시장보고서 | 연간정보서비스 | 맞춤형시장조사 | 메일링 | 샘플 요청 목록
자동차용 콕핏 도메인 컨트롤러(2025년)
Automotive Cockpit Domain Controller Research Report, 2025
상품코드 : 1777120
리서치사 : ResearchInChina
발행일 : 2025년 07월
페이지 정보 : 영문 650 Pages
 라이선스 & 가격 (부가세 별도)
US $ 4,500 ￦ 6,340,000
Unprintable PDF (Single User License) help
PDF 보고서를 1명만 이용할 수 있는 라이선스입니다. 인쇄 불가능하며, 텍스트의 Copy&Paste도 불가능합니다.
US $ 6,800 ￦ 9,581,000
Printable & Editable PDF (Enterprise-wide License) help
PDF 보고서를 동일 기업의 모든 분이 이용할 수 있는 라이선스입니다. 인쇄 가능하며 인쇄물의 이용 범위는 PDF 이용 범위와 동일합니다.


한글목차

딥 AI 임파워먼트를 위한 조종석 도메인 컨트롤러의 세 가지 레이아웃 솔루션

지능형 조종석이 기능의 중첩에서 AI의 심층적인 강화로 변화함에 따라 조종석 도메인 제어 하드웨어 제품에 대한 요구가 증가하고 있습니다. AI 콕핏 도메인 컨트롤러 제품은 다음과 같은 레이아웃 방향을 개발하고 있습니다.

1. 높은 컴퓨팅 성능의 단일 칩 AI 조종석 도메인 컨트롤 레이아웃

엔드사이드 AI 대규모 모델, 3D HMI, 차량내 게임, 몰입형 인터랙션, 스마트 조종석과 지능형 운전의 통합 등 기능적 요구사항에 힘입어 조종석은 복잡한 알고리즘 요구사항을 지원하기 위해 높은 연산능력, 넓은 대역폭, 고속 통신 등 더 높은 성능을 필요로 합니다. 성능을 필요로 합니다. 높은 연산 능력 측면에서 CPU, GPU, NPU 등 콕핏 칩 제품의 핵심은 지속적으로 업그레이드되고 진화하고 있습니다. 양산되고 있는 주류 하이엔드 콕핏 SOC의 CPU 연산능력은 200+KDMIPS 이상에 이르며, 600+KDMIPS의 CPU 연산능력을 가진 콕핏 칩 솔루션도 출시되고 있습니다. 양산 모델의 조종석 AI 연산능력은 약 60 TOPS에 달하며, 향후 360 TOPS, 400 TOPS, 나아가 720 TOPS의 연산능력을 가진 조종석 도메인 컨트롤 제품이 양산될 예정입니다.

2025년, 많은 고연산 성능의 조종석 SOC 제품이 출시될 것으로 예상되며, 공급업체들은 고연산 성능의 단일 SOC 칩을 기반으로 한 AI 조종석 도메인 제어 솔루션을 적극적으로 출시할 것으로 보입니다.

퀄컴은 2024년 10월 CPU 연산능력 660KDMIPS, AI 연산능력 360TOPS의 5세대 Snapdragon Cockpit Elite 8397을 발표했습니다. 최대 16대의 4K 디스플레이, 실시간 레이 트레이싱, 몰입형 3D 경험을 동시에 지원하며, 엔드 측의 AI 대규모 모델이 더 높은 성능으로 작동할 수 있도록 지원합니다. Desay SV, PATEO, Visteon, Garmin 등공급업체들은 AI 대규모 모델 및 크로스 도메인 통합 등의 니즈에 대응하기 위해 이 칩을 탑재한 도메인 컨트롤러 제품을 출시하기 시작했습니다.

2. 듀얼 칩 조종석 도메인 컨트롤러 레이아웃

단일 칩의 성능 향상 외에도 일부 OEM은 듀얼 콕핏 SoC 칩을 사용하여 콕핏의 낮은 지연으로 효율적이고 안정적인 작동을 보장합니다. 예를 들어 듀얼 Qualcomm 8295 칩 콕핏 도메인 컨트롤러, 듀얼 Qualcomm 8155 칩 콕핏 도메인 컨트롤러, 듀얼 SiEngine Longying No.1 등 콕핏 도메인 컨트롤러 제품입니다. 이 제품들은 고속 상호 연결 인터페이스를 통해 두 개의 칩을 연결하고, 독자적인 연산 능력 할당 기술을 사용하여 높은 연산 능력, 넓은 대역폭, 다른 조종석 도메인 제어 제품의 레이아웃을 실현하고, AI 대규모 모델, 3D, 멀티모달 인터랙션 및 기타 차량에서의 양산을 지원합니다.

3. 조종석 도메인 컨트롤러 + AI 코프로세서 또는 AI BOX 등의 방법으로 AI 조종석 평등성 지원

또한 조종석 칩의 연산 능력이 병목 현상이 발생하는 업계의 딜레마에 직면하여 일부 기업은 조종석 도메인 컨트롤러 + AI BOX 솔루션을 출시하여 자동차의 원래 배선 기술을 변경하지 않고도 AI 조종석의 평등한 레이아웃을 가속화합니다. 가속화하고 있습니다.

중국의 자동차 산업에 대해 조사분석했으며, 자동차용 콕핏 도메인 컨트롤러의 탑재 수, 개발 동향, 각 OEM 구성 전략 등의 정보를 제공하고 있습니다.

목차

제1장 지능형 콕핏 도메인 컨트롤러의 탑재 수의 분석

제2장 지능형 콕핏 도메인 컨트롤러 제품의 개발 동향

제3장 OEM 지능형 콕핏 도메인 컨트롤러구성 전략과 응용 동향

제4장 지능형 콕핏 도메인 컨트롤러( 각 모델) Tier 1 솔루션과 동향

제5장 콕핏·드라이빙 통합 도메인 컨트롤러( 각 모델) Tier 1 솔루션과 동향

제6장 중국의 콕핏 도메인 컨트롤러 공급업체의 조사

KSA
영문 목차

영문목차

Cockpit domain controller research: three cockpit domain controller architectures for AI

Three layout solutions for cockpit domain controllers for deep AI empowerment

As intelligent cockpit transforms from function superposition to AI deep empowerment, higher requirements are put forward for cockpit domain control hardware products. AI cockpit domain controller products have developed the following layout directions:

1. High-computing power single-chip AI cockpit domain control layout

Driven by the functional requirements of AI large models on the end side, 3D HMI, in-car games, immersive interaction, and the integration of smart cockpits and intelligent driving, the cockpit requires higher performance such as high computing power, large bandwidth, and high-speed communication to support complex algorithm requirements. In terms of high computing power, the core of cockpit chip products such as CPU, GPU and NPU are constantly upgrading and evolving. The CPU computing power of the mainstream high-end cockpit SOCs that have been mass-produced has reached more than 200+KDMIPS, and cockpit chip solutions with CPU 600+KDMIPS computing power are also being deployed; the cockpit AI computing power of mass-produced models is up to about 60TOPS, and in the future, cockpit domain control products with computing power of 360TOPS, 400TOPS, and even 720TOPS will be put into mass production.

With the launch of a number of high-computing cockpit SOC products, in 2025, suppliers will actively deploy AI cockpit domain controller solutions based on high-computing single SOC chips.

In October 2024, Qualcomm released the fifth-generation Snapdragon Cockpit Elite 8397, with a CPU computing power of 660KDMIPS and an AI computing power of 360TOPS. It can simultaneously support up to 16 4K displays, real-time ray tracing and immersive 3D experience, and help the end-side AI large model to run at a higher performance. Desay SV, PATEO, Visteon, Garmin and other suppliers have begun to deploy domain controller products based on this chip to help meet the needs of AI large models, cross-domain integration, etc.

In April 2025, PATEO announced the expansion of its cooperation with Qualcomm Technologies to create a new generation of smart cockpit solutions equipped with Snapdragon Cockpit Platform Elite (QAM8397P). Combining PATEO's deep accumulation in the field of smart cockpit software and hardware development, and the advanced AI capabilities, excellent computing performance and high-definition graphics capabilities provided by Snapdragon Cockpit Platform Elite (QAM8397P), PATEO's new cockpit solution will help global automakers provide top-level smart cockpit products for central computing architecture, and provide high-performance, high-scalability and safe smart cockpit solutions. Currently, PATEO's smart cockpit solution based on the Snapdragon Cockpit Platform Elite (QAM8397P) has been designated for a mass production project by a leading Chinese automaker.

In 2025, SemiDrive launched the new generation of AI cockpit chips X10 series, which integrates 40TOPS NPU computing power and 154GB/s ultra-large memory bandwidth, supports the deployment of 7B multi-modal large models on the end side, and solves the pain point of response delay. At the same time, SemiDrive Technology has in-depth cooperation with large model companies such as FaceWall Intelligence and Banma Intelligent Driving to improve the tool chain and accelerate the implementation of in-vehicle AI. Suppliers such as Desay SV have announced that they will develop a new generation of AI cockpit platforms based on SemiDrive X10 to achieve higher performance in a more efficient and economical way, bringing users a safer and more personalized AI cockpit experience.

2. Dual-chip cockpit domain controller layout

In addition to the performance improvement of a single chip, some OEMs use dual-cockpit SoC chips to ensure low latency, efficient and stable operation of the cockpit. Such as dual Qualcomm 8295 chip cockpit domain controller, dual Qualcomm 8155 chip cockpit domain controller, dual SiEngine Longying No. 1 and other cockpit domain controller products. They connect the two chips through a high-speed interconnect interface and use a unique computing power allocation technology to achieve high computing power, large bandwidth and other cockpit domain control product layouts, helping AI large models, 3D, multi-modal interaction and other mass production on vehicles.

For example, the newly launched Lynk & Co 900 cockpit in 2025 is equipped with dual Qualcomm Snapdragon 8295 chips to build a high-computing power base, realizing cockpit functions such as 30-inch 6K integrated main screen, 30-inch 6K floating entertainment screen in the rear row and 95-inch AR-HUD, 3D visual desktop, cross-screen gestures, immersive sound effects, and "AI smart butler" emotional interaction.

3. Cockpit domain controller + AI coprocessor or AI BOX and other methods to help AI cockpit equality

In addition, facing the industry dilemma of cockpit chip computing power bottleneck, some companies have launched cockpit domain controller + AI BOX solutions to accelerate the layout of AI cockpit equality without changing the original wiring architecture of the vehicle.

For example, at the 2025 Shanghai Auto Show, the AI cockpit exhibited by Aptiv deployed multi-modal large models on the end side and combined them with large models on the cloud, based on the existing high-computing cockpit platform as the AI main processor and the computing power expansion of the AI coprocessor, to achieve fast and flexible deployment, so that the large model capabilities can be better improved on the end side of the smart cockpit.

In June 2025, ThunderSoft launched ThunderSoft AI Box, which built an elastic computing matrix based on the NVIDIA DRIVE AGX vehicle computing platform, and can flexibly adapt low, medium and high-end models to the AI computing power requirements of Agent in different scenarios. Without large-scale hardware transformation, large models can be efficiently deployed.

In April 2025, Banma Intelligent Driving and Unisoc jointly launched the new generation of head unit interaction external hardware solution product Banma AIBOX, which achieves a comprehensive upgrade of computing performance, operating system, application software and service ecology through seamless collaboration with the original vehicle without changing the interior and wiring of the entire vehicle. At present, it is mainly aimed at the old models of Roewe RX5 equipped with AliOS operating system to solve the problem of upgrading the original car system experience. AI-related functions will be launched in succession.

With the centralized evolution of EEA and the launch of new multi-domain SOC products, cockpit domain controller is accelerating the evolution towards multi-domain integration

As the E/E architecture evolves towards centralization, many OEMs and suppliers have launched cockpit domain control integration such as parking,connectivity, intelligent driving and other cross-domain integration products, and the layout of multi-domain integration domain control products such as cockpit-parking integration and cockpit-driving integration has accelerated.

Cockpit-parking integration domain controller is mainly a new market demand product driven by the cost reduction of the whole vehicle and the accelerated popularization of automobile intelligence. On the basis of trying not to increase the original cost, cockpit-parking integration is a mass-producible solution for cockpit domain controller to achieve more functional integration. At present, cockpit-parking integration is mainly based on Qualcomm 8155/Qualcomm 8255, SemiDrive X9SP, SiEngine Longying No.1 and other chips to create domain controller products.

SemiDrive X9SP is the flagship product of the X9 series of smart cockpit chips. As a full-scenario automotive-grade SoC chip designed for smart cockpits and cross-domain integration scenarios, the X9SP "cockpit-parking integration" architecture integrates the cockpit domain (central control/instrument/in-vehicle entertainment/voice interaction/application ecology) and parking domain (APA/surround view image/DVR/DMS) functions on a single computing platform through hardware integration.

Cockpit domain control products based on SemiDrive X9SP have achieved large-scale mass production. In June 2025, Chery Tiggo 7 High Energy Edition was officially launched. Its 1.5T model was equipped with SemiDrive Technology's X9SP cockpit chip, which supports high-reliability instruments and 13.2-inch super interactive AI digital screens.

In terms of cockpit-driving integration, the number of cockpit-driving integrated domain controller installed in China's passenger cars in 2024 was about 438,600, and the number of models has reached more than 20. Except for the low-end version of Leapmotor C series (less than 200,000 yuan), other models including Xpeng, NIO, Voyah, Leapmotor LEAP3.5 architecture and Xiaomi cars all adopt multi-chip ONE BOX solution, with a typical configuration of mainstream smart cockpit chips (Qualcomm 8295/8155) + mainstream intelligent driving chips (Nvidia Orin-X), etc.

In May 2025, Xiaomi released its latest model YU7, which is equipped with a four-in-one domain control module, which has built-in ADD assisted driving domain controller, T-Box communication module, DCD cockpit domain controller, and VCCD vehicle domain controller. The latter three are placed on one mainboard, while the ADD assisted driving domain control is a separate mainboard, integrated into a four-domain-in-one computing platform. It not only reduces the volume and weight, the number of controllers is reduced by 75%, the occupied space is reduced by 57%, the weight of parts is reduced from 6.85kg to 3.6kg, and the weight of parts is reduced by 47%, but also achieves full-link energy efficiency optimization. The entire EEA increases the range by more than 16km, of which the sentinel mode reduces power consumption by 40% and increases the range by more than 5 kilometers.

With the continuous launch of high-performance cross-domain SOC chip products, many OEMs and suppliers have accelerated the layout of single-SOC cockpit-driving domain control products, preferring chips based on Qualcomm Ride Flex SA8775P chip, NVIDIA Thor, Black Sesame C1296, etc., and mass-produced models will appear in 2025.

Table of Contents

1 Analysis of Intelligent Cockpit Domain Controller Installation

2 Intelligent Cockpit Domain Controller Product Development Trend

3 Intelligent Cockpit Domain Controller Configuration Strategy and Application Trend of OEMs

4 Intelligent Cockpit Domain Controller (By Model) Tier1 Solutions and Trend

5 Cockpit-Driving Integration Domain Controller (By Model) Tier1 Solutions and Trend

6 Research on Chinese Cockpit Domain Controller Suppliers

(주)글로벌인포메이션 02-2025-2992 kr-info@giikorea.co.kr
ⓒ Copyright Global Information, Inc. All rights reserved.
PC버전 보기