솔더 재료 시장 : 제품별, 프로세스별, 최종 용도별 - 세계 기회 분석과 산업 예측(2023-2032년)

Solder Materials Market By Product (Bar, Wire, Paste, Others), By Process (Wave/reflow, Screen printing, Robotic, Others), By End-use (Automotive, Consumer electronics, Others): Global Opportunity Analysis and Industry Forecast, 2023-2032

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한글목차

솔더 재료 세계 시장 규모는 2022년에 46억 달러로 평가되며, 2023-2032년에 CAGR 4.5%로 성장하며, 2032년에는 71억 달러에 달할 것으로 예측되고 있습니다.

납땜 재료는 일반적으로 용도의 요구 사항에 따라 특정 융점과 특성을 가진 다양한 금속 합금으로 구성됩니다. 일반적인 솔더 합금에는 주석(Sn), 납(Pb), 은(Ag), 구리(Cu), 비스무트(Bi) 및 기타 금속의 조합이 포함됩니다. 납땜 재료의 선택은 접합되는 금속의 유형, 작동 조건 및 규제 고려 사항과 같은 요인에 따라 달라집니다. 납땜에서는 납땜 합금 자체 외에도 플럭스가 자주 사용됩니다. 플럭스는 금속 표면을 청소하고, 산화물을 제거하고, 솔더의 습윤 및 흐름을 촉진하는 데 도움이되는 화학 화합물입니다. 액체, 페이스트, 솔더 와이어 코어에 내장된 것 등 다양한 형태가 있습니다.

납땜은 자동차 제조 및 수리에서 차량 시스템내 와이어 하네스, 센서, 회로 기판 등 다양한 전기 연결에 사용됩니다. 납땜은 공예품, 조각, 스테인드글라스 조립, 모형 제작 등 다양한 금속 가공 프로젝트에 적용되고 있습니다. 납땜은 신뢰성과 내구성이 최우선시되는 항공우주 및 방위 전자제품 제조에서도 매우 중요합니다. 항공 전자기기에서 미사일 유도 시스템까지 다양한 분야에서 사용되고 있습니다.

IoT(사물인터넷), 5G, AI(인공지능), AR(증강현실) 등 혁신적인 기술의 등장으로 전자기기 및 전자부품에 대한 수요가 더욱 증가하고 있습니다. 이러한 기술에는 복잡한 전자 시스템과 소형화된 부품이 포함되는 경우가 많으며, 이를 조립하기 위해서는 특수 납땜 재료가 필요합니다. 전자 산업이 지속적으로 성장하고 다양화됨에 따라 전자 부품을 인쇄 회로 기판(PCB), 반도체 패키지 및 기타 전자 부품 조립에 사용되는 납땜 재료에 대한 수요도 증가하고 있습니다. 납땜은 전자제품 제조의 기본 공정이며, 납땜 재료는 전자제품의 신뢰성, 성능 및 수명을 보장하는 데 중요한 역할을 합니다. 따라서 전자 산업의 확대는 납땜 재료 시장의 중요한 촉진제 역할을 하고 있습니다.

그러나 땜납 제조에 사용되는 원자재의 세계 공급망은 복잡하고 상호 연관되어 있습니다. 공급 부족, 물류 문제, 자연 재해 및 지정학적 사건으로 인한 생산 중단과 같은 공급망의 혼란은 가격 변동을 악화시키고 공급 제약으로 이어질 수 있습니다.

납땜 재료 시장은 제품, 공정, 최종 사용 산업 및 지역별로 분류됩니다. 제품별로는 바, 와이어, 페이스트, 플럭스로 분류됩니다. 플럭스별로는 웨이브/리플로우, 스크린 인쇄, 로봇, 레이저로 분류됩니다. 최종 사용 산업별로는 가전, 자동차, 기타로 분류됩니다. 지역별로는 북미, 유럽, 아시아태평양, LAMEA로 분류됩니다.

이해관계자 주요 이점

• 이 보고서는 2022-2032년 솔더 재료 시장 분석 시장 부문, 현재 동향, 추정 및 동향, 역학에 대한 정량적 분석을 제공하여 솔더 재료 시장의 유력한 기회를 식별합니다.
• 시장 성장 촉진요인, 시장 성장 억제요인, 시장 기회와 관련된 정보와 함께 시장 조사를 제공합니다.
• Porter's Five Forces 분석은 이해 관계자가 이익 중심의 비즈니스 결정을 내리고 공급업체와 공급업체의 네트워크를 강화할 수 있도록 구매자와 공급업체의 힘을 강조합니다.
• 솔더 재료 시장 세분화에 대한 자세한 분석은 시장 기회를 결정하는 데 도움이 됩니다.
• 각 지역의 주요 국가는 세계 시장에 대한 매출 기여도에 따라 매핑되어 있습니다.
• 시장 기업의 포지셔닝은 벤치마킹을 용이하게 하고 시장 기업의 현재 위치를 명확하게 이해할 수 있습니다.
• 이 보고서에는 지역별 및 세계 납땜 재료 시장 동향, 주요 기업, 시장 부문, 용도 및 시장 성장 전략에 대한 분석이 포함되어 있습니다.

이 보고서에서 가능한 커스터마이징(추가 비용 및 일정이 있습니다.)

• 고객의 관심사에 따른 기업 개요 추가
• 국가별 또는 지역별 추가 분석 - 시장 규모 및 전망
• SWOT 분석
• 시장 규모 및 예측

목차

제1장 서론

제2장 주요 요약

제3장 시장 개요

• 시장의 정의와 범위
• 주요 조사 결과
  • 영향요인
  • 주요 투자 기회
• Porter's Five Forces 분석
• 시장 역학
  • 촉진요인
  • 억제요인
  • 기회
• 밸류체인 분석
• 주요 규제 분석
• 특허 상황

제4장 솔더 재료 시장 : 제품별

• 개요
• 바
• 와이어
• 페이스트
• 기타

제5장 솔더 재료 시장 : 프로세스별

• 개요
• 웨이브/리플로우
• 스크린 인쇄
• 로봇
• 기타

제6장 솔더 재료 시장 : 최종 용도별

• 개요
• 자동차
• 가전
• 기타

제7장 솔더 재료 시장 : 지역별

• 개요
• 북미
  • 미국
  • 캐나다
  • 멕시코
• 유럽
  • 독일
  • 프랑스
  • 이탈리아
  • 영국
  • 스페인
  • 기타
• 아시아태평양
  • 중국
  • 인도
  • 일본
  • 한국
  • 호주
  • 기타
• 라틴아메리카·중동 및 아프리카
  • 브라질
  • 사우디아라비아
  • 남아프리카공화국
  • 기타

제8장 경쟁 상황

• 서론
• 주요 성공 전략
• 주요 10사의 제품 매핑
• 경쟁 대시보드
• 경쟁 히트맵
• 주요 기업의 포지셔닝, 2022년

제9장 기업 개요

• Indium Corporation
• Alpha Assembly Solutions
• Kester
• Senju Metal Industry Co., Ltd
• AIM Solder, LLC
• Weller Tools GmbH
• Nihon Superior Co., Ltd.
• KMG Chemicals, Inc.
• Balver Zinn
• Qualitek International, Inc.

KSA

영문 목차

영문목차

The global solder materials market size was valued at $4.6 billion in 2022, and is projected to reach $7.1 billion by 2032, growing at a CAGR of 4.5% from 2023 to 2032.

Solder materials typically consist of various metal alloys with specific melting points and properties tailored to the requirements of the application. Common solder alloys include combinations of tin (Sn), lead (Pb), silver (Ag), copper (Cu), bismuth (Bi), and other metals. The choice of solder material depends on factors such as the type of metals being joined, the operating conditions, and regulatory considerations. In addition to the solder alloy itself, flux is often used in soldering. Flux is a chemical compound that helps clean the metal surfaces, remove oxides, and promote the wetting and flow of the solder. It is available in different forms, such as liquid, paste, or incorporated within the core of solder wire.

Soldering is utilized in automotive manufacturing and repair for various electrical connections, such as wiring harnesses, sensors, and circuit boards within vehicle systems. Soldering finds applications in various metalworking projects, including crafts, sculptures, stained glass assembly, and model making. Soldering is also crucial in the manufacturing of aerospace and defense electronics, where reliability and durability are paramount. It is used in applications ranging from avionics to missile guidance systems.

The emergence of innovative technologies such as IoT (Internet of Things), 5G, AI (Artificial Intelligence), and augmented reality (AR) creates additional demand for electronic devices and components. These technologies often involve complex electronic systems and miniaturized components, necessitating specialized solder materials for their assembly. As the electronics industry continues to grow and diversify, the demand for solder materials used in assembling electronic components onto printed circuit boards (PCBs), semiconductor packages, and other electronic assemblies also increases. Soldering is a fundamental process in electronics manufacturing, and solder materials play a crucial role in ensuring the reliability, performance, and longevity of electronic devices. Therefore, the expansion of the electronics industry serves as a significant driver for the solder materials market.

However, the global supply chain for raw materials used in solder production is complex and interconnected. Disruptions in the supply chain, such as supply shortages, logistical challenges, or disruptions in production due to natural disasters or geopolitical events, exacerbate price volatility and lead to supply constraints.

The solder materials market is segmented on the basis of product, process, end-use industry, and region. By product, it is categorized into bar, wire, paste, and flux. By flux, it is classified into wave/reflow, screen printing, robotic, laser. By end-use industry, it is divided into consumer electronics, automotive, others. Region-wise, the market is studied across North America, Europe, Asia-Pacific, and LAMEA.

The major players operating in the global Solder Materials market are Indium Corporation, Alpha Assembly Solutions, Kester, Senju Metal Industry Co., Ltd., AIM Solder, Weller Tools GmbH, Nihon Superior Co., Ltd., MG Chemicals, Balver Zinn, Qualitek International, Inc.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the solder materials market analysis from 2022 to 2032 to identify the prevailing solder materials market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the solder materials market segmentation assists to determine the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global solder materials market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

• Quarterly Update and* (only available with a corporate license, on listed price)
• 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
• Free Upcoming Version on the Purchase of Five and Enterprise User License.
• 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
• 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
• Free data Pack on the Five and Enterprise User License. (Excel version of the report)
• Free Updated report if the report is 6-12 months old or older.
• 24-hour priority response*
• Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

• Additional company profiles with specific to client's interest
• Additional country or region analysis- market size and forecast
• SWOT Analysis
• Volume Market Size and Forecast

Key Market Segments

By Product

• Bar
• Wire
• Paste
• Others

By Process

• Wave/reflow
• Screen printing
• Robotic
• Others

By End-use

• Automotive
• Consumer electronics
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • Italy
  • UK
  • Spain
  • Rest of Europe
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Rest of Asia-Pacific
• LAMEA
  • Brazil
  • Saudi Arabia
  • South Africa
  • Rest of LAMEA

Key Market Players:

• Indium Corporation
• Alpha Assembly Solutions
• Kester
• Senju Metal Industry Co., Ltd
• AIM Solder, LLC
• Weller Tools GmbH
• Nihon Superior Co., Ltd.
• KMG Chemicals, Inc.
• Balver Zinn
• Qualitek International, Inc.

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

• 1.1. Report description
• 1.2. Key market segments
• 1.3. Key benefits to the stakeholders
• 1.4. Research methodology
  • 1.4.1. Primary research
  • 1.4.2. Secondary research
  • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

• 2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW

• 3.1. Market definition and scope
• 3.2. Key findings
  • 3.2.1. Top impacting factors
  • 3.2.2. Top investment pockets
• 3.3. Porter's five forces analysis
• 3.4. Market dynamics
  • 3.4.1. Drivers
  • 3.4.2. Restraints
  • 3.4.3. Opportunities
• 3.5. Value Chain Analysis
• 3.6. Key Regulation Analysis
• 3.7. Patent Landscape

CHAPTER 4: SOLDER MATERIALS MARKET, BY PRODUCT

• 4.1. Overview
  • 4.1.1. Market size and forecast
• 4.2. Bar
  • 4.2.1. Key market trends, growth factors and opportunities
  • 4.2.2. Market size and forecast, by region
  • 4.2.3. Market share analysis by country
• 4.3. Wire
  • 4.3.1. Key market trends, growth factors and opportunities
  • 4.3.2. Market size and forecast, by region
  • 4.3.3. Market share analysis by country
• 4.4. Paste
  • 4.4.1. Key market trends, growth factors and opportunities
  • 4.4.2. Market size and forecast, by region
  • 4.4.3. Market share analysis by country
• 4.5. Others
  • 4.5.1. Key market trends, growth factors and opportunities
  • 4.5.2. Market size and forecast, by region
  • 4.5.3. Market share analysis by country

CHAPTER 5: SOLDER MATERIALS MARKET, BY PROCESS

• 5.1. Overview
  • 5.1.1. Market size and forecast
• 5.2. Wave/reflow
  • 5.2.1. Key market trends, growth factors and opportunities
  • 5.2.2. Market size and forecast, by region
  • 5.2.3. Market share analysis by country
• 5.3. Screen printing
  • 5.3.1. Key market trends, growth factors and opportunities
  • 5.3.2. Market size and forecast, by region
  • 5.3.3. Market share analysis by country
• 5.4. Robotic
  • 5.4.1. Key market trends, growth factors and opportunities
  • 5.4.2. Market size and forecast, by region
  • 5.4.3. Market share analysis by country
• 5.5. Others
  • 5.5.1. Key market trends, growth factors and opportunities
  • 5.5.2. Market size and forecast, by region
  • 5.5.3. Market share analysis by country

CHAPTER 6: SOLDER MATERIALS MARKET, BY END-USE

• 6.1. Overview
  • 6.1.1. Market size and forecast
• 6.2. Automotive
  • 6.2.1. Key market trends, growth factors and opportunities
  • 6.2.2. Market size and forecast, by region
  • 6.2.3. Market share analysis by country
• 6.3. Consumer electronics
  • 6.3.1. Key market trends, growth factors and opportunities
  • 6.3.2. Market size and forecast, by region
  • 6.3.3. Market share analysis by country
• 6.4. Others
  • 6.4.1. Key market trends, growth factors and opportunities
  • 6.4.2. Market size and forecast, by region
  • 6.4.3. Market share analysis by country

CHAPTER 7: SOLDER MATERIALS MARKET, BY REGION

• 7.1. Overview
  • 7.1.1. Market size and forecast By Region
• 7.2. North America
  • 7.2.1. Key market trends, growth factors and opportunities
  • 7.2.2. Market size and forecast, by Product
  • 7.2.3. Market size and forecast, by Process
  • 7.2.4. Market size and forecast, by End-use
  • 7.2.5. Market size and forecast, by country
    • 7.2.5.1. U.S.
    • 7.2.5.1.1. Market size and forecast, by Product
    • 7.2.5.1.2. Market size and forecast, by Process
    • 7.2.5.1.3. Market size and forecast, by End-use
    • 7.2.5.2. Canada
    • 7.2.5.2.1. Market size and forecast, by Product
    • 7.2.5.2.2. Market size and forecast, by Process
    • 7.2.5.2.3. Market size and forecast, by End-use
    • 7.2.5.3. Mexico
    • 7.2.5.3.1. Market size and forecast, by Product
    • 7.2.5.3.2. Market size and forecast, by Process
    • 7.2.5.3.3. Market size and forecast, by End-use
• 7.3. Europe
  • 7.3.1. Key market trends, growth factors and opportunities
  • 7.3.2. Market size and forecast, by Product
  • 7.3.3. Market size and forecast, by Process
  • 7.3.4. Market size and forecast, by End-use
  • 7.3.5. Market size and forecast, by country
    • 7.3.5.1. Germany
    • 7.3.5.1.1. Market size and forecast, by Product
    • 7.3.5.1.2. Market size and forecast, by Process
    • 7.3.5.1.3. Market size and forecast, by End-use
    • 7.3.5.2. France
    • 7.3.5.2.1. Market size and forecast, by Product
    • 7.3.5.2.2. Market size and forecast, by Process
    • 7.3.5.2.3. Market size and forecast, by End-use
    • 7.3.5.3. Italy
    • 7.3.5.3.1. Market size and forecast, by Product
    • 7.3.5.3.2. Market size and forecast, by Process
    • 7.3.5.3.3. Market size and forecast, by End-use
    • 7.3.5.4. UK
    • 7.3.5.4.1. Market size and forecast, by Product
    • 7.3.5.4.2. Market size and forecast, by Process
    • 7.3.5.4.3. Market size and forecast, by End-use
    • 7.3.5.5. Spain
    • 7.3.5.5.1. Market size and forecast, by Product
    • 7.3.5.5.2. Market size and forecast, by Process
    • 7.3.5.5.3. Market size and forecast, by End-use
    • 7.3.5.6. Rest of Europe
    • 7.3.5.6.1. Market size and forecast, by Product
    • 7.3.5.6.2. Market size and forecast, by Process
    • 7.3.5.6.3. Market size and forecast, by End-use
• 7.4. Asia-Pacific
  • 7.4.1. Key market trends, growth factors and opportunities
  • 7.4.2. Market size and forecast, by Product
  • 7.4.3. Market size and forecast, by Process
  • 7.4.4. Market size and forecast, by End-use
  • 7.4.5. Market size and forecast, by country
    • 7.4.5.1. China
    • 7.4.5.1.1. Market size and forecast, by Product
    • 7.4.5.1.2. Market size and forecast, by Process
    • 7.4.5.1.3. Market size and forecast, by End-use
    • 7.4.5.2. India
    • 7.4.5.2.1. Market size and forecast, by Product
    • 7.4.5.2.2. Market size and forecast, by Process
    • 7.4.5.2.3. Market size and forecast, by End-use
    • 7.4.5.3. Japan
    • 7.4.5.3.1. Market size and forecast, by Product
    • 7.4.5.3.2. Market size and forecast, by Process
    • 7.4.5.3.3. Market size and forecast, by End-use
    • 7.4.5.4. South Korea
    • 7.4.5.4.1. Market size and forecast, by Product
    • 7.4.5.4.2. Market size and forecast, by Process
    • 7.4.5.4.3. Market size and forecast, by End-use
    • 7.4.5.5. Australia
    • 7.4.5.5.1. Market size and forecast, by Product
    • 7.4.5.5.2. Market size and forecast, by Process
    • 7.4.5.5.3. Market size and forecast, by End-use
    • 7.4.5.6. Rest of Asia-Pacific
    • 7.4.5.6.1. Market size and forecast, by Product
    • 7.4.5.6.2. Market size and forecast, by Process
    • 7.4.5.6.3. Market size and forecast, by End-use
• 7.5. LAMEA
  • 7.5.1. Key market trends, growth factors and opportunities
  • 7.5.2. Market size and forecast, by Product
  • 7.5.3. Market size and forecast, by Process
  • 7.5.4. Market size and forecast, by End-use
  • 7.5.5. Market size and forecast, by country
    • 7.5.5.1. Brazil
    • 7.5.5.1.1. Market size and forecast, by Product
    • 7.5.5.1.2. Market size and forecast, by Process
    • 7.5.5.1.3. Market size and forecast, by End-use
    • 7.5.5.2. Saudi Arabia
    • 7.5.5.2.1. Market size and forecast, by Product
    • 7.5.5.2.2. Market size and forecast, by Process
    • 7.5.5.2.3. Market size and forecast, by End-use
    • 7.5.5.3. South Africa
    • 7.5.5.3.1. Market size and forecast, by Product
    • 7.5.5.3.2. Market size and forecast, by Process
    • 7.5.5.3.3. Market size and forecast, by End-use
    • 7.5.5.4. Rest of LAMEA
    • 7.5.5.4.1. Market size and forecast, by Product
    • 7.5.5.4.2. Market size and forecast, by Process
    • 7.5.5.4.3. Market size and forecast, by End-use

CHAPTER 8: COMPETITIVE LANDSCAPE

• 8.1. Introduction
• 8.2. Top winning strategies
• 8.3. Product mapping of top 10 player
• 8.4. Competitive dashboard
• 8.5. Competitive heatmap
• 8.6. Top player positioning, 2022

CHAPTER 9: COMPANY PROFILES

• 9.1. Indium Corporation
  • 9.1.1. Company overview
  • 9.1.2. Key executives
  • 9.1.3. Company snapshot
  • 9.1.4. Operating business segments
  • 9.1.5. Product portfolio
  • 9.1.6. Business performance
  • 9.1.7. Key strategic moves and developments
• 9.2. Alpha Assembly Solutions
  • 9.2.1. Company overview
  • 9.2.2. Key executives
  • 9.2.3. Company snapshot
  • 9.2.4. Operating business segments
  • 9.2.5. Product portfolio
  • 9.2.6. Business performance
  • 9.2.7. Key strategic moves and developments
• 9.3. Kester
  • 9.3.1. Company overview
  • 9.3.2. Key executives
  • 9.3.3. Company snapshot
  • 9.3.4. Operating business segments
  • 9.3.5. Product portfolio
  • 9.3.6. Business performance
  • 9.3.7. Key strategic moves and developments
• 9.4. Senju Metal Industry Co., Ltd
  • 9.4.1. Company overview
  • 9.4.2. Key executives
  • 9.4.3. Company snapshot
  • 9.4.4. Operating business segments
  • 9.4.5. Product portfolio
  • 9.4.6. Business performance
  • 9.4.7. Key strategic moves and developments
• 9.5. AIM Solder, LLC
  • 9.5.1. Company overview
  • 9.5.2. Key executives
  • 9.5.3. Company snapshot
  • 9.5.4. Operating business segments
  • 9.5.5. Product portfolio
  • 9.5.6. Business performance
  • 9.5.7. Key strategic moves and developments
• 9.6. Weller Tools GmbH
  • 9.6.1. Company overview
  • 9.6.2. Key executives
  • 9.6.3. Company snapshot
  • 9.6.4. Operating business segments
  • 9.6.5. Product portfolio
  • 9.6.6. Business performance
  • 9.6.7. Key strategic moves and developments
• 9.7. Nihon Superior Co., Ltd.
  • 9.7.1. Company overview
  • 9.7.2. Key executives
  • 9.7.3. Company snapshot
  • 9.7.4. Operating business segments
  • 9.7.5. Product portfolio
  • 9.7.6. Business performance
  • 9.7.7. Key strategic moves and developments
• 9.8. KMG Chemicals, Inc.
  • 9.8.1. Company overview
  • 9.8.2. Key executives
  • 9.8.3. Company snapshot
  • 9.8.4. Operating business segments
  • 9.8.5. Product portfolio
  • 9.8.6. Business performance
  • 9.8.7. Key strategic moves and developments
• 9.9. Balver Zinn
  • 9.9.1. Company overview
  • 9.9.2. Key executives
  • 9.9.3. Company snapshot
  • 9.9.4. Operating business segments
  • 9.9.5. Product portfolio
  • 9.9.6. Business performance
  • 9.9.7. Key strategic moves and developments
• 9.10. Qualitek International, Inc.
  • 9.10.1. Company overview
  • 9.10.2. Key executives
  • 9.10.3. Company snapshot
  • 9.10.4. Operating business segments
  • 9.10.5. Product portfolio
  • 9.10.6. Business performance
  • 9.10.7. Key strategic moves and developments

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