, Á¶¸³À» Æ÷ÇÔÇÑ ÁÖ¿ä ¾÷üµéÀÇ ¼öÁ÷Àû ÅëÇÕÀº ǰÁú °ü¸®¿Í »ý»ê·® ¾ÈÁ¤¼ºÀ» º¸ÀåÇϱâ À§ÇÑ °æÀï ¿ìÀ§·Î ºÎ»óÇϰí ÀÖ½À´Ï´Ù.

Â÷·®¿ë ¿¬¼ºÈ¸·Î±âÆÇ ½ÃÀåÀÇ ¼ºÀå ¿äÀÎÀº ¹«¾ùÀΰ¡?

ÀÚµ¿Â÷ÀÇ Àüµ¿È­, ÀÚµ¿È­, µðÁöÅÐÈ­·Î ÀÎÇØ Ç÷§Æû Àü¹ÝÀÇ ÀüÀÚÀåÄ¡ ÅëÇÕÀÌ ÀçÆíµÇ°í ÀÖ´Â °¡¿îµ¥, ÀÚµ¿Â÷ FPC ½ÃÀåÀº Áö¼ÓÀûÀ¸·Î ¼ºÀåÇϰí ÀÖÀ¸¸ç, FPC´Â ÁøÈ­ÇÏ´Â ÆûÆÑÅÍ¿Í ½Ã½ºÅÛ ¼ö¿ä¿¡ ´ëÀÀÇÏ´Â ¼ÒÇü, °æ·®, °í½Å·Ú¼º ȸ·Î ¼Ö·ç¼ÇÀ» ÅëÇØ Â÷¼¼´ë ÀÚµ¿Â÷ ¼³°è¸¦ °¡´ÉÇÏ°Ô Çϰí ÀÖ½À´Ï´Ù. Â÷¼¼´ë ÀÚµ¿Â÷ ¼³°è¸¦ °¡´ÉÇÏ°Ô Çϰí ÀÖ½À´Ï´Ù.

ÁÖ¿ä ¼ºÀå ÃËÁø¿äÀÎÀ¸·Î´Â Â÷·® 1´ë´ç ÀüÀÚºÎǰ žÀç·® Áõ°¡, EV ¹× ADAS ¾ÆÅ°ÅØÃ³ÀÇ È®»ê, Àç·á ¹× ¼³°è Çõ½Å, ÀÚµ¿È­ Áß½ÉÀÇ Á¦Á¶ È®À强 µîÀÌ ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Áö¿ªº° Á¤Ã¥ º¯È­, OEMÀÇ ±â¼ú ·Îµå¸Ê, µðÁöÅÐ ÄÛÇÍ ½Ã½ºÅÛÀÇ º¸±Þ È®´ëµµ ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù.

ÀÚµ¿Â÷°¡ ½º¸¶Æ®È­, Ä¿³ØÆ¼µåÈ­, Àüµ¿È­ Ç÷§ÆûÀ¸·Î ÁøÈ­ÇÏ´Â °¡¿îµ¥, Ç÷º¼­ºí Àμâ ȸ·Î´Â ¹Ì·¡ÀÇ ÀÚµ¿Â÷¿ë ÀÏ·ºÆ®·Î´Ð½ºÀÇ Áö´É°ú È¿À²¼ºÀ» µÞ¹ÞħÇÏ´Â Á¶¿ëÇÑ ÀÎÇÁ¶ó°¡ µÉ ¼ö ÀÖÀ»±î?

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Global Industry Analysts´Â º»»çÀÇ ±¹°¡, Á¦Á¶°ÅÁ¡, ¼öÃâÀÔ(¿ÏÁ¦Ç° ¹× OEM)À» ±â¹ÝÀ¸·Î ±â¾÷ÀÇ °æÀï·Â º¯È­¸¦ ¿¹ÃøÇß½À´Ï´Ù. ÀÌ·¯ÇÑ º¹ÀâÇÏ°í ´Ù¸éÀûÀÎ ½ÃÀå ¿ªÇÐÀº ÀÎÀ§ÀûÀÎ ¼öÀÍ¿ø°¡ Áõ°¡, ¼öÀͼº °¨¼Ò, °ø±Þ¸Á ÀçÆí µî ¹Ì½ÃÀû ¹× °Å½ÃÀû ½ÃÀå ¿ªÇÐ Áß¿¡¼­µµ ƯÈ÷ °æÀï»çµé¿¡°Ô ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

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Global Industry Analysts´Â ÀÌ·¯ÇÑ È¥¶õÀÌ ÇâÈÄ 2-3°³¿ù ³»¿¡ ¸¶¹«¸®µÇ°í »õ·Î¿î ¼¼°è Áú¼­°¡ º¸´Ù ¸íÈ®ÇÏ°Ô È®¸³µÉ °ÍÀ¸·Î ¿¹»óÇϰí ÀÖÀ¸¸ç, Global Industry Analysts´Â ÀÌ·¯ÇÑ »óȲÀ» ½Ç½Ã°£À¸·Î ÃßÀûÇϰí ÀÖ½À´Ï´Ù.

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Global Automotive Flexible Printed Circuit (FPC) Market to Reach US$1.1 Billion by 2030

The global market for Automotive Flexible Printed Circuit (FPC) estimated at US$771.8 Million in the year 2024, is expected to reach US$1.1 Billion by 2030, growing at a CAGR of 6.8% over the analysis period 2024-2030. Double-Sided FPC, one of the segments analyzed in the report, is expected to record a 7.5% CAGR and reach US$723.6 Million by the end of the analysis period. Growth in the Multi-Layer FPC segment is estimated at 6.0% CAGR over the analysis period.

The U.S. Market is Estimated at US$202.9 Million While China is Forecast to Grow at 6.6% CAGR

The Automotive Flexible Printed Circuit (FPC) market in the U.S. is estimated at US$202.9 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$184.0 Million by the year 2030 trailing a CAGR of 6.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.4% and 5.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.4% CAGR.

Global Automotive Flexible Printed Circuit (FPC) Market - Key Trends & Drivers Summarized

Why Are Flexible Printed Circuits Gaining Strategic Importance in Automotive Electronics Architecture?

Flexible printed circuits (FPCs) are becoming foundational to the evolving architecture of automotive electronics, driven by the industry's pivot toward lightweighting, miniaturization, and high-density interconnects. Compared to traditional wire harnesses and rigid PCBs, FPCs offer superior flexibility, reduced weight, and space-saving integration-key requirements in increasingly compact and electronics-dense vehicle platforms. Their ability to conform to complex geometries enables seamless routing through tight vehicle compartments, including infotainment systems, ADAS modules, interior lighting, and powertrain controls.

The shift toward electric and software-defined vehicles is further accelerating FPC adoption. As EV platforms demand higher circuit complexity and thermal efficiency, FPCs provide the required performance with reduced volume and enhanced reliability. Their resilience to vibration, bending, and high-temperature environments also makes them ideal for mission-critical functions in modern automotive applications, from battery management systems (BMS) to advanced safety controllers.

How Are Material Innovations, HDI Designs, and Process Automation Enhancing FPC Performance?

Advancements in base materials-such as polyimide substrates, low-Dk dielectric films, and thermally conductive adhesives-are elevating the mechanical and electrical performance of automotive FPCs. These materials allow for higher current-carrying capacity, thermal management, and EMI shielding, making FPCs suitable for power-intensive and signal-sensitive automotive systems. Dual-layer and multi-layer FPC designs with high-density interconnects (HDI) are enabling greater circuit complexity without compromising space or form factor.

Process automation in FPC fabrication is improving consistency, throughput, and cost-efficiency. Laser direct imaging (LDI), roll-to-roll manufacturing, and automated optical inspection (AOI) systems are helping manufacturers meet the stringent quality and scalability demands of automotive Tier 1 suppliers. Integration with SMT (surface-mount technology) and modular assembly processes is also streamlining end-use adaptability, especially for high-volume applications like touchscreens, sensors, and digital instrument clusters.

Which Automotive Systems and Platforms Are Accelerating the Use of Flexible Printed Circuits?

Infotainment and HMI (human-machine interface) modules are major adopters of FPCs, where flexible circuits support touchscreens, control buttons, lighting elements, and display connectivity with minimal wiring clutter. Instrument clusters and head-up displays (HUDs) also rely heavily on FPCs to reduce assembly weight and enhance system durability under constant thermal cycling.

Powertrain and safety-critical systems-such as electronic control units (ECUs), ADAS modules, and EV battery packs-are increasingly integrating FPCs to achieve higher design flexibility and reliability. In EVs, FPCs are being used in BMS, thermal monitoring, and interconnect modules within battery enclosures. Additionally, automotive lighting systems, including LED headlights, ambient lighting, and taillights, are deploying FPCs for compact routing and thermal management in confined form factors.

How Are Regional Manufacturing Hubs and Automotive Electrification Trends Impacting FPC Demand?

Asia-Pacific continues to lead FPC production, anchored by China, Japan, South Korea, and Taiwan-regions with robust automotive electronics manufacturing ecosystems. These countries offer the high-volume, high-precision fabrication capabilities required for automotive-grade FPC production. Regional EV mandates, growing domestic EV brands, and a strong base of electronics component suppliers are supporting sustained FPC demand.

Europe is witnessing rising adoption due to its strong focus on automotive electrification, regulatory mandates for lightweighting, and deep-rooted engineering excellence among premium OEMs. North America’s growth is being shaped by EV startups, increased localization of electronics manufacturing, and integration of FPCs into software-defined vehicle architectures. Emerging markets in Latin America and Southeast Asia are adopting FPCs more gradually, influenced by growth in local electronics assembly and rising automotive feature content.

What Role Do OEM-Tier 1 Collaborations, Supply Chain Localization, and Vertical Integration Play in Market Development?

Automakers and Tier 1 suppliers are engaging in early-stage co-development of FPC-based modules to ensure mechanical compatibility, long-term durability, and manufacturing efficiency. These collaborations are optimizing FPC layout, signal routing, and thermal profiles according to specific vehicle architectures. Suppliers are increasingly offering value-added services such as component integration, conformal coating, and thermal simulations to deliver turnkey flexible circuit solutions.

Supply chain localization is becoming a strategic priority to reduce lead times, manage geopolitical risk, and meet regional sourcing mandates. Some FPC manufacturers are establishing regional plants or joint ventures near automotive OEM clusters to support just-in-time delivery and customization. Vertical integration by key players-encompassing substrate production, circuit design, fabrication, and assembly-is also emerging as a competitive advantage to ensure quality control and cost stability across volumes.

What Are the Factors Driving Growth in the Automotive Flexible Printed Circuit Market?

The automotive FPC market is poised for sustained growth as vehicle electrification, automation, and digitalization reshape electronics integration across platforms. FPCs are enabling the next generation of automotive design through compact, lightweight, and high-reliability circuit solutions that align with evolving form factors and system demands.

Key growth drivers include rising electronic content per vehicle, proliferation of EV and ADAS architectures, material and design innovations, and automation-led manufacturing scalability. Demand is further reinforced by regional policy shifts, OEM technology roadmaps, and increasing penetration of digital cockpit systems.

As vehicles evolve into smart, connected, and electrified platforms, will flexible printed circuits become the silent infrastructure powering the intelligence and efficiency of tomorrow’s automotive electronics?

SCOPE OF STUDY:

The report analyzes the Automotive Flexible Printed Circuit (FPC) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product Type (Double-Sided FPC, Multi-Layer FPC, Single-Sided FPC); Application (Fuel Automotive, New Energy Automotive)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 41 Featured) -

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

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