개요
세계의 이종 집적 시장은 2023년에 9억 달러에 달하며, 2031년에는 102억 달러에 달할 것으로 예측되며, 예측 기간인 2024-2031년 CAGR은 35.7%로 성장합니다.
데이터센터, 과학 연구, 시뮬레이션 등의 분야에서 고성능 컴퓨팅 솔루션에 대한 수요가 증가하면서 이종 집적에 대한 수요가 증가하고 있으며, CPU, GPU, 메모리 컴포넌트를 결합한 통합 솔루션은 에너지 효율, 성능, 확장성이 요구되는 컴퓨팅 워크로드를 위한 효율성, 뛰어난 성능, 확장성을 요구하는 컴퓨팅 워크로드에 대한 요구사항을 충족시켜줍니다. 무어의 법칙 스케일링, 3D 집적, 첨단 포장 기술, 신소재 등 반도체 기술의 발전은 이종 통합의 혁신을 가속화하고 있습니다. 반도체 제조업체와 파운드리 업체들은 첨단 공정, 포장 솔루션, 통합 방법을 개발하기 위해 연구개발에 투자하여 시장 성장을 가속하고 있습니다.
이종 집적에 대한 소비자 수요 증가는 예측 기간 중 시장 성장을 가속할 것입니다. 예를 들어 2023년 7월 13일 Camtek Ltd.는 Tier-1 제조업체로부터 이종 집적, HBM 및 팬아웃 용도을 위한 42개의 시스템을 수주했습니다. 대부분의 주문은 고대역폭 메모리(HBM) 및 이종 집적용 칩셋 모듈을 제조하는 것입니다. 칩셋 모듈은 컴퓨팅 파워를 향상시키는 중요한 컴포넌트입니다.
북미는 이종산업간 통합을 위한 다양한 산업의 R&D 지출 증가로 인해 시장을 주도하고 있는 지역입니다. 전자, 항공우주, IT, 제조, 헬스케어 등 다양한 기술 산업의 R&D 지출이 북미에 집중되어 있습니다. R&D 프로젝트는 이종 집적도를 위한 집적 능력 향상과 포장 방법 개발에 집중되어 있습니다.
역학
반도체 기술의 급속한 발전
반도체의 기술 발전으로 집적도가 높아지면서 더 많은 부품을 더 작은 공간에 더 많이 집적할 수 있게 되었습니다. 이는 서로 다른 유형의 컴포넌트를 단일 패키지 또는 시스템에 통합해야 하는 이종 통합에 특히 중요합니다. 통합 밀도가 높아지면 통합 솔루션의 전반적인 성능, 기능 및 효율성이 향상됩니다. 반도체의 발전은 부품의 소형화에 기여하여 소형 디바이스의 제조를 가능하게 합니다. 이는 모바일 기기나 차량용 전자기기와 같이 휴대가 가능하고 공간 효율적인 솔루션이 필요한 용도에 도움이 됩니다. 이종 집적은 이러한 소형화 추세를 활용하여 작지만 강력한 통합 시스템을 구현할 수 있습니다.
주요 제조업체들의 신제품 출시가 활발해지고 있는 것도 예측 기간 중 시장 성장을 가속하는 요인입니다. 예를 들어 2023년 5월 16일 iDEAL Semiconductor는 SuperQ Technology를 시장에 출시했습니다. 이 제품은 태양광 패널, 데이터센터, 전기자동차, 모터 드라이브 등 다양한 용도의 전력 손실을 줄이는 데 도움이 될 수 있습니다. 높은 효율은 탄소발자국을 줄이는 데 도움이 됩니다.
확대되는 스마트 제조와 인더스트리 4.0을 위한 노력
스마트 제조 및 인더스트리 4.0 프로젝트에 힘입어 통합형 산업용 IoT 솔루션의 채택이 확대되고 있습니다. 이러한 솔루션을 실현하려면 센서, 액추에이터, 컨트롤러, 통신 모듈 및 데이터 처리 장비를 일관된 시스템으로 통합해야 합니다. 이종 통합을 통해 컴포넌트의 원활한 통합, 예지보전, 산업 공정 최적화를 실현할 수 있습니다.
인더스트리 4.0은 전체 생산 공정의 데이터 통합에 중점을 두고 있습니다. 분석 중심의 의사결정과 다양한 시스템의 통합은 이종 통합을 통해 쉽게 이루어질 수 있습니다. 통합 시스템은 여러 소스에서 데이터를 수집하고 이를 기반으로 행동할 수 있으며, 스마트 팩토리의 효율성과 생산성을 향상시킬 수 있습니다. 반도체산업협회의 데이터에 따르면 2025년까지 전 세계에서 750억개 이상의 IoT 기기가 설치될 것으로 예상됩니다. 세계 IoT 반도체 부품 시장은 2025년까지 연평균 19% 성장하여 800억 달러에 달할 것으로 예상됩니다.
통합의 복잡성
다양한 기술, 폼팩터, 기능을 가진 다양한 컴포넌트를 통합하는 복잡성은 종종 개발 비용 상승으로 이어집니다. 이종 집적 솔루션에 투자하는 기업은 전용 설계 툴, 통합 기술 전문 지식, 프로토타이핑, 테스트, 검증 및 설계 반복과 관련된 비용이 발생할 수 있습니다. 높은 개발 비용으로 인해, 특히 R&D 예산이 한정된 기업이나 비용에 민감한 용도의 경우, 이종 집적을 채택하는 것을 주저할 수 있습니다.
이종 집적의 복잡한 특성으로 인해 통합 솔루션의 개발 주기와 시장 출시 시간이 길어질 수 있습니다. 복잡한 통합 시스템의 설계, 테스트, 최적화 및 검증을 위해서는 치밀한 계획, 부서 간 협력 및 설계 반복이 필요합니다. 개발 일정이 지연되면 시장 경쟁력에 영향을 미치고, 기회를 놓치고, 빠르게 진화하는 산업에서 이종 집적 솔루션의 채택이 지연될 수 있습니다.
인터페이스, 프로토콜, 작동 전압, 온도 프로파일이 서로 다른 컴포넌트를 통합하는 것은 기술적인 문제를 야기합니다. 통합된 부품의 호환성, 신호 무결성, 전원 공급, 열 관리 및 신뢰성을 보장하기 위해서는 철저한 엔지니어링 전문 지식과 혁신적인 솔루션이 필요합니다. 통합 문제를 극복하는 것은 개발 프로세스를 복잡하게 만들고, 맞춤형 또는 우회적인 방법을 필요로 할 수 있으며, 개발 시간과 비용을 더욱 증가시킬 수 있습니다.
Overview
Global Heterogeneous Integration Market reached US$ 0.9 Billion in 2023 and is expected to reach US$ 10.2 Billion by 2031, growing with a CAGR of 35.7% during the forecast period 2024-2031.
The growing need for high-performance computing solutions in applications such as data centers, scientific research and simulation drives the demand for heterogeneous integration. Integrated solutions combining CPUs, GPUs and memory components offer energy efficiency, superior performance and scalability for demanding computing workloads. Growing advancements in semiconductor technologies, including Moore's Law scaling, 3D integration, advanced packaging techniques and new materials, fuel innovation in heterogeneous integration. Semiconductor manufacturers and foundries invest in R&D to develop advanced processes, packaging solutions and integration methodologies, driving market growth.
Growing consumer demand for heterogeneous integration helps to boost market growth over the forecast period. For instance, on July 13, 2023, Camtek Ltd, received an order of 42 Systems from Tier-1 Manufacturers for Heterogeneous Integration, HBM and Fan-out Applications. Most of the orders are for High Bandwidth Memory (HBM) and the manufacture of chipset modules for heterogeneous integration. The chipset module is an important component in enhancing computing power.
North America is a dominating region in the market due to the growing research and development expenditure by various industries of heterogeneous integration. Research and development expenditures across a wide range of technological industries such as electronics, aerospace, IT, manufacturing and healthcare are heavily attracted to North America. Research and development projects concentrate on improving integration capabilities and developing packaging methods for heterogeneous integration.
Dynamics
Rapid Advancements in Semiconductor Technologies
Technological Advancements in semiconductors allow for higher integration densities and enable more Component to be integrated into smaller spaces. The is particularly important for heterogeneous integration, where different types of Component need to be integrated into a single package or system. Higher integration densities improve the overall performance, functionality and efficiency of integrated solutions. Semiconductor advancements contribute to the miniaturization of Component, making it possible to create compact devices. The is beneficial for applications that require portable and space-efficient solutions like mobile devices and automotive electronics. Heterogeneous integration leverages these miniaturization trends to create smaller yet powerful integrated systems.
Growing major key player's initiatives in the new product launches helps to boost market growth over the forecast period. For instance, on May 16, 2023, iDEAL Semiconductor launched SuperQ Technology in the market. It helps to reduce power loss in various applications such as solar panels, data centers, electric vehicles and motor drives. Its elevated efficiency helps to reduce carbon footprint.
Growing Smart Manufacturing and Industry 4.0 Initiatives
The growing adoption of integrated industrial IoT solutions is boosted by smart manufacturing and Industry 4.0 projects. Sensors, actuators, controllers, communication modules and data processing units must frequently be integrated into a coherent system to implement these solutions. Heterogeneous integration makes it possible for Component to be seamlessly integrated, predictive maintenance and process optimization in industry.
Industry 4.0 places a strong emphasis on data integration throughout the production process. Analytics-driven decision-making and the integration of diverse systems are made easier by heterogeneous integration. Integrated systems can gather and act upon data from multiple sources, leading to improved efficiency and productivity in smart factories. According to the Semiconductor Industry Association data, by 2025, over 75 billion installed IoT devices globally. The global IoT semiconductor component market is slated to grow at a CAGR of 19% to US$80 billion in 2025.
Complexity of Integration
The complexity of integrating diverse Component with varying technologies, form factors and functionalities often leads to higher development costs. Companies investing in heterogeneous integration solutions may incur expenses related to specialized design tools, expertise in integration techniques, prototyping, testing, validation and iteration of designs. The higher development costs can deter some companies from adopting heterogeneous integration, particularly those with limited R&D budgets or cost-sensitive applications.
The intricate nature of heterogeneous integration can result in longer development cycles and time-to-market for integrated solutions. Designing, testing, optimizing and validating complex integrated systems require meticulous planning, collaboration among cross-functional teams and iterative design iterations. Delays in development timelines can impact market competitiveness, missed opportunities and slower adoption of heterogeneous integration solutions in rapidly evolving industries.
Integrating Component with different interfaces, protocols, operating voltages and thermal profiles presents technical challenges. Ensuring compatibility, signal integrity, power delivery, thermal management and reliability across integrated Component requires thorough engineering expertise and innovative solutions. Overcoming integration challenges adds complexity to the development process and may require customizations or workarounds, further contributing to development time and costs.
The global heterogeneous integration market is segmented based on component, design, end-user and region.
Advanced Manufacturing & Multi-Chip Integration Component is Dominating in the Market
Based on the component, the heterogeneous integration market is segmented into advanced manufacturing & multi chip integration, integrated photonics, integrated power electronics, mems and sensor integration, 5g and rf and analog mixed signal.
Modern manufacturing methods enable electrical components to be made smaller while maintaining their functionality. By combining several chips or components into a single package, multichip integration (MCI) approaches can reduce package size and increase efficiency. The complexity of electronic devices is making it increasingly necessary to integrate many functionalities into constrained spaces. Processors, memory, sensors and other components combined more easily because of advanced manufacturing and MCI, resulting in highly integrated systems with better functionality and performance.
Improved heat management in electronic systems is supported by MCI techniques and advanced production procedures. The technologies help address thermal issues in high-performance electronics by incorporating cooling solutions, heat dissipation structures and thermal interfaces right into the package. Long-term cost savings can result from advanced manufacturing and MCI techniques, despite the initial infrastructure and R&D costs. Through component reduction, assembly process simplification and increased dependability, these technologies help lower the total cost of electronic systems.
North America is Dominating the Heterogeneous Integration Market
Having a high concentration of top semiconductor businesses, producers of electronic Component, academic institutions and technical inventors, North America has a strong technological ecosystem. The creation of cutting-edge heterogeneous integration solutions is encouraged by this environment, along with innovation and collaboration. The region is home of some of the largest semiconductor manufacturers. The creation of heterogeneous integration solutions depends on the semiconductor integration techniques and technologies that these companies invented.
Growing Government funding for heterogeneous integration helps to boost regional market growth over the forecast period. For instance, on May 17, 2022, UCLA and SEMI announced that they won a US$ 300,000 grant from U.S. Department of Commerce's National Institute of Standards and Technology for the production of a roadmap for advanced packaging technologies.
The major global players in the market include ASE TECHNOLOGY HOLDING, Intel, Etron Technology, EV Group, Taiwan Semiconductor Manufacturing Company Limited, Applied Materials, Inc., Semi, Micross, Skywater Technology and Silicon Austria Labs GmbH.
As global shortage of raw materials, the pandemic caused disruptions in globally supply chains. The complex supply chain of electronic Component and materials is necessary for heterogeneous integration. Many manufacturing facilities and production lines were temporarily shut down or operated at reduced capacity due to restrictions, lockdowns and safety protocols. The led to production slowdowns and challenges in meeting demand for heterogeneous integration solutions, impacting market growth and delivery schedules.
The pandemic-induced changes in consumer behavior, remote working trends, digitalization initiatives and healthcare requirements influenced the demand for heterogeneous integration solutions. Increased demand for telecommunication equipment, data centers, IoT devices, healthcare electronics and e-commerce platforms led to shifts in demand patterns within the heterogeneous integration market. The shift to remote work and virtual collaboration posed challenges for companies involved in heterogeneous integration, particularly in terms of project management, engineering collaboration, prototyping and testing. Remote work setups impacted productivity, innovation cycles and the development of new integrated solutions, requiring adjustments and digital transformation efforts.
Global supply chains are disrupted by geopolitical tensions between the countries which have an impact on the distribution and travel of raw materials and Component. The availability and cost of vital Component used in integrated systems are impacted in the case of the heterogeneous integration market by disruptions in the semiconductor supply chain and logistics brought on by the conflict between Russia and Ukraine. Market turbulence and uncertainty are frequently caused by geopolitical tensions as investors and companies respond to geopolitical risks and incidents. In the heterogeneous integration market and close industries, uncertainty affects decisions regarding investments and causes volatility in market trends, demand and investment patterns.
Geopolitical events influence currency exchange rates. Currency fluctuations affect import/export costs, international trade, pricing strategies and profitability for companies operating in the global heterogeneous integration market, especially those with exposure to affected currencies. Geopolitical tensions result in regulatory changes, trade restrictions, sanctions or export policies that impacted the operations and business environment for companies in the heterogeneous integration market. Changes in trade policies or regulatory frameworks can affect market access, trade relationships, compliance requirements and business continuity planning for industry players.
The global heterogeneous integration market report would provide approximately 62 tables, 57 figures and 180 Pages.
Target Audience 2024
LIST NOT EXHAUSTIVE