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세계의 팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장 규모, 점유율, 성장 분석, 웨이퍼 지름별, 제품 유형별, 기판 재료별, 용도별, 지역별 - 산업 예측(2025-2032년)
Fan-Out Wafer Level Packaging Market Size, Share, and Growth Analysis, By Wafer Diameter, By Product Type (Fan-Out Panel-Level Packaging, Fan-Out in Laminate ), By Substrate Material, By Application, By Region - Industry Forecast 2025-2032
상품코드 : 1736973
리서치사 : SkyQuest
발행일 : 2025년 05월
페이지 정보 : 영문 192 Pages
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한글목차

팬아웃 웨이퍼 레벨 패키징(FOWLP) 세계 시장 규모는 2023년 35억 달러, 2024년 38억 9,000만 달러에서 2032년에는 91억 달러로 성장할 것으로 예측되며, 예측 기간(2025-2032년) CAGR은 11.2%를 나타낼 전망입니다.

세계 팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장은 IoT 디바이스 및 스마트폰, 웨어러블, 스마트 TV와 같은 소형 전자기기에 필수적인 소형화, 고출력 집적회로에 대한 수요 증가에 힘입어 성장하고 있습니다. 이러한 추세는 크기를 최소화하면서 성능과 열적 특성을 향상시키는 첨단 반도체 패키징 솔루션을 요구하고 있습니다. 그러나 높은 제조 비용과 재료 뒤틀림으로 인한 잠재적 결함 등의 문제가 성장을 가로막고 있습니다. 이러한 장애물에도 불구하고, 스마트 자동차 솔루션에 첨단 전자 부품을 통합하는 것은 새로운 수익 기회를 창출하고 고성능 패키징에 대한 수요를 증가시키고 있습니다. 각 업체들은 패키지온패키지 솔루션과 새로운 접합 방식과 같은 기술 혁신을 통해 통신 및 AI를 포함한 다양한 용도에서 신뢰성 있고 효율적이며 컴팩트한 반도체 솔루션에 대한 수요 증가에 대응할 수 있는 역량을 갖추고 있습니다.

목차

서론

조사 방법

주요 요약

시장 역학과 전망

주요 시장 인사이트

팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장 규모 : 웨이퍼 지름별&CAGR(2025-2032)

팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장 규모 : 제품 유형별&CAGR(2025-2032)

팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장 규모 : 기판 재료별&CAGR(2025-2032)

팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장 규모 : 용도별&CAGR(2025-2032)

팬아웃 웨이퍼 레벨 패키징(FOWLP) 시장 규모 : 지역별&CAGR(2025-2032)

경쟁 정보

주요 기업 개요

결론과 제안

LSH
영문 목차

영문목차

Global Fan-Out Wafer Level Packaging Market size was valued at USD 3.5 billion in 2023 and is poised to grow from USD 3.89 billion in 2024 to USD 9.1 billion by 2032, growing at a CAGR of 11.2% during the forecast period (2025-2032).

The global fan-out wafer level packaging (FOWLP) market is driven by the escalating demand for miniaturized, high-power integrated circuits, essential for IoT devices and compact electronics like smartphones, wearables, and smart TVs. This trend necessitates advanced semiconductor packaging solutions that enhance performance and thermal characteristics while minimizing size. However, challenges such as high manufacturing costs and potential defects due to material warpage impede growth. Despite these hurdles, the integration of advanced electronic components in smart automotive solutions presents new revenue opportunities, propelling demand for high-performance packaging. Companies are innovating with technologies like package-on-package solutions and novel bonding methods, positioning themselves to meet the rising needs for reliable, efficient, and compact semiconductor solutions across various applications, including telecommunications and AI.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Fan-Out Wafer Level Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Fan-Out Wafer Level Packaging Market Segments Analysis

Global Fan-Out Wafer Level Packaging Market is segmented by Wafer Diameter, Product Type, Substrate Material, Application and region. Based on Wafer Diameter, the market is segmented into 200 mm and 300 mm. Based on Product Type, the market is segmented into Fan-Out Panel-Level Packaging (FOPLP), Fan-Out in Laminate (FOIL) and Embedded Die Fan-Out Wafer Level Packaging (eDFOWLP). Based on Substrate Material, the market is segmented into Glass, Polymer and Interposer. Based on Application, the market is segmented into Smartphones, Tablets, Automotive, Wearables and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Fan-Out Wafer Level Packaging Market

The Global Fan-Out Wafer Level Packaging (FOWLP) market is driven by the rising need for compact, high-performance semiconductor chips utilized in wearable technology, smartphones, Internet of Things (IoT) devices, and automotive electronics. This packaging method is particularly favored for next-generation semiconductor applications, as it effectively reduces form factor while enhancing performance, energy efficiency, and integration capabilities. As manufacturers around the world focus on producing smaller devices with greater functionality, the demand for FOWLP solutions continues to grow significantly, positioning it as a key player in the semiconductor industry's evolution towards more advanced and efficient technologies.

Restraints in the Global Fan-Out Wafer Level Packaging Market

The Global Fan-Out Wafer Level Packaging (FOWLP) market encounters several constraints largely due to rising production costs associated with the implementation of sophisticated manufacturing processes and specialized machinery. These advanced methods are necessary, yet they can lead to complications such as warpage and material shrinkage during production, ultimately diminishing yield rates and escalating expenses in mass production. Furthermore, for small and medium-sized semiconductor companies, the high initial infrastructure investments and costly raw materials present substantial challenges, limiting the widespread adoption of FOWLP in applications where cost efficiency is crucial. Consequently, these factors significantly impede the growth and accessibility of FOWLP technology.

Market Trends of the Global Fan-Out Wafer Level Packaging Market

The Global Fan-Out Wafer Level Packaging (FOWLP) market is experiencing a significant trend towards the integration of chiplet architectures and heterogeneous packages. This shift is largely driven by the need for advanced functionalities and improved power efficiency in semiconductor devices, particularly for applications in cloud computing, artificial intelligence, and high-performance computing (HPC). As companies increasingly adopt chiplet-based designs, FOWLP technology is becoming essential for seamlessly integrating various types of dies, including logic chips, memory, and sensors, into a cohesive package. This trend not only enhances performance but also facilitates customized solutions, positioning FOWLP as a critical player in the evolving semiconductor landscape.

Table of Contents

Introduction

Research Methodology

Executive Summary

Market Dynamics & Outlook

Key Market Insights

Global Fan-Out Wafer Level Packaging Market Size by Wafer Diameter & CAGR (2025-2032)

Global Fan-Out Wafer Level Packaging Market Size by Product Type & CAGR (2025-2032)

Global Fan-Out Wafer Level Packaging Market Size by Substrate Material & CAGR (2025-2032)

Global Fan-Out Wafer Level Packaging Market Size by Application & CAGR (2025-2032)

Global Fan-Out Wafer Level Packaging Market Size & CAGR (2025-2032)

Competitive Intelligence

Key Company Profiles

Conclusion & Recommendations

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