Stratistics MRC에 따르면 세계의 전자 부품 시장은 2025년 4,424억 달러를 차지하며 예측 기간 동안 12.4%의 연평균 복합 성장률(CAGR)로 성장해 2032년까지 1조 27억 달러에 달할 것으로 예측됩니다.
전자부품은 전기회로의 기본적인 구성요소이며, 전기신호를 조정, 제어, 전송하도록 설계되어 있습니다. 이러한 부품은 통신, 자동차, 소비자 전자공학, 산업용 자동화 등 다양한 산업의 전자기기의 기능을 실현하고 있습니다.
IEA의 Global Electric Vehicle Outlook에 따르면 2022년에는 세계에서 1,000만대 이상의 전기차가 판매됐으며, 판매 대수는 35%, 1,400만대 증가할 것으로 예상되고 있습니다.
소비자 일렉트로닉스의 폭발적인 성장
스마트폰, 웨어러블, 스마트 홈 디바이스의 보급이 반도체 기술의 혁신을 촉진하고 있습니다. 소형화 동향과 AI 탑재 기능의 통합이 부품 개발을 한층 더 가속시키고 있습니다.
부품의 진부화와 짧은 제품 수명주기의 위험
제조업체 각사는 진화하는 업계 표준에 대응하기 위해, 계속적으로 설계를 갱신할 필요가 있어, 이것이 제조 비용을 밀어 올립니다. 또한, 소비자의 선호의 급속한 변화나 새로운 기술에 의해 기존의 부품이 시대 지연이 될 가능성도 있습니다.이 과제는 차세대 시스템과의 호환성이 중요한 통신과 자동차 등의 분야에서 특히
현지 생산에 대한 정부의 이니셔티브와 인센티브
세금 우대, 보조금, 인프라 개발 등의 인센티브는 기업이 현지에 생산 시설을 설립하도록 장려하고 있습니다. 또한, 반도체 제조 및 연구 개발에 대한 투자는 혁신을 촉진하고 제조업체가 최첨단 전자 부품을 개발할 수 있도록 돕습니다.
표준 부품의 치열한 가격 경쟁과 경쟁
저항기와 커패시터와 같은 표준 부품은 대량 생산되므로 제조업체 간의 비용 경쟁이 치열해집니다.
COVID-19 팬데믹은 세계공급망을 혼란시켜 전자부품의 입수에 영향을 주었습니다. 디지털 전환을 가속화하여 반도체와 커넥티비티 솔루션 수요를 증대시켰습니다.
예측 기간 동안 액티브 컴포넌트 부서가 최대화될 전망
증폭, 스위칭, 에너지 변환 등의 전자 회로 기능에서 중요한 역할을 하기 때문에 예측 기간 동안 능동 부품 분야가 최대 시장 점유율을 차지할 것으로 예측됩니다. 부품은 소비자 일렉트로닉스에서 자동차, 산업용 자동화에 이르기까지 다양한 용도로 필수적입니다.
예측 기간 동안 표면실장기술(SMT) 분야의 CAGR이 가장 높아질 전망
예측 기간 동안 표면실장기술(SMT) 분야는 콤팩트하고 고밀도인 전자 어셈블리의 제조를 효율화할 수 있기 때문에 가장 높은 성장률을 나타낼 것으로 예측되고 있습니다.
예측 기간 동안 아시아태평양은 세계 전자 제조의 지배적인 지위에 견인되어 최대 시장 점유율을 차지할 것으로 예측됩니다. 이 지역은 강력한 인프라, 숙련된 노동력, 대규모 생산을 지원하는 유리한 정부 정책의 혜택을 받고 있습니다.
예측기간 중 북미지역은 차세대 기술에 대한 투자와 반도체 생산의 온쇼어링 증가로 가장 높은 CAGR을 보여줄 것으로 예측됩니다.
According to Stratistics MRC, the Global Electronic Components Market is accounted for $442.4 billion in 2025 and is expected to reach $1002.7 billion by 2032 growing at a CAGR of 12.4% during the forecast period. Electronic components are fundamental building blocks of electrical circuits, designed to regulate, control, or transmit electrical signals. They are categorized into active components (such as semiconductors and integrated circuits), passive components (including resistors, capacitors, and inductors), and electromechanical components (such as connectors and switches). These components enable the functionality of various electronic devices across industries, including telecommunications, automotive, consumer electronics, and industrial automation. Their efficient integration ensures performance optimization, power management, and signal processing in advanced electronic systems.
According to IEA's Global Electric Vehicle Outlook, more than 10 million electric cars will be sold globally in 2022, and the sales are expected to grow by another 35% or 14 million in the year. This explosive growth of electric cars' share of the overall car market has risen from 14% in 2022 and is set to increase further to 18% in 2023.
Explosive growth of consumer electronics
Increasing adoption of smartphones, wearables, and smart home devices is driving innovation in semiconductor technology. Miniaturization trends and the integration of AI-powered functionalities are further accelerating component development. Additionally, the rise of IoT-enabled devices and connected ecosystems is creating new opportunities for high-performance electronic components. As manufacturers focus on enhancing efficiency and reducing power consumption, the market is expected to witness sustained growth.
Risk of component obsolescence and short product lifecycles
Manufacturers must continuously update designs to keep pace with evolving industry standards, which adds to production costs. Additionally, rapid shifts in consumer preferences and emerging technologies can render existing components outdated. This challenge is particularly significant in sectors such as telecommunications and automotive, where compatibility with next-generation systems is crucial which impedes the market growth.
Government initiatives and incentives for local manufacturing
Incentives such as tax benefits, subsidies, and infrastructure development are encouraging companies to establish production facilities locally. These initiatives aim to reduce dependency on imports and strengthen supply chain resilience. Additionally, investments in semiconductor fabrication and research are fostering innovation, enabling manufacturers to develop cutting-edge electronic components. The push for self-reliance in electronics production is expected to drive long-term industry growth.
Intense price competition and commoditization of standard components
Standardized components, such as resistors and capacitors, are produced in high volumes, leading to aggressive cost competition among manufacturers. Companies must differentiate their offerings through technological advancements and value-added features to maintain profitability. Additionally, fluctuations in raw material costs and supply chain disruptions can impact pricing strategies leading to stunt market growth.
The COVID-19 pandemic disrupted global supply chains, affecting the availability of electronic components. Lockdowns and factory closures led to production delays, causing shortages in critical sectors such as automotive and consumer electronics. However, the crisis also accelerated digital transformation, increasing demand for semiconductors and connectivity solutions. Remote work, e-learning, and telemedicine drove the need for high-performance computing devices, boosting component sales.
The active components segment is expected to be the largest during the forecast period
The active components segment is expected to account for the largest market share during the forecast period owing to their critical role in electronic circuit functionality, including amplification, switching, and energy conversion. Components such as transistors, diodes, integrated circuits, and power management devices are essential across a wide spectrum of applications, from consumer electronics to automotive and industrial automation. Their rising usage in smart devices and energy-efficient systems has significantly increased demand.
The surface-mount technology (SMT) segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the surface-mount technology (SMT) segment is predicted to witness the highest growth rate due to its ability to streamline the manufacturing of compact and high-density electronic assemblies. SMT allows for the efficient placement of components directly onto printed circuit boards, improving mechanical performance and reducing production time. As devices become increasingly compact, this assembly method is becoming the preferred choice for manufacturers across sectors.
During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by its dominant position in global electronics manufacturing. Countries such as China, South Korea, Japan, and Taiwan host major semiconductor and electronic assembly hubs, supplying components to markets worldwide. The region benefits from a strong infrastructure, skilled workforce, and favorable government policies that support large-scale production. Additionally, rising consumer demand for advanced electronics within these economies further boosts internal consumption.
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR attributed to increasing investments in next-generation technologies and onshoring of semiconductor production. The region is seeing heightened demand for components used in aerospace, defense, 5G infrastructure, and electric vehicles, all of which require high reliability and performance. Government initiatives aimed at strengthening domestic semiconductor capabilities are also contributing to growth.
Key players in the market
Some of the key players in Electronic Components Market include Amphenol Corporation, TE Connectivity Ltd., Murata Manufacturing Co. Ltd, TDK Corporation, Corning Incorporated, Delta Electronics, Inc., Hon Hai Precision Industry Co. Ltd (Foxconn), Celestica Inc., E Ink Holdings, Inc., Unimicron Technology Corp, Shengyi Technology Co. Ltd, Chaozhou Three-Circle Group, Sunny Optical Technology Group Co Ltd, Fabrinet, Elite Material Co. Ltd, Jabil Inc., Flex Ltd., and LARGAN Precision Co., Ltd.
In May 2025, TDK accelerated the launch of its third-generation silicon anode batteries due to rising demand from smartphone manufacturers. These batteries offer higher energy density compared to conventional ones. A fourth-generation battery is planned for release next year.
In May 2025, Foxconn announced a partnership with NVIDIA to build a state-of-the-art AI Factory supercomputing center in Taiwan. This facility will provide advanced AI infrastructure to various sectors.
In April 2025, Fabrinet partnered with Innoviz Technologies to commence mass production of the InnovizTwo LiDAR product platform. This collaboration focuses on manufacturing both long-range and short-range LiDAR systems. The partnership aims to meet the growing demand for advanced driver-assistance systems.