Automotive Power Management ICs and Signal Chain Chips Industry Research Report, 2025
상품코드:1806653
리서치사:ResearchInChina
발행일:2025년 08월
페이지 정보:영문 710 Pages
라이선스 & 가격 (부가세 별도)
한글목차
중앙 컴퓨팅 플랫폼의 전력 공급 전략 : 고성능 SoC는 다상 컨트롤러+DrMOS를 채택하고, 대형 PMIC+소형 PMIC를 결합
시스템온칩(SoC)은 컴퓨팅, 스토리지, 통신, 센서 인터페이스를 하나의 칩에 집적시킨 것입니다. 지능형 구동 SoC를 예로 들면, 일반적으로 CPU, GPU, NPU/BPU, DSP/ISP, 스토리지, 인터페이스 유닛, 보안 모듈 등의 구성요소가 통합되어 있습니다. 이러한 SoC는 대량의 데이터를 처리하고 복잡한 계산을 수행하여 차량이 실시간으로 의사결정을 내릴 수 있도록 합니다. 따라서, 특히 핵심 전압 레일에 첨단 전력 관리 솔루션이 요구됩니다.
구역 제어+중앙 컴퓨팅 아키텍처와 AI의 급속한 발전으로 SoC의 연산 능력과 성능에 대한 요구가 높아지고 있습니다. SoC는 대량의 병렬 연산 기능, 더 높은 클럭 주파수, 더 빠른 동적 응답 속도가 필요합니다. 연산 능력과 성능의 향상은 발열 증가, 전력 소비 증가, 전류 증가를 의미합니다. 동시에 GPU의 성능 향상에 따라 전력 공급의 안정성에 대한 요구 사항도 높아지고 있습니다. 따라서 고성능 SoC는 더 나은 변환 효율, 동적 부하 적응 능력, 더 정교한 배전 및 제어 전략을 실현하고 발열을 어느 정도 억제할 수 있는 더 정교한 전력 관리 솔루션이 필요합니다.
SoC에서 하나의 GPU 모듈의 전류 요구량은 100A에 가깝고, 다른 여러 회로의 전류도 50A에 가깝습니다. SoC 내 전력 소모가 많은 NPU, GPU, CPU 코어에 전력을 공급하기 위해 SoC의 고전력 코어 레일은 일반적으로 다상 컨트롤러+DrMOS 배전 방식을 채택하여 SoC의 높은 연산 능력 요구 사항을 지원합니다.
존 컨트롤러 전원 공급 전략: PMIC/SBC가 LDO와 DC/DC의 일부를 대체하고, 주요 기업들이 원스톱 솔루션 제공 시작
ZCU(Zone Control Unit)의 PCB 보드는 주로 메인 제어 MCU, 전력 관리 장치, 통신 회로, 인터페이스 회로 등으로 구성됩니다. 이 중 전력 관리 장치에는 DC/DC, LDO, PMIC, SBC 등의 칩이 포함되어 MCU, CAN/LIN/이더넷 트랜시버 등의 장치에 전력을 공급합니다. 인터페이스 회로에서 ZCU는 하이사이드/로우사이드 드라이버 칩, 전자 퓨즈, 모터 드라이버 칩, 게이트 드라이버 칩, 디스크리트 MOSFET을 통해 차체의 전자 부하를 구동합니다.
ZCU의 메인 제어 MCU의 전원 공급은 비교적 복잡합니다. 코어, 디지털 주변기기, ADC는 모두 독립적인 전원 공급이 필요하며, 필요한 전압은 1.25V, 3.3V, 5V 등입니다. 또한 ZCU는 기본적으로 게이트웨이 기능을 통합하고 있기 때문에 이더넷 스위치와 PHY에도 전원을 공급해야 하며, 일반적으로 3.3V에서 전류 2-3A, 0.9V 또는 1.1V에서 전류 1A 미만으로 공급해야 합니다. ZCU에는 좌석 및 도어 모터 제어가 포함되어 있으며, 이러한 모터의 센서는 일반적으로 ZCU 메인 보드에 없기 때문에 센서 데이터를보다 정확하게 수집하기 위해 MCU의 전원 공급을 추적하는 추적기 LDO가 필요합니다.
구역 제어 아키텍처의 변화에 따라 LDO를 통해 흩어져 있는 소형 ECU의 MCU에 대한 전력 공급 수급은 구역 컨트롤러 전력 공급을 위한 PMIC에 통합될 수 있습니다. LDO는 DC/DC와 함께 PMIC에 통합되어 ZCU를 위한 시스템 레벨의 전원 공급 솔루션을 제공합니다. 현재 ZCU용 전원 공급 솔루션은 대부분 PMIC 또는 SBC를 사용하고 있으며, 극히 일부는 DC/DC와 LDO를 사용하고 있습니다.
중국의 자동차용 PMIC-시그널체인 칩 산업에 대해 조사 분석했으며, 세계 및 중국의 자동차용 아날로그 칩 시장 규모, 배전 아키텍처의 개발 동향, 국내외 벤더 등의 정보를 전해드립니다.
목차
제1장 자동차용 아날로그 칩과 차량 배전 아키텍처 개요
자동차용 PMIC 및 시그널 체인 칩 분류와 시장
차량 전력 공급 전략과 진화 동향
제2장 자동차용 아날로그 칩의 용도 : 서브 시나리오별
시나리오 1 : 지능형 주행
시나리오 2 : 지능형 콕핏 도메인 콘트롤러-
시나리오 3 : 보디 일렉트로닉스
시나리오 4 : 차량 제어
시나리오 5 : 48V 저전압 전력 공급
제3장 자동차용 아날로그 칩의 용도 및 시장 : 제품 유형별
전력 관리 체인 : DC-DC 칩
전력 관리 체인 : LDO 칩
전력 관리 체인 : 드라이버 칩
전력 관리 체인 : 배터리 관리 IC(BMIC)
전력 관리 체인 : PMIC/SBC
시그널 체인 : 앰프
시그널 체인 : 데이터 컨버터
시그널 체인 : 클락 칩
제4장 국내 자동차용 아날로그 칩 벤더
Novosense Microelectronics
SGMICRO
Shanghai Belling
LEN Technology
Halo Microelectronics
BYD Semiconductor
YCT Electronics
Silergy
3PEAK
JoulWatt Technology
Awinic
Silicon Content Technology(SCT)
Southchip Semiconductor Technology
ETA Semiconductor
제5장 국외 자동차용 아날로그 칩 벤더
Texas Instruments(TI)
Infineon
NXP
LSH
영문 목차
영문목차
Analog chips are used to process continuous analog signals from the natural world, such as light, sound, electricity/magnetism, position/speed/acceleration, and temperature. They are mainly composed of resistors, capacitors, transistors, integrated circuits, etc. According to their functions, analog chips can be divided into two major categories: power management chips and signal chain chips.
Signal Chain Chips: They process the analog signals (sound, light, electricity, speed, position, etc.) collected by sensors through transmission, reception, analog-to-digital conversion, amplification, filtering, and other operations, converting them into digital signals for further storage and processing. The main product types include amplifiers/comparators, data converters, isolation/interfaces, and clock chips.
Power Management Chips: They are often used for the management, monitoring, and distribution of power supplies in electronic devices. Their functions generally include voltage conversion, current control, low-dropout voltage regulation, power supply selection, dynamic voltage adjustment, and power switch timing control. They can be divided into AC/DC, DC/DC, LDO, battery management chips (BMIC), driver chips, multi-channel power management integrated circuits (PMIC), and system basis chips (SBC).
Power Supply Strategy for Central Computing Platforms: High-Performance SoCs Adopt Multi-Phase Controllers + DrMOS, Combined with Large PMICs + Small PMICs
A System-on-Chip (SoC) integrates computing, storage, communication, and sensor interfaces into a single chip. Taking an intelligent driving SoC as an example, it usually integrates components such as a CPU, GPU, NPU/BPU, DSP/ISP, storage and interface units, and security modules. These SoCs can process large amounts of data and perform complex calculations that enable vehicles to make real-time decisions. Therefore, advanced power management solutions are required, especially for core voltage rails.
With the rapid development of Zonal control + central computing architecture and AI, higher requirements are put forward for the computing power and performance of SoCs. SoCs need a large amount of parallel computing capabilities, higher clock frequencies, and faster dynamic response speeds. Higher computing power and performance mean greater heat generation, higher power consumption, and larger currents. At the same time, with the improvement of GPU performance, its requirements for power supply stability are also higher. Therefore, high-performance SoCs need more sophisticated power management solutions to achieve better conversion efficiency, dynamic load adaptation capabilities, more refined power distribution and control strategies, and also reduce heat generation to a certain extent.
In the SoC, current requirement of a single GPU module is close to 100A, and the currents of several other circuits are also close to 50A. In order to supply power to the power-hungry NPU, GPU, and CPU cores in the SoC, the high-power core rails of the SoC usually adopt a power distribution scheme of multi-phase controllers + DrMOS to support the high-computing-power requirements of the SoC.
Taking MPS's SoC power supply solution for central computing platforms as an example: For central computing platforms, MPS has launched the MPSafe central computing unit power solution suitable for high-performance SoCs. The solution of MPQ2967-AEC1 (multi-phase controller) + MPQ86960 (DrMOS) is specially designed for core power supply of high-computing-power and high-current main chips. This solution can achieve higher power density and efficiency, and realize a timing controller and monitoring that comply with the ISO 26262 ASIL functional safety standard.
MPQ2967-AEC1: As a multi-phase digital PWM controller, it can be configured as a four-phase two-rail controller at most, with fast transient response, programmability, and scalability.
MPQ86960-AEC1: As a high-performance DrMOS device, it is a monolithic half-bridge that integrates a power MOSFET and a gate driver. It can achieve a continuous output current (IOUT) of up to 50A within a wide input voltage (VIN) range.
The power management of central computing platform is extremely complex. In addition to the power supply for the SoC, devices such as MCUs, LPDDR, Flash, Ethernet switches, and SerDes also need power supply. Generally speaking, in addition to battery protection devices, primary power supplies, and "multi-phase controllers + DrMOS", the power supply of the entire central computing platform will also use large PMICs + small PMICs as supplements to ensure the stable transition of the system, automatic power-on and power-off, and help integrate functional safety. PMICs are very closely coupled with SoCs. Generally, manufacturers of SoCs and MCUs will design their own matching PMICs, and at most, an external ASIL-D power supply will be used as a "gatekeeper" for functional safety.
Taking NXP's central computing platform solution as an example: If the S32N series of processors is adopted, it can be combined with NXP's own PMIC power management chips PF53 and FS04. FS04 is a high-voltage ASIL-D PMIC for S32N processors, integrating 1 HV BUCK, 5 LV BUCKs, and 1 LDO. The FS04 PMIC improves accuracy through an analog-to-digital converter and complies with the ASIL D safety standard. The PF53 POL regulator supplies power to the S32N core, providing high-power support while optimizing material costs.
Power Supply Strategy for Zonal Controllers: PMICs/SBCs Will Replace Some LDOs and DC/DCs, and Leading Enterprises Launch One-Stop Solutions
PCB board of a Zone Control Unit (ZCU) is mainly composed of a main control MCU, a power management unit, a communication circuit, an interface circuit, etc. Among them, the power management unit includes chips such as DC/DC, LDO, PMIC, and SBC, which supply power to devices such as MCUs and CAN/LIN/Ethernet transceivers. In the interface circuit, the ZCU drives the electronic loads of the vehicle body through high/low-side driver chips, electronic fuses, motor driver chips, gate driver chips, and discrete MOSFETs.
The power supply for main control MCU of ZCU is relatively complex. The core, digital peripherals, and ADC all need independent power supplies, and the required voltages are 1.25V, 3.3V, 5V, etc. In addition, ZCUs basically integrate gateway functions, so they also need to supply power to Ethernet switches and PHYs, usually 3.3V with a current of 2-3A, and 0.9V and 1.1V with a current of less than 1A. Because the ZCU includes motor control for seats and doors, and the sensors of such motors are generally not on the ZCU main board, a tracker LDO is required to follow the power supply of the MCU to obtain sensor data more accurately.
In line with the changes in zonal control architecture, power supply demand of MCUs in scattered small ECUs through LDOs may be integrated into PMICs for zonal controller power supply. LDOs will be integrated with DC/DCs into PMICs to provide system-level power solutions for ZCUs. At present, most of the power supply solutions for ZCUs use PMICs or SBCs, and a small part use DC/DCs and LDOs.
Taking Infineon's zonal controller solution as an example: For zonal controllers, Infineon can provide one-stop solutions including the OPTIREG(TM) product series, supplementary NOR Flash solutions, microcontroller solutions, PROFET(TM) intelligent power switches, MOSFETs, and corresponding gate drivers.
In addition to power supply, SBCs also integrate other functions such as CAN/LIN transceivers, watchdog timers, LIMP HOME, and high-side drivers. In some designs, to simplify system design and reduce PCB area, DC/DC, LDO, Tracking LDO, watchdog, voltage monitoring, communication, and diagnostic functions are integrated into a single chip, facilitating functional redundancy and reducing PCB size.
Taking Novosense Microelectronics as an example, to meet the integrated needs of intelligent control modules in the next-generation automotive electronic architecture for power supply, communication, and driving functions, in July 2025, Novosense Microelectronics launched the new NSR926X series of automotive-grade SBC system basis chips. Adopting an all-in-one platform-level design, it integrates three low-dropout regulators (LDOs), four high-side drivers (HSS), a LIN transceiver, and a high-speed CAN transceiver with Partial Networking (PN) function.
Steer-by-Wire Systems: Transition from 12V to 48V Power Supply, and Development towards Full-Link Solutions for Sensing, Communication, Driving, and Control
Since steer-by-wire systems eliminate the mechanical connection between the steering wheel and the steering wheels and rely entirely on electronic signals and electric drives to perform steering operations, they not only need to drive high-torque steering motors (six-phase dual-motor redundancy design) but also support high-power consumption components such as road feel simulation motors, sensors, and controllers, and must meet the ASIL-D functional safety level. Therefore, the requirements of steer-by-wire systems for power management chips and driver chips are much higher than those of traditional steering systems.
In a steer-by-wire system, the power supply system is responsible for supplying power to two redundant six-phase steering motors, two redundant torque feedback motors, the electronic control unit in the system, and other vehicle electrical appliances, so the power supply bears a huge load. If the 12V power supply is still used, a larger current is required to obtain greater power, and excessive current will have an adverse impact on the overall stability of the system. Therefore, the power supply voltage of the steer-by-wire system can be increased, and a 48V power supply can be used to solve this problem. Compared with the 12V system, the 48V system can make the redundant actuators of high-peak load devices such as steer-by-wire systems lighter and more cost-effective.
Taking ON Semiconductor's steer-by-wire system solution as an example: For 48V steer-by-wire systems, ON Semiconductor has built a full-link technology from sensing and communication to driving and control, covering various products such as sensors, power supplies, signal chains, and isolation protection.
NIV3071: NIV3071 is an electronic fuse (e-Fuse) that integrates 4 independent channels in one package, supporting a continuous output current of up to 10A, and is suitable for a wide range of automotive applications from 12V to 48V.
NCV51511: It is an automotive-grade low-side gate driver with high driving current capability and options, optimized for DC-DC power supplies and inverters. NCV51511 can be used to drive MOSFETs in half-bridge or synchronous buck architectures.
T10 MOSFET Series: Based on the new shielded gate trench technology, the T10 MOSFET series significantly improves efficiency and effectively reduces output capacitance, RDS (ON), and gate charge compared with traditional designs. The T10-M is designed with extremely low RDS (ON), equipped with a soft recovery body diode, and also effectively reduces ringing, overshoot, and electromagnetic interference noise during switching. It is particularly suitable for application scenarios that require high switching speed and efficiency, such as motor drives and load switches.
NCV77320: It is an inductive position sensor for automotive applications, which can measure angle or linear position. NCV77320 has strong anti-interference ability and can be used in places such as pedals, throttles, chassis heights, and actuator position feedback. In 48V steer-by-wire systems, it can be used as a steer-by-wire sensor.
NCV7041: It is a high-voltage, high-resolution current sensing amplifier with a common-mode input range of-5.0V to + 80V, which can perform one-way or two-way current measurement across a sensing resistor in various applications.
Table of Contents
1 Overview of Automotive Analog Chips and Vehicle Power Distribution Architecture
1.1 Classification and Market of Automotive PMICs and Signal Chain Chips
Analog Chips: Working Principles
Functional Classification of Analog Chips: Signal Chain Chips, Power Management Chips
Applications of Analog Chips in Automotive Electronics
Power Management Chips: Definition
Power Management Chips: Product Classification
Signal Chain Chips: Definition and Product Classification
Overview of Vehicle Chip Types, Processes, and Per-Vehicle Usage
Global Analog Chip Market Size
Chinese Analog Chip Market Size
Chinese Analog Chip Market: Localization Substitution Process
Chinese Automotive Analog Chip Market Size
2024 Global and Chinese Analog Chip Market Patterns
1.2 Vehicle Power Supply Strategies and Evolution Trends
Development Trends of Vehicle Power Distribution Architecture:
Traditional Power Distribution Architecture
Domain Controller Power Distribution Architecture
Zonal Power Distribution Architecture
Two Forms of Low-Voltage Power Distribution for Zonal Controllers
Low-Voltage Power Distribution Solutions for Zonal Controllers
Requirements for Future Intelligent Power Distribution Architecture
2 Application Automotive Analog Chips (by Sub-Scenarios)
