WLCSP 무전해도금 시장 보고서(2026년)
WLCSP Electroless Plating Global Market Report 2026
상품코드 : 1924447
리서치사 : The Business Research Company
발행일 : On Demand Report
페이지 정보 : 영문 250 Pages
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한글목차

WLCSP 무전해도금 시장의 규모는 최근 현저한 성장을 보이고 있습니다. 2025년 25억 9,000만 달러에서 2026년에는 28억 4,000만 달러로, CAGR 9.6%로 확대할 전망입니다. 지난 수년간의 성장은 반도체 제조 확대, IC 미세화 수요 증가, 웨이퍼 레벨 칩 스케일 패키징의 조기 도입, 전자기기 조립 작업의 성장, 내식성 도금 기술에 대한 수요 증가에 기인하는 것으로 보입니다.

WLCSP 무전해도금 시장 규모는 향후 수년간 강력한 성장이 전망됩니다. 2030년에는 41억 달러에 달하며, CAGR은 9.6%에 달할 전망입니다. 예측 기간 중의 성장 요인으로는 첨단 패키징에 대한 수요 증가, 자동차 전자기기 보급 확대, AI 탑재 장치 채택 증가, 고밀도 인쇄회로기판 제조 확대, 마이크로 일렉트로닉스의 열 관리에 대한 관심 증가 등을 꼽을 수 있습니다. 예측 기간의 주요 동향으로는 소형화된 반도체 패키징의 활용 확대, 고정밀 웨이퍼 레벨 공정의 채택 증가, 열전도율 강화 도금 수요 증가, 첨단 납땜성 향상 기술의 확대, 내식성 및 내마모성 코팅의 통합 증가 등을 꼽을 수 있습니다.

5G 네트워크의 성장은 향후 수년간 WLCSP 무전해 도금 시장의 성장을 촉진할 것으로 예측됩니다. 이러한 성장은 주로 더 빠른 데이터 전송 속도에 대한 수요 증가, 네트워크 안정성 향상, 사물인터넷(IoT) 연결성 개선, 증강현실(AR), 가상현실(VR), 자율주행차 등 신기술을 지원해야 할 필요성 때문인 것으로 분석됩니다. 5G 네트워크의 발전은 소형 디바이스의 고속 데이터 처리 및 연결성 향상에 필수적인 정밀하고 신뢰할 수 있는 도금 솔루션을 필요로 하는 고성능 및 소형화 부품에 대한 수요를 자극하여 WLCSP 무전해 도금에 대한 수요를 촉진할 것입니다. 예를 들어 2023년 2월 독일에 본사를 둔 이동통신사 T-Mobile International AG는 5G 활성 계약 건수가 10억 건을 넘어섰다고 보고했으며, 2028년 말까지 50억 명이 5G 계약을 맺을 것으로 예측했습니다. 따라서 5G 네트워크의 확장은 WLCSP 무전해 도금 시장을 크게 견인하고 있습니다.

WLCSP(웨이퍼 레벨 칩 스케일 패키지) 무전해 도금 시장의 주요 업체들은 기존 고객의 요구에 보다 적절히 대응하기 위해 시설 확장에 주력하고 있습니다. 제조시설이란 원재료를 완제품으로 가공하는 건물 또는 복합시설을 말합니다. 예를 들어 2023년 10월, WLCSP 무전해 도금을 전문으로 하는 미국 기업 Amcor Technology는 베트남에 새로운 시설 건설 계획을 발표했습니다. 베트남 캠퍼스는 옌퐁2C 산업단지내 57에이커(약 23만 평방미터)의 광활한 면적을 차지하며, 앰코의 최대 규모의 공장이 될 예정입니다. Amkor는 시설, 기계 및 장비를 포함한 프로젝트의 1단계 및 2단계에 16억 달러의 투자를 할당했습니다. 베트남에 대한 대규모 제조 투자를 통해 Amkor는 고객에게 비교할 수 없는 지역적 범위를 제공하고, 세계 및 지역 공급망을 모두 지원할 수 있게 되었습니다. 이를 통해 통신, 자동차, 고성능 컴퓨팅 및 기타 중요 분야의 고객이 요구하는 안전하고 신뢰할 수 있는 공급망을 구현할 수 있습니다.

목차

제1장 개요

제2장 시장의 특징

제3장 시장 공급망 분석

제4장 세계 시장 동향과 전략

제5장 최종 용도 산업의 시장 분석

제6장 시장 : 금리, 인플레이션, 지정학, 무역 전쟁과 관세의 영향, 관세 전쟁과 무역 보호주의에 의한 공급망에 대한 영향, Covid가 시장에 미치는 영향을 포함한 거시경제 시나리오

제7장 세계의 전략 분석 프레임워크, 현재 시장 규모, 시장 비교 및 성장률 분석

제8장 시장의 세계 TAM(Total Addressable Market)

제9장 시장 세분화

제10장 지역별·국가별 분석

제11장 아시아태평양 시장

제12장 중국 시장

제13장 인도 시장

제14장 일본 시장

제15장 호주 시장

제16장 인도네시아 시장

제17장 한국 시장

제18장 대만 시장

제19장 동남아시아 시장

제20장 서유럽 시장

제21장 영국 시장

제22장 독일 시장

제23장 프랑스 시장

제24장 이탈리아 시장

제25장 스페인 시장

제26장 동유럽 시장

제27장 러시아 시장

제28장 북미 시장

제29장 미국 시장

제30장 캐나다 시장

제31장 남미 시장

제32장 브라질 시장

제33장 중동 시장

제34장 아프리카 시장

제35장 시장 규제 상황과 투자환경

제36장 경쟁 구도와 기업 개요

제37장 기타 대기업과 혁신적 기업

제38장 세계의 시장 경쟁 벤치마킹과 대시보드

제39장 주요 합병과 인수

제40장 시장의 잠재력이 높은 국가, 부문, 전략

제41장 부록

KSA
영문 목차

영문목차

WLCSP electroless plating is a true chip-scale packaging technology that minimizes package size and enhances thermal conduction in chips, connecting the printed circuit board using solder balls.

In the WLCSP (wafer-level chip-scale packaging) electroless plating market, the main types of plating are nickel, copper, composites, and others. Nickel is a lustrous silvery-white metal used to protect parts from natural wear, abrasion, and corrosion. It finds applications in corrosion resistance, wear resistance, appearance enhancement, solderability improvement, and other areas requiring enhanced conductivity. Industries that utilize nickel electroless plating include automotive, electronics, aerospace, machinery, and others.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs on specialty metals such as nickel, copper, and alloy materials used in WLCSP electroless plating have increased production costs and disrupted supply chains, particularly affecting semiconductor fabrication hubs in Asia Pacific. High precision plating processes for electronics and automotive applications face delays due to restricted material availability. However, tariffs have also accelerated local sourcing, stimulated domestic alloy development, and encouraged manufacturers to innovate cost-efficient plating solutions to maintain competitiveness.

The WLCSP electroless plating market research report is one of a series of new reports from The Business Research Company that provides WLCSP electroless plating market statistics, including WLCSP electroless plating industry global market size, regional shares, competitors with a WLCSP electroless plating market share, detailed WLCSP electroless plating market segments, market trends and opportunities, and any further data you may need to thrive in the WLCSP electroless plating industry. This WLCSP electroless plating market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The wlcsp electroless plating market size has grown strongly in recent years. It will grow from $2.59 billion in 2025 to $2.84 billion in 2026 at a compound annual growth rate (CAGR) of 9.6%. The growth in the historic period can be attributed to rise in semiconductor manufacturing expansion, increase in ic miniaturization demand, early adoption of wafer level chip scale packaging, growth in electronics assembly operations, rising need for corrosion resistant plating technologies.

The wlcsp electroless plating market size is expected to see strong growth in the next few years. It will grow to $4.1 billion in 2030 at a compound annual growth rate (CAGR) of 9.6%. The growth in the forecast period can be attributed to increasing demand for advanced ic packaging, growth in automotive electronics penetration, rising adoption of AI enabled devices, expansion of high density pcb manufacturing, growing focus on thermal management in microelectronics. Major trends in the forecast period include increasing use of miniaturized semiconductor packaging, rising adoption of high precision wafer level processes, growing demand for enhanced thermal conductivity plating, expansion of advanced solderability enhancement techniques, rising integration of corrosion and wear resistant coatings.

The growth of 5G networks is anticipated to drive the expansion of the WLCSP electroless plating market in the coming years. This growth is primarily due to the rising demand for higher data speeds, enhanced network reliability, improved connectivity for the Internet of Things (IoT), and the necessity to support emerging technologies like augmented reality (AR), virtual reality (VR), and autonomous vehicles. The development of 5G networks boosts the demand for WLCSP electroless plating by necessitating high-performance, miniaturized components that require precise and reliable plating solutions to facilitate faster data processing and improved connectivity in compact devices. For instance, in February 2023, T-Mobile International AG, a Germany-based mobile telecommunications company, reported that there were over 1 billion active 5G subscriptions, with projections indicating that 5 billion individuals will have 5G subscriptions by the end of 2028. Hence, the expansion of 5G networks is significantly driving the WLCSP electroless plating market.

Leading companies in the WLCSP (wafer-level chip scale package) electroless plating market are concentrating on expanding their facilities to better cater to the needs of their existing consumers. A manufacturing facility is a building or complex where raw materials are transformed into finished goods. For example, in October 2023, Amkor Technology, Inc., a US-based company specializing in WLCSP electroless plating, revealed plans for the construction of a new facility in Vietnam. This Vietnam campus is set to become Amkor's largest factory, covering an extensive 57-acre area within the Yen Phong 2C Industrial Park. Amkor has allocated an investment of US$1.6 billion for the first two phases of the project, which includes facilities, machinery, and equipment. This significant investment in manufacturing in Vietnam will enable Amkor to offer an unparalleled geographic footprint to its clients, serving both global and regional supply chains. It will provide the secure and reliable supply chain that clients in communications, automotive, high-performance computing, and other critical sectors seek.

In January 2023, LB Semicon, a South Korea-based semiconductor chip manufacturing company, acquired the VertaCure XP G2 system from Yield Engineering Systems, Inc. for an undisclosed sum. This acquisition was aimed at enhancing LB Semicon's capabilities in the bump/RDL application for wafer-level chip-scale packaging (WLCSP). The VertaCure XP G2 system is known for its improved throughput, excellent particle performance, and comprehensive PI/PBO curing capabilities, all of which are attributed to its established vacuum-based method. Yield Engineering Systems, Inc., based in the US, specializes in manufacturing equipment that supports wafer-level chip-scale packaging.

Major companies operating in the wlcsp electroless plating market are Atotech, MacDermid Alpha, Uyemura, Heraeus, DuPont, Umicore, PacTech, MKS Instruments, Applied Materials, ClassOne Technology, Technic Inc., Entegris, Qnity Electronics, JCU Corporation, Maxell, Jetchem International, AOTCO, Nanophase Technologies, Shikoku Chemicals, Nihon Parkerizing

Europe was the largest region in the WLCSP electroless plating market in 2025. Asia-Pacific is expected to be the fastest-growing region in the WLCSP electroless plating market report during the forecast period. The regions covered in the wlcsp electroless plating market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the wlcsp electroless plating market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The WLCSP electroless plating market consists of revenues earned by entities by providing WLCSP electroless plating services such as layout & mask tooling, wafer RDL patterning and bumping (ball sphere loaded or plated), automated optical inspection (AOI) for quality assurance and wafer map generation. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

WLCSP Electroless Plating Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses wlcsp electroless plating market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

Where is the largest and fastest growing market for wlcsp electroless plating ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The wlcsp electroless plating market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

Scope

Added Benefits available all on all list-price licence purchases, to be claimed at time of purchase. Customisations within report scope and limited to 20% of content and consultant support time limited to 8 hours.

Table of Contents

1. Executive Summary

2. WLCSP Electroless Plating Market Characteristics

3. WLCSP Electroless Plating Market Supply Chain Analysis

4. Global WLCSP Electroless Plating Market Trends And Strategies

5. WLCSP Electroless Plating Market Analysis Of End Use Industries

6. WLCSP Electroless Plating Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, Supply Chain Impact from Tariff War & Trade Protectionism, And Covid And Recovery On The Market

7. Global WLCSP Electroless Plating Strategic Analysis Framework, Current Market Size, Market Comparisons And Growth Rate Analysis

8. Global WLCSP Electroless Plating Total Addressable Market (TAM) Analysis for the Market

9. WLCSP Electroless Plating Market Segmentation

10. WLCSP Electroless Plating Market Regional And Country Analysis

11. Asia-Pacific WLCSP Electroless Plating Market

12. China WLCSP Electroless Plating Market

13. India WLCSP Electroless Plating Market

14. Japan WLCSP Electroless Plating Market

15. Australia WLCSP Electroless Plating Market

16. Indonesia WLCSP Electroless Plating Market

17. South Korea WLCSP Electroless Plating Market

18. Taiwan WLCSP Electroless Plating Market

19. South East Asia WLCSP Electroless Plating Market

20. Western Europe WLCSP Electroless Plating Market

21. UK WLCSP Electroless Plating Market

22. Germany WLCSP Electroless Plating Market

23. France WLCSP Electroless Plating Market

24. Italy WLCSP Electroless Plating Market

25. Spain WLCSP Electroless Plating Market

26. Eastern Europe WLCSP Electroless Plating Market

27. Russia WLCSP Electroless Plating Market

28. North America WLCSP Electroless Plating Market

29. USA WLCSP Electroless Plating Market

30. Canada WLCSP Electroless Plating Market

31. South America WLCSP Electroless Plating Market

32. Brazil WLCSP Electroless Plating Market

33. Middle East WLCSP Electroless Plating Market

34. Africa WLCSP Electroless Plating Market

35. WLCSP Electroless Plating Market Regulatory and Investment Landscape

36. WLCSP Electroless Plating Market Competitive Landscape And Company Profiles

37. WLCSP Electroless Plating Market Other Major And Innovative Companies

38. Global WLCSP Electroless Plating Market Competitive Benchmarking And Dashboard

39. Key Mergers And Acquisitions In The WLCSP Electroless Plating Market

40. WLCSP Electroless Plating Market High Potential Countries, Segments and Strategies

41. Appendix

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