Research Report on Intelligent Vehicle E/E Architectures and Their Impact on Supply Chain in 2024
상품코드:1567950
리서치사:ResearchInChina
발행일:2024년 09월
페이지 정보:영문 650 Pages
라이선스 & 가격 (부가세 별도)
한글목차
ResearchInChina의 통계에 따르면, 2024년 상반기 도메인 융합 아키텍처 승용차는 77만 9,000대가 판매되어 7.9%의 점유율을 차지했고, 그 다음으로는 준중앙 구역 아키텍처 승용차가 33만 6,000대로 3.4%의 점유율을 차지했으며, 중앙 존 아키텍처 승용차가 6만 7,000대로 0.7%의 점유율을 기록했습니다.
존 아키텍처의 명백한 비용 우위와 우수한 차량 공간 설계로 인해 2027년까지 '준 중앙 구역' 아키텍처와 '중앙 구역' 아키텍처의 보급률은 각각 16.3%와 14.3%에 달할 것으로 예상됩니다.
예를 들어, Geely는 2024년 상반기 전기화율 34.2%, 도메인 융합 아키텍처 보급률 25.4%를 확보했습니다.
2024년 8월, Geely의 Galaxy E5는 GEEA 3.0에서 데뷔했습니다.
차체 도메인에는 운전석 ZCU(ZCUDM)와 조수석 ZCU(ZCUP)가 있습니다.
Flyme Auto는 Android를 기반으로 한 맞춤형 서비스입니다.
싱글칩 '조종석 주차 통합 솔루션'은 SiEngine Technology의 'Longying No.1'을 기반으로 합니다.
전기 구동 시스템은 "11-in-one"을 실현 : VCU, MCU, HBMS, LBMS, OBC, DCDC, PDU, 모터, 감속기, 감속기, GWRC, TMS
준중앙 구역 제어 아키텍처는 차량 와이어 하니스 레이아웃 개선, 경량화, 비용 절감 등의 이점을 가져다주며, 갤럭시 E5의 사용 가능 면적은 전체 조종석 면적의 67.2%를 차지해 동급 배터리 구동 A클래스 SUV 중 단연 돋보입니다. 보조금과 할인을 적용한 가격은 109,800-145,800위안으로 A급 배터리 구동 SUV 시장에 높은 영향을 미칠 것으로 예상됩니다.
Geely는 GEEA 3.0을 더 많은 모델에 보급하고 차량에 차량 수준의 OS를 탑재하여 진정한 중앙 컴퓨팅 영역 아키텍처 플랫폼을 형성할 것입니다.
또한, Leapmotor의 센트럴 존 아키텍처를 탑재한 차량의 판매량이 급증하고 있습니다. 현재 판매되고 있는 Leapmotor의 주요 모델, 즉 C16, C10, C11, C01은 최신 LEAP 3.0(Four-leaf Clover Central Zone Architecture)을 탑재하고 있으며, 2024년 8월 Leapmotor의 판매량은 3만 305대로 전년 동월 대비 113% 이상 급증했습니다.
LEAP 3.0을 기반으로 4개의 도메인을 하나로 통합하고 ECU 수를 줄인 LEAP 3.0은 LEAP 2.0(도메인 집중형 아키텍처)에 비해 자동차 컨트롤러 수를 42개에서 28개로, 자동차 와이어링 하니스를 1.5km 미만으로, 무게를 23kg으로 줄입니다. 비용 절감과 공간 확대와 함께 기능 구성이 개선되고 가격이 낮아졌습니다.
중앙/준중앙 구역 아키텍처는 Leapmotor C 시리즈, Geely Galaxy E5, IM L6, 곧 출시될 Voyah Courage 등 OEM이 비용을 절감할 수 있는 방법입니다.
EEA의 혁신 : SoC 외에도 ECU 통합 설계와 중앙 크로스 도메인 SoC(MCU)를 탑재하여 공급망 통합을 가속화하고 비용을 절감합니다.
기존의 분산형 아키텍처가 적용된 차량에는 100개 이상의 ECU가 탑재되어 있습니다. 기능 도메인 아키텍처는 ECU의 부분적인 통합을 실현했습니다. 최종 중앙 컴퓨팅 영역 아키텍처에서는 ZCU와 HPC가 차량 내 대부분의 ECU를 통합합니다.
ZCU의 하드웨어 설계 개념은 보드 레벨 통합을 통해 컨트롤러를 표준화하고 유사한 특성을 가진 모든 제어 모듈을 구역으로 통합하고 MCU는 ECU를 초대형 컨트롤러에 통합하여 하나의 PCBA에서 서로 다른 구역의 기능을 제어합니다. 따라서 존 아키텍처에서는 ECU 수가 줄어들고, 줄어든 ECU는 ZCU에 통합됩니다. 또는 ECU를 HPC에 업로드하여 스마트 센서 및 액추에이터로 변환할 수 있습니다.
이 보고서는 중국 자동차 산업에 대한 조사 분석을 통해 지능형 차량의 E/E 아키텍처와 그 공급망에 미치는 영향을 살펴봅니다.
목차
제1장 EEA의 정의, 전개, 데이터 분석
자동차 EEA의 정의 프레임워크와 평가 시스템
데이터 분석 : EEA 전개와 동향
25개사 OEM의 EEA 전개와 공급망
제2장 공급망에 대한 EEA 업그레이드와 진화의 영향
소프트웨어 업그레이드 : 차량 레벨 운영체제
하드웨어 업그레이드 : 기존 ECU 통합 설계에 의해 센트럴 크로스 도메인 SoC가 탑재된다
통신 업그레이드 : 도메인 게이트웨이, 센트럴 게이트웨이, 존 게이트웨이
통신 업그레이드 : 존 백본 네트워크, 1-2.5G 고속 링 네트워크 + CAN-XL/10M 저속 네트워크
통신 업그레이드 : PCIe 스위치와 PCIe SSD 스토리지가 널리 사용되게 된다
전원 업그레이드 : 48V 저전압 전원 네트워크 혁신과 이더넷 케이블(PoE) 전원
보안 업그레이드 : 존 아키텍처에서의 사이버 보안 보호
제3장 중국 OEM의 EEA, 공급망, 모델 플랫폼 계획
Xpeng
NIO
Li Auto
Xiaomi Automobile
Huawei Smart Selection 기반 모델
Neta
Leapmotor
Voyah
Geely
SAIC(IM, Rising Auto, MG 등)
ARCFOX
Changan Automobile
GAC
BYD
FAW Group
Chery Automobile
Great Wall Motors
제4장 국외 OEM의 EEA, 공급망, 모델 플랫폼 계획
Tesla
BMW
Mercedes-Benz
Volkswagen
Volvo
Ford Motor
General Motors
Stellantis
ksm
영문 목차
영문목차
E/E Architecture (EEA) research: Advanced EEAs have become a cost-reducing tool and brought about deep reconstruction of the supply chain
The central/quasi-central + zonal architecture has become a way for OEMs to reduce costs
In this report, ResearchInChina divides the EEAs of OEMs into five types:
Distributed ECU
Domain centralized architecture: The multi-domain architecture spreads to fuel vehicles, A-class and below battery-electric passenger cars;
Domain fusion architecture: Usually equipped with the vehicle central domain controller, it can support cross-domain communication, such as cockpit-driving integration, integration of intelligent driving and chassis, cockpit-body-gateway integration, camera sharing, etc.
Quasi-central computing + zonal architecture: With ZCUs (intelligent power distribution, zonal servitization), there are still multiple computing centers with multiple boxes and chips;
Central computing + zonal architecture: With vehicle-level OS and ZCUs (intelligent power distribution, zonal servitization), it can support a computing center with multiple chips or a single chip in a single box to realize the integration of cockpit domain, intelligent driving domain, vehicle control domain, etc..
According to statistics from ResearchInChina, 779,000 passenger cars with domain fusion architectures were sold in 2024H1, accounting for 7.9%, followed by 336,000 passenger cars with quasi-central + zonal architectures with a share of 3.4% and 67,000 passenger cars with central + zonal architectures with a share of 0.7%.
Due to the obvious cost advantages incurred by zonal architectures and the superior vehicle space design, the penetration rate of "quasi-central + zonal" architectures and "central + zonal" architectures will reach 16.3% and 14.3% by 2027 respectively.
For example, Geely secured an electrification rate of 34.2% and a domain fusion architecture penetration rate of 25.4% in 2024H1.
In August 2024, Geely Galaxy E5 debuted with GEEA 3.0:
In the body domain, there are a driver-side ZCU (ZCUDM) and a front-passenger-side ZCU (ZCUP)
Flyme Auto is deeply customized based on Android
The single-chip "cockpit-parking integration solution is based on "Longying No.1" of SiEngine Technology
The electric drive system realizes "eleven-in-one": VCU, MCU, HBMS, LBMS, OBC, DCDC, PDU, Motor, Reducer, GWRC and TMS
As the quasi-central + zonal control architecture brings advantages like better vehicle wiring harness layout, weight reduction, and cost reduction, the usable area in the Galaxy E5 car accounts for 67.2% of the total cockpit space, which is outstanding among battery-electric A-class SUVs of the same level. It is priced at RMB109,800-145,800 after being subsidized and discounted. It is expected to have a huge impact on the A-class battery-electric SUV market.
Geely will promote GEEA 3.0 among more models, and further install vehicle-level OS in vehicles to form a true central computing + zonal architecture platform.
In addition, Leapmotor's vehicles equipped with central + zonal architectures have experienced a surge in sales volume. Leapmotor's main models currently on sale, namely C16, C10, C11 and C01, carry the latest LEAP 3.0 ("Four-leaf Clover" central + zonal architecture). In August 2024, Leapmotor sold 30,305 vehicles, a year-on-year spike of more than 113%.
Based on LEAP 3.0, four domains are integrated into one, and the number of ECUs is slashed. Compared with LEAP 2.0 (domain centralized architecture), LEAP 3.0 makes the number of automotive controllers in the vehicle fall from 42 to 28, the vehicle wiring harness to less than 1.5 km, and the weight to 23 kg. While reducing costs and increasing space, it improves functional configuration and lower the price.
The central/quasi-central + zonal architecture has become a way for OEMs to reduce costs, such as Leapmotor C series, Geely Galaxy E5, IM L6, and the soon-to-be-delivered Voyah Courage.
EEA innovation: In addition to SoCs, ECU integrated design and central cross-domain SoCs (MCUs) will be introduced to accelerate supply chain integration and reduce costs.
A vehicle equipped with a traditional distributed architecture has more than 100 ECUs. The functional domain architecture has achieved partial ECU integration. Under the final central computing + zonal architecture, ZCUs and HPCs will integrate most of the ECUs in the vehicle.
The hardware design concept of ZCUs is to standardize controllers by board-level integration, and integrate all control modules with similar properties in a zone. The MCU integrates ECUs into a super large controller, so that one PCBA controls the functions of different zones. Therefore, under the zonal architecture, the number of ECUs is slashed, and the reduced ECUs are incorporated into ZCUs. Alternatively, they can be uploaded to the HPC, and transformed into smart sensors or actuators.
ZCUs can reduce the number of ECUs and communication interfaces, wiring harness costs and weight while saving space and achieving higher computing power utilization. Currently, most OEMs have planned to use 2 to 4 ZCUs in their next-generation multi-domain computing architectures each to integrate most ECU functions and cut down the number of ECUs.
As most of ECU functions are integrated into the HPC and ZCUs, MCUs (SoCs) have been upgraded, and high-performance MCUs (SoCs) have been widely used.
In addition to the widely used NXP S32G2/G3 series, Renesas R-CarS3/S4 series, TI DRA series, SemiDrive G9H and other chips, NXP's powerful 5nm MCUs (SoCs), SemiDrive E3650, etc. also attract much attention.
NXP's first 5nm automotive MCU (SoC)
At the end of March 2024, NXP officially launched the world's first 5-nanometer automotive MCU. However, NXP did not call it an MCU, but dubbed it the S32N55 processor, the first device in the new S32N family of vehicle super-integration processors. It is actually a SoC with the following features:
It has highly efficient computing cores that emphasize real-time performance;
The cores can operate in split or lockstep mode to support different functional safety levels up to ISO 26262 ASIL D;
It has a variety of network interfaces, including CAN, LIN, FlexRay, automotive Ethernet, CAN-FD, CAN-XL and PCIe, with at least 15 CAN network interfaces;
Multiple ECU functions are integrated, including vehicle dynamic control, body, comfort, and central gateway. For example, S32N55 boasts the Automotive Math and Motor Control Library (AMMCLib) which supports AUTOSAR and small real-time operating systems (such as Zephyr), Real-Time Drivers (RTD), Type1 hypervisors, Inter-Platform Communication Framework (IPCF), Safety Software Framework (SAF) and Structural Core Self-Test (SCST).
SemiDrive E3650
This product uses the latest ARM Cortex R52+ high-performance lock-step multi-core cluster, supports virtualization, has a non-volatile memory (NVM) up to 16MB, large-capacity SRAM and rich available peripheral resources to enable EEAs with higher integration and wider configurations.
EEA innovation: from decentralized operating system to vehicle-level OS which is the key to central computing
The vehicle OS is oriented towards the central computing platform and is based on SOA. It can integrate the functions of different domains in the vehicle (cockpit, intelligent driving, vehicle control, etc.) into one platform system, thereby providing a vehicle-level platform with the same set of programming interfaces. It is a development and operation platform for all vehicle domain software and services.
Leapmotor vehicle OS: software and hardware decoupling, SOA, and multi-system software integration.
Leapmotor OS IVI system: QNX (cluster) + Android (IVI system) based on QNX Hypervisor;
Gateway, etc.: Linux;
ADAS, vehicle control, CAN bus system: based on RTOS;
Communication middleware: DDS distributed communication middleware + Mailbox communication bus;
SOA: "Four-Leaf Clover" SOA software design architecture. 200+ interfaces are open for custom scenario applications, 500+ interfaces are reserved, scenario codes can be shared. Super senseless OTA: cockpit upgrade completed within 8 seconds (detection environment in 7 seconds, system switching in one second).
NIO's full-stack self-developed vehicle OS - SkyOS
SkyOS-L: The first real-time operating system that realizes localization of AutoSAR and large-scale commercialization. Compared with AUTOSAR, SkyOS-L has a 30-40% higher real-time periodic signal delivery rate;
SkyOS-M: The microkernel architecture runs in the central brain and mainly controls the body, chassis, suspension, etc. The kernel is more stable than traditional Linux with better service isolation. On the basis of safety isolation, there is a four-layer monitoring and three-layer recovery security mechanism;
SkyOS-C: The deeply customized operating system based on Android carries the functions of the smart cockpit, with the self-developed TOX protocol stack, more stable data transmission, and AI smart experience including NOMI;
SkyOS-R: It improves the load capacity of the system;
SOA framework: NIO defines a high-performance cross-domain communication protocol named TOX, which means Talks Over X. It can be applied to all network types and all communication terminals;
The cross-domain communication protocol TOX can provide high-bandwidth, high-capacity, low-latency, and high-reliability communication. It can be 30-50 times faster than the traditional CAN bus. Compared with the traditional automotive communication protocol SOME/IP, the end-to-end delay is reduced by 40%, and the zero packet loss threshold is increased by 109%. The reliability of TOX transmission is higher than SOME/IP.
Xpeng's unified cross-domain middleware (UCM) for vehicles:
Vehicle communication middleware includes system security middleware, data security middleware, functional safety, vehicle OTA, vehicle SOA, etc. Cockpit applications and autonomous driving applications are immune to differences or changes in hardware platforms, thus greatly improving research and development efficiency and speed.
To optimally allocate hardware resources, Xpeng adopts the "building blocks" approach to arrange and combine resources according to actual needs, so as to make products with optimal utilization, best performance and best experience.
EEA innovation: Cockpit-driving integration and integration of cockpit + driving + vehicle control are gradually becoming the mainstream, and the PCIe communication framework will be built
Under the quasi-central/central architecture, all systems that require computing resources, such as intelligent driving, cockpit, parking, power, chassis, body, and seating systems, may be concentrated in a central computing unit. Therefore, a severe challenge for automotive networks is the high-performance computing interconnection of the central computing platform itself.
According to the degree of concentration of the "central computing platform", there are "Multi-Box", "One-Box", "One-Board" and "One-SoC". In addition to breakthroughs in integrated design technology at the chip hardware level, this centralized process also relies on advances in communication technologies such as inter-board interconnection, inter-chip interconnection, and on-chip interconnection.
As shown in the figure below, 4 Ethernets are connected to the PCIe bridge. The bandwidth of these 4 ECUs is about 50Gbps, so a bridge chip or switch should be used to convert Ethernet to PCIe.
Architecture centralization has promoted the development of data storage technology from traditional eMMC and UFS to more powerful PCIe 3.0 and PCIe 4.0 SSD. Large-capacity SSDs with PCIe bus will be the main form of automotive storage under zonal architectures in the future.
Table of Contents
1 Definition, Deployment and Data Analysis of EEAs
1.1 Definition Framework and Evaluation System of Automotive EEAs
1.1.1 Definition and Classification of Automotive EEAs
1.1.2 Evolution of Automotive EEAs
1.1.3 Five Evaluation Dimensions of EEAs
1.2 Data Analysis: Deployment and Trends of EEAs
1.2.1 EEA Deployment and Trends in the Next Five Years
1.2.2 EEA Deployment and Trends in the Next Five Years (Appendix)
1.2.3 Major OEMs Adopting Domain Fusion Architectures and Sales Volume of Models with Such Architectures (1)
1.2.4 Major OEMs Adopting Domain Fusion Architectures and Sales Volume of Models with Such Architectures (2)
1.2.5 Major OEMs Adopting Domain Fusion Architectures and Sales Volume of Models with Such Architectures (3)
1.2.6 Major OEMs Adopting Quasi-central Computing + Zonal Architectures and Sales Volume of Models with Such Architectures
1.2.7 Major OEMs Adopting Central Computing + Zonal Architectures and Sales Volume of Models with Such Architectures
1.3 EEA Deployment and Supply Chain of 25 OEMs
1.3.1 EEA Deployment and Supply Chain of 25 OEMs (1)
1.3.2 EEA Deployment and Supply Chain of 25 OEMs (2)
1.3.3 EEA Deployment and Supply Chain of 25 OEMs (3)
1.3.4 EEA Deployment and Supply Chain of 25 OEMs (4)
1.3.5 EEA Deployment and Supply Chain of 25 OEMs (5)
1.3.6 EEA Deployment and Supply Chain of 25 OEMs (6)
1.3.7 EEA Deployment and Supply Chain of 25 OEMs (7)
1.3.8 EEA Deployment and Supply Chain of 25 OEMs (8)
1.3.9 EEA Deployment and Supply Chain of 25 OEMs (9)
1.3.10 EEA Deployment and Supply Chain of 25 OEMs (10)
2 Impact of EEA Upgrade and Evolution on the Supply Chain
2.1 Software Upgrade: Vehicle-level Operating System
2.1.1 Automotive Operating Systems Evolve to Vehicle-level Operating Systems
2.1.2 Key to OEMs' Self-developed Vehicle OS: Upper-layer Application Ecosystem
2.1.3 Decision-making Factors of OEMs' Self-developed Vehicle OS
2.1.4 Vehicle OS Layout of OEMs (1)
2.1.5 Vehicle OS Layout of OEMs (2)
2.1.6 Vehicle OS Layout of OEMs (3)
2.2 Hardware Upgrade: Traditional ECU Integrated Design Introduces Central Cross-domain SoCs
2.2.1 Usage of ECUs under Traditional Architectures
2.2.2 A Large Number of ECUs Will Be Integrated into ZCUs and HPCs amid Evolution of Automotive EEAs
2.2.3 ECU Integrated Design of OEMs amid Evolution of Automotive EEAs
2.2.4 ECU Integration Derives High-performance Central Cross-domain SoCs: SemiDrive's Body + Chassis + Power Cross-domain Fusion Chip - E3650
2.2.5 ECU Integration Derives High-performance Central Cross-domain SoCs: NXP's first 5nm automotive MCU - S32N55
2.2.6 ECU Integration Derives High-performance Central Cross-domain SoCs: NXP's first 5nm automotive MCU - S32N55
2.2.7 Cross-domain High-performance Central Computing SoCs (MCUs)
2.3 Communication Upgrade: Domain Gateways, Central & Zonal Gateways
2.3.1 Gateway Deployment under "Central Computing + Zonal" Architectures: Zonal Gateways & Central Gateways
2.3.2 Gateway Deployment under "Central Computing + Zonal" Architectures: Domain Gateways Evolve into Zonal Gateways
2.3.3 Gateway Deployment under "Central Computing + Zonal" Architectures: Introduction of High-performance Gateway SoCs