한글목차

클라우드 EDA 세계 시장은 2030년까지 137억 달러에 이를 전망

2023년에 92억 달러로 추정되는 클라우드 EDA 세계 시장은 분석 기간인 2023-2030년에 CAGR 5.9%로 성장하여 2030년에는 137억 달러에 이를 것으로 예측됩니다. 본 보고서에서 분석한 부문 중 하나인 반도체 지적재산(SIP)은 CAGR 6.4%를 나타내고, 분석 기간 종료시에는 51억 달러에 이를 것으로 예측됩니다. 컴퓨터 지원 엔지니어링(CAE) 분야의 성장률은 분석 기간을 통해서 CAGR 6.9%로 추정됩니다.

미국 시장은 23억 달러, 중국은 CAGR 7.0%로 성장 예측

미국의 클라우드 EDA 시장은 2023년에 23억 달러로 추정됩니다. 세계 2위 경제대국인 중국은 2030년까지 19억 달러 규모에 이를 것으로 예측되며, 분석 기간인 2023-2030년간 CAGR은 7.0%입니다. 기타 주목해야 할 지역별 시장으로서는 일본과 캐나다가 있으며, 분석 기간중 CAGR은 각각 4.8%와 5.4%를 나타낼 것으로 예측됩니다. 유럽에서는 독일이 CAGR 5.1%를 나타낼 전망입니다.

세계 클라우드 EDA 시장 - 주요 동향 및 촉진요인 정리

클라우드 EDA란 무엇이며, 어떻게 설계 환경을 변화시키고 있는가?

전자 설계 자동화(EDA) 툴은 복잡한 전자 시스템 및 집적 회로의 설계 및 제조에 필수적입니다. 기존에는 EDA 툴이 로컬 서버나 시스템에 저장되어 있었으나, 클라우드로의 전환이 진행되면서 유연성, 확장성, 협업 기능 등 기존에는 불가능했던 기능들이 제공되고 있습니다. 클라우드 EDA는 여러 사용자가 서로 다른 위치에서 동일한 프로젝트에 동시에 접속하여 작업할 수 있기 때문에 생산성을 향상시키고 새로운 전자제품 시장 출시 시간을 단축할 수 있습니다. 또한, 클라우드 환경에서는 고가의 하드웨어와 전담 IT 유지보수 팀이 필요하지 않기 때문에 자본 지출을 크게 줄일 수 있으며, 비용 구조를 설비투자 모델에서 보다 관리하기 쉬운 OEX 모델로 전환할 수 있습니다.

기술의 발전이 클라우드 EDA를 어떻게 강화하는가?

클라우드 컴퓨팅 기술의 발전은 클라우드 EDA 분야에 큰 도움이 되고 있습니다. 클라우드 서비스에서 사용할 수 있는 고성능 컴퓨팅(HPC) 기능은 EDA의 기본인 복잡한 설계 및 시뮬레이션 작업을 더 빠르게 처리할 수 있게 해줍니다. 이는 스마트폰, IoT 기기 등 기능성과 신뢰성을 보장하기 위해 대규모 시뮬레이션이 필요한 전자기기가 점점 더 복잡해지고 있다는 점을 감안할 때 특히 중요합니다. 또한, 클라우드 보안 프로토콜의 발전으로 과거 클라우드 EDA 솔루션 도입의 큰 장벽으로 여겨졌던 데이터 기밀성 및 보안에 대한 우려가 상당 부분 해소되었습니다. 더 강력한 암호화 방법과 개선된 데이터 처리 절차로 인해 기업은 지적 재산을 훼손하지 않고도 클라우드 EDA 툴을 활용할 수 있게 되었습니다.

현대 전자제품 개발에서 클라우드 EDA의 역할은 무엇인가?

클라우드 EDA는 단순한 운영 도구가 아니라 빠르게 진화하는 전자 산업에서 전략적 자산입니다. 디바이스의 고집적화, 다기능화에 따라 회로의 복잡성은 기하급수적으로 증가하고 있습니다. 클라우드 EDA는 이러한 복잡성을 효과적으로 관리하기 위해 필요한 컴퓨팅 성능과 유연성을 제공합니다. 스타트업과 소규모 기업의 경우, 클라우드 EDA는 초기 비용이 저렴하기 때문에 소규모 팀도 기존 EDA 툴과 같은 경제적 부담 없이 야심찬 전자 프로젝트를 진행할 수 있습니다. 대기업의 경우, 클라우드 리소스의 확장성을 통해 프로젝트 요구사항에 따라 컴퓨팅 리소스를 동적으로 할당할 수 있어 비용과 개발 일정을 모두 최적화할 수 있습니다. 또한, 클라우드 EDA는 전 세계 팀 간의 실시간 협업을 지원합니다. 이는 여러 해외 거점에서 개발이 이루어지는 세계화 시장에서 필수적인 기능입니다.

클라우드 EDA 시장의 성장 동력은?

클라우드 EDA 시장의 성장은 전자제품 설계의 복잡성 증가, 전 세계 전자제품 시장의 확대, 기술 분야 전반의 클라우드 기반 솔루션으로의 전환 등 여러 가지 요인에 기인합니다. 특히 가전, 자동차, 항공우주 등 기술 혁신에 대한 압박이 높고 지속적인 혁신이 요구되는 산업에서 보다 효율적이고 비용 효율적이며 빠른 설계 주기에 대한 요구는 특히 중요합니다. 또한, 개인화된 고성능 전자제품에 대한 소비자 행동의 변화는 더욱 정교한 설계와 테스트를 필요로 하며, 클라우드 EDA 툴은 이를 효과적으로 촉진할 수 있습니다. 또한, 광대역 보급과 네트워크 보안 강화로 대표되는 세계 기술 인프라의 성숙도가 높아짐에 따라 클라우드 EDA 솔루션으로 전환하는 기업도 늘어날 것입니다. 이러한 추세는 클라우드 컴퓨팅과 전자 설계의 지속적인 기술 발전과 함께 클라우드 EDA 산업의 강력한 성장 궤도를 예측했습니다.

조사 대상 기업 예(총 36건)

• Autodesk, Inc.
• Cadence Design Systems, Inc.
• ANSYS, Inc.
• Arm Ltd.
• Aspen Technology, Inc.
• Aldec, Inc.
• Altair Engineering, Inc.
• Bentley Systems, Inc.
• CAST, Inc.
• Achronix Semiconductor Corporation
• Altium Limited
• Agnisys Inc.
• ALTEM Technologies
• 4.ST Belgium
• Ceetron AS

목차

제1장 조사 방법

제2장 주요 요약

• 시장 개요
• 주요 기업
• 시장 동향과 촉진요인
• 세계 시장 전망

제3장 시장 분석

• 미국
• 캐나다
• 일본
• 중국
• 유럽
• 프랑스
• 독일
• 이탈리아
• 영국
• 기타 유럽
• 아시아태평양
• 세계 기타 지역

제4장 경쟁

영문목차

Global Cloud EDA Market to Reach US$13.7 Billion by 2030

The global market for Cloud EDA estimated at US$9.2 Billion in the year 2023, is expected to reach US$13.7 Billion by 2030, growing at a CAGR of 5.9% over the analysis period 2023-2030. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is expected to record a 6.4% CAGR and reach US$5.1 Billion by the end of the analysis period. Growth in the Computer Aided Engineering (CAE) segment is estimated at 6.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.3 Billion While China is Forecast to Grow at 7.0% CAGR

The Cloud EDA market in the U.S. is estimated at US$2.3 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$1.9 Billion by the year 2030 trailing a CAGR of 7.0% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 4.8% and 5.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.1% CAGR.

Global Cloud EDA Market - Key Trends & Drivers Summarized

What Is Cloud EDA, and How Is It Transforming the Design Landscape?

Electronic Design Automation (EDA) tools are critical for the design and production of complex electronic systems and integrated circuits. Traditionally housed on local servers and systems, EDA tools are increasingly being migrated to the cloud, providing flexibility, scalability, and collaborative capabilities that were previously unattainable. Cloud EDA enables multiple users to access and work on the same project simultaneously from different locations, enhancing productivity and reducing the time to market for new electronic products. Moreover, the cloud environment can significantly cut down capital expenditure as it eliminates the need for expensive hardware and dedicated IT maintenance teams, shifting the cost structure from a capex model to a more manageable opex model.

How Are Technological Advancements Enhancing Cloud EDA?

The advancement of cloud computing technologies has been a boon for the Cloud EDA sector. High-performance computing (HPC) capabilities available via cloud services allow for faster processing of complex design and simulation tasks that are fundamental to EDA. This is particularly important given the growing complexity of electronic devices, such as smartphones and IoT devices, which require extensive simulation to ensure functionality and reliability. Furthermore, advancements in security protocols in the cloud have alleviated many of the concerns related to data sensitivity and security, which were once seen as major barriers to the adoption of cloud EDA solutions. With stronger encryption methods and improved data handling procedures, firms can now take advantage of cloud EDA tools without compromising their intellectual property.

What Role Does Cloud EDA Play in Modern Electronics Development?

Cloud EDA is not just an operational tool; it is a strategic asset in the rapidly evolving electronics industry. As devices become more integrated and feature-rich, the underlying complexity of circuits grows exponentially. Cloud EDA provides the necessary computational power and flexibility to manage this complexity effectively. For startups and smaller firms, the lower upfront costs associated with cloud EDA mean that smaller teams can undertake ambitious electronics projects without the financial burden of traditional EDA tools. For larger enterprises, the scalability of cloud resources allows for the dynamic allocation of computing resources to match project demands, optimizing both costs and development timelines. Additionally, cloud EDA supports real-time collaboration across global teams, an indispensable feature in a globalized market where development often occurs across multiple international sites.

What Drives the Growth in the Cloud EDA Market?

The growth in the Cloud EDA market is driven by several factors, including the increasing complexity of electronic device design, the global expansion of the electronics market, and the overall shift towards cloud-based solutions across the technology sector. The need for more efficient, cost-effective, and faster design cycles is particularly critical in industries like consumer electronics, automotive, and aerospace, where the pressure to innovate is high and continuous. Additionally, the shift in consumer behavior towards personalized and high-performance electronic devices requires more sophisticated design and testing, which cloud EDA tools facilitate effectively. Moreover, as the technology infrastructure globally continues to mature—exemplified by wider broadband availability and stronger network security—more firms are likely to transition to cloud EDA solutions. These trends, coupled with ongoing technological advancements in both cloud computing and electronic design, forecast a robust growth trajectory for the Cloud EDA industry.

Select Competitors (Total 36 Featured) -

• Autodesk, Inc.
• Cadence Design Systems, Inc.
• ANSYS, Inc.
• Arm Ltd.
• Aspen Technology, Inc.
• Aldec, Inc.
• Altair Engineering, Inc.
• Bentley Systems, Inc.
• CAST, Inc.
• Achronix Semiconductor Corporation
• Altium Limited
• Agnisys Inc.
• ALTEM Technologies
• 4.ST Belgium
• Ceetron AS

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Cloud EDA - Global Key Competitors Percentage Market Share in 2024 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
  • Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
  • Global Economic Outlook
  • Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
  • Companies Move EDA Into the Cloud. Here's Why
  • Recent Market Activity
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
  • EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
  • IP Cores per SoC
  • The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
  • Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
  • Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
  • Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
  • EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
  • Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
  • Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
  • With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
  • Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
  • Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
  • Healthy Demand for PCBs Bodes Well for Market Growth
  • Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
  • Challenges to Cloud EDA & How They Can be Overcome
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
  • TABLE 3: World Recent Past, Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 7: World Recent Past, Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 9: World Recent Past, Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 13: World Recent Past, Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 15: World Recent Past, Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • TABLE 21: World Cloud EDA Market Analysis of Annual Sales in US$ Million for Years 2020 through 2030

III. MARKET ANALYSIS

• UNITED STATES
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
  • TABLE 22: USA Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 23: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 24: USA Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 25: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• CANADA
  • TABLE 26: Canada Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 27: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 28: Canada Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 29: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• JAPAN
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
  • TABLE 30: Japan Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 31: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 32: Japan Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 33: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• CHINA
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
  • TABLE 34: China Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 35: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 36: China Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 37: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• EUROPE
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
  • TABLE 38: Europe Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
  • TABLE 39: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
  • TABLE 40: Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 41: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 42: Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 43: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• FRANCE
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
  • TABLE 44: France Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 45: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 46: France Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 47: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• GERMANY
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
  • TABLE 48: Germany Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 49: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 50: Germany Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 51: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• ITALY
  • TABLE 52: Italy Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 53: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 54: Italy Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 55: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• UNITED KINGDOM
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
  • TABLE 56: UK Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 57: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 58: UK Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 59: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• REST OF EUROPE
  • TABLE 60: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 61: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 62: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 63: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• ASIA-PACIFIC
  • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
  • TABLE 64: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 65: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 66: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 67: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
• REST OF WORLD
  • TABLE 68: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 69: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
  • TABLE 70: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
  • TABLE 71: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030

IV. COMPETITION