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3D 스태킹 시장 보고서(2025년)
3D Stacking Global Market Report 2025
상품코드 : 1727729
리서치사 : The Business Research Company
발행일 : On Demand Report
페이지 정보 : 영문 175 Pages
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한글목차

3D 스태킹 시장 규모는 향후 수년간 급성장이 예상됩니다. 예측 기간 동안의 성장은 에너지 효율적인 부품에 대한 수요 증가, 신흥 기술 분야의 응용 확대, 전자 제품의 소형화 요구의 높아짐, LED 수요 증가, 전자 기기의 복잡화 등의 요인에 의한 것으로 예측됩니다. 이 기간에 예상되는 주요 동향에는 선진 패키징 기술, 전략적 제휴, 메모리 기술의 진보, 반도체 제조 기술의 혁신, 연구 개발 투자 증가 등이 있습니다.

LED 수요 증가가 3D 스태킹 시장의 성장을 견인할 것으로 예측됩니다. 3D 스태킹은 더 높은 집적 밀도, 더 나은 열 관리, 전력 소비 감소 및 광학 효율 향상을 가능하게 하여 LED 성능을 향상시킵니다. 국제에너지기구는 새로운 LED의 효율성이 꾸준히 향상되었으며, 2030년에는 인터넷 제로 시나리오를 따라 2022년 평균보다 약 30% 높은 약 140 lm/W에 이를 것으로 예상한다고 보고했습니다.

3D 스태킹 시장의 각 기업은 전력 효율을 개선하고 광대역폭의 3D 메모리 집적을 가능하게 하기 위해 3D 적층 특정 용도용 집적 회로(ASIC) 아키텍처 등의 기술 혁신에 주력하고 있습니다. 이 아키텍처는 기존 2D 설계 방식과 비교하여 성능을 향상하고 밀도를 높이며 전력 소비를 줄이기 위해, 여러 ASIC 레이어를 TSV(Through-Silicon Via) 또는 다른 방법을 사용하여 상호 연결함으로써 수직으로 쌓아 올립니다. Nano Labs Ltd.는 인공지능(AI)의 추론과 블록체인의 성능 향상을 목적으로 한 ASIC 아키텍처인 FPU3.0을 발표했습니다. 고급 3D DRAM 스태킹 기술을 사용하여 FPU3.0은 FPU2.0에 비해 전력 효율이 5배 향상되어 고성능 에너지 효율 ASIC의 새로운 표준을 제시합니다.

목차

제1장 주요 요약

제2장 시장 특징

제3장 시장 동향과 전략

제4장 시장 - 거시경제 시나리오 금리, 인플레이션, 지정학, 신형 코로나 바이러스 감염의 영향과 회복이 시장에 미치는 영향을 포함한 거시경제 시나리오

제5장 세계 성장 분석과 전략 분석 프레임워크

제6장 시장 세분화

제7장 지역별/국가별 분석

제8장 아시아태평양 시장

제9장 중국 시장

제10장 인도 시장

제11장 일본 시장

제12장 호주 시장

제13장 인도네시아 시장

제14장 한국 시장

제15장 서유럽 시장

제16장 영국 시장

제17장 독일 시장

제18장 프랑스 시장

제19장 이탈리아 시장

제20장 스페인 시장

제21장 동유럽 시장

제22장 러시아 시장

제23장 북미 시장

제24장 미국 시장

제25장 캐나다 시장

제26장 남미 시장

제27장 브라질 시장

제28장 중동 시장

제29장 아프리카 시장

제30장 경쟁 구도와 기업 프로파일

제31장 기타 주요 기업 및 혁신 기업

제32장 세계 시장 경쟁 벤치마킹과 대시보드

제33장 주요 인수합병(M&A)

제34장 최근 시장 동향

제35장 시장의 잠재력이 높은 국가, 부문, 전략

제36장 부록

SHW
영문 목차

영문목차

3D stacking is an advanced semiconductor integration technique that involves vertically layering multiple silicon dies or chiplets with high-density interconnects to enhance performance, power efficiency, and functionality while reducing the form factor and latency in electronic devices. This technique is commonly used in high-performance computing, artificial intelligence, memory technologies, advanced sensor systems, and next-generation consumer electronics to achieve faster processing speeds, better energy efficiency, and improved data transfer capabilities.

The primary device types in 3D stacking include logic integrated circuits (ICs), imaging and optoelectronics, memory devices, micro-electro-mechanical systems (MEMS) or sensors, LEDs, and others. Logic ICs in 3D stacking are vertically interconnected semiconductor devices that enhance performance, power efficiency, and data transfer speeds by integrating multiple logic layers within a compact structure. This involves techniques such as die-to-die, die-to-wafer, wafer-to-wafer, chip-to-chip, and chip-to-wafer, using interconnection technologies such as 3D hybrid bonding, 3D through-silicon vias (TSV), and monolithic 3D integration. These methods are applied across various industries, including consumer electronics, healthcare, manufacturing, communications, automotive, and more.

The 3D stacking market research report is one of a series of new reports from The Business Research Company that provides 3D stacking market statistics, including 3D stacking industry global market size, regional shares, competitors with a 3D stacking market share, detailed 3D stacking market segments, market trends and opportunities, and any further data you may need to thrive in the 3D stacking industry. This 3D stacking market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The 3D stacking market size has grown rapidly in recent years. It will grow from $1.64 billion in 2024 to $1.93 billion in 2025 at a compound annual growth rate (CAGR) of 17.6%. The growth during the historic period can be attributed to factors such as the increasing need for high-performance memory and storage in various applications, rising demand for efficient processing power, a growing need for compact packaging solutions, a heightened interest in heterogeneous integration, and the growing adoption of edge computing.

The 3D stacking market size is expected to see rapid growth in the next few years. It will grow to $3.65 billion in 2029 at a compound annual growth rate (CAGR) of 17.3%. The growth during the forecast period can be attributed to factors such as the rising demand for energy-efficient components, expanding applications in emerging technologies, increasing need for miniaturized electronic products, growing demand for light-emitting diodes, and the increasing complexity of electronic devices. Key trends expected in this period include advanced packaging techniques, strategic collaborations, advancements in memory technologies, innovations in semiconductor manufacturing techniques, and increased investment in research and development.

The growing demand for LEDs is expected to drive the growth of the 3D stacking market. LED, or light-emitting diode, is a semiconductor device that produces light when an electric current flows through it. The demand for LEDs is increasing due to their energy efficiency, long lifespan, and environmental advantages over traditional lighting. 3D stacking improves LED performance by allowing for higher integration density, better thermal management, reduced power consumption, and enhanced optical efficiency. This makes it crucial for advanced lighting, display, and miniaturized electronics. For example, in July 2023, the International Energy Agency, a France-based autonomous intergovernmental organization, reported that the efficiency of new LEDs is improving steadily, with expectations to reach approximately 140 lm/W by 2030, around 30% higher than the 2022 average, in line with the Net Zero Scenario. Therefore, the rising demand for LEDs is driving the growth of the 3D stacking market.

Companies in the 3D stacking market are focusing on technological innovations, such as 3D stacked application-specific integrated circuit (ASIC) architecture, to improve power efficiency and enable high-bandwidth 3D memory integration. This architecture vertically stacks multiple ASIC layers, interconnected using through-silicon vias (TSVs) or other methods, to enhance performance, increase density, and reduce power consumption compared to traditional 2D designs. For example, in December 2024, Nano Labs Ltd., a China-based integrated circuit design company, introduced the FPU3.0, an ASIC architecture aimed at improving artificial intelligence (AI) inference and blockchain performance. Using advanced 3D DRAM stacking technology, the FPU3.0 offers a fivefold improvement in power efficiency compared to the FPU2.0, setting a new standard for high-performance, energy-efficient ASICs. This breakthrough underscores the company's commitment to advancing technology and supporting the growth of AI and cryptocurrency applications.

In October 2024, Merck KGaA, a Germany-based science and technology company, acquired Unity-SC for $161.79 million. This acquisition enhances Merck's semiconductor capabilities by integrating advanced metrology and inspection solutions, which improve the quality, yield, and efficiency of next-generation chip manufacturing. The move strengthens Merck's expertise in optics and semiconductors, positioning its Electronics business to advance AI, HPC, and HBM applications. Unity-SC, a France-based company specializing in semiconductor metrology and inspection technology, focuses on 3D stacking of chiplets for advanced packaging.

Major players in the 3d stacking market are Samsung Electronics Co. Ltd., Sony Group Corporation, Taiwan Semiconductor Manufacturing Company Ltd., Intel Corporation, International Business Machines Corporation, Qualcomm Technologies Inc., Broadcom Inc., Micron Technology Inc., Advanced Micro Devices Inc., ASML Holding N.V., ASE Technology Holding Co. Ltd., Toshiba Corporation, Texas Instruments Incorporated, Western Digital Technologies Inc., Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., JCET Group, Entegris Inc., Imec, Xperi Inc., Nano Labs Ltd., 3D Plus, and Tezzaron.

Asia Pacific was the largest region in the 3D stacking market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in 3D stacking report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

The countries covered in the 3D stacking market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The 3D stacking market consists of sales of stacked chips, memory modules, interposers, packaging materials, and semiconductor wafers. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

3D Stacking Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on 3d stacking market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

Where is the largest and fastest growing market for 3d stacking ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The 3d stacking market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

Scope

Table of Contents

1. Executive Summary

2. 3D Stacking Market Characteristics

3. 3D Stacking Market Trends And Strategies

4. 3D Stacking Market - Macro Economic Scenario Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics And Covid And Recovery On The Market

5. Global 3D Stacking Growth Analysis And Strategic Analysis Framework

6. 3D Stacking Market Segmentation

7. 3D Stacking Market Regional And Country Analysis

8. Asia-Pacific 3D Stacking Market

9. China 3D Stacking Market

10. India 3D Stacking Market

11. Japan 3D Stacking Market

12. Australia 3D Stacking Market

13. Indonesia 3D Stacking Market

14. South Korea 3D Stacking Market

15. Western Europe 3D Stacking Market

16. UK 3D Stacking Market

17. Germany 3D Stacking Market

18. France 3D Stacking Market

19. Italy 3D Stacking Market

20. Spain 3D Stacking Market

21. Eastern Europe 3D Stacking Market

22. Russia 3D Stacking Market

23. North America 3D Stacking Market

24. USA 3D Stacking Market

25. Canada 3D Stacking Market

26. South America 3D Stacking Market

27. Brazil 3D Stacking Market

28. Middle East 3D Stacking Market

29. Africa 3D Stacking Market

30. 3D Stacking Market Competitive Landscape And Company Profiles

31. 3D Stacking Market Other Major And Innovative Companies

32. Global 3D Stacking Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The 3D Stacking Market

34. Recent Developments In The 3D Stacking Market

35. 3D Stacking Market High Potential Countries, Segments and Strategies

36. Appendix

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