한글목차

세계의 다이싱 테이프 시장 규모는 2024년에 13억 4,000만 달러로 평가되었고, 2030년에는 19억 4,000만 달러에 이를 전망이며, 예측 기간 중 CAGR 6.21%로 성장할 것으로 예측됩니다.

다이싱 테이프는 반도체 및 일렉트로닉스 제조에 있어서, 고정밀도의 다이싱 공정으로 웨이퍼, 유리, 세라믹 기판을 확실히 유지하기 위해서 사용되는 특수한 점착 재료입니다. 이러한 테이프는 기계적 또는 레이저에 의한 절단 작업 중 치핑, 크랙, 미스얼라인을 방지하기 위해 필수적입니다. UV 경화형, 비UV형, 열박리형, 감압형 등 다양한 타입이 있어 다양한 용도의 요구에 대응하고 있습니다. 시장의 확대는 전자, 자동차, 전기 통신, 산업 용도의 반도체 수요 증가에 의해 추진되고 있습니다. 집적회로의 복잡화 및 소형화가 진행됨에 따라 정확하고 손상 없는 부품 분리를 실현하는 신뢰성 높은 고성능 다이싱 테이프 솔루션에 대한 니즈도 커지고 있습니다.

시장 성장 촉진요인

반도체 산업 확대

주요 시장 과제

첨단 기술의 고비용 다이싱 테이프

주요 시장 동향

비자외선 다이싱 테이프 채용 증가

목차

제1장 개요

제2장 조사 방법

제3장 주요 요약

제4장 고객의 목소리

제5장 세계의 다이싱 테이프 시장 전망

• 시장 규모 및 예측
  • 금액별
• 시장 점유율 및 예측
  • 유형별(UV 경화형 다이싱 테이프, 비UV형 다이싱 테이프, 방열형 다이싱 테이프, 감압형 다이싱 테이프)
  • 재료별(폴리에틸렌, 폴리염화비닐, 폴리에틸렌테레프탈레이트, 폴리올레핀)
  • 최종 이용 산업별(반도체, 일렉트로닉스, 포토닉스, 자동차)
  • 지역별(북미, 유럽, 남미, 중동 및 아프리카, 아시아태평양)
• 기업별(2024년)
• 시장 맵

제6장 북미의 다이싱 테이프 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 북미 : 국가별 분석
  • 미국
  • 캐나다
  • 멕시코

제7장 유럽의 다이싱 테이프 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 유럽 : 국가별 분석
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 스페인

제8장 아시아태평양의 다이싱 테이프 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 아시아태평양 : 국가별 분석
  • 중국
  • 인도
  • 일본
  • 한국
  • 호주

제9장 중동 및 아프리카의 다이싱 테이프 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 중동 및 아프리카 : 국가별 분석
  • 사우디아라비아
  • 아랍에미리트(UAE)
  • 남아프리카

제10장 남미의 다이싱 테이프 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 남미 : 국가별 분석
  • 브라질
  • 콜롬비아
  • 아르헨티나

제11장 시장 역학

• 성장 촉진요인
• 과제

제12장 시장 동향 및 발전

• 합병 및 인수
• 제품 출시
• 최근 동향

제13장 기업 프로파일

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Shinto Paint Co., Ltd
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Lintec Corporation
• Samsung Fine Chemicals
• Avery Dennison Corporation

제14장 전략적 제안

제15장 기업 소개 및 면책사항

영문목차

The Global Dicing Tapes Market was valued at USD 1.34 Billion in 2024 and is projected to reach USD 1.94 Billion by 2030, growing at a CAGR of 6.21% during the forecast period. Dicing tapes are specialized adhesive materials used in semiconductor and electronics manufacturing to securely hold wafers, glass, or ceramic substrates during high-precision dicing processes. These tapes are essential for preventing chipping, cracking, or misalignment during mechanical or laser-based cutting operations. With types ranging from UV curable and non-UV to heat-release and pressure-sensitive variants, these tapes are tailored to meet diverse application needs. The market's expansion is being propelled by the growing demand for semiconductors in electronics, automotive, telecom, and industrial applications. As the complexity and miniaturization of integrated circuits increase, so does the need for reliable, high-performance dicing tape solutions that can ensure accurate and damage-free component separation.

Key Market Drivers

Expansion of the Semiconductor Industry

The rapid growth of the global semiconductor sector is a major driver of the Dicing Tapes market. With increasing adoption of electronic devices in areas such as consumer electronics, automotive systems, telecom infrastructure, and medical technology, there is a heightened need for precise semiconductor chip fabrication. Dicing tapes are vital to maintaining wafer integrity during dicing, especially as chip designs become more compact and intricate. Advanced adhesion and thermal resistance properties are essential in this context, prompting manufacturers to innovate and deliver next-generation tape solutions. Continued R&D in materials and adhesives ensures compatibility with evolving semiconductor manufacturing standards and supports the industry's demand for performance and reliability.

Key Market Challenges

High Cost of Advanced Dicing Tapes

One of the primary challenges in the Dicing Tapes market is the elevated cost of producing technologically advanced tapes. These specialized tapes are engineered to perform under stringent conditions-such as maintaining adhesion under thermal stress and enabling clean, precise wafer separation. However, the R&D, raw materials, and manufacturing processes required to produce such high-performance products significantly increase production expenses. For semiconductor manufacturers, particularly small and mid-sized firms, these higher costs can impact overall profitability. The financial burden of incorporating premium dicing tapes into production lines may limit adoption and create entry barriers, especially in cost-sensitive regions or for lower-volume applications.

Key Market Trends

Increased Adoption of Non-UV Dicing Tapes

A notable trend shaping the Dicing Tapes market is the growing shift toward non-UV dicing tapes. These tapes eliminate the need for ultraviolet exposure, offering enhanced protection for delicate wafers and components during the dicing process. With better adhesion and compatibility for high-precision applications, non-UV tapes are increasingly used in advanced semiconductor packaging. Their role is especially prominent in the fabrication of chips for 5G networks, artificial intelligence, and memory devices, where clean cuts and wafer stability are critical. These tapes also support high-temperature processing environments and fine-pitch designs, making them ideal for next-generation chip technologies. As manufacturers seek more robust and efficient solutions, non-UV dicing tapes are gaining favor across the semiconductor value chain.

Key Market Players

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Lintec Corporation
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Shinto Paint Co., Ltd
• Samsung Fine Chemicals
• Avery Dennison Corporation

Report Scope:

In this report, the Global Dicing Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Dicing Tapes Market, By Type:

• UV Curable Dicing Tapes
• Non-UV Dicing Tapes
• Heat Release Dicing Tapes
• Pressure Sensitive Dicing Tapes

Dicing Tapes Market, By Material:

• Polyethylene
• Polyvinyl Chloride
• Polyethylene Terephthalate
• Polyolefin

Dicing Tapes Market, By End-use Industry:

• Semiconductor
• Electronics
• Photonics
• Automotive

Dicing Tapes Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
• South America
  • Brazil
  • Argentina
  • Colombia
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Dicing Tapes Market.

Available Customizations:

Global Dicing Tapes Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Dicing Tapes Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (UV Curable Dicing Tapes, Non-UV Dicing Tapes, Heat Release Dicing Tapes, Pressure Sensitive Dicing Tapes)
  • 5.2.2. By Material (Polyethylene, Polyvinyl Chloride, Polyethylene Terephthalate, Polyolefin)
  • 5.2.3. By End-use Industry (Semiconductor, Electronics, Photonics, Automotive)
  • 5.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Dicing Tapes Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Material
  • 6.2.3. By End-use Industry
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Dicing Tapes Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By End-use Industry
  • 6.3.2. Canada Dicing Tapes Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By End-use Industry
  • 6.3.3. Mexico Dicing Tapes Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By End-use Industry

7. Europe Dicing Tapes Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Material
  • 7.2.3. By End-use Industry
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Dicing Tapes Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By End-use Industry
  • 7.3.2. France Dicing Tapes Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By End-use Industry
  • 7.3.3. United Kingdom Dicing Tapes Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By End-use Industry
  • 7.3.4. Italy Dicing Tapes Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By End-use Industry
  • 7.3.5. Spain Dicing Tapes Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By End-use Industry

8. Asia Pacific Dicing Tapes Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Material
  • 8.2.3. By End-use Industry
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Dicing Tapes Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By End-use Industry
  • 8.3.2. India Dicing Tapes Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By End-use Industry
  • 8.3.3. Japan Dicing Tapes Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By End-use Industry
  • 8.3.4. South Korea Dicing Tapes Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By End-use Industry
  • 8.3.5. Australia Dicing Tapes Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By End-use Industry

9. Middle East & Africa Dicing Tapes Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Material
  • 9.2.3. By End-use Industry
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Dicing Tapes Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By End-use Industry
  • 9.3.2. UAE Dicing Tapes Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By End-use Industry
  • 9.3.3. South Africa Dicing Tapes Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By End-use Industry

10. South America Dicing Tapes Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Material
  • 10.2.3. By End-use Industry
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Dicing Tapes Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By End-use Industry
  • 10.3.2. Colombia Dicing Tapes Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By End-use Industry
  • 10.3.3. Argentina Dicing Tapes Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By End-use Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends and Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. Nitto Denko Corporation
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services Offered
• 13.2. 3M Company
• 13.3. Tesa SE
• 13.4. Shinto Paint Co., Ltd
• 13.5. Momentive Performance Materials Inc
• 13.6. Dai Nippon Printing Co., Ltd.
• 13.7. Mitsui Chemicals, Inc.
• 13.8. Lintec Corporation
• 13.9. Samsung Fine Chemicals
• 13.10. Avery Dennison Corporation

14. Strategic Recommendations

15. About Us & Disclaimer