WLCSP Electroless Plating Global Market Report 2025
상품코드:1678646
리서치사:The Business Research Company
발행일:On Demand Report
페이지 정보:영문 200 Pages
라이선스 & 가격 (부가세 별도)
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한글목차
WLCSP 무전해도금 시장 규모는 향후 몇 년 동안 빠르게 성장할 것으로 예상되며, 2029년에는 CAGR 10.2%로 38억 9,000만 달러에 달할 것으로 예상됩니다. 예측 기간 동안의 성장은 차량용 전자제품의 발전, 5G 기술의 통합, IoT의 성장, 웨어러블 수요 증가, AI 장치의 확대, 에너지 효율이 높은 전자제품에 기인하는 것으로 추정됩니다. 예측 기간의 주요 동향으로는 고속 및 고주파 애플리케이션에 대한 집중, 열 관리 강화에 대한 수요, 5G 기술 도입 증가, 특정 산업 요구사항에 대한 맞춤화, 환경적 지속가능성에 대한 관심 등이 있습니다.
5G 네트워크의 성장은 향후 몇 년 동안 WLCSP 무전해도금 시장의 성장을 촉진할 것으로 예상됩니다. 이러한 성장은 주로 더 빠른 데이터 통신, 네트워크 신뢰성 향상, 사물인터넷(IoT) 연결성 향상, 증강현실(AR), 가상현실(VR), 자율주행차 등 신흥 기술을 지원해야 할 필요성이 증가함에 따라 5G 네트워크의 개발로 인해 고성능, 소형화된 부품이 필요하게 되었습니다. 소형 기기의 데이터 처리 속도와 연결성 향상을 촉진하기 위해 정밀하고 신뢰할 수 있는 도금 솔루션이 필요하기 때문에 WLCSP 무전해도금에 대한 수요가 증가할 것입니다. 예를 들어, 2023년 2월 독일에 본사를 둔 이동통신사 T-Mobile International AG는 활성 5G 계약이 10억 건을 넘어 섰다고보고했으며 2028년 말까지 50억 명이 5G 계약을 체결 할 것으로 예상했습니다. 따라서 5G 네트워크의 확장은 WLCSP 무전해도금 시장을 크게 견인하고 있습니다.
WLCSP(웨이퍼 레벨 칩 스케일 패키지) 무전해도금 시장의 급격한 성장은 전 세계 전자제품 제조의 확대에 힘입은 것입니다. 전자 제조에는 전자부품, 장치 및 시스템의 대규모 생산이 포함됩니다. 소비자 전자제품, 통신 장비, 산업용 애플리케이션에 의해 주도되는 전자제품 제조의 세계 활성화는 무전해도금에서 지지를 받고 있습니다. 이 공정은 정확한 범프 형성, 언더필 밀봉, 패시베이션을 용이하게 하여 다양한 전자 애플리케이션을 위한 신뢰할 수 있는 고성능 WLCSP 패키지를 제작할 수 있습니다. 예를 들어, 어스웹(Earthweb)이 2023년 2월에 보고한 바에 따르면, 세계 최대 PC 판매업체인 레노버(Lenovo)는 2022년 3분기에 약 1,700만 대의 PC 판매량을 기록했습니다. 이 수치는 HP의 1,271만 대, 애플의 580만 대, 델의 1,202만 대를 상회합니다. 따라서 전 세계 전자 제조 산업의 호황은 여전히 WLCSP 무전해도금 시장의 성장 원동력이 되고 있습니다.
목차
제1장 주요 요약
제2장 시장 특징
제3장 시장 동향과 전략
제4장 시장 - 거시경제 시나리오 금리, 인플레이션, 지정학, 코로나, 회복이 시장에 미치는 영향을 포함한 거시경제 시나리오
제5장 세계의 성장 분석과 전략 분석 프레임워크
세계 WLCSP 무전해도금 PESTEL 분석(정치, 사회, 기술, 환경, 법적 요인, 촉진요인, 억제요인)
최종 이용 산업 분석
세계의 WLCSP 무전해도금 시장 : 성장률 분석
세계의 WLCSP 무전해도금 시장 실적 : 규모와 성장, 2019-2024
세계의 WLCSP 무전해도금 시장 예측 : 규모와 성장, 2024-2029, 2034F
세계 WLCSP 무전해도금 전체 시장(TAM)
제6장 시장 세분화
세계의 WLCSP 무전해도금 시장 : 유형별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
니켈
구리
복합재료
기타 유형
세계의 WLCSP 무전해도금 시장 : 용도별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
내부식성
내마모성
외관
납땜성
기타(전도성 향상을 포함)
세계의 WLCSP 무전해도금 시장 : 최종사용자별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
자동차
일렉트로닉스
항공우주
기계
기타 최종사용자
세계의 WLCSP 무전해도금 시장, 니켈 하위 세분화, 유형별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
무전해 니켈 도금
니켈 기반 합금
세계의 WLCSP 무전해도금 시장, 구리 종류별 하위 세분화, 실적과 예측, 2019-2024, 2024-2029F, 2034F
무전해 구리 도금
구리 기반 합금
세계의 WLCSP 무전해도금 시장, 복합재료 하위 세분화, 유형별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
니켈 구리 복합재료
기타 복합재료
세계의 WLCSP 무전해도금 시장, 기타 유형 하위 세분화, 유형별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
금도금
은도금
특수 합금
제7장 지역별·국가별 분석
세계의 WLCSP 무전해도금 시장 : 지역별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
세계의 WLCSP 무전해도금 시장 : 국가별, 실적과 예측, 2019-2024, 2024-2029F, 2034F
제8장 아시아태평양 시장
제9장 중국 시장
제10장 인도 시장
제11장 일본 시장
제12장 호주 시장
제13장 인도네시아 시장
제14장 한국 시장
제15장 서유럽 시장
제16장 영국 시장
제17장 독일 시장
제18장 프랑스 시장
제19장 이탈리아 시장
제20장 스페인 시장
제21장 동유럽 시장
제22장 러시아 시장
제23장 북미 시장
제24장 미국 시장
제25장 캐나다 시장
제26장 남미 시장
제27장 브라질 시장
제28장 중동 시장
제29장 아프리카 시장
제30장 경쟁 구도와 기업 개요
WLCSP 무전해도금 시장 : 경쟁 구도
WLCSP 무전해도금 시장 : 기업 개요
Heraeus Holding GmbH Overview, Products and Services, Strategy and Financial Analysis
DuPont de Nemours Inc. Overview, Products and Services, Strategy and Financial Analysis
Olin Corporation Overview, Products and Services, Strategy and Financial Analysis
Rockwell Automation Inc. Overview, Products and Services, Strategy and Financial Analysis
Shanghai Aiko Chemical Co Ltd. Overview, Products and Services, Strategy and Financial Analysis
제31장 기타 주요 기업과 혁신적 기업
MKS Instruments Inc.
MacDermid Inc.
Shikoku Chemicals Corporation
Atotech Deutschland GmbH
Nihon Parkerizing Co Ltd.
C. Uyemura & Co Ltd.
Enthone Inc.
Nippon Seisen Kogyo Co Ltd.
Coventya International GmbH
Park Chemical Corporation
Allied Finishing Inc.
Nanophase Technologies Corporation
Precision Plating Co
ERIE PLATING COMPANY
Harwick Standard Distributors Inc.
제32장 세계의 시장 경쟁 벤치마킹과 대시보드
제33장 주요 인수합병
제34장 최근의 시장 동향
제35장 시장 잠재력이 높은 국가, 부문, 전략
WLCSP 무전해도금 시장 2029 : 새로운 기회를 제공하는 국가
WLCSP 무전해도금 시장 2029 : 새로운 기회를 제공하는 부문
WLCSP 무전해도금 시장 2029 : 성장 전략
시장 동향에 기반한 전략
경쟁 전략
제36장 부록
ksm
영문 목차
영문목차
WLCSP electroless plating is a true chip-scale packaging technology that minimizes package size and enhances thermal conduction in chips, connecting the printed circuit board using solder balls.
In the WLCSP (wafer-level chip-scale packaging) electroless plating market, the main types of plating are nickel, copper, composites, and others. Nickel is a lustrous silvery-white metal used to protect parts from natural wear, abrasion, and corrosion. It finds applications in corrosion resistance, wear resistance, appearance enhancement, solderability improvement, and other areas requiring enhanced conductivity. Industries that utilize nickel electroless plating include automotive, electronics, aerospace, machinery, and others.
The WLCSP electroless plating market research report is one of a series of new reports from The Business Research Company that provides WLCSP electroless plating market statistics, including WLCSP electroless plating industry global market size, regional shares, competitors with a WLCSP electroless plating market share, detailed WLCSP electroless plating market segments, market trends and opportunities, and any further data you may need to thrive in the WLCSP electroless plating industry. This WLCSP electroless plating market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The WLCSP electroless plating market size has grown strongly in recent years. It will grow from $2.41 billion in 2024 to $2.64 billion in 2025 at a compound annual growth rate (CAGR) of 9.4%. The growth in the historic period can be attributed to semiconductor industry growth, miniaturization trends, consumer electronics demand, automotive electronics, high-performance computing.
The WLCSP electroless plating market size is expected to see rapid growth in the next few years. It will grow to $3.89 billion in 2029 at a compound annual growth rate (CAGR) of 10.2%. The growth in the forecast period can be attributed to advancements in automotive electronics, 5G technology integration, IoT growth, rising demand for wearables, expansion of AI devices, energy-efficient electronics. Major trends in the forecast period include focus on high-speed and high-frequency applications, demand for enhanced thermal management, rise in 5G technology implementation, customization for specific industry requirements, focus on environmental sustainability.
The growth of 5G networks is anticipated to drive the expansion of the WLCSP electroless plating market in the coming years. This growth is primarily due to the rising demand for higher data speeds, enhanced network reliability, improved connectivity for the Internet of Things (IoT), and the necessity to support emerging technologies like augmented reality (AR), virtual reality (VR), and autonomous vehicles. The development of 5G networks boosts the demand for WLCSP electroless plating by necessitating high-performance, miniaturized components that require precise and reliable plating solutions to facilitate faster data processing and improved connectivity in compact devices. For instance, in February 2023, T-Mobile International AG, a Germany-based mobile telecommunications company, reported that there were over 1 billion active 5G subscriptions, with projections indicating that 5 billion individuals will have 5G subscriptions by the end of 2028. Hence, the expansion of 5G networks is significantly driving the WLCSP electroless plating market.
The anticipated surge in the WLCSP (wafer-level chip-scale package) electroless plating market is propelled by the global escalation in electronics manufacturing. Electronics manufacturing involves the large-scale production of electronic components, devices, and systems. The heightened global activity in electronics manufacturing, driven by consumer electronics, communication devices, and industrial applications, finds support in electroless plating. This process facilitates precise bump formation, underfill encapsulation, and passivation, enabling the creation of dependable, high-performance WLCSP packages for a diverse array of electronic applications. For example, as reported by Earthweb Inc. in February 2023, Lenovo, the world's largest PC seller, recorded sales of approximately 17 million computers in the third quarter of 2022. This figure surpasses HP's 12.71 million, Apple's 5.80 million, and Dell's 12.02 million shipments. Hence, the global upswing in electronics manufacturing remains the driving force behind the growth of the WLCSP electroless plating market.
Product innovation is a significant trend in the WLCSP (Wafer-Level Chip Scale Package) electroless plating market, with major players focusing on developing new products to enhance their position. For example, in January 2023, TWI Ltd., a UK-based technology engineering company, introduced an electroless nickel-phosphorus plating (ENP) composite coating. ENP coating finds applications in various sectors such as aviation, oil and gas, geothermal energy, construction, and electronics due to its exceptional mechanical and tribological properties, including high hardness, wear resistance, and corrosion resistance. The resilience to damage and deterioration, as well as antifouling and anti-scaling properties of ENP coatings, can be controlled by modifying the microstructure through methods such as altering the alloy chemistry (e.g., phosphorus concentration, including nanoparticles) and post-plating heat treatment. Additionally, nanoparticles can enhance coating properties such as hydrophobicity, hardness, wear resistance, and low coefficient of friction (CTE).
Leading companies in the WLCSP (wafer-level chip scale package) electroless plating market are concentrating on expanding their facilities to better cater to the needs of their existing consumers. A manufacturing facility is a building or complex where raw materials are transformed into finished goods. For example, in October 2023, Amkor Technology, Inc., a US-based company specializing in WLCSP electroless plating, revealed plans for the construction of a new facility in Vietnam. This Vietnam campus is set to become Amkor's largest factory, covering an extensive 57-acre area within the Yen Phong 2C Industrial Park. Amkor has allocated an investment of US$1.6 billion for the first two phases of the project, which includes facilities, machinery, and equipment. This significant investment in manufacturing in Vietnam will enable Amkor to offer an unparalleled geographic footprint to its clients, serving both global and regional supply chains. It will provide the secure and reliable supply chain that clients in communications, automotive, high-performance computing, and other critical sectors seek.
In January 2023, LB Semicon, a South Korea-based semiconductor chip manufacturing company, acquired the VertaCure XP G2 system from Yield Engineering Systems, Inc. for an undisclosed sum. This acquisition was aimed at enhancing LB Semicon's capabilities in the bump/RDL application for wafer-level chip-scale packaging (WLCSP). The VertaCure XP G2 system is known for its improved throughput, excellent particle performance, and comprehensive PI/PBO curing capabilities, all of which are attributed to its established vacuum-based method. Yield Engineering Systems, Inc., based in the US, specializes in manufacturing equipment that supports wafer-level chip-scale packaging.
Major companies operating in the WLCSP electroless plating market include Heraeus Holding GmbH, DuPont de Nemours Inc., Olin Corporation, Rockwell Automation Inc., Shanghai Aiko Chemical Co Ltd., MKS Instruments Inc., MacDermid Inc., Shikoku Chemicals Corporation, Atotech Deutschland GmbH, Nihon Parkerizing Co Ltd., C. Uyemura & Co Ltd., Enthone Inc., Nippon Seisen Kogyo Co Ltd., Coventya International GmbH, Park Chemical Corporation, Allied Finishing Inc., Nanophase Technologies Corporation, Precision Plating Co, ERIE PLATING COMPANY, Harwick Standard Distributors Inc., KC Jones Plating Company, ARC Technologies Inc., Klein Plating Works Inc., Bales Metal Surface Solutions, Peninsula Metal Finishing Inc., Okuno Chemical Industries Co Ltd., Bajaj Electroplaters Private Limited, Electroless Nickel Inc., Plating Specialties Inc., Surface Technology Inc., Umicore N.V., Uyemura Kogyo Co Ltd., VATEC Co Ltd.
Europe was the largest region in the WLCSP electroless plating market in 2024. Asia-Pacific is expected to be the fastest-growing region in the WLCSP electroless plating market report during the forecast period. The regions covered in the wlcsp electroless plating market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the wlcsp electroless plating market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The WLCSP electroless plating market consists of revenues earned by entities by providing WLCSP electroless plating services such as layout & mask tooling, wafer RDL patterning and bumping (ball sphere loaded or plated), automated optical inspection (AOI) for quality assurance and wafer map generation. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
WLCSP Electroless Plating Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses on wlcsp electroless plating market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Where is the largest and fastest growing market for wlcsp electroless plating ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The wlcsp electroless plating market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
The market characteristics section of the report defines and explains the market.
The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
The forecasts are made after considering the major factors currently impacting the market. These include:
The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.
Market segmentations break down the market into sub markets.
The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:1) By Type: Nickel; Copper; Composites; Other Types
3. WLCSP Electroless Plating Market Trends And Strategies
4. WLCSP Electroless Plating Market - Macro Economic Scenario Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics And Covid And Recovery On The Market
5. Global WLCSP Electroless Plating Growth Analysis And Strategic Analysis Framework
5.1. Global WLCSP Electroless Plating PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
5.2. Analysis Of End Use Industries
5.3. Global WLCSP Electroless Plating Market Growth Rate Analysis
5.4. Global WLCSP Electroless Plating Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
5.5. Global WLCSP Electroless Plating Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
5.6. Global WLCSP Electroless Plating Total Addressable Market (TAM)
6. WLCSP Electroless Plating Market Segmentation
6.1. Global WLCSP Electroless Plating Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Nickel
Copper
Composites
Other Types
6.2. Global WLCSP Electroless Plating Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Corrosion Resistance
Wear Resistance
Appearance
Solderability
Others (including Enhanced Conductivity)
6.3. Global WLCSP Electroless Plating Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Automotive
Electronics
Aerospace
Machinery
Other End Users
6.4. Global WLCSP Electroless Plating Market, Sub-Segmentation Of Nickel, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Electroless Nickel Plating
Nickel-Based Alloys
6.5. Global WLCSP Electroless Plating Market, Sub-Segmentation Of Copper, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Electroless Copper Plating
Copper-Based Alloys
6.6. Global WLCSP Electroless Plating Market, Sub-Segmentation Of Composites, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Nickel-Copper Composites
Other Composite Materials
6.7. Global WLCSP Electroless Plating Market, Sub-Segmentation Of Other Types, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
Gold Plating
Silver Plating
Specialty Alloys
7. WLCSP Electroless Plating Market Regional And Country Analysis
7.1. Global WLCSP Electroless Plating Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
7.2. Global WLCSP Electroless Plating Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
