¼¼°èÀÇ ·¯±âµå ÁýÀûȸ·Î(IC) ½ÃÀå
Rugged Integrated Circuits (IC)
»óǰÄÚµå : 1556830
¸®¼­Ä¡»ç : Global Industry Analysts, Inc.
¹ßÇàÀÏ : 2024³â 09¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 180 Pages
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 5,850 £Ü 8,053,000
PDF (Single User License) help
PDF º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â °¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 17,550 £Ü 24,161,000
PDF (Global License to Company and its Fully-owned Subsidiaries) help
PDF º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμâ´Â °¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


Çѱ۸ñÂ÷

¼¼°èÀÇ ·¯±âµå ÁýÀûȸ·Î(IC) ½ÃÀåÀº 2030³â±îÁö 31¾ï ´Þ·¯¿¡ µµ´Þ

2023³â¿¡ 22¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â ¼¼°èÀÇ ·¯±âµå ÁýÀûȸ·Î(IC) ½ÃÀåÀº 2023-2030³â CAGR 4.9%·Î ¼ºÀåÇϸç, 2030³â¿¡´Â 31¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. º» ¸®Æ÷Æ®¿¡¼­ ºÐ¼®ÇÑ ºÎ¹®ÀÇ ÇϳªÀÎ ·¯±âµå ¸ð¹ÙÀÏ ÄÄÇ»ÅÍ ¾ÖÇø®ÄÉÀ̼ÇÀº CAGR 5.6%¸¦ ±â·ÏÇϸç, ºÐ¼® ±â°£ Á¾·á½Ã¿¡´Â 14¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ·¯±âµå ÅÂºí¸´ ¾ÖÇø®ÄÉÀÌ¼Ç ºÐ¾ßÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£ Áß CAGR 4.8%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº ÃßÁ¤ 6¾ï 310¸¸ ´Þ·¯, Áß±¹Àº CAGR 8.1%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ ·¯±âµå ÁýÀûȸ·Î(IC) ½ÃÀåÀº 2023³â¿¡ 6¾ï 310¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ÀÇ °æÁ¦´ë±¹ÀÎ Áß±¹Àº 2023-2030³â CAGRÀ» 8.1%·Î¼­ 2030³â±îÁö 6¾ï 4,320¸¸ ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ±âŸ ÁÖ¸ñÇØ¾ß ÇÒ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖÀ¸¸ç, ºÐ¼® ±â°£ Áß CAGRÀº °¢°¢ 1.8%¿Í 5.0%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR 3.0%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ ·¯±âµå ÁýÀûȸ·Î(IC) ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

·¯±âµå ÁýÀûȸ·Î(IC) : °¡È¤ÇÑ È¯°æ¿¡¼­ Àü¿øÀÇ ½Å·Ú¼º

¶ó±êµå ÁýÀûȸ·Î(IC)´Â °í¿Â, ¹æ»ç¼±, ±â°èÀû ½ºÆ®·¹½º¿Í °°Àº °¡È¤ÇÑ È¯°æ¿¡¼­ ¾ÈÁ¤ÀûÀ¸·Î ÀÛµ¿Çϵµ·Ï ¼³°èµÈ Ư¼ö ¹ÝµµÃ¼ ¼ÒÀÚÀÔ´Ï´Ù. ÀÌ·¯ÇÑ IC´Â Ç×°ø¿ìÁÖ, ±º, ÀÚµ¿Â÷, »ê¾÷ ºÐ¾ß¿Í °°ÀÌ Ç¥ÁØ »ó¿ë µî±Þ ºÎǰÀÌ °íÀ峯 ¼ö ÀÖ´Â ¿ëµµ¿¡ ÇʼöÀûÀÔ´Ï´Ù. ·¯±âµå IC´Â Ç¥ÁØ ICÀÇ ÀϹÝÀûÀÎ ÀÛµ¿ ÆÄ¶ó¹ÌÅ͸¦ ÃʰúÇÏ´Â Á¶°ÇÀ» °ßµô ¼ö ÀÖµµ·Ï ¼³°èµÇ¾î Áß¿äÇÑ ¿ëµµ¿¡¼­ Áö¼ÓÀûÀÎ ±â´É°ú ½Å·Ú¼ºÀ» º¸ÀåÇÕ´Ï´Ù. ¿­¾ÇÇÑ È¯°æ¿¡¼­ ÀÛµ¿ÇÏ´Â ½Ã½ºÅÛÀÇ ¾ÈÀü, ¼º´É ¹× ¼ö¸í¿¡ Áß¿äÇÑ ¿ªÇÒÀ» ÇÏ´Â ·¯±âµå ICÀÇ Á߿伺Àº ¾Æ¹«¸® °­Á¶Çصµ Áö³ªÄ¡Áö ¾Ê½À´Ï´Ù.

·¯±âµå IC ½ÃÀåÀº ¾÷°èÀÇ ¿ä±¸¿¡ µû¶ó ¾î¶»°Ô ÁøÈ­Çϰí Àִ°¡?

·¯±âµå IC ½ÃÀåÀº °í½Å·Ú¼º ÀüÀÚ ºÎǰ¿¡ ´ëÇÑ »ê¾÷°èÀÇ ¿ä±¸°¡ Áõ°¡ÇÔ¿¡ µû¶ó ÁøÈ­Çϰí ÀÖ½À´Ï´Ù. ½ÃÀåÀÇ ÁÖ¿ä µ¿Çâ Áß Çϳª´Â Ç×°ø¿ìÁÖ ¹× ¹æÀ§ »ê¾÷°ú °°Àº ºÐ¾ßÀÇ ¿ä±¸¿¡ ÈûÀÔ¾î ´õ ³ôÀº ¿Âµµ¿¡¼­ ÀÛµ¿ÇÏ°í ´õ Å« ±â°èÀû ½ºÆ®·¹½º¸¦ °ßµô ¼ö ÀÖ´Â ICÀÇ °³¹ßÀÔ´Ï´Ù. ¾÷°è¿¡¼­´Â ¼º´É ÀúÇÏ ¾øÀÌ ÄÄÆÑÆ®ÇÑ ½Ã½ºÅÛ¿¡ ÅëÇÕÇÒ ¼ö ÀÖ´Â ´õ ÀÛ°í °¡º­¿î ºÎǰ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó ·¯±âµå ICÀÇ ¼ÒÇüÈ­µµ Áß¿äÇÑ Ãß¼¼·Î ÀÚ¸® Àâ¾Ò½À´Ï´Ù. ¶ÇÇÑ ÀÚÀ²ÁÖÇà ÀÚµ¿Â÷ÀÇ ºÎ»ó°ú »ê¾÷ ȯ°æ¿¡¼­ÀÇ »ç¹°ÀÎÅͳÝ(IoT) È®´ë·Î ÀÎÇØ Áøµ¿, ¸ÕÁö, ÀüÀڱ⠰£¼·ÀÌ ¸¹Àº ȯ°æ¿¡¼­µµ ¾ÈÁ¤ÀûÀ¸·Î ÀÛµ¿ÇÒ ¼ö ÀÖ´Â ·¯±âµå IC¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÷´Ü ¼ÒÀç¿Í ÄÚÆÃÀÇ ÅëÇÕµµ ½ÃÀå¿¡ ¿µÇâÀ» ¹ÌÄ¡°í ÀÖÀ¸¸ç, ÀÌ·¯ÇÑ ±â¼ú Çõ½ÅÀº ·¯±âµå ICÀÇ ³»±¸¼º°ú ¼º´ÉÀ» Çâ»ó½Ã۰í ÀÖ½À´Ï´Ù.

·¯±âµå IC ½ÃÀåÀÌ Á÷¸éÇÑ °úÁ¦´Â?

·¯±âµå IC ½ÃÀåÀº ƯÈ÷ ³»±¸¼º°ú ½Å·Ú¼º¿¡ ´ëÇÑ ¿ä±¸°¡ ³ô¾ÆÁü¿¡ µû¶ó ¸î °¡Áö µµÀü °úÁ¦¿¡ Á÷¸éÇØ ÀÖ½À´Ï´Ù. ÁÖ¿ä °úÁ¦ Áß Çϳª´Â ·¯±âµå ICÀÇ ³ôÀº °³¹ß ¹× Á¦Á¶ ºñ¿ëÀ¸·Î, Áß¼Ò±â¾÷°ú ºñ¿ëÀÌ Áß¿äÇÑ ¿ä¼ÒÀÎ ¿ëµµ¿¡ À庮ÀÌ µÉ ¼ö ÀÖ½À´Ï´Ù. ·¯±âµå IC°¡ ¿ä±¸µÇ´Â ¼º´É ¹× ½Å·Ú¼º ±âÁØÀ» ÃæÁ·ÇÏ´ÂÁö È®ÀÎÇϱâ À§ÇØ ±¤¹üÀ§ÇÑ Å×½ºÆ®¿Í °ËÁõÀÌ ÇÊ¿äÇѵ¥, ÀÌ °úÁ¤¿¡´Â ¸¹Àº ½Ã°£°ú ºñ¿ëÀÌ ¼Ò¿äµÇ¹Ç·Î ¶Ç ´Ù¸¥ µµÀü°úÁ¦°¡ µÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ Ç×°ø¿ìÁÖ, ¹æÀ§, ÀÚµ¿Â÷ µîÀÇ »ê¾÷¿¡¼­ ±â¼ú º¯È­ÀÇ ¼Óµµ°¡ »¡¶óÁü¿¡ µû¶ó ·¯±âµå ICÀÇ ¼³°è ¹× Àç·á¿¡ ´ëÇÑ Áö¼ÓÀûÀÎ Çõ½ÅÀÌ ÇÊ¿äÇϸç, ÀÌ´Â Á¦Á¶ÀÇ º¹À⼺°ú ºñ¿ëÀ» Áõ°¡½Ãŵ´Ï´Ù. ƯÈ÷ ¹ÝµµÃ¼ »ê¾÷ÀÇ ¼¼°è °ø±Þ¸Á È¥¶õÀº ·¯±âµå IC¿¡ ÇÊ¿äÇÑ ÇÙ½É ºÎǰÀÇ °¡¿ë¼º°ú ºñ¿ë¿¡ ¿µÇâÀ» ¹ÌÃÄ ÀÌ·¯ÇÑ ¹®Á¦¸¦ ´õ¿í ¾ÇÈ­½Ã۰í ÀÖ½À´Ï´Ù.

·¯±âµå IC ½ÃÀåÀÇ ¼ºÀå ¿øµ¿·ÂÀº?

·¯±âµå ÁýÀûȸ·Î(IC) ½ÃÀåÀÇ ¼ºÀåÀº ¿©·¯ °¡Áö ¿äÀο¡ ÀÇÇØ ÁÖµµµÇ°í ÀÖ½À´Ï´Ù. ƯÈ÷ Ç×°ø¿ìÁÖ, ¹æÀ§, ÀÚµ¿Â÷, »ê¾÷ ÀÚµ¿È­ µîÀÇ »ê¾÷¿¡¼­ ¿­¾ÇÇÑ È¯°æ¿¡¼­µµ ½Å·ÚÇÒ ¼ö ÀÖ´Â ÀüÀÚ ºÎǰ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ´Â °ÍÀÌ °¡Àå Å« ¿øµ¿·ÂÀÌ µÇ°í ÀÖ½À´Ï´Ù. ¿­¾ÇÇÑ È¯°æ¿¡¼­ÀÇ ÀÚÀ²ÁÖÇàÂ÷ ¹× IoT ¿ëµµÀÇ È®´ë´Â ¿­¾ÇÇÑ È¯°æ¿¡¼­µµ ¾ÈÁ¤ÀûÀ¸·Î ÀÛµ¿ÇÏ´Â ·¯±âµå IC¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ Áß¿äÇÑ ¿ëµµ¿¡¼­ ÀüÀÚ ½Ã½ºÅÛÀÇ ³»±¸¼º°ú ¼º´ÉÀ» °­È­Çϱâ À§ÇÑ Áö¼ÓÀûÀÎ ³ë·ÂÀº ·¯±âµå ICÀÇ Çõ½Å°ú äÅÃÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ƯÈ÷ ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¹ÝµµÃ¼ »ê¾÷ ¹ßÀüÀº Á¦Á¶¾÷üµéÀÌ È¤µ¶ÇÑ È¯°æ¿¡ °ßµô ¼ö Àִ ÷´Ü ºÎǰÀ» °³¹ßÇÏ·Á´Â ³ë·ÂÀ¸·Î ·¯±âµå IC¿¡ ´ëÇÑ ¼ö¿ä¸¦ ´õ¿í Áõ°¡½Ã۰í ÀÖ½À´Ï´Ù.

Á¶»ç ´ë»ó ±â¾÷ÀÇ ¿¹(ÁÖ¸ñ 36»ç)

¸ñÂ÷

Á¦1Àå Á¶»ç ¹æ¹ý

Á¦2Àå °³¿ä

Á¦3Àå ½ÃÀå ºÐ¼®

Á¦4Àå °æÀï

KSA
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

Global Rugged Integrated Circuits (IC) Market to Reach US$3.1 Billion by 2030

The global market for Rugged Integrated Circuits (IC) estimated at US$2.2 Billion in the year 2023, is expected to reach US$3.1 Billion by 2030, growing at a CAGR of 4.9% over the analysis period 2023-2030. Rugged Mobile Computers Application, one of the segments analyzed in the report, is expected to record a 5.6% CAGR and reach US$1.4 Billion by the end of the analysis period. Growth in the Rugged Tablets Application segment is estimated at 4.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$603.1 Million While China is Forecast to Grow at 8.1% CAGR

The Rugged Integrated Circuits (IC) market in the U.S. is estimated at US$603.1 Million in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$643.2 Million by the year 2030 trailing a CAGR of 8.1% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.8% and 5.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 3.0% CAGR.

Global Rugged Integrated Circuits (IC) Market - Key Trends and Drivers Summarized

Rugged Integrated Circuits (IC): Powering Reliability in Harsh Environments

Rugged Integrated Circuits (ICs) are specialized semiconductor devices designed to operate reliably in extreme and harsh environments, such as high temperatures, radiation, and mechanical stress. These ICs are essential in applications where standard commercial-grade components would fail, such as aerospace, military, automotive, and industrial sectors. Rugged ICs are engineered to withstand conditions that exceed the typical operating parameters of standard ICs, ensuring continuous functionality and reliability in critical applications. The importance of rugged ICs cannot be overstated, as they play a crucial role in the safety, performance, and longevity of systems that operate in challenging environments.

How Is the Rugged IC Market Evolving with Industry Demands?

The rugged IC market is evolving in response to the increasing demands of industries that require highly reliable electronic components. One of the key trends in the market is the development of ICs that can operate at higher temperatures and withstand greater mechanical stress, driven by the needs of sectors such as aerospace and defense. The miniaturization of rugged ICs is another significant trend, as industries demand smaller, lighter components that can be integrated into compact systems without sacrificing performance. Additionally, the rise of autonomous vehicles and the expansion of the Internet of Things (IoT) in industrial settings are driving demand for rugged ICs that can operate reliably in environments with high levels of vibration, dust, and electromagnetic interference. The integration of advanced materials and coatings is also influencing the market, as these innovations enhance the durability and performance of rugged ICs.

What Challenges Does the Rugged IC Market Face?

The rugged IC market faces several challenges, particularly as the requirements for durability and reliability become more stringent. One of the primary challenges is the high cost of developing and manufacturing rugged ICs, which can be a barrier for smaller companies or for applications where cost is a critical factor. The need for extensive testing and validation to ensure that rugged ICs meet the required standards of performance and reliability is another challenge, as this process can be time-consuming and expensive. Additionally, the rapid pace of technological change in industries such as aerospace, defense, and automotive requires continuous innovation in rugged IC design and materials, adding to the complexity and cost of production. The global supply chain disruptions, particularly in the semiconductor industry, further exacerbate these challenges by impacting the availability and cost of critical components needed for rugged ICs.

What Is Driving Growth in the Rugged IC Market?

The growth in the Rugged Integrated Circuits (IC) market is driven by several factors. The increasing demand for reliable electronic components in extreme environments is a major driver, particularly in industries such as aerospace, defense, automotive, and industrial automation. The expansion of autonomous vehicles and IoT applications in harsh environments is also fueling demand for rugged ICs that can operate reliably under challenging conditions. Additionally, the ongoing efforts to enhance the durability and performance of electronic systems in critical applications are driving innovation and adoption of rugged ICs. The growth of the semiconductor industry, particularly in emerging markets, is further contributing to the demand for rugged ICs as manufacturers seek to develop advanced components that can withstand the rigors of harsh environments.

Select Competitors (Total 36 Featured) -

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â