3D 일렉트로닉스 프린팅(3D EP) 시장 규모는 향후 수년간 큰 성장이 전망됩니다. 이것은 3D 일렉트로닉스 프린팅 용도의 지속적 발전과 실증과 함께 프린팅 기술과 플랫폼 기능의 진보에 의한 것입니다. 이 시장의 10년간 CAGR은 37%로 예측됩니다. 3D 일렉트로닉스 프린팅의 시장 규모도 확대하고 있으며, 2023년 시장 규모는 3억 달러로, 2033년에는 79억 달러로 확대할 전망입니다.
3D 프린티드 일렉트로닉스 시장에 대해 조사했으며, 시장 성장에 대한 과제, 시장에 참여하는 주요 기업, 상세 시장 데이터와 예측에 대해 해설하고 있습니다.
목차
주요 요약
제1장 동향, 기회, 과제
- 이 리포트의 배경과 맥락
- 리포트 읽기
- 3D 프린팅 일렉트로닉스 분야의 동향, 기회, 과제
- 3D 프린팅 일렉트로닉스 기술과 응용의 현재 및 향후 가능성
- 현재의 경쟁 구도 매핑
- 업계의 미래와 성장의 기회 예측
- 현재의 3D 프린팅 일렉트로닉스 공간
- 사내 PCB 프로토타이핑을 이동
- 업계의 방향성을 좌우하는 주목할 만한 동향
- 지속가능성
- 시작시 재료 소비량의 삭감
- 디자인별 재활용 가능성
- 디바이스 소형화에 의해 수명주기에 대한 영향을 경감
- 공급망 보안과 압축
- 기존 3D 프린팅으로 반도체 제조를 지원
- 반도체(CHIP)를 생산하기 위한 유익한 인센티브 창출에 관한 법률
- 기회
- 사물인터넷
- IoT 디바이스내 안테나의 컨포멀 인쇄
- 볼류메트릭 IoT
- 플렉서블 IoT
- 소량 다품종 일렉트로닉스가 더욱 더 실현 가능하게 된다.
- 전자기기의 소형화
- 상호 접속
- 패시브
- 임베디드 및 스택 컴포넌트와 수직통합형 IC
- 사내 프로토타이핑으로의 이동별 지적재산 보호
- 디자인의 자유
- 상부, 저부, 측면에 장착된 컴포넌트에 의해 회로기판에 다른 각도가 추가
- 다방향 비아별 고밀도 배선
- 과제
- 양산
- 인쇄 프로세스에서의 SMT 통합에 의해 생산량을 극복
- 재료 개발을 계속한다.
- 3D 프린트 일렉트로닉스용 심리스 디지털 스레드를 구축
- 전자 컴퓨터 지원 설계와 기계 컴퓨터 지원 설계의 경계선이 모호해지기 시작한다.
- 갭을 메우는 새로운 소프트웨어 솔루션
제2장 기술, 응용, 시장
- 기술
- 전도성 재료 인쇄 기술
- 폴리머 분말상 융합
- 액층 광중합
- 정전기 제거 재료 인쇄 기술
- 폴리머 분말상 융합
- 액층 광중합
- 재료 압출
- 3D 전자 인쇄 기술
- 잉크젯 인쇄
- 에어로졸 제트 인쇄
- 압출 기반 인쇄
- 재료
- 전도성 잉크
- 은나노입자 잉크
- 압출재와 제한사항
- 유전체 잉크 및 수지
- 응용
- 인쇄회로기판
- 3D 프린트 다층 PCB
- 인쇄회로기판의 미래
- 커넥터와 상호 접속
- 안테나, 앰프, 트랜시버
- 첨단 안테나 제작을 지지하는 3DEP
- 차세대 안테나의 멀티 매트리얼 인쇄
- 6G의 부상
- 커패시터
- 센서
- 양자 센서
- PCB를 초월 : 차세대 컴포넌트와 응용에서의 3DEP 혁신
- 옵토일렉트로닉스
- 배터리
- 랩온어칩
제3장 시장 참여 기업
- Nano Dimension
- Technology-Dragonfly IV
- Optomec
- Aerosol Jet
- Bot Factory
- Ceradrop
- Chemcubed
- NeoTech
- PV Nanocell
- Voltera
- Fujifilm Corporation
- Panasonic
- Additive Electronics
- Notion Systems
- nScrypt
- Nano3DPrint
제4장 10년간의 예측
- 조사 방법
- 가격결정
- 서비스 매출
- 업계
- 3D 프린터의 분류
- 시장 전체
- 적층 가공 연구 소개
- 애널리스트 소개
- 이 리포트에서 사용되는 두자어와 약어
KSA
The 3D electronics printing (3DEP) market is expected to experience significant growth in the coming years. This is due to the advancements in printing technology and platform capability, alongside the ongoing development and demonstration of the applications of 3D electronics printing. The market is projected to achieve a 10-year CAGR of 37%. The market size for 3D electronics printing is also expanding, with an estimated total market value of $0.3 billion in 2023, which is expected to increase to $7.9 billion by 2033.
This report describes the value propositions of 3DEP, the challenges to market growth, key players in the 3DEP space, and detailed market data and forecasting.
Companies or organizations covered in this report include, but are not limited to: Ceradrop, Nano Dimension, NeoTech, Optomec, FujiFilm, Voltera, BotFactory, nScrypt, J.A.M.E.S., NextFlex, ChemCubed, PV Nanocell, Panasonic, Additive Electronics, Nano3DPrint, and Notion Systems.
Table of Contents
Executive Summary
- Defining the value propositions of 3D Electronics Printing
- Miniaturisation
- Design Freedom
- Reshoring and localisation9
- Sustainability
- Challenges to market growth
- Key players in the 3D Electronics Printing Space
- The industry remains consolidated around a small number of player
- Low-cost 3DEP providers reduce barriers to entry
- Forecasting the growth of the market
Chapter One: Trends, opportunities and challenges
- Background and context to this report
- Reading this report
- Trends, Opportunities, and challenges in the 3D printing electronics space
- The current and future potential for 3D printing electronics technologies and applications
- Mapping the current competitive landscape
- Building a future view of the industry and forecasting its opportunity for growth
- The current 3D printing electronics space
- 3D Electronics Printing prepares to move from the lab to the factory
- Electronics prototyping remains the go-to application
- Moving PCB prototyping in-house
- Standing at the precipice of commercial 3D printed electronics
- Notable trends driving the direction of the industry
- Sustainability
- Reducing material consumption in prototyping
- Recyclability through design
- Miniaturisation of devices reducing life cycle impact
- Supply Chain security and compression
- Supporting Semiconductor production using conventional 3D printing
- Creating helpful incentives to produce semiconductors (CHIPs) act
- Opportunities
- Internet of things
- Conformal printing of antenna within IoT devices
- Volumetric IoT
- Flexible IoT
- Low volume, high mix electronics become increasingly viable
- Miniaturisation of electronics
- Off-setting the limitations of physics through compact circuit design
- Interconnects
- Passives
- Embedded and stacked components and vertically integrated ICs
- Protecting Intellectual Property via moving to in-house prototyping
- Freedom of Design
- Top, bottom and side-mounted components, adding another angle to circuit boards
- Higher density routing with multi-directional vias
- Challenges
- Volume production
- Overcoming production volume with SMT integration in the print process
- Continuing materials development
- Building a seamless digital thread for 3D printed electronics
- Delineation of electronic computer-aided design and mechanical computer-aided design begin to blur
- Emerging software solutions to bridge the gap
Chapter Two: Technology, Applications and Markets
- Technologies
- Technologies capable of printing conductive materials
- Polymer Powder Bed Fusion
- Vat Photopolymerization
- Technologies capable of printing static-dissipative materials
- Polymer Powder Bed Fusion
- Vat Photopolymerisation
- Material Extrusion
- 3D Electronic Printing Technologies
- Inkjet Printing
- Aerosol Jet Printing
- Extrusion-Based Printing
- Materials
- Conductive Inks
- Silver Nanoparticle Inks
- Extrusion materials and limitations
- Dielectric inks and resins
- Applications
- PCBs
- 3D printed multi-layer PCBs
- Future of printed PCBs
- Connectors and Interconnects
- Antennas, Amplifiers and Transceiver
- 3DEP supporting advanced antenna production
- Multi-material printing of next-generation antenna
- Rise of 6G
- Capacitors
- Sensors
- Quantum sensors
- Beyond the PCB: 3DEP innovations in next-generation components and applications
- Optoelectronics
- Batteries
- Lab-on-chips
Chapter Three: Market players
- Nano Dimension, Israel, 2012
- Nano Dimensions attempts to acquire Stratasys
- Financial performance
- Technology-Dragonfly IV
- Materials
- Partnerships
- Optomec, United States, 1997
- Technology
- Aerosol Jet Printer Portfolio
- Aerosol jet HD2
- Aerosol Jet AJ Flex
- Aerosol Jet Print Engine
- Bot Factory, United States, 2013
- Ceradrop, France, 2006
- Ceradrop Technology
- F-serie
- X-Serie
- Industrial platform
- Chemcubed, United States, 2014
- NeoTech, Germany, 2006
- Technology
- 15X BT
- 45XG4
- PV Nanocell, Israel, 2010
- Voltera, Canada, 2013
- Fujifilm Corporation, Japan, 1934
- Technology
- Panasonic, Japan, 1918
- Additive Electronics, Germany, 2022
- Notion Systems, Germany, 2012
- nScrypt, United States, 2002
- Nano3DPrint, United States, 2013
- Entry into the professional space with the D4200S
Chapter Four: Ten year forecasts
- Methodology
- Pricing
- Service revenue
- Industry
- 3D printer categorisation
- Total market
- Exhibit 4.1: Total market for 3D Electronics Printing, by USD$ revenue
- Exhibit 4.2: Total market for 3D Electronics Printing, by USD$ share
- Exhibit 4.3: Total market for 3D Electronics Printing, by YoY growth change Hardware
- Exhibit 4.4: 3D Electronics Printing Hardware Growth, by revenue and YoY change
- Exhibit 4.5: 3D Electronics Printing Hardware Growth, by printer type
- Exhibit 4.6: 3D Electronics Printing Hardware Shipments and Install Base
- Exhibit 4.7: 3D Electronics Printing Hardware Shipments by Printer Category
- Exhibit 4.8: 3D Electronics Printing Install Base by Printer Category
- Exhibit 4.9: 3D Electronics Printing Hardware, by Industry
- Exhibit 4.10: 3D Electronics Printing Hardware, by Industry Share Material
- Exhibit 4.11: 3D Electronics Printing Material Revenue Growth and Year-on-Year Growth
- Exhibit 4.12: 3D Electronics Printing Material Revenue by Material Type
- Exhibit 4.13: 3D Electronics Printing Material Revenue Share by Type
- Exhibit 4.14: 3D Electronics Printing Material Revenue by Printer Category
- Exhibit 4.15: 3D Electronics Printing Material Revenue by Printer Category Share
- Exhibit 4.16: 3D Electronics Printing Material Revenue by industry Services
- Exhibit 4.17: 3D Electronics Printing Service Revenue Growth and Year-on-Year Growth
- Exhibit 4.18: 3D Electronics Printing Service Revenue by provider
- Exhibit 4.19: 3D Electronics Printing Service Revenue by Share
- About Additive Manufacturing Research
- About the Analyst
- Acronyms and Abbreviations Used In this Report
