Stratistics MRC에 따르면 세계 SOI(Silicon On Insulator) 시장은 2025년 17억 8,000만 달러를 차지하고 예측 기간 중 CAGR 17.3%로 확대되어 2032년까지 54억 6,000만 달러에 이를 전망입니다.
SOI(Silicon On Insulator) 제조 공정에서는 절연 기판(일반적으로 이산화규소) 위에 실리콘의 얇은 층을 퇴적시킵니다. RF 용도, 고속 또는 저전력 집적 회로 및 고급 마이크로프로세서는 모두 SOI 기술을 많이 사용합니다.
반도체 산업협회(SIA)에 따르면 2024년 세계 반도체 산업 매출은 6,276억 달러로 전년 대비 19.1% 증가했습니다.
자동차 일렉트로닉스 이용 확대
자율주행 기술, 커넥티드 자동차 에코시스템, 전기자동차(EV)의 출현은 자동차 산업에 변화를 가져오고 있습니다. 또한 SOI 디바이스가 제공하는 내구성과 장기적인 신뢰성은 AEC-Q100과 같은 자동차 규격에서 점점 평가되고 있습니다.
엄청난 생산비와 재료비
SOI 기술이 널리 사용되는 것을 방해하는 주요 장애물 중 하나는 제조 비용이 상대적으로 높다는 것입니다. 또한, SOI 기판은 층 두께를 정확하게 제어할 필요가 있어 여분의 절연 산화물층이 있기 때문에 그 비용은 훨씬 높아집니다.
자율주행차와 전기차 이용 확대
SOI 디바이스의 최대의 성장 기회의 하나는 급속하게 가속하는 전기자동차(EV)와 자율 주행 기술에의 시프트입니다. 이러한 자동차에는 높은 신뢰성을 가지고, 가혹한 조건이나 폭넓은 온도 범위에서 기능하는 일렉트로닉스가 필요합니다. 센서, 파워 매니지먼트 집적회로, 차량용 마이크로컨트롤러에 최적인 옵션입니다. 게다가 EV의 보급이 진행되어 신뢰성이 높고 전력 효율이 높은 반도체에 대한 수요가 높아짐에 따라, 특히 차재 전자 기기가 보다 소프트웨어 주도형이 되어 네트워크화됨에 따라 SOI 기술에는 장기적으로 큰 비즈니스 기회가 생길 것으로 예측됩니다.
다른 반도체 기술과의 경쟁 격화
SOI의 장점에도 불구하고, 다른 반도체 기술, 특히 FinFET과 첨단 벌크 CMOS는 심각한 위협이 되고 있습니다. 최적화를 통해 성숙도, 규모에 따른 비용 효율, 에코시스템 지원이라는 점에서 경쟁력이 있습니다. 또한, 벌크 실리콘 기술은 누설을 제어하고 보다 뛰어난 성능을 발휘하기 때문에 특히 비용에 민감한 대량 생산과 소비자 일렉트로닉스에 있어서 SOI의 특징적인 가치 제안이 위험해지고 있습니다.
COVID-19의 대유행은 다양한 형태로 SOI(Silicon On Insulator) 시장에 영향을 주었습니다. 반도체 생산과 SOI 웨이퍼의 납품 지연은 당초 노동력 부족, 공장 폐쇄, 세계 공급망의 혼란에 의해 유발되어 소비자 일렉트로닉스나 자동차 부문 등의 최종 이용 산업에 영향을 주었습니다. 팬데믹은 데이터센터, 5G 인프라, 커넥티드 디바이스에 대한 수요를 높여 디지털 전환을 가속화했습니다.
무선 주파수(RF) 디바이스 부문은 예측 기간 동안 최대가 될 전망
무선 주파수(RF) 디바이스 부문은 예측 기간 동안 최대 시장 점유율을 차지할 것으로 예측됩니다. 무선 통신에 사용되는 프론트엔드 모듈에 이상적입니다. RF-SOI 디바이스에 대한 수요는 5G 인프라와 IoT 커넥티비티의 개발뿐만 아니라 세계 모바일 데이터 트래픽 증가에 의해 견인되고 있습니다.
스마트컷 부문은 예측기간 중 가장 높은 CAGR이 예상된다.
예측 기간 동안 스마트 컷 부문이 가장 높은 성장률을 보일 것으로 예측됩니다. 용도에 필수적인 확장성 향상, 저전력 소비, 우수한 전기적 성능을 갖춘 정교한 SOI 웨이퍼 제조에 자주 사용되고 있으며, RF 디바이스, 파워 일렉트로닉스 및 고성능 로직 회로에서의 사용 확대로 세계 SOI 시장에서의 급속한 상승에 박차를 가하고 있습니다.
예측 기간 동안 북미가 최대 시장 점유율을 차지할 것으로 예측됩니다. 이는 산업 전반에 걸쳐 최첨단 기술이 널리 채용되어 유명한 반도체 기업이 존재하고 세련된 연구시설이 있기 때문입니다. 반도체의 제조와 설계에 대규모 투자를 하는 미국은 특히 RF 디바이스, MEMS, 파워 반도체의 기술 혁신의 주요한 중심지입니다. 또한, 북미의 SOI 시장에서의 우위성은 국내 칩 제조와 5G 네트워크의 성장을 지원하는 정부의 이니셔티브에 의해 더욱 견고한 것이 되고 있습니다.
예측 기간 동안 아시아태평양이 가장 높은 CAGR을 나타낼 것으로 예측됩니다. 중국, 한국, 대만, 일본과 같은 국가들은 엄청난 연구 개발 비용, 지원 정부, 유리한 정책을 가지고 있습니다. 또한 아시아태평양의 SOI 채용은 소비자 전자 및 산업 자동화에서 고성능, 에너지 효율적인 칩 수요 증가로 더욱 가속화되고 있습니다.
According to Stratistics MRC, the Global Silicon on Insulators Market is accounted for $1.78 billion in 2025 and is expected to reach $5.46 billion by 2032 growing at a CAGR of 17.3% during the forecast period. In the silicon on insulator (SOI) fabrication process, a thin layer of silicon is deposited on top of an insulating substrate, usually silicon dioxide. By lowering parasitic device capacitance, this structure outperforms traditional bulk silicon in terms of performance and power efficiency. RF applications, high-speed or low-power integrated circuits, and sophisticated microprocessors all make extensive use of SOI technology. It is perfect for contemporary electronic devices where compactness and energy efficiency are crucial because of its capacity to reduce leakage current and increase switching speed.
According to the Semiconductor Industry Association (SIA), global semiconductor industry sales totaled $627.6 billion in 2024, reflecting a 19.1% increase compared to the previous year.
Growing use of automotive electronics
The emergence of autonomous driving technologies, connected car ecosystems, and electric vehicles (EVs) is transforming the automotive industry. These developments mainly depend on semiconductor devices that are dependable and high-performing even in harsh environments. SOI chips are ideal for safety-critical systems like braking, steering, and navigation because of their exceptional thermal conductivity, resistance to latch-up, and immunity to soft errors. Furthermore, the durability and long-term dependability that SOI devices offer are becoming more and more valued by automotive standards like AEC-Q100.
Exorbitant production and material expenses
One of the main obstacles preventing SOI technology from being widely used is the comparatively high cost of fabrication. Compared to traditional bulk silicon wafer manufacturing, the production of SOI wafers requires more resource-intensive, complex processes like SIMOX and the Smart Cut(TM) method. Furthermore, because SOI substrates require precise control over layer thickness and have an extra insulating oxide layer, their cost is much higher. Moreover, the limited R&D budgets of small and medium-sized semiconductor companies are also impacted by cost constraints, which prevent wider industry penetration.
Growing use of autonomous and electric vehicles
One of the biggest growth opportunities for SOI devices is the rapidly accelerating shift to electric vehicles (EVs) and autonomous driving technologies. These cars need electronics that are highly reliable and able to function in harsh conditions and a wide range of temperatures. SOI is the perfect choice for advanced driver-assistance systems (ADAS) sensors, power management integrated circuits, and automotive microcontrollers due to its exceptional high-temperature performance and resistance to latch-up and soft errors. Additionally, a strong long-term opportunity for SOI technology will arise as EV adoption increases and the demand for reliable and power-efficient semiconductors rises, particularly as vehicle electronics become more software-driven and networked.
Increasing rivalry with other semiconductor technologies
Despite SOI's benefits, other semiconductor technologies-most notably FinFET and advanced bulk CMOS-are a serious threat. At advanced process nodes, FinFET in particular is widely used due to its exceptional power efficiency and scalability. Large foundries like TSMC and Intel have a competitive edge in terms of maturity, cost-effectiveness at scale, and ecosystem support because they have optimized their FinFET processes for mass production. Furthermore, bulk silicon technologies keep getting better at controlling leaks and performing better, which puts SOI's distinctive value proposition in jeopardy, particularly in high-volume manufacturing and consumer electronics that are cost-sensitive.
The COVID-19 pandemic affected the silicon on insulators (SOI) market in a variety of ways. Delays in semiconductor production and SOI wafer deliveries were initially caused by workforce shortages, factory closures, and global supply chain disruptions, which had an impact on end-use industries like consumer electronics and the automotive sector. The pandemic did, however, also hasten digital transformation by raising demand for data centers, 5G infrastructure, and connected devices-all of which depend on high-performance, energy-efficient semiconductors, of which SOI technology is essential. Moreover, the long-term outlook for the SOI market improved as remote work, online services, and edge computing gained popularity.
The radio frequency (RF) devices segment is expected to be the largest during the forecast period
The radio frequency (RF) devices segment is expected to account for the largest market share during the forecast period. The growing use of SOI-based RF chips in smart phones, tablets, and 5G communication systems is primarily responsible for this dominance. RF-SOI technology is perfect for front-end modules used in wireless communication because it provides high performance at high frequencies, low power consumption, and excellent isolation. Demand for RF-SOI devices is still being driven by the increase in global mobile data traffic, as well as the development of 5G infrastructure and IoT connectivity. Furthermore, RF applications play a significant role in the expansion of the SOI market as a whole.
The smart cut segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the smart cut segment is predicted to witness the highest growth rate. The precise layer transfer made possible by Smart Cut technology makes it possible to fabricate thin, homogeneous silicon layers on insulating substrates with great accuracy and few flaws. This technique is frequently used to create sophisticated SOI wafers with improved scalability, lower power consumption, and superior electrical performance-all of which are critical for next-generation semiconductor applications like 5G, artificial intelligence, and high-speed computing. Moreover, its quick rise in the global SOI market is being fueled by its expanding use in RF devices, power electronics, and high-performance logic circuits.
During the forecast period, the North America region is expected to hold the largest market share, driven by the widespread adoption of cutting-edge technologies across industries, the presence of prominent semiconductor companies, and sophisticated research facilities. Strong demand for SOI-based products in industries like consumer electronics, autonomous vehicles, defense systems, and 5G infrastructure benefits the region. With large investments in semiconductor fabrication and design, the U.S. in particular is a major center for innovation in RF devices, MEMS, and power semiconductors. Additionally, North America's dominance in the SOI market is being further cemented by government initiatives that support domestic chip manufacturing and the growth of 5G networks.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR. The region's growing electronics manufacturing base, increased investments in semiconductor fabrication and growing use of SOI technology in cutting-edge applications like 5G, IoT, and electric vehicles are all contributing factors to this quick growth. Leading the way are nations like China, South Korea, Taiwan, and Japan, who have substantial R&D expenditures, supportive governments, and advantageous policies. Furthermore, Asia-Pacific's adoption of SOI is further accelerated by the rise in demand for high-performance, energy-efficient chips in consumer electronics and industrial automation.
Key players in the market
Some of the key players in Silicon on Insulators Market include Murata Manufacturing Co., Ltd., IBM, Sumco Corporation, Qorvo, Inc., Shin-Etsu Chemical Co., Ltd., NXP Semiconductors N.V., Magnachip Semiconductor Inc, Qualcomm Inc., Wafer World Inc., Silicon Valley Microelectronics, Inc., United Microelectronics Corporation, STMicroelectronics N.V., Intel Corporation, Skyworks Solutions, Inc. and Ultrasil Corporation.
In February 2025, Murata Electronics (India) Private Limited, a subsidiary of Murata Manufacturing Co. Ltd., has signed an agreement to lease a factory at the OneHub Chennai Industrial Park, Tamil Nadu. The Japanese firm will commence full-scale operation in financial year 2026.
In February 2025, NXP Semiconductors N.V. announced it has entered into a definitive agreement to acquire Kinara, Inc., an industry leader in high performance, energy-efficient and programmable discrete neural processing units (NPUs). These devices enable a wide range of edge AI applications, including multi-modal generative AI models.
In September 2024, IBM and L&T Semiconductor Technologies (SiLT) have signed an agreement to co-develop advanced processors for edge devices, hybrid cloud systems and areas like mobility, industrial, energy, and servers. In a social media post, Union Minister for Information and Broadcasting and Electronics and IT Ashwini Vaishnaw said that this partnership will boost India's semiconductor capabilities by creating competitive products for global markets.