한글목차

세계의 패키지내 전원 칩 시장은 2024년에 30억 6,000만 달러로 평가되었으며, 2030년까지 CAGR 7.86%로 성장하여 48억 2,000만 달러에 달할 것으로 예측됩니다.

패키지내 전원(PSiP) 칩은 DC-DC 컨버터, 전압 레귤레이터와 같은 전원 관리 기능을 다른 반도체 부품과 함께 하나의 소형 패키지에 통합합니다. 이 설계는 전력 공급을 최적화하고 효율을 향상시키며 전자 시스템의 설치 면적을 줄입니다.

주요 시장 촉진요인

세계 인패키지 전원 칩(PSiP) 시장은 전자기기의 소형화 및 집적화의 지속적인 추진과 에너지 효율이 높은 전원 솔루션에 대한 수요 증가로 인해 큰 영향을 받고 있습니다. 이 두 가지 중요한 요소는 다양한 애플리케이션에서 전력 공급을 최적화하고 시스템 풋프린트를 줄이는 데 필수적인 PSiP 기술의 설계 및 채택에 직접적인 영향을 미치고 있습니다.

주요 시장 과제

열 관리의 복잡성은 세계 인패키지 전원 칩 시장의 성장을 직접적으로 저해하는 주요 과제입니다. 패키지내 전원(PSiP) 설계에 내재된 고밀도 집적은 제한된 공간에서 높은 전력 밀도를 생성합니다.

주요 시장 동향

탄화규소, 질화갈륨과 같은 WBG(Wide Band Gap) 반도체 재료의 채택은 세계 인패키지 전원 칩 시장을 재편하는 중요한 트렌드입니다. 이러한 소재는 기존 실리콘보다 더 높은 전압, 온도, 주파수에서 작동할 수 있어 컴팩트한 PSiP 설계에서 전력 밀도 향상과 에너지 효율 개선을 직접적으로 실현할 수 있습니다.

목차

제1장 개요

제2장 조사 방법

제3장 주요 요약

제4장 고객의 소리

제5장 세계의 패키지내 전원 칩 시장 전망

• 시장 규모 및 예측
  • 금액별
• 시장 점유율과 예측
  • 제품별(PSiP, PwrSoC)
  • 용도별(통신·IT, 자동차, 소비자 전자제품, 의료기기, 군·방위)
  • 지역별
  • 기업별(2024)
• 시장 맵

제6장 북미의 패키지내 전원 칩 시장 전망

• 시장 규모 및 예측
• 시장 점유율과 예측
• 북미 : 국가별 분석
  • 미국
  • 캐나다
  • 멕시코

제7장 유럽의 패키지내 전원 칩 시장 전망

• 시장 규모 및 예측
• 시장 점유율과 예측
• 유럽 : 국가별 분석
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 스페인

제8장 아시아태평양의 패키지내 전원 칩 시장 전망

• 시장 규모 및 예측
• 시장 점유율과 예측
• 아시아태평양 : 국가별 분석
  • 중국
  • 인도
  • 일본
  • 한국
  • 호주

제9장 중동 및 아프리카의 패키지내 전원 칩 시장 전망

• 시장 규모 및 예측
• 시장 점유율과 예측
• 중동 및 아프리카 : 국가별 분석
  • 사우디아라비아
  • 아랍에미리트
  • 남아프리카공화국

제10장 남미의 패키지내 전원 칩 시장 전망

• 시장 규모 및 예측
• 시장 점유율과 예측
• 남미 : 국가별 분석
  • 브라질
  • 콜롬비아
  • 아르헨티나

제11장 시장 역학

• 성장 촉진요인
• 과제

제12장 시장 동향과 발전

• 인수합병
• 제품 출시
• 최근 동향

제13장 세계의 패키지내 전원 칩 시장 : SWOT 분석

제14장 Porter's Five Forces 분석

• 업계내 경쟁
• 신규 참여의 가능성
• 공급업체의 능력
• 고객의 능력
• 대체품의 위협

제15장 경쟁 구도

• Infineon Technologies AG
• Texas Instruments Incorporated
• Semiconductor Components Industries, LLC
• STMicroelectronics International N.V.
• Analog Devices, Inc.
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• Lextar Electronics Corporation

제16장 전략적 제안

제17장 조사 회사 소개 및 면책사항

영문목차

The Global Power Supply In Package Chip Market, valued at USD 3.06 Billion in 2024, is projected to experience a CAGR of 7.86% to reach USD 4.82 Billion by 2030. The Power Supply In Package (PSiP) chip integrates power management functions, such as DC-DC converters and voltage regulators, with other semiconductor components into a single compact package. This design optimizes power delivery, improves efficiency, and reduces the electronic system's footprint.

Key Market Drivers

The global Power Supply In Package chip market is significantly influenced by the continuous drive towards miniaturization and integration within electronic devices, alongside an escalating demand for energy-efficient power solutions. These twin imperatives directly impact the design and adoption of PSiP technologies, which are critical for optimizing power delivery and reducing system footprints across various applications. The broader semiconductor industry, which encompasses these power management solutions, demonstrated substantial growth, with Infineon Technologies AG reporting in November 2023 that its total revenue for fiscal year 2023 reached €16.309 billion, marking a 15 percent increase over the prior year.

Key Market Challenges

The complexity of thermal management presents a notable challenge directly hampering the growth of the Global Power Supply In Package Chip Market. The dense integration inherent in Power Supply In Package (PSiP) designs generates high power densities within a confined space. This necessitates robust heat dissipation mechanisms to prevent overheating, which is critical for ensuring stable operational performance and extending device longevity. Developing effective thermal solutions adds significant layers of complexity to the design and engineering processes for PSiP products.

Key Market Trends

The adoption of wide bandgap (WBG) semiconductor materials, such as silicon carbide and gallium nitride, represents a pivotal trend reshaping the Global Power Supply In Package Chip Market. These materials enable devices to operate at higher voltages, temperatures, and frequencies than traditional silicon, directly leading to greater power density and improved energy efficiency within compact PSiP designs. The superior electrical properties of WBG semiconductors facilitate faster switching speeds and reduced power losses, which are critical for the demanding performance requirements of modern electronics.

Key Market Players

• Infineon Technologies AG
• Texas Instruments Incorporated
• Semiconductor Components Industries, LLC
• STMicroelectronics International N.V.
• Analog Devices, Inc.
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• Lextar Electronics Corporation

Report Scope:

In this report, the Global Power Supply In Package Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power Supply In Package Chip Market, By Product:

• PSiP
• PwrSoC

Power Supply In Package Chip Market, By Application:

• Telecom and IT
• Automotive
• Consumer Electronics
• Medical Devices
• Military & Defense

Power Supply In Package Chip Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Power Supply In Package Chip Market.

Available Customizations:

Global Power Supply In Package Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power Supply In Package Chip Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Product (PSiP, PwrSoC)
  • 5.2.2. By Application (Telecom and IT, Automotive, Consumer Electronics, Medical Devices, Military & Defense)
  • 5.2.3. By Region
  • 5.2.4. By Company (2024)
• 5.3. Market Map

6. North America Power Supply In Package Chip Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Product
  • 6.2.2. By Application
  • 6.2.3. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Power Supply In Package Chip Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Product
      • 6.3.1.2.2. By Application
  • 6.3.2. Canada Power Supply In Package Chip Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Product
      • 6.3.2.2.2. By Application
  • 6.3.3. Mexico Power Supply In Package Chip Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Product
      • 6.3.3.2.2. By Application

7. Europe Power Supply In Package Chip Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Product
  • 7.2.2. By Application
  • 7.2.3. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Power Supply In Package Chip Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Product
      • 7.3.1.2.2. By Application
  • 7.3.2. France Power Supply In Package Chip Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Product
      • 7.3.2.2.2. By Application
  • 7.3.3. United Kingdom Power Supply In Package Chip Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Product
      • 7.3.3.2.2. By Application
  • 7.3.4. Italy Power Supply In Package Chip Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Product
      • 7.3.4.2.2. By Application
  • 7.3.5. Spain Power Supply In Package Chip Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Product
      • 7.3.5.2.2. By Application

8. Asia Pacific Power Supply In Package Chip Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Product
  • 8.2.2. By Application
  • 8.2.3. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Power Supply In Package Chip Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Product
      • 8.3.1.2.2. By Application
  • 8.3.2. India Power Supply In Package Chip Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Product
      • 8.3.2.2.2. By Application
  • 8.3.3. Japan Power Supply In Package Chip Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Product
      • 8.3.3.2.2. By Application
  • 8.3.4. South Korea Power Supply In Package Chip Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Product
      • 8.3.4.2.2. By Application
  • 8.3.5. Australia Power Supply In Package Chip Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Product
      • 8.3.5.2.2. By Application

9. Middle East & Africa Power Supply In Package Chip Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Product
  • 9.2.2. By Application
  • 9.2.3. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Power Supply In Package Chip Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Product
      • 9.3.1.2.2. By Application
  • 9.3.2. UAE Power Supply In Package Chip Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Product
      • 9.3.2.2.2. By Application
  • 9.3.3. South Africa Power Supply In Package Chip Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Product
      • 9.3.3.2.2. By Application

10. South America Power Supply In Package Chip Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Product
  • 10.2.2. By Application
  • 10.2.3. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Power Supply In Package Chip Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Product
      • 10.3.1.2.2. By Application
  • 10.3.2. Colombia Power Supply In Package Chip Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Product
      • 10.3.2.2.2. By Application
  • 10.3.3. Argentina Power Supply In Package Chip Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Product
      • 10.3.3.2.2. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Power Supply In Package Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Infineon Technologies AG
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Texas Instruments Incorporated
• 15.3. Semiconductor Components Industries, LLC
• 15.4. STMicroelectronics International N.V.
• 15.5. Analog Devices, Inc.
• 15.6. NXP Semiconductors N.V.
• 15.7. Renesas Electronics Corporation
• 15.8. Vishay Intertechnology, Inc.
• 15.9. Panasonic Corporation
• 15.10. Lextar Electronics Corporation

16. Strategic Recommendations

17. About Us & Disclaimer