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중국의 자동차용 마이크로컨트롤러 유닛(MCU) 산업 보고서(2025년)
Automotive Microcontroller Unit (MCU) Industry Report, 2025
상품코드 : 1694629
리서치사 : ResearchInChina
발행일 : 2025년 03월
페이지 정보 : 영문 470 Pages
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한글목차

지능형 차량 제어를 위한 미들 하이엔드 MCU는 국외 제품을 대체하는 국산 제품의 중요한 초점이 되었습니다.

소프트웨어 정의 자동차, 인텔리전스, 전동화의 동향에 있어서, 지능형 차량 제어 부문에서는 고성능·고신뢰성의 자동차용 마이크로컨트롤러 유닛(MCU)에 대한 요구가 높아지고 있습니다. 2027년 중국 승용차의 '준중앙 존' 아키텍처의 보급률이 16.3%에 달할 것으로 예상되며 '중앙 존' 아키텍처의 보급률은 14.3%에 이를 것으로 추정됩니다. 미들-하이엔드 자동차용 마이크로컨트롤러 유닛(MCU) 수요를 크게 뒷받침합니다.

현재 자동차용 마이크로컨트롤러 유닛(MCU)의 공정 노드는 주로 40nm 이상으로 성숙하고 있습니다. EEA의 진화에 따라 일부 첨단 자동차용 마이크로컨트롤러 유닛(MCU) 제품은 28/22nm 공정, 혹은 더욱 진보된 16/18nm 공정을 채용하는 경향이 강해질 것으로 보입니다.

지능형 차량 제어용 미드-하이엔드 MCU는 주로 존 컨트롤 유닛(ZCU), 센트럴 도메인 컨트롤 유닛(XCU), 자율주행·파워/섀시 도메인 컨트롤 유닛, 센트럴 컴퓨팅 유닛(CCU)에 탑재됩니다. 응용 시나리오는 전기 파워 스티어링 시스템, 전자 안정 제어 시스템, 서스펜션 시스템, 안티 록 브레이크 시스템, 에어백 시스템, 신 에너지 자동차 인버터, 배터리 관리 시스템 등을 포함합니다. Infineon 및 Renesas와 같은 기업은 이미 16-28nm 프로세스 노드를 커버하는 TC4x 및 RH850 시리즈로 자율주행 및 파워/섀시 도메인 하이엔드 시장을 독점하고 있습니다.

한편, 중국의 일부 칩 공급업체는 서서히 기술적인 브레이크 스루를 완수해, 지능적인 차량 제어용의 미들-하이엔드 MCU로 국외의 동업 타사를 대체할 능력을 갖게 되었습니다.

SemiDrive : 2022년 4월 SemiDrive는 고성능 MCU 제품인 E3 Series를 발표했습니다. 칩과 키 그룹화된 소프트웨어는 ISO 26262 ASIL D 기능 안전 제품 인증과 중국의 Class II 암호화 인증을 통과했으며 하드웨어 보안 모듈은 높은 수준의 정보 보안을 지원합니다. E3 시리즈는 현재 존 컨트롤, 바디 컨트롤, 전기 구동, 배터리 관리 시스템(BMS), 지능형 섀시, ADAS 등의 핵심 분야에서 널리 사용되고 있으며, 중요한 자동차 용도에서 양산 경험을 도입하고 있습니다. 출하 대수는 수백만대에 이르며 40개가 넘는 주요 차종으로 양산되고 있습니다.

Chipsea : 2024년, AEC-Q100 Grade 2를 준수하는 32비트 범용 자동차용 마이크로컨트롤러 유닛(MCU), CS32F036Q를 발표했습니다.

C*Core Technology : CCFC2003PT, CCFC2006PT 시리즈 칩은 엔진 제어 MCU의 대체품입니다.

Tongxin Micro : ASIL-D 인증을 받은 THA6 시리즈가 파워 도메인 시장에 진출했습니다.

2024년 SemiDrive는 차세대 존 컨트롤 유닛(ZCU)을 중심으로 E3시리즈의 제품 라인업을 더욱 개선하여 바디 컨트롤, 바디 섀시 파워의 크로스 도메인 통합, 슈퍼 파워 도메인 컨트롤 등 존 EEA의 핵심 응용 시나리오를 목표로 한 ZCU 협력 솔루션을 발표했습니다. CPU/NVM 및 사용 가능한 GPIO를 가로 및 세로 축으로 사용 이 포트폴리오에는 E3119, E3620B, E3650, E3800이 포함됩니다.

그 중에서도 지능형 제어를 위한 플래그쉽 MCU 제품인 E3650은 존 컨트롤 유닛(ZCU) 및 도메인 컨트롤 유닛(DCU)과 같은 용도 시나리오를 위해 특별히 설계되었습니다.

이 보고서는 중국의 자동차용 마이크로컨트롤러 유닛(MCU) 산업에 대해 조사 분석하여 시장 규모, 설계 동향, 응용 시나리오, 국내외 공급업체 등의 정보를 제공합니다.

목차

제1장 자동차용 마이크로컨트롤러 유닛(MCU)의 정의와 개요

제2장 자동차용 마이크로컨트롤러 유닛(MCU) 산업 동향

제3장 OEM 각사에 의한 자동차용 마이크로컨트롤러 유닛(MCU)의 응용

제4장 자동차용 마이크로컨트롤러 유닛(MCU)의 주요 응용 시나리오

제5장 중국의 자동차용 마이크로컨트롤러 유닛(MCU) 공급업체

제6장 국외의 자동차용 마이크로컨트롤러 유닛(MCU) 공급업체

KTH
영문 목차

영문목차

Research on automotive MCUs: the independent, controllable supply chain for automotive MCUs is rapidly maturing

Mid-to-high-end MCUs for intelligent vehicle control are a key focus of domestic products replacing foreign ones.

In the trends towards software-defined vehicles, intelligence, and electrification, the intelligent vehicle control sector has higher requirements for high-performance, high-reliability automotive MCUs. It is estimated that in 2027, the penetration rate of "quasi-central + zonal" architecture in China's passenger cars will hit 16.3%, and that of "central + zonal" architecture will reach 14.3%, giving a big boost to the demand for mid-to-high-end automotive MCUs.

Currently, automotive MCU process nodes are primarily at 40nm and above, and mature. With the evolution of EEA, some advanced automotive MCU products will increasingly adopt 28/22nm process or even more advanced 16/18nm.

Mid-to-high-end MCUs for intelligent vehicle control are mainly deployed in zone control units (ZCU), central domain control units (XCU), autonomous driving and power/chassis domain control units, and central computing units (CCU). Application scenarios include electric power steering systems, electronic stability control systems, suspension systems, anti-lock braking systems, airbag systems, new energy vehicle inverters, and battery management systems. Companies like Infineon and Renesas dominate the high-end markets of autonomous driving and power/chassis domains with TC4x and RH850 series, which already cover 16-28nm process nodes.

Meanwhile, some Chinese chip vendors have gradually made technological breakthroughs and had the ability to replace their foreign peers in mid-to-high-end MCUs for intelligent vehicle control:

SemiDrive: In April 2022, SemiDrive launched its high-performance MCU product, the E3 Series. The chips and key grouped software have passed ISO 26262 ASIL D functional safety product certification and China's Class II cryptographic certification, with hardware security modules supporting high-level information security. The E3 Series is now widely used in core areas such as zone control, body control, electric drive, battery management system (BMS), intelligent chassis, and ADAS, and incorporates mass-production experience in critical vehicle applications. With shipments up to millions of units, it has been mass-produced for over 40 mainstream vehicle models.

Chipsea: In 2024, it launched CS32F036Q, a 32-bit general-purpose automotive MCU compliant with AEC-Q100 Grade 2.

C*Core Technology: CCFC2003PT and CCFC2006PT series chips have been an alternative to engine control MCUs.

Tongxin Micro: The THA6 series, ASIL-D certified, has entered the power domain market.

In 2024, SemiDrive further improved its E3 series product lineup, focusing on the next-generation zone control units (ZCU), and introduced a ZCU cooperative solution targeting core application scenarios in zonal EEA, including body control, body + chassis + power cross-domain integration, and super power domain control. Using CPU/NVM and available GPIO as transverse and longitudinal axes, this portfolio includes the E3119, E3620B, E3650, and E3800.

First Tier: E3119/E3118/E3119-IOE

IO and IO-rich products capable of supporting development of entry-level ZCUs for traditional gateways, body control, and anti-pinch applications.

Compact packaging, supporting SMP and FOTA, and 10x CANFD and 1x Gbit, with up to 326 IOs, and also paired with second- or third-tier products.

Second Tier: E3620B

Primarily used for advanced integrated ZCUs, enabling further integration of power and chassis domains, and also paired with first- or third-tier products.

Hardware-level communication engine SSDPE and multi-channel Gbit transmission capacity.

Third Tier: E3650

Balance computing power, storage, high functionality, low power consumption, low communication latency, and ring network capabilities, making it the preferred choice in 48V domain controller platforms. It can also be paired with first-tier products.

Feature a multi-core high-compute cluster, the largest number of available GPIOs on the market, leading virtualized mass-production experience, hardware-level communication engine SSDPE, and multi-channel Gbit transmission capacity.

Fourth Tier: E3800

Super power domain integration, featuring more scenario-specific acceleration co-processors and more advanced high-speed interfaces.

Among them, the flagship MCU product for intelligent control, E3650, is specifically designed for application scenarios such as zone control units (ZCU) and domain control units (DCU).

Nearly a 40% surge in computing power, and a 30% expansion in storage capacity: It adopts the latest ARM Cortex R52+ high-performance lockstep multi-core cluster, with main frequency up to 600MHz, the highest in its class, and packs the largest storage capacity in the same tier.

30% more available peripherals and GPIOs: It integrates multiple peripheral BOM devices and is configured with the largest number of available GPIOs on the market, significantly reducing various peripheral IO expansion chips required for the system.

50% improvement in low-power performance: It features a built-in hardware communication acceleration engine that offloads communication task processing in domain control, reducing packet loss and latency while significantly lowering the load on the main CPU.

Ceiling-level information security protection: It integrates the SemiDrive Xuanwu Ultra-Secure HSM (Hardware Security Module), and supports OEMs' customized and complex encryption/decryption algorithms. It complies with ISO 21434, Evita Full, and higher information security standards, and meets both domestic and overseas high-level security standards.

Additionally, E3650 has been specifically optimized for virtualization (Hypervisor) support on MCU systems, offering a production-ready virtual solution to help OEMs achieve efficient business isolation and code integration. E3650 not only covers four core application scenarios of intelligent driving/intelligent cockpit, power domain control, VMC chassis domain control, and zone control unit, but also reduces BOM costs by nearly 60% (varying by system design) thanks to its higher integration level. Currently, E3650 has officially begun customer sampling and has been designated by multiple leading OEMs.

RISC-V architecture is bringing new opportunities in automotive MCU market, and Chinese players work to build an independent, controllable supply chain.

Core architectures for automotive MCUs are relatively diverse. Mainstream ARM architecture-based processors currently dominate the global market in intelligent cockpits, vehicle entertainment, and ADAS, but their percentage in body domain controller, chassis, and powertrain applications is relatively small, where Power PC and Infineon TriCore architectures prevail.

With the rise of the new open-source RISC-V architecture, Chinese and foreign IP suppliers have launched over a dozen series of automotive-grade IPs, covering general-purpose, high-performance MCUs and security chip IPs, and basically meeting current demand for automotive control chips. On this basis, chip vendors are now developing high-performance RISC-V chips for body, powertrain, and chassis applications.

In 2023, Qualcomm, NXP, Bosch, Infineon, and Nordic Semiconductor jointly invested in a company aimed at advancing the adoption of RISC-V. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive.

In 2024, Renesas announced R9A02G021, the industry's first general-purpose 32-bit RISC-V-based microcontroller (MCU), designed to withstand harsh conditions. Consuming extremely low power in standby, it provides 128KB of fast flash memory, 16KB of SRAM memory and 4KB of flash memory for data storage.

In 2025, Infineon plans to introduce RISC-V into the automotive MCU market, launch a new family under its AURIX brand, and accelerate ecosystem establishment via a virtual prototype.

RISC-V is an open, reduced instruction set computer (RISC)-based instruction set architecture (ISA) designed to serve as a general-purpose computer architecture. Embracing an open-source design philosophy, RISC-V allows anyone to view, use, modify, and distribute its design. The goal is to provide a flexible, scalable, and high-performance computer architecture suitable for a wide range of applications. Key benefits include low development threshold, low licensing costs, high software portability, independent controllability, and flexibility and customization capabilities for proprietary chips.

To be applied in automotive electronics, the following conditions must be met:

Safety and Reliability: RISC-V implementation must comply with stringent industry safety standards, such as ISO 26262 functional safety certification, to be considered for critical applications.

Ecosystem and Support: The availability of a robust and mature ecosystem (including tools, software, and support) has a big impact on the adoption of RISC-V in the automotive sector.

Industry Acceptance: OEMs and Tier1 suppliers transitioning to RISC-V in hardware and software system design may require extensive testing, verification, and assurances of long-term support.

Cost and Licensing: With open-source nature, RISC-V remains superior in licensing costs, but its overall system cost (including development, integration, and support) should remain competitive.

China is striving to develop RISC-V architecture MCUs. Companies like HPMicro, Nanjing Cercis Semiconductor, Wuhan Binary Semiconductor, Chipext, and ESWIN Computing are facilitating the deployment of RISC-V-based MCUs in vehicles and expanding the application areas.

HPMicro: Andes Technology, Jingwei HiRain, and HPMicro have collaborated to integrate the AndesCore(TM) RISC-V processor series, HPMicro's full range of HPM6200 products, and Jingwei HiRain's Vehicle OS software platform solution to jointly build a RISC-V ecosystem in automotive chips. HPMicro has completed ISO 9001 quality management certification and ISO 26262 ASIL D functional safety management system certification. The full HPM6200 product line has passed AEC-Q100 Grade 1 certification, with an operating temperature range of -40°C to 125°C.

Cercis Semiconductor: The Cercis M100 achieves a CoreMark score of up to 2.42 (CPU performance), actual benchmark results of up to 2.42 Coremark/MHz, and quicker overall response. It meets automotive ASIL-B requirements, supports Chinese cryptographic standards (SM2/3/4) with its hardware security module (HSM), and complies with the ISO 21434 cybersecurity standard. Great Wall Motor plans to widely adopt the chip in its multiple vehicle models, expected to be no less than 2.5 million units over the next five years.

Table of Contents

1 Definition and Overview of Automotive Microcontroller Units (MCUs)

2 Automotive Microcontroller Unit (MCU) Industry Trends

3 Application of Automotive Microcontroller Units (MCUs) by OEMs

4 Major Application Scenarios of Automotive Microcontroller Units (MCUs)

5 Chinese Automotive MCU Vendors

6 Foreign Automotive MCU Vendors

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