포토리소그래피 장비 시장 - 세계 산업 규모, 점유율, 동향, 기회, 예측 : 유형별, DUV 유형별, 파장별, 디바이스 파장별, 최종 용도별, 용도별, 지역별 및 경쟁 상황(2021-2031년)
Photolithography Equipment Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type, By DUV Type (ArFi ), By Wavelength, By Device Wavelength, By End-Use, By Application, By Region & Competition, 2021-2031F
상품코드:1914635
리서치사:TechSci Research
발행일:2026년 01월
페이지 정보:영문 185 Pages
라이선스 & 가격 (부가세 별도)
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
한글목차
세계의 포토리소그래피 장비 시장은 2025년 149억 1,000만 달러에서 2031년까지 233억 1,000만 달러로 확대되고, CAGR 7.73%를 기록할 것으로 예측됩니다.
이 장비 카테고리는 반도체 제조 공정에서 감광성 화학적 포토레지스트로 처리된 기판에 포토마스크에서 기하학적 패턴을 전사하는 데 사용되는 광학 시스템으로 구성되어 있습니다. 시장 성장은 주로 고성능 컴퓨팅의 미세화 집적 회로에 대한 수요 증가와 대량의 칩 생산이 필요한 자동차 전자제품에 대한 큰 수요에 의해 주도되고 있습니다. SEMI에 따르면, 포토리소그래피 분야를 포함한 웨이퍼 제조 장비 부문은 메모리 및 로직 디바이스에 대한 투자에 힘입어 2024년 1,010억 달러에 달할 것으로 예상했습니다.
시장 개요
예측 기간
2027-2031년
시장 규모 : 2025년
149억 1,000만 달러
시장 규모 : 2031년
233억 1,000만 달러
CAGR : 2026-2031년
7.73%
가장 빠르게 성장하는 부문
EUV
최대 시장
북미
이러한 긍정적인 전망에도 불구하고, 첨단 극자외선(EUV) 시스템에 필요한 막대한 자본 투자로 인해 시장은 큰 장벽에 직면해 있습니다. 이러한 재정적 장벽은 중소 파운드리 기업의 시장 진입을 제한하고, 3nm 이하 공정 노드를 추구할 수 있는 제조업체의 수를 제한하는 요인으로 작용하고 있습니다. 결과적으로 높은 진입 비용과 고급 노드에서 수율을 유지하기 위한 기술적 복잡성이 결합되어 시장의 광범위한 확장을 저해할 수 있습니다.
시장 촉진요인
극자외선(EUV) 및 고NA 리소그래피 시스템의 채택 확대는 첨단 노드에서 로직 및 메모리 칩 생산을 가능하게 하는 주요 성장 요인으로 작용하고 있습니다. 반도체 제조업체들이 인공지능(AI) 및 고성능 컴퓨팅(HPC) 애플리케이션을 위해 2nm 이하 아키텍처를 목표로 하고 있는 가운데, 이러한 고해상도 시스템에 대한 의존도는 계속 증가하고 있습니다. 이러한 기술적 전환은 주요 장비 제조업체의 대규모 자본 투자로 두드러지게 나타나고 있습니다. 예를 들어, ASML은 2024년 7월 발표한 '2024년 2분기 실적 보고'에서 분기 순수주가 56억 유로에 달했으며, 그 중 25억 유로가 EUV 장비 수주였다고 보고했습니다. 이러한 견조한 수주 상황은 업계 전반의 경기 침체에도 불구하고 차세대 리소그래피 장비가 트랜지스터 미세화에 필수적인 역할을 하고 있음을 입증하고 있습니다.
동시에 국내 반도체 제조 자립화를 위한 정부의 전략적 인센티브가 다양한 지역에서 포토리소그래피 장비 조달을 촉진하고 있습니다. 각국은 현지 공급망 확보와 지정학적 리스크 감소를 위해 신규 제조시설 건설에 적극적으로 보조금을 지급하고 있습니다. 2024년 4월 미국 상무부가 발표한 '바이든-해리스 행정부, TSMC와의 잠정 합의 발표'에서 지적한 바와 같이, 정부는 애리조나 주에 위치한 3개의 신규 제조 공장을 지원하기 위해 최대 66억 달러의 직접 자금 지원을 제안했습니다. 이러한 대규모 공공투자는 시설 확장에 따른 재정적 부담을 줄여주고, 직접적으로 장비 수주 증가로 이어지고 있습니다. SEMI는 2024년까지 이러한 인프라 수요에 대응하기 위해 전 세계 반도체 생산능력이 6% 증가할 것으로 전망하며, 국가 주도의 제조 이니셔티브와 장비 시장 규모의 연관성을 강조했습니다.
시장의 과제
첨단 극자외선(EUV) 노광 장비에 필요한 막대한 자본 투자는 세계 포토리소그래피 장비 시장의 성장을 저해하는 심각한 재정적 장벽으로 작용하고 있습니다. 이 엄청난 비용으로 인해 차세대 리소그래피 기술의 채택은 자금력이 풍부한 일부 반도체 제조업체에 국한되어 중소 파운드리 업체들이 3nm 이하 공정 노드로의 전환을 막고 있습니다. 그 결과, 시장은 고객 기반의 집중화로 인해 경쟁 환경의 다변화로 인한 잠재적 판매량이 제한되고, 첨단 제조 분야로의 신규 진입이 사실상 막혀 있습니다.
이러한 막대한 자금 지출의 필요성은 업계 전체의 참여를 저해하고 시장 지배력을 집중시키는 견고한 진입장벽을 형성합니다. 이러한 높은 자본집약성은 최근 투자 데이터에서도 확인할 수 있습니다. SEMI에 따르면, 2025년 2분기 세계 반도체 제조 장비 수주액은 330억 7,000만 달러에 달했습니다. 이 엄청난 숫자는 고급 노드에서 운영을 유지하기 위해 필요한 자원의 규모를 보여주며, 가장 지배적인 업계 플레이어의 투자 능력에 의해서만 확장이 제한되는 시장 구조를 강화합니다.
시장 동향
첨단 패키징 기술과 이기종 집적 기술의 보급은 장비 요구 사항을 근본적으로 변화시키고 있습니다. 이에 따라 더 큰 크기의 기판을 처리할 수 있고, 칩렛 구조의 높은 오버레이 정밀도를 확보할 수 있는 리소그래피 장비가 요구되고 있습니다. 업계가 물리적 미세화의 한계에 가까워짐에 따라, 제조업체들은 서로 다른 다이 간의 정밀한 상호연결을 실현하는 특수한 백엔드 리소그래피 시스템을 필요로 하는 3D 적층 기술로 전환하고 있습니다. 이러한 변화는 트랜지스터 미세화에 중점을 두었던 이전 공정과 달리, 재배선층에 필요한 광시야각 능력과 해상도를 겸비한 장비에 대한 수요를 견인하고 있습니다. 예를 들어, 인텔은 2024년 1월 '뉴멕시코 제조 기지 개설' 보도자료를 통해 첨단 반도체 패키징 기술, 특히 3D 적층 기술인 Foveros의 양산을 지원하기 위해 35억 달러를 투자하여 설비를 구축했다고 발표했습니다.
동시에, 리소그래피 공정 제어에 인공지능을 통합하는 것은 리버스 리소그래피 기술과 마스크 합성에 따른 계산 복잡성의 급격한 증가를 관리하는 중요한 트렌드로 부상하고 있습니다. 반도체 제조업체들은 기존에는 정확한 포토마스크 패턴 계산에 막대한 CPU 시간이 필요했던 계산 리소그래피 워크로드를 획기적으로 가속화하기 위해 생성형 AI 알고리즘을 활용하고 있습니다. 이 기술 통합은 복잡한 계산을 고속화 플랫폼으로 오프로드함으로써 웨이퍼 처리량을 향상시키고 에너지 소비를 최적화합니다. 엔비디아가 2024년 3월 발표한 '엔비디아, 반도체 제조용 생성형 AI 본격 도입 발표'에 따르면, cuLitho 플랫폼을 통해 파운드리는 기존 방식 대비 최대 40배 빠른 속도로 포토마스크를 처리할 수 있으며, 고급 노드의 개발 주기를 크게 단축할 수 있습니다.
Taiwan Semiconductor Manufacturing Company Limited
Eulitha AG
NuFlare Technology Inc.
제16장 전략적 제안
제17장 조사 회사 소개 및 면책사항
KSM
영문 목차
영문목차
The Global Photolithography Equipment Market is anticipated to expand from USD 14.91 Billion in 2025 to USD 23.31 Billion by 2031, registering a CAGR of 7.73%. This equipment category consists of optical systems used during semiconductor fabrication to transfer geometric patterns from a photomask onto a substrate treated with light-sensitive chemical photoresist. Market growth is primarily propelled by the rising need for miniaturized integrated circuits in high-performance computing and the substantial demand for automotive electronics, which requires high-volume chip production. According to SEMI, the wafer fab equipment segment, which includes the photolithography sector, was projected to reach $101 billion in 2024, driven by investments in memory and logic devices.
Market Overview
Forecast Period
2027-2031
Market Size 2025
USD 14.91 Billion
Market Size 2031
USD 23.31 Billion
CAGR 2026-2031
7.73%
Fastest Growing Segment
EUV
Largest Market
North America
Despite this positive outlook, the market encounters a major obstacle due to the immense capital expenditure necessary for advanced Extreme Ultraviolet systems. This financial hurdle restricts market access for smaller foundries and limits the number of manufacturers able to pursue sub-3nm process nodes. Consequently, the combination of high entry costs and the technical complexity involved in maintaining yield rates at advanced nodes may hinder broader market expansion.
Market Driver
The increasing adoption of Extreme Ultraviolet and High-NA lithography systems acts as a primary catalyst for market growth, facilitating the production of logic and memory chips at advanced nodes. As semiconductor manufacturers target sub-2nm architectures for artificial intelligence and high-performance computing applications, reliance on these high-resolution systems is intensifying. This technological shift is highlighted by significant capital commitments from leading equipment providers; for instance, ASML reported in its 'Q2 2024 Financial Results' in July 2024 that quarterly net bookings reached €5.6 billion, with €2.5 billion specifically for EUV system orders. This strong order intake underscores the essential role of next-generation lithography tools in enabling continued transistor downscaling despite broader industry cyclicality.
Simultaneously, strategic government incentives aimed at achieving domestic semiconductor manufacturing sovereignty are stimulating the procurement of photolithography equipment across various regions. Nations are actively subsidizing the construction of new fabrication facilities to secure local supply chains and reduce geopolitical risks. As noted by the U.S. Department of Commerce in April 2024 regarding the 'Biden-Harris Administration Announces Preliminary Terms with TSMC', the government proposed up to $6.6 billion in direct funding to support three greenfield fabrication plants in Arizona. These massive public investments alleviate the financial burden of facility expansion, leading directly to increased equipment orders. SEMI projected in 2024 that global semiconductor manufacturing capacity would rise by 6% to meet this infrastructure demand, highlighting the link between sovereign manufacturing initiatives and equipment market volume.
Market Challenge
The massive capital expenditure necessary for advanced Extreme Ultraviolet systems constitutes a critical financial barrier hampering the growth of the Global Photolithography Equipment Market. This prohibitively high cost limits the adoption of next-generation lithography technologies to a select group of semiconductor manufacturers with deep financial reserves, thereby preventing smaller foundries from transitioning to sub-3nm process nodes. Consequently, the market suffers from a consolidated customer base, which restricts the potential volume sales that would result from a more diversified competitive landscape and effectively bars new entrants from the advanced manufacturing sector.
The requirement for such vast financial outlays creates a rigid entry barrier that stifles broader industry participation and concentrates market power. This intense capital intensity is evident in recent investment data; according to SEMI, global semiconductor equipment billings rose to $33.07 billion in the second quarter of 2025. This substantial figure demonstrates the sheer magnitude of resources needed to sustain operations at advanced nodes, reinforcing a market structure where expansion is constrained by the investment capacity of only the most dominant industry players.
Market Trends
The proliferation of advanced packaging and heterogeneous integration is fundamentally altering equipment requirements, creating a preference for lithography tools capable of handling larger substrates and ensuring high overlay accuracy for chiplet architectures. As the industry nears physical scaling limits, manufacturers are pivoting toward 3D stacking techniques that require specialized back-end lithography systems to create precise interconnects between disparate dies. This shift drives demand for equipment that balances resolution with the wide-field capabilities needed for redistribution layers, distinct from the front-end focus on transistor shrinkage. For example, Intel announced in its January 2024 'Intel Opens New Mexico Manufacturing Hub' press release that it invested $3.5 billion to equip operations for advanced semiconductor packaging technologies, specifically to support mass production of its 3D stacking Foveros capabilities.
Concurrently, the integration of artificial intelligence for lithography process control is emerging as a vital trend to manage the exponential rise in computational complexity associated with inverse lithography technology and mask synthesis. Semiconductor fabricators are utilizing generative AI algorithms to drastically accelerate computational lithography workloads, which traditionally consume massive amounts of CPU time to calculate accurate photomask patterns. This technological integration enhances wafer throughput and optimizes energy consumption by offloading complex calculations to accelerated computing platforms. According to NVIDIA's March 2024 announcement, 'NVIDIA Announces Production Launch of Generative AI for Semiconductor Manufacturing', the cuLitho platform allows foundries to process photomasks up to 40 times faster than conventional methods, significantly shortening the development cycle for advanced nodes.
Key Market Players
ASML Holding N.V.
Canon Inc.
EV Group
GlobalFoundries Inc.
Nikon Corporation
Veeco Instruments Inc.
SUSS MicroTec SE
Taiwan Semiconductor Manufacturing Company Limited
Eulitha AG
NuFlare Technology Inc.
Report Scope
In this report, the Global Photolithography Equipment Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Photolithography Equipment Market, By Type
EUV (Extreme Ultraviolet)
DUV (Deep Ultraviolet)
Photolithography Equipment Market, By DUV Type
ArFi (Argon Fluoride Immersion)
KrF (Krypton Fluoride)
ArF (Argon Fluoride, I-Line)
Photolithography Equipment Market, By Wavelength
1nm-170nm
170nm-270nm
270nm-370nm
Photolithography Equipment Market, By Device Wavelength
Mercury Lamps
Fluorine Lamps
Excimer Lasers
Laser Produced Plasma
Photolithography Equipment Market, By End-Use
IDMs (Integrated Device Manufacturer)
Foundries
Photolithography Equipment Market, By Application
Back-End
Front-End
Photolithography Equipment Market, By Region
North America
United States
Canada
Mexico
Europe
France
United Kingdom
Italy
Germany
Spain
Asia Pacific
China
India
Japan
Australia
South Korea
South America
Brazil
Argentina
Colombia
Middle East & Africa
South Africa
Saudi Arabia
UAE
Competitive Landscape
Company Profiles: Detailed analysis of the major companies present in the Global Photolithography Equipment Market.
Available Customizations:
Global Photolithography Equipment Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:
Company Information
Detailed analysis and profiling of additional market players (up to five).
Table of Contents
1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations
3. Executive Summary
3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends
4. Voice of Customer
5. Global Photolithography Equipment Market Outlook
5.1. Market Size & Forecast
5.1.1. By Value
5.2. Market Share & Forecast
5.2.1. By Type (EUV (Extreme Ultraviolet), DUV (Deep Ultraviolet))
5.2.2. By DUV Type (ArFi (Argon Fluoride Immersion, KrF (Krypton Fluoride), ArF (Argon Fluoride), I-Line))
5.2.3. By Wavelength (1nm-170nm, 170nm-270nm, 270nm-370nm)
5.2.4. By Device Wavelength (Mercury Lamps, Fluorine Lamps, Excimer Lasers, Laser Produced Plasma)
5.2.5. By End-Use (IDMs (Integrated Device Manufacturer), Foundries)
5.2.6. By Application (Back-End, Front-End)
5.2.7. By Region
5.2.8. By Company (2025)
5.3. Market Map
6. North America Photolithography Equipment Market Outlook
6.1. Market Size & Forecast
6.1.1. By Value
6.2. Market Share & Forecast
6.2.1. By Type
6.2.2. By DUV Type
6.2.3. By Wavelength
6.2.4. By Device Wavelength
6.2.5. By End-Use
6.2.6. By Application
6.2.7. By Country
6.3. North America: Country Analysis
6.3.1. United States Photolithography Equipment Market Outlook
6.3.1.1. Market Size & Forecast
6.3.1.1.1. By Value
6.3.1.2. Market Share & Forecast
6.3.1.2.1. By Type
6.3.1.2.2. By DUV Type
6.3.1.2.3. By Wavelength
6.3.1.2.4. By Device Wavelength
6.3.1.2.5. By End-Use
6.3.1.2.6. By Application
6.3.2. Canada Photolithography Equipment Market Outlook
6.3.2.1. Market Size & Forecast
6.3.2.1.1. By Value
6.3.2.2. Market Share & Forecast
6.3.2.2.1. By Type
6.3.2.2.2. By DUV Type
6.3.2.2.3. By Wavelength
6.3.2.2.4. By Device Wavelength
6.3.2.2.5. By End-Use
6.3.2.2.6. By Application
6.3.3. Mexico Photolithography Equipment Market Outlook
6.3.3.1. Market Size & Forecast
6.3.3.1.1. By Value
6.3.3.2. Market Share & Forecast
6.3.3.2.1. By Type
6.3.3.2.2. By DUV Type
6.3.3.2.3. By Wavelength
6.3.3.2.4. By Device Wavelength
6.3.3.2.5. By End-Use
6.3.3.2.6. By Application
7. Europe Photolithography Equipment Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Type
7.2.2. By DUV Type
7.2.3. By Wavelength
7.2.4. By Device Wavelength
7.2.5. By End-Use
7.2.6. By Application
7.2.7. By Country
7.3. Europe: Country Analysis
7.3.1. Germany Photolithography Equipment Market Outlook
7.3.1.1. Market Size & Forecast
7.3.1.1.1. By Value
7.3.1.2. Market Share & Forecast
7.3.1.2.1. By Type
7.3.1.2.2. By DUV Type
7.3.1.2.3. By Wavelength
7.3.1.2.4. By Device Wavelength
7.3.1.2.5. By End-Use
7.3.1.2.6. By Application
7.3.2. France Photolithography Equipment Market Outlook
7.3.2.1. Market Size & Forecast
7.3.2.1.1. By Value
7.3.2.2. Market Share & Forecast
7.3.2.2.1. By Type
7.3.2.2.2. By DUV Type
7.3.2.2.3. By Wavelength
7.3.2.2.4. By Device Wavelength
7.3.2.2.5. By End-Use
7.3.2.2.6. By Application
7.3.3. United Kingdom Photolithography Equipment Market Outlook
7.3.3.1. Market Size & Forecast
7.3.3.1.1. By Value
7.3.3.2. Market Share & Forecast
7.3.3.2.1. By Type
7.3.3.2.2. By DUV Type
7.3.3.2.3. By Wavelength
7.3.3.2.4. By Device Wavelength
7.3.3.2.5. By End-Use
7.3.3.2.6. By Application
7.3.4. Italy Photolithography Equipment Market Outlook
7.3.4.1. Market Size & Forecast
7.3.4.1.1. By Value
7.3.4.2. Market Share & Forecast
7.3.4.2.1. By Type
7.3.4.2.2. By DUV Type
7.3.4.2.3. By Wavelength
7.3.4.2.4. By Device Wavelength
7.3.4.2.5. By End-Use
7.3.4.2.6. By Application
7.3.5. Spain Photolithography Equipment Market Outlook
7.3.5.1. Market Size & Forecast
7.3.5.1.1. By Value
7.3.5.2. Market Share & Forecast
7.3.5.2.1. By Type
7.3.5.2.2. By DUV Type
7.3.5.2.3. By Wavelength
7.3.5.2.4. By Device Wavelength
7.3.5.2.5. By End-Use
7.3.5.2.6. By Application
8. Asia Pacific Photolithography Equipment Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Type
8.2.2. By DUV Type
8.2.3. By Wavelength
8.2.4. By Device Wavelength
8.2.5. By End-Use
8.2.6. By Application
8.2.7. By Country
8.3. Asia Pacific: Country Analysis
8.3.1. China Photolithography Equipment Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Type
8.3.1.2.2. By DUV Type
8.3.1.2.3. By Wavelength
8.3.1.2.4. By Device Wavelength
8.3.1.2.5. By End-Use
8.3.1.2.6. By Application
8.3.2. India Photolithography Equipment Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Type
8.3.2.2.2. By DUV Type
8.3.2.2.3. By Wavelength
8.3.2.2.4. By Device Wavelength
8.3.2.2.5. By End-Use
8.3.2.2.6. By Application
8.3.3. Japan Photolithography Equipment Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Type
8.3.3.2.2. By DUV Type
8.3.3.2.3. By Wavelength
8.3.3.2.4. By Device Wavelength
8.3.3.2.5. By End-Use
8.3.3.2.6. By Application
8.3.4. South Korea Photolithography Equipment Market Outlook
8.3.4.1. Market Size & Forecast
8.3.4.1.1. By Value
8.3.4.2. Market Share & Forecast
8.3.4.2.1. By Type
8.3.4.2.2. By DUV Type
8.3.4.2.3. By Wavelength
8.3.4.2.4. By Device Wavelength
8.3.4.2.5. By End-Use
8.3.4.2.6. By Application
8.3.5. Australia Photolithography Equipment Market Outlook
8.3.5.1. Market Size & Forecast
8.3.5.1.1. By Value
8.3.5.2. Market Share & Forecast
8.3.5.2.1. By Type
8.3.5.2.2. By DUV Type
8.3.5.2.3. By Wavelength
8.3.5.2.4. By Device Wavelength
8.3.5.2.5. By End-Use
8.3.5.2.6. By Application
9. Middle East & Africa Photolithography Equipment Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Type
9.2.2. By DUV Type
9.2.3. By Wavelength
9.2.4. By Device Wavelength
9.2.5. By End-Use
9.2.6. By Application
9.2.7. By Country
9.3. Middle East & Africa: Country Analysis
9.3.1. Saudi Arabia Photolithography Equipment Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Type
9.3.1.2.2. By DUV Type
9.3.1.2.3. By Wavelength
9.3.1.2.4. By Device Wavelength
9.3.1.2.5. By End-Use
9.3.1.2.6. By Application
9.3.2. UAE Photolithography Equipment Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Type
9.3.2.2.2. By DUV Type
9.3.2.2.3. By Wavelength
9.3.2.2.4. By Device Wavelength
9.3.2.2.5. By End-Use
9.3.2.2.6. By Application
9.3.3. South Africa Photolithography Equipment Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Type
9.3.3.2.2. By DUV Type
9.3.3.2.3. By Wavelength
9.3.3.2.4. By Device Wavelength
9.3.3.2.5. By End-Use
9.3.3.2.6. By Application
10. South America Photolithography Equipment Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Type
10.2.2. By DUV Type
10.2.3. By Wavelength
10.2.4. By Device Wavelength
10.2.5. By End-Use
10.2.6. By Application
10.2.7. By Country
10.3. South America: Country Analysis
10.3.1. Brazil Photolithography Equipment Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Type
10.3.1.2.2. By DUV Type
10.3.1.2.3. By Wavelength
10.3.1.2.4. By Device Wavelength
10.3.1.2.5. By End-Use
10.3.1.2.6. By Application
10.3.2. Colombia Photolithography Equipment Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Type
10.3.2.2.2. By DUV Type
10.3.2.2.3. By Wavelength
10.3.2.2.4. By Device Wavelength
10.3.2.2.5. By End-Use
10.3.2.2.6. By Application
10.3.3. Argentina Photolithography Equipment Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Type
10.3.3.2.2. By DUV Type
10.3.3.2.3. By Wavelength
10.3.3.2.4. By Device Wavelength
10.3.3.2.5. By End-Use
10.3.3.2.6. By Application
11. Market Dynamics
11.1. Drivers
11.2. Challenges
12. Market Trends & Developments
12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments
13. Global Photolithography Equipment Market: SWOT Analysis
14. Porter's Five Forces Analysis
14.1. Competition in the Industry
14.2. Potential of New Entrants
14.3. Power of Suppliers
14.4. Power of Customers
14.5. Threat of Substitute Products
15. Competitive Landscape
15.1. ASML Holding N.V.
15.1.1. Business Overview
15.1.2. Products & Services
15.1.3. Recent Developments
15.1.4. Key Personnel
15.1.5. SWOT Analysis
15.2. Canon Inc.
15.3. EV Group
15.4. GlobalFoundries Inc.
15.5. Nikon Corporation
15.6. Veeco Instruments Inc.
15.7. SUSS MicroTec SE
15.8. Taiwan Semiconductor Manufacturing Company Limited
