Heterogeneous Integration Global Market Report 2025
상품코드:1727828
리서치사:The Business Research Company
발행일:On Demand Report
페이지 정보:영문 175 Pages
라이선스 & 가격 (부가세 별도)
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한글목차
이종 집적 시장 규모는 향후 수년간 비약적인 성장이 예상됩니다. 2029년에는 31억 2,000만 달러로 성장할 전망이며, CAGR 31.4%로 성장이 전망됩니다. 이 예측 기간의 성장은 고성능 컴퓨팅에 대한 수요 증가, IoT 디바이스 채택 확대, 5G 네트워크의 보급, 에너지 효율적인 전자기기에 대한 요구 증가, 자율주행차의 용도 확대에 기인하고 있습니다. 주요 동향으로는 3D 포장 혁신, 시스템 인 포장(SiP) 설계 진전, 첨단 상호연결 기술 개발, 포토닉스 및 일렉트로닉스 통합, 열 관리 솔루션 개선, IoT 및 웨어러블 디바이스 소형화, 재료 진보 등이 있습니다.
IoT 디바이스의 채용 확대가 이종 집적 시장의 확대를 촉진할 것으로 예측되고 있습니다. IoT 디바이스는 가정, 산업, 헬스케어 등 다양한 부문에서 데이터 교환 및 자동화를 촉진하는 센서와 소프트웨어를 통합한 인터넷 연결 객체입니다. IoT의 도입이 급증하고 있는 배경에는 여러 산업에서의 접속성, 자동화, 데이터 주도의 의사결정에 대한 수요 증가가 있습니다. 이종 집적은 센서, 프로세서, 통신 모듈과 같은 다양한 구성 요소를 컴팩트하고 에너지 효율적인 시스템에 원활하게 결합할 수 있어 IoT 장치를 강화하고 연결 애플리케이션의 뛰어난 성능과 다기능성을 보장합니다. 예를 들어 스웨덴에 본사를 두고 있는 네트워크 통신 기업인 에릭슨은 2022년 11월 IoT 연결 장치의 수가 2022년 132억 대에서 2028년 347억 대로 증가할 것으로 예측된다고 보고했습니다. 그 결과, IoT 디바이스의 보급이 이종 집적 시장의 확대에 박차를 가하고 있습니다.
또한 스마트폰 수요 증가도 이종 집적 시장의 성장에 기여할 것으로 기대되고 있습니다. 스마트폰은 통화, 메시징, 인터넷 열람, 앱 기능 등을 겸비해 터치스크린 인터페이스로 관리할 수 있는 모바일 기기입니다. 스마트폰의 보급이 진행되고 있는 배경에는, 비용의 저하, 기술의 진보, 인터넷의 보급, 일상 업무에서 모바일 애플리케이션에 대한 의존도의 고조 등이 있습니다. 이종 집적은 프로세서, 센서, 메모리 등의 다양한 컴포넌트를 컴팩트한 설계에 매끄럽게 내장함으로써 스마트폰을 강화하고 최신 디바이스의 성능, 에너지 효율, 선진적 기능의 향상으로 이어집니다. 예를 들어 2024년 2월 영국을 거점으로 하는 온라인 전화 비교 서비스인 Uswitch Limited의 보고서에 따르면 2022년 초 영국의 모바일 접속 수는 7,180만 건으로 2021년부터 3.8% 증가했습니다. 2025년에는 6,830만 명으로 추정되는 인구의 95%, 약 6,500만 명이 스마트폰을 사용하게 될 것으로 예상됩니다. 그 결과 스마트폰 수요의 증가가 이종 집적 시장의 성장을 견인하고 있습니다.
목차
제1장 주요 요약
제2장 시장 특징
제3장 시장 동향 및 전략
제4장 시장-거시경제 시나리오 금리, 인플레이션, 지정학, 신형 코로나 바이러스 감염의 영향과 회복이 시장에 미치는 영향을 포함한 거시경제 시나리오
제5장 세계의 성장 분석 및 전략 분석 프레임워크
세계의 이종 집적 PESTEL 분석(정치, 사회, 기술, 환경, 법적 요인, 촉진요인 및 억제요인)
최종 이용 산업의 분석
세계의 이종 집적 시장 : 성장률 분석
세계의 이종 집적 시장 실적 : 규모 및 성장(2019-2024년)
세계의 이종 집적 시장 예측 : 규모 및 성장(2024-2029년, 2034년)
세계의 이종 집적 전체 시장 규모(TAM)
제6장 시장 세분화
세계의 이종 집적 시장 : 컴포넌트별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
첨단 제조 및 멀티칩 집적
통합 포토닉스
통합 파워 일렉트로닉스
마이크로 전기 기계 시스템(MEMS)과 센서의 집적
5G
무선 주파수(RF) 및 아날로그 믹스 신호
세계의 이종 집적 시장 : 설계별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
공동 설계
모델링 및 시뮬레이션
세계의 이종 집적 시장 : 최종 사용자별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
반도체 및 전자기기
정보기술(IT) 및 통신
자동차 및 운송
헬스케어 및 생명과학
제조업 및 산업
항공우주 및 방위
기타
세계의 이종 집적 시장 : 선진 제조 및 멀티칩 집적별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
2.5D 및 3D포장
팬아웃형 웨이퍼 레벨 포장(FOWLP)
시스템 인 포장(SiP)
세계의 이종 집적 시장 : 집적 포토닉스별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
실리콘 포토닉스
광 인터커넥트
광집적회로(PIC)
세계의 이종 집적 시장 : 집적 파워 일렉트로닉스별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
와이드 밴드갭 반도체(SiC, GaN)
파워 모듈
스마트 파워 IC
세계의 이종 집적 시장 : 마이크로 일렉트로 기계식 시스템(MEMS) 및 센서 집적별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
관성 센서
압력 및 환경 센서
바이오 MEMS 및 마이크로플루이딕스 장치
세계의 이종 집적 시장 : 5G별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
밀리미터파 안테나
빔포밍 기술
5G 베이스밴드 및 RF의 통합
세계의 이종 집적 시장 : 무선 주파수(RF) 및 아날로그 믹스 시그널별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
RF 프론트엔드 모듈
믹스 시그널 ASIC
고주파 증폭기 및 필터
제7장 지역별 및 국가별 분석
세계의 이종 집적 시장 : 지역별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
세계의 이종 집적 시장 : 국가별 분석 및 예측(2019-2024년, 2024-2029년, 2034년)
제8장 아시아태평양 시장
제9장 중국 시장
제10장 인도 시장
제11장 일본 시장
제12장 호주 시장
제13장 인도네시아 시장
제14장 한국 시장
제15장 서유럽 시장
제16장 영국 시장
제17장 독일 시장
제18장 프랑스 시장
제19장 이탈리아 시장
제20장 스페인 시장
제21장 동유럽 시장
제22장 러시아 시장
제23장 북미 시장
제24장 미국 시장
제25장 캐나다 시장
제26장 남미 시장
제27장 브라질 시장
제28장 중동 시장
제29장 아프리카 시장
제30장 경쟁 구도 및 기업 프로파일
이종 집적 시장 : 경쟁 구도
이종 집적 시장 : 기업 프로파일
Samsung Electronics Co. Ltd. : 개요, 제품 및 서비스, 전략 및 재무 분석
Taiwan Semiconductor Manufacturing Company Limited(TSMC) : 개요, 제품 및 서비스, 전략 및 재무 분석
Intel Corporation : 개요, 제품 및 서비스, 전략 및 재무 분석
International Business Machines Corporation : 개요, 제품 및 서비스, 전략 및 재무 분석
Qualcomm Incorporated : 개요, 제품 및 서비스, 전략 및 재무 분석
제31장 기타 주요 기업 및 혁신 기업
Broadcom Inc.
Micron Technology Inc.
Hewlett Packard Enterprise Company
NVIDIA Corporation
Applied Materials Inc.
Advanced Micro Devices Inc.
ASE Technology Holding Co. Ltd.
STMicroelectronics NV
Analog Devices Inc.
GlobalFoundries Inc.
EV Group
SkyWater Technology Inc.
Micross Components Inc.
Etron Technology
Silicon Austria Labs GmbH
제32장 세계 시장 경쟁 벤치마킹 및 대시보드
제33장 주요 인수합병(M&A)
제34장 최근 시장 동향
제35장 시장의 잠재력이 높은 국가, 부문 및 전략
이종 집적 시장(2029년) : 새로운 기회를 제공하는 국가
이종 집적 시장(2029년) : 새로운 기회를 제공하는 부문
이종 집적 시장(2029년) : 성장 전략
시장 동향에 의한 전략
경쟁 전략
제36장 부록
AJY
영문 목차
영문목차
Heterogeneous integration is the process of combining diverse components such as chips, sensors, and actuators often made from different materials and technologies into a single system or package to enhance functionality and performance. This approach enables advanced applications in electronics, including AI, 5G, IoT, and high-performance computing, by addressing the limitations of traditional monolithic integration.
The key components of heterogeneous integration include advanced manufacturing and multi-chip integration, integrated photonics, integrated power electronics, microelectromechanical systems (MEMS) and sensor integration, 5G, and RF and analog mixed signals. Advanced manufacturing employs cutting-edge technologies to produce precise, high-performance products efficiently, while multi-chip integration consolidates multiple chips into a single package to improve performance, reduce size, and enhance functionality. The various design approaches involved include co-design, modeling, and simulation. Heterogeneous integration is widely used across industries such as semiconductors and electronics, IT and telecommunications, automotive and transportation, healthcare and life sciences, manufacturing and industrial, aerospace and defense, and others.
The heterogeneous integration market research report is one of a series of new reports from The Business Research Company that provides heterogeneous integration market statistics, including the heterogeneous integration industry's global market size, regional shares, competitors with a heterogeneous integration market share, detailed heterogeneous integration market segments, market trends and opportunities, and any further data you may need to thrive in the heterogeneous integration industry. This heterogeneous integration market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.
The heterogeneous integration market size has grown exponentially in recent years. It will grow from $0.79 billion in 2024 to $1.05 billion in 2025 at a compound annual growth rate (CAGR) of 31.8%. The growth during the historic period can be attributed to the increasing demand for high-performance computing, the rapid development of IoT and AI technologies, the growing adoption of advanced packaging techniques, rising consumer demand for compact and multifunctional devices, the expansion of 5G infrastructure, and the increasing focus on energy-efficient solutions in electronics.
The heterogeneous integration market size is expected to see exponential growth in the next few years. It will grow to $3.12 billion in 2029 at a compound annual growth rate (CAGR) of 31.4%. The growth in the forecast period can be attributed to the rising demand for high-performance computing, increasing adoption of IoT devices, the proliferation of 5G networks, the growing need for energy-efficient electronics, and expanding applications in autonomous vehicles. Key trends include innovations in 3D packaging, advancements in system-in-package (SiP) designs, the development of advanced interconnect technologies, the integration of photonics and electronics, improved thermal management solutions, miniaturization for IoT and wearable devices, and advancements in materials.
The growing adoption of IoT devices is anticipated to propel the expansion of the heterogeneous integration market. IoT devices are internet-connected objects embedded with sensors and software that facilitate data exchange and automation across various sectors, including homes, industries, and healthcare. The surge in IoT adoption is driven by the increasing demand for connectivity, automation, and data-driven decision-making across multiple industries. Heterogeneous integration enhances IoT devices by enabling the seamless combination of diverse components such as sensors, processors, and communication modules into compact, energy-efficient systems, ensuring superior performance and multifunctionality for connected applications. For example, in November 2022, Ericsson, a Sweden-based network and telecommunications company, reported that the number of IoT-connected devices is projected to rise from 13.2 billion in 2022 to 34.7 billion by 2028. As a result, the growing adoption of IoT devices is fueling the expansion of the heterogeneous integration market.
The rising demand for smartphones is also expected to contribute to the growth of the heterogeneous integration market. A smartphone is a mobile device that combines calling, messaging, internet browsing, and app functionality, all managed through a touchscreen interface. The increasing adoption of smartphones is driven by factors such as declining costs, technological advancements, widespread internet availability, and the growing reliance on mobile applications for everyday tasks. Heterogeneous integration enhances smartphones by seamlessly incorporating various components, including processors, sensors, and memory, into compact designs, leading to improved performance, energy efficiency, and advanced features in modern devices. For instance, in February 2024, a report by Uswitch Limited, a UK-based online and telephone comparison service, revealed that at the beginning of 2022, the UK had 71.8 million mobile connections, reflecting a 3.8% increase from 2021. By 2025, 95% of the estimated 68.3 million population, approximately 65 million individuals, is expected to be using smartphones. Consequently, the increasing demand for smartphones is driving the growth of the heterogeneous integration market.
In October 2024, Amkor Technology Inc., a US-based semiconductor manufacturing company, entered into a partnership with Taiwan Semiconductor Manufacturing Company Limited (TSMC). This collaboration aims to strengthen the US semiconductor supply chain by advancing packaging capabilities within domestic production, thereby reducing dependency on overseas operations. Taiwan Semiconductor Manufacturing Company, based in Taiwan, specializes in semiconductor manufacturing and packaging technologies.
Major players in the heterogeneous integration market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, Broadcom Inc., Micron Technology Inc., Hewlett Packard Enterprise Company, NVIDIA Corporation, Applied Materials Inc., Advanced Micro Devices Inc., ASE Technology Holding Co. Ltd., STMicroelectronics NV, Analog Devices Inc., GlobalFoundries Inc., EV Group, SkyWater Technology Inc., Micross Components Inc., Etron Technology, Silicon Austria Labs GmbH.
North America was the largest region in the heterogeneous integration market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in heterogeneous integration report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.
The countries covered in the heterogeneous integration market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The heterogeneous integration market includes revenues earned by entities by providing services such as interposer and substrate development, testing and validation, and system-on-chip (SoC) integration. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included. The heterogeneous integration market consists of sales of integrated circuits (ICs), system-in-package (SiP), motion sensors, memory modules, and power management ICs. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values and are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
Heterogeneous Integration Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses on heterogeneous integration market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Where is the largest and fastest growing market for heterogeneous integration ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The heterogeneous integration market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
The market characteristics section of the report defines and explains the market.
The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
The forecasts are made after considering the major factors currently impacting the market. These include:
The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.
Market segmentations break down the market into sub markets.
The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:1) By Component: Advanced Manufacturing And Multi-Chip Integration; Integrated Photonics; Integrated Power Electronics; Microelectromechanical Systems (MEMS) And Sensor Integration; 5G; Radio Frequency (RF) And Analog Mixed Signal
2) By Design: Co-Design; Modeling And Simulation
3) By End-User: Semiconductor And Electronics; Information Technology (IT) And Telecommunications; Automotive And Transportation; Healthcare And Life Sciences; Manufacturing And Industrial; Aerospace And Defense; Other End Users
Subsegments:
1) By Advanced Manufacturing And Multi-Chip Integration: 2.5D And 3D Packaging; Fan-Out Wafer-Level Packaging (FOWLP); System-In-Package (SiP)
3) By Integrated Power Electronics: Wide Bandgap Semiconductors (SiC; GaN); Power Modules; Smart Power ICs
4) By Microelectromechanical Systems (MEMS) And Sensor Integration: Inertial Sensors; Pressure And Environmental Sensors; BioMEMS And Microfluidic Devices
5) By 5G: mmWave Antennas; Beamforming Technologies; 5G Baseband And RF Integration
6) By Radio Frequency (RF) And Analog Mixed Signal: RF Front-End Modules; Mixed-Signal ASICs; High-Frequency Amplifiers And Filters
Companies Mentioned: Samsung Electronics Co. Ltd.; Taiwan Semiconductor Manufacturing Company Limited (TSMC); Intel Corporation; International Business Machines Corporation; Qualcomm Incorporated
3. Heterogeneous Integration Market Trends And Strategies
4. Heterogeneous Integration Market - Macro Economic Scenario Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics And Covid And Recovery On The Market
5. Global Heterogeneous Integration Growth Analysis And Strategic Analysis Framework
5.1. Global Heterogeneous Integration PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
5.2. Analysis Of End Use Industries
5.3. Global Heterogeneous Integration Market Growth Rate Analysis
5.4. Global Heterogeneous Integration Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
5.5. Global Heterogeneous Integration Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
5.6. Global Heterogeneous Integration Total Addressable Market (TAM)
6. Heterogeneous Integration Market Segmentation
6.1. Global Heterogeneous Integration Market, Segmentation By Component, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Advanced Manufacturing And Multi-Chip Integration
Integrated Photonics
Integrated Power Electronics
Microelectromechanical Systems (MEMS) And Sensor Integration
5G
Radio Frequency (RF) And Analog Mixed Signal
6.2. Global Heterogeneous Integration Market, Segmentation By Design, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Co-Design
Modeling And Simulation
6.3. Global Heterogeneous Integration Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Semiconductor And Electronics
Information Technology (IT) And Telecommunications
Automotive And Transportation
Healthcare And Life Sciences
Manufacturing And Industrial
Aerospace And Defense
Other End Users
6.4. Global Heterogeneous Integration Market, Sub-Segmentation Of Advanced Manufacturing And Multi-Chip Integration, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
2.5D And 3D Packaging
Fan-Out Wafer-Level Packaging (FOWLP)
System-In-Package (SiP)
6.5. Global Heterogeneous Integration Market, Sub-Segmentation Of Integrated Photonics, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Silicon Photonics
Optical Interconnects
Photonic Integrated Circuits (PICs)
6.6. Global Heterogeneous Integration Market, Sub-Segmentation Of Integrated Power Electronics, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Wide Bandgap Semiconductors (SiC; GaN)
Power Modules
Smart Power ICs
6.7. Global Heterogeneous Integration Market, Sub-Segmentation Of Microelectromechanical Systems (MEMS) And Sensor Integration, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Inertial Sensors
Pressure And Environmental Sensors
BioMEMS And Microfluidic Devices
6.8. Global Heterogeneous Integration Market, Sub-Segmentation Of 5G, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
mmWave Antennas
Beamforming Technologies
5G Baseband And RF Integration
6.9. Global Heterogeneous Integration Market, Sub-Segmentation Of Radio Frequency (RF) And Analog Mixed Signal, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
RF Front-End Modules
Mixed-Signal ASICs
High-Frequency Amplifiers And Filters
7. Heterogeneous Integration Market Regional And Country Analysis
7.1. Global Heterogeneous Integration Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
7.2. Global Heterogeneous Integration Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
