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¹ÝµµÃ¼ Á¦Á¶/Àåºñ ½ÃÀåÀ» Á¶»ç ºÐ¼®ÇÑ ÀÚ·á·Î ½ÃÀå±Ô¸ð, »ê¾÷ºÐ¼®, ÇâÈÄ ½ÃÀå¿¹Ãø µîÀÇ ³»¿ëÀ» ´Ù·ç°í ÀÖ½À´Ï´Ù.

1 - 25 (Àüü: 1,618°Ç)
¼¼°èÀÇ Ä¨ ½ºÄÉÀÏ ÆÐŰÁö(CSP) LED ½ÃÀå
Chip Scale Package (CSP) LED
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ´ÙÀÌ º»´õ Àåºñ ½ÃÀå
Die Bonder Equipment
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ÀÚµ¿Â÷ Àμâȸ·Î±âÆÇ ½ÃÀå
Automotive Printed Circuit Boards
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¾ð´õÇÊ Àç·á ½ÃÀå
Underfill Materials
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ Ç¥¸é ½ÇÀå ½ºÀ§Ä¡ ½ÃÀå
Surface Mount Switches
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ Ç¥ÁØ ·ÎÁ÷ µð¹ÙÀ̽º ½ÃÀå
Standard Logic Devices
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ ¼¼Á¤ Àåºñ ½ÃÀå
Semiconductor Wafer Cleaning Equipment
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¸®¼Ò±×·¡ÇÇ Àåºñ ½ÃÀå
Lithography Equipment
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ Æ¯Á¤ ¿ëµµ¿ë ÁýÀûȸ·Î(ASIC) ½ÃÀå
Application Specific Integrated Circuit (ASIC)
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¿þÀÌÆÛ ·¹º§ ÆÐŰ¡ Àåºñ ½ÃÀå
Wafer-level Packaging Equipment
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ SMT ¹èÄ¡ Àåºñ ½ÃÀå
SMT Placement Equipment
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ½Ç¸®ÄÜ Æ÷Åä´Ð½º ½ÃÀå
Silicon Photonics
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ SFF º¸µå ½ÃÀå
SFF Board
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¼¾¼­ Çãºê ½ÃÀå
Sensor Hubs
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¹ÝµµÃ¼ Á¦Á¶ ¼ÒÇÁÆ®¿þ¾î ½ÃÀå
Semiconductor Fabrication Software
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ºñÈֹ߼º ¸Þ¸ð¸® ½ÃÀå
Non-Volatile Memory
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¸ÖƼ ¸ðµå Ĩ¼Â ½ÃÀå
Multi-mode Chipsets
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿ë MOCVD Àåºñ ½ÃÀå
MOCVD Equipment for Power Electronics
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ È¥ÇÕ ½ÅÈ£ SoC ½ÃÀå
Mixed Signal SoC
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
Æ÷Åä´Ð ¾çÀÚ ÄÄÇ»ÅÍ ½ÃÀå
Markets for Photonic Quantum Computers
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 4,695 £Ü 6,601,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ·ÎÁ÷ IC ½ÃÀå ¿¹Ãø(-2032³â) : Á¦Ç°º°, ·ÎÁ÷ Á¾·ùº°, ±â¼úº°, ÃÖÁ¾»ç¿ëÀÚº°, Áö¿ªº° ºÐ¼®
Logic Integrated Circuits Market Forecasts to 2032 - Global Analysis By Product, Logic Type, Technology, End User and By Geography
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 4,150 £Ü 5,834,000 (ºÎ°¡¼¼ º°µµ)
ÀÎÅÍÆäÀ̽º IC ½ÃÀå ¿¹Ãø(-2032³â) : Á¦Ç° À¯Çü, ÀÎÅÍÆäÀ̽º À¯Çü, ÀÎÅÍÆäÀ̽º ±Ô°Ý, ±â¼ú, ÃÖÁ¾»ç¿ëÀÚ, Áö¿ªº° ¼¼°è ºÐ¼®
Interface IC Market Forecasts to 2032 - Global Analysis By Product Type, Interface Type, Interface Standard, Technology, End User and By Geography
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 4,150 £Ü 5,834,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ¹ÝµµÃ¼ ·¹ÀÌÀú ½ÃÀå
Semiconductor Lasers
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ ÀÚµ¿Â÷¿ë ¸¶ÀÌÅ©·Î ½ºÀ§Ä¡ ½ÃÀå
Automotive Micro Switch
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
¼¼°èÀÇ Wi-Fi Ĩ¼Â ½ÃÀå
Wi-Fi Chipsets
¹ßÇà 2025³â 07¿ù
°¡°Ý US $ 5,850 £Ü 8,225,000 (ºÎ°¡¼¼ º°µµ)
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