한글목차

세계의 SiC 웨이퍼용 레이저 절단 장비 시장 규모는 2024년에 1억 3,800만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 15.8%로 확대하며, 2031년까지 3억 8,100만 달러로 재조정될 전망입니다.

이 보고서는 SiC 웨이퍼용 레이저 커팅 장비에 대한 최근 관세 조정과 국제적인 전략적 대응 조치에 대해 국경 간 산업적 발자취, 자본 배분 패턴, 지역 경제의 상호의존성, 공급망 재편 등의 관점에서 종합적인 평가를 제공합니다.

2024년 세계 SiC 웨이퍼용 레이저 커팅 장비의 생산량은 242대, 세계 평균 시장 가격은 대당 약 57만 8,000달러에 달했습니다.

실리콘 카바이드(SiC)는 1893년 연삭 휠과 자동차 브레이크의 산업용 연마재로 발견되었습니다. 20세기 중반, SiC 웨이퍼의 용도는 LED 기술까지 확대되었습니다. 그 이후, 우수한 물리적 특성으로 인해 수많은 반도체 응용 분야로 확대되고 있습니다. 이러한 특성은 반도체 산업 안팎에서 폭넓게 활용되고 있습니다. 무어의 법칙이 한계에 다다른 것처럼 보이는 가운데, 반도체 업계내 많은 기업이 미래 반도체 재료로 실리콘 카바이드에 주목하고 있습니다.

기존의 실리콘 기판과 비교하여 실리콘 카바이드를 사용하면 여러 가지 장점이 있습니다. 주요 장점 중 하나는 경도입니다. 이러한 특성은 고속, 고온, 고전압 응용 분야에서 많은 이점을 제공합니다.

실리콘 카바이드 웨이퍼는 열전도율이 높아 열을 한 지점에서 다른 지점으로 효율적으로 전달할 가능성이 있습니다. 이를 통해 전기 전도성이 향상되고, 궁극적으로 미세화가 촉진됩니다. 이는 SiC 웨이퍼로의 전환에 있으며, 공통된 목표 중 하나입니다.

또한 탄화규소 기판은 열팽창 계수가 낮은 특성을 가지고 있습니다. 열팽창은 재료가 가열 또는 냉각될 때 발생하는 팽창과 수축의 양과 방향을 말합니다. 가장 일반적인 예로 얼음을 들 수 있는데, 실리콘 카바이드는 많은 금속과 반대로 냉각시 팽창하고 가열시 수축하는 성질을 가지고 있습니다. 실리콘 카바이드의 낮은 열팽창 계수는 가열 및 냉각시 치수 및 형상 변화가 매우 적다는 것을 의미합니다. 이러한 특성으로 인해 소형 소자 구현 및 단일 칩에 트랜지스터 고밀도 집적에 최적입니다.

SiC는 다이아몬드와 동등한 경도를 가지고 있습니다. 따라서 다이아몬드 블레이드로 SiC를 다이싱 가공할 경우, 칩이나 균열과 같은 결함이 발생하여 전류 누설이 발생할 수 있습니다. 이는 자동차 용도의 까다로운 요구 사항을 충족시킬 수 없습니다.

실리콘 카바이드의 레이저 절단 방식은 레이저 개질 절단 기술입니다. 그 원리는 고투과 파장의 레이저 빔을 렌즈로 집광하여 웨이퍼 내부에 조사함으로써 다광자 흡수가 발생하여 국소적인 변형층(개질층)을 형성하는 것입니다. 이 층은 주로 공극, 고변위 밀도 층 및 균열로 구성됩니다. 이 개질층이 후속 웨이퍼 다이싱 및 크래킹의 기점이 됩니다. 레이저와 광로 시스템을 최적화하여 개질층을 웨이퍼 내부에 가두어 표면이나 바닥에 열적 손상을 주지 않고 외력을 이용하여 균열을 표면이나 바닥으로 유도하여 웨이퍼를 정해진 크기로 분리합니다.

지난 10년간의 CAGR로 판단할 때, 개발도상국의 포장 및 테스트 장비에 대한 수요는 더욱 활발합니다. 현재 반도체 시장의 칩 부족으로 인해 패키징 및 테스트 업계는 자본 확충을 통해 적극적으로 생산 능력을 확장하고 있습니다. 신에너지 자동차, 에너지, 산업, 통신 등 분야에서 실리콘 카바이드 장치의 보급률이 높아짐에 따라 실리콘 카바이드 레이저 절단에 대한 시장 수요도 증가하고 있습니다.

레이저 스텔스 절단법은 기존의 연삭 휠 절단이나 레이저 절삭에 비해 우수한 스크라이빙 품질과 높은 효율을 가지고 있으며, 불규칙한 형태의 칩 다이싱을 실현할 수 있으며, 웨이퍼의 수율 향상에 기여합니다. 이러한 장점으로 인해 레이저 스텔스 다이싱은 웨이퍼 슬리빙 기술의 주류로 자리 잡았으며, MEMS 디바이스 칩 제조에 있으며, 필수적인 기술로 자리 잡았습니다.

이 보고서는 SiC 웨이퍼용 레이저 커팅 장비 세계 시장에 대해 총판매량, 판매 매출, 가격, 주요 기업의 시장 점유율 및 순위를 중심으로 지역별, 국가별, 유형별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

SiC 웨이퍼용 레이저 커팅 장비 시장 규모, 추정 및 예측은 판매량(단위) 및 매출액(백만 달러)의 관점에서 제공되며, 2024년을 기준 연도, 2020-2031년의 과거 데이터와 예측 데이터를 포함합니다. 정량적 분석과 정성적 분석을 통해 SiC 웨이퍼용 레이저 커팅 장비: 관련 사업/성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 포지셔닝 분석, 정보에 입각한 사업 판단을 할 수 있도록 도와드립니다.

시장 세분화

기업별

• DISCO Corporation
• Suzhou Delphi Laser Co
• Han's Laser Technology
• 3D-Micromac
• Synova S.A.
• HGTECH
• ASMPT
• GHN.GIE
• Wuhan DR Laser Technology

유형별 부문

• 가공 사이즈 6인치 미만
• 가공 사이즈 8인치 미만

용도별 부문

• 파운드리
• IDM

지역별

• 북미
  • 미국
  • 캐나다
• 아시아태평양
  • 중국
  • 일본
  • 한국
  • 동남아시아
  • 인도
  • 호주
  • 기타 아시아태평양
• 유럽
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 네덜란드
  • 북유럽 국가
  • 기타 유럽
• 라틴아메리카
  • 멕시코
  • 브라질
  • 기타 라틴아메리카
• 중동 및 아프리카
  • 튀르키예
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동 및 아프리카

영문목차

The global market for SiC Wafer Laser Cutting Equipment was estimated to be worth US$ 138 million in 2024 and is forecast to a readjusted size of US$ 381 million by 2031 with a CAGR of 15.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on SiC Wafer Laser Cutting Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

In 2024, global SiC Wafer Laser Cutting Equipment production reached 242 units, with an average global market price of around US$ 578,000 per unit.

Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. About midway through the 20th century, SiC wafer uses grew to include in LED technology. Since then, it has expanded into numerous semiconductor applications due to its advantageous physical properties. These properties are apparent in its wide range of uses in and outside the semiconductor industry. With Moore's Law appearing to reach it's limit, many companies within the semiconductor industry is looking towards silicon carbide as the semiconductor material of the future.

There are numerous advantages to using silicon carbide over more traditional silicon substrates. One of the major advantages is its hardness. This gives the material many advantages, in high speed, high temperature and/or high voltage applications.

Silicon carbide wafers have high thermal conductivity, which means they can transfer heat from one point to another well. This improves its electrical conductivity and ultimately miniaturization, one of the common goals of switching to SiC wafers.

Silicon carbide substrates also have a low coefficient for thermal expansion. Thermal expansion is the amount and direction a material expands or contracts as it heats up or cools down. The most common explanation is ice, although it behaves opposite of most metals, expanding as it cools and shrinking as it heats up. Silicon carbide's low coefficient for thermal expansion means that it does not change significantly in size or shape as it is heated up or cooled down, which makes it perfect for fitting into small devices and packing more transistors onto a single chip.

SiC has the similar hardness as the diamond. Hence dicing the SiC by diamond blade will produce defects of chipping and crack which will induce the current leakage that can't meet the strict demand of automobile applications.

The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.

Judging from the compound annual growth rate in the past ten years, the demand for packaging and testing equipment in developing countries is more vigorous. Due to the current shortage of chips in the chip market, the packaging and testing industry is seeking capital expansion and actively expanding production capacity. As the penetration rate of silicon carbide devices in new energy vehicles, energy, industry, communications and other fields increases, the market demand for silicon carbide laser cutting.

Compared with the traditional grinding wheel cutting and laser ablation, the laser stealth cutting method has better scribing quality and high scribing efficiency, and can realize irregular-shaped chip dicing, which improves the wafer output rate. These advantages make laser stealth dicing become the mainstream of wafer scribing technology, and even an indispensable technology for MEMS device chip manufacturing.

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Cutting Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of SiC Wafer Laser Cutting Equipment by region & country, by Type, and by Application.

The SiC Wafer Laser Cutting Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Cutting Equipment.

Market Segmentation

By Company

• DISCO Corporation
• Suzhou Delphi Laser Co
• Han's Laser Technology
• 3D-Micromac
• Synova S.A.
• HGTECH
• ASMPT
• GHN.GIE
• Wuhan DR Laser Technology

Segment by Type

• Processing Sizes up to 6 Inches
• Processing Sizes up to 8 Inches

Segment by Application

• Foundry
• IDM

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of SiC Wafer Laser Cutting Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of SiC Wafer Laser Cutting Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 SiC Wafer Laser Cutting Equipment Product Introduction
• 1.2 Global SiC Wafer Laser Cutting Equipment Market Size Forecast
  • 1.2.1 Global SiC Wafer Laser Cutting Equipment Sales Value (2020-2031)
  • 1.2.2 Global SiC Wafer Laser Cutting Equipment Sales Volume (2020-2031)
  • 1.2.3 Global SiC Wafer Laser Cutting Equipment Sales Price (2020-2031)
• 1.3 SiC Wafer Laser Cutting Equipment Market Trends & Drivers
  • 1.3.1 SiC Wafer Laser Cutting Equipment Industry Trends
  • 1.3.2 SiC Wafer Laser Cutting Equipment Market Drivers & Opportunity
  • 1.3.3 SiC Wafer Laser Cutting Equipment Market Challenges
  • 1.3.4 SiC Wafer Laser Cutting Equipment Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global SiC Wafer Laser Cutting Equipment Players Revenue Ranking (2024)
• 2.2 Global SiC Wafer Laser Cutting Equipment Revenue by Company (2020-2025)
• 2.3 Global SiC Wafer Laser Cutting Equipment Players Sales Volume Ranking (2024)
• 2.4 Global SiC Wafer Laser Cutting Equipment Sales Volume by Company Players (2020-2025)
• 2.5 Global SiC Wafer Laser Cutting Equipment Average Price by Company (2020-2025)
• 2.6 Key Manufacturers SiC Wafer Laser Cutting Equipment Manufacturing Base and Headquarters
• 2.7 Key Manufacturers SiC Wafer Laser Cutting Equipment Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of SiC Wafer Laser Cutting Equipment
• 2.9 SiC Wafer Laser Cutting Equipment Market Competitive Analysis
  • 2.9.1 SiC Wafer Laser Cutting Equipment Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by SiC Wafer Laser Cutting Equipment Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Wafer Laser Cutting Equipment as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Processing Sizes up to 6 Inches
  • 3.1.2 Processing Sizes up to 8 Inches
• 3.2 Global SiC Wafer Laser Cutting Equipment Sales Value by Type
  • 3.2.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global SiC Wafer Laser Cutting Equipment Sales Value, by Type (2020-2031)
  • 3.2.3 Global SiC Wafer Laser Cutting Equipment Sales Value, by Type (%) (2020-2031)
• 3.3 Global SiC Wafer Laser Cutting Equipment Sales Volume by Type
  • 3.3.1 Global SiC Wafer Laser Cutting Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Type (2020-2031)
  • 3.3.3 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Type (%) (2020-2031)
• 3.4 Global SiC Wafer Laser Cutting Equipment Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Foundry
  • 4.1.2 IDM
• 4.2 Global SiC Wafer Laser Cutting Equipment Sales Value by Application
  • 4.2.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global SiC Wafer Laser Cutting Equipment Sales Value, by Application (2020-2031)
  • 4.2.3 Global SiC Wafer Laser Cutting Equipment Sales Value, by Application (%) (2020-2031)
• 4.3 Global SiC Wafer Laser Cutting Equipment Sales Volume by Application
  • 4.3.1 Global SiC Wafer Laser Cutting Equipment Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Application (2020-2031)
  • 4.3.3 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Application (%) (2020-2031)
• 4.4 Global SiC Wafer Laser Cutting Equipment Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Region
  • 5.1.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2020-2025)
  • 5.1.3 Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2026-2031)
  • 5.1.4 Global SiC Wafer Laser Cutting Equipment Sales Value by Region (%), (2020-2031)
• 5.2 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region
  • 5.2.1 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2020-2025)
  • 5.2.3 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2026-2031)
  • 5.2.4 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (%), (2020-2031)
• 5.3 Global SiC Wafer Laser Cutting Equipment Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 5.4.2 North America SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 5.5.2 Europe SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 5.6.2 Asia Pacific SiC Wafer Laser Cutting Equipment Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 5.7.2 South America SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.3.2 United States SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.4.2 Europe SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.5.2 China SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.6.2 Japan SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.7.2 South Korea SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.8.2 Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
  • 6.9.2 India SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 DISCO Corporation
  • 7.1.1 DISCO Corporation Company Information
  • 7.1.2 DISCO Corporation Introduction and Business Overview
  • 7.1.3 DISCO Corporation SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 DISCO Corporation SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.1.5 DISCO Corporation Recent Development
• 7.2 Suzhou Delphi Laser Co
  • 7.2.1 Suzhou Delphi Laser Co Company Information
  • 7.2.2 Suzhou Delphi Laser Co Introduction and Business Overview
  • 7.2.3 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.2.5 Suzhou Delphi Laser Co Recent Development
• 7.3 Han's Laser Technology
  • 7.3.1 Han's Laser Technology Company Information
  • 7.3.2 Han's Laser Technology Introduction and Business Overview
  • 7.3.3 Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 Han's Laser Technology SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.3.5 Han's Laser Technology Recent Development
• 7.4 3D-Micromac
  • 7.4.1 3D-Micromac Company Information
  • 7.4.2 3D-Micromac Introduction and Business Overview
  • 7.4.3 3D-Micromac SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 3D-Micromac SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.4.5 3D-Micromac Recent Development
• 7.5 Synova S.A.
  • 7.5.1 Synova S.A. Company Information
  • 7.5.2 Synova S.A. Introduction and Business Overview
  • 7.5.3 Synova S.A. SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Synova S.A. SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.5.5 Synova S.A. Recent Development
• 7.6 HGTECH
  • 7.6.1 HGTECH Company Information
  • 7.6.2 HGTECH Introduction and Business Overview
  • 7.6.3 HGTECH SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 HGTECH SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.6.5 HGTECH Recent Development
• 7.7 ASMPT
  • 7.7.1 ASMPT Company Information
  • 7.7.2 ASMPT Introduction and Business Overview
  • 7.7.3 ASMPT SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 ASMPT SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.7.5 ASMPT Recent Development
• 7.8 GHN.GIE
  • 7.8.1 GHN.GIE Company Information
  • 7.8.2 GHN.GIE Introduction and Business Overview
  • 7.8.3 GHN.GIE SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 GHN.GIE SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.8.5 GHN.GIE Recent Development
• 7.9 Wuhan DR Laser Technology
  • 7.9.1 Wuhan DR Laser Technology Company Information
  • 7.9.2 Wuhan DR Laser Technology Introduction and Business Overview
  • 7.9.3 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Product Offerings
  • 7.9.5 Wuhan DR Laser Technology Recent Development

8 Industry Chain Analysis

• 8.1 SiC Wafer Laser Cutting Equipment Industrial Chain
• 8.2 SiC Wafer Laser Cutting Equipment Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 SiC Wafer Laser Cutting Equipment Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 SiC Wafer Laser Cutting Equipment Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer