세계의 반도체 패키징용 도금 용액 : 시장 점유율과 순위, 전체 판매량 및 수요 예측(2025-2031년)
Semiconductor Packaging Electroplating Solution - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
상품코드:1861355
리서치사:QYResearch
발행일:2025년 10월
페이지 정보:영문
라이선스 & 가격 (부가세 별도)
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한글목차
반도체 패키징용 도금 용액 세계 시장 규모는 2024년에 3억 5,200만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 8.6%로 성장하여 2031년까지 5억 8,600만 달러로 확대될 것으로 예측됩니다.
본 보고서는 반도체 패키징용 도금 용액에 대한 최근 관세 조정과 국제적인 전략적 대응 조치, 국경을 초월한 산업 발자국, 자본 배분 패턴, 지역 경제의 상호의존성, 공급망 재구축을 종합적으로 평가합니다.
반도체 패키징용 도금 용액은 반도체 패키징 공정에서 사용되는 중요한 재료입니다. 그 핵심 기능은 전기화학 증착을 통해 칩 표면에 고정밀 금속 피막(구리, 니켈, 금 등)을 형성하여 칩과 패키지 캐리어 간의 전기적 상호 연결을 가능하게 하는 것입니다. 도체도금이란 칩 제조 공정에서 도금 용액 속의 금속 이온을 웨이퍼 표면에 부착시켜 금속 배선을 형성하는 공정을 말합니다. 2024년, 반도체 패키징용 도금 용액의 세계 판매량은 5,000톤에 달하고, 평균 판매 가격은 톤당 약 70,000달러에 달했습니다.
시장의 주요 시장 성장 촉진요인은 다음과 같습니다.
기술 혁신과 산업 구조의 변화: AI/HPC 수요 급증:
기술적 연관성: AI 칩은 2.5D/3D 패키징을 통한 고대역폭 상호연결이 필요하며, 고순도 및 저응력화를 위한 도금 용액의 고도화를 추진하고 있습니다.
5G/6G 통신 기술의 발전:
응용 시나리오: 5G 기지국 칩은 고주파 신호 전송을 지원해야 하며, 신호 손실을 줄이기 위해 도금층의 표면 거칠기(Ra<0.1μm)가 요구됩니다.
시장 성장: 전 세계 5G 기지국 수는 2025년까지 계속 증가하여 고주파 도금 용액에 대한 수요를 견인할 것으로 예측됩니다.
정책과 자본의 이중 추진력:
정책적 지원: 중국의 14차 5개년 계획에서 집적회로를 전략산업으로 명시하고 있으며, 도금 용액의 연구개발 및 생산라인 건설에 대한 지방 보조금이 적용됩니다.
국내 대체 가속화:
기술적 돌파구: 국내 기업(상하이 신양, 쑤저우 정루이 등)은 5nm 이하 구리 도금 재료에서 기술적 돌파구를 마련하여 Atotech 등 수입 제품을 점차 대체하고 있습니다. 비용 우위: 국내 도금 용액은 수입품 대비 30-50% 저렴한 비용으로 주요 패키징 및 테스트 기업(장전과기, 동복미전자 등)의 채택률이 지속적으로 상승하고 있습니다.
환경 규제 강화:
컴플라이언스 비용: EU의 전자폐기물 규제에 따라 2025년까지 전자제품의 육가크롬 함량을 0.1wt% 미만으로 제한해야 하기 때문에 도금 용액 제조업체들은 무크롬/저크롬 포뮬러 개발에 박차를 가하고 있습니다.
시장 기회: 친환경 도금 용액은 EU 및 북미 시장에서 빠르게 성장하고 있으며, 기존 제품을 크게 능가하는 성장세를 보이고 있습니다.
이 보고서는 반도체 패키징용 도금 용액 세계 시장에 대해 총 판매량, 매출액, 가격, 주요 기업의 시장 점유율 및 순위를 중심으로 지역별, 국가별, 유형별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.
반도체 패키징용 도금 용액 시장 규모, 추정치, 예측치를 판매량(톤) 및 매출액(백만 달러)으로 제공하며, 2024년을 기준 연도로 하여 2025-2031년 과거 데이터와 예측 데이터를 포함하는 2024년부터 2031년까지의 예측 데이터를 제공합니다. 정량적, 정성적 분석을 통해 독자들이 반도체 패키징용 도금 용액에 대한 사업 전략 및 성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 자사 포지셔닝 분석, 정보에 입각한 사업적 판단을 할 수 있도록 지원합니다.
The global market for Semiconductor Packaging Electroplating Solution was estimated to be worth US$ 352 million in 2024 and is forecast to a readjusted size of US$ 586 million by 2031 with a CAGR of 8.6% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Semiconductor Packaging Electroplating Solution cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Semiconductor packaging plating fluid is a key material used in the semiconductor packaging process. Its core function is to form a high-precision metal coating (such as copper, nickel, or gold) on the chip surface through electrochemical deposition, enabling electrical interconnection between the chip and the packaging carrier. Conductor electroplating refers to the process of applying metal ions from the plating fluid to the wafer surface during chip manufacturing to form metal interconnects. In 2024, global sales of semiconductor packaging plating fluid reached 5,000 tons, with an average selling price of approximately $70,000 per ton.
Market drivers primarily include the following:
Technology upgrades and industrial transformations: Exploding demand for AI/HPC:
Technology links: AI chips require high-bandwidth interconnects through 2.5D/3D packaging, driving the upgrade of electroplating solutions toward high purity and low stress.
Advances in 5G/6G communication technologies:
Application scenarios: 5G base station chips must support high-frequency signal transmission, requiring the plating layer to have a low surface roughness (Ra < 0.1μm) to reduce signal loss.
Market growth: The number of global 5G base stations is expected to continue to increase by 2025, driving demand for high-frequency electroplating solutions.
Dual drivers of policy and capital:
Policy support: China's 14th Five-Year Plan explicitly lists integrated circuits as a strategic industry, and local subsidies cover electroplating solution R&D and production line construction.
Accelerating domestic substitution:
Technology breakthroughs: Domestic companies (such as Shanghai Xinyang and Suzhou Jingrui) have achieved technological breakthroughs in sub-5nm copper electroplating materials, gradually replacing imported products such as Atotech. Cost Advantage: Domestic electroplating solutions are 30%-50% cheaper than imported products, and their penetration rate continues to increase among leading packaging and testing companies (such as Changdian Technology and Tongfu Microelectronics).
Stricter Environmental Regulations:
Compliance Costs: The EU's Electronic Waste Regulation requires hexavalent chromium content in electronic products to be less than 0.1wt% by 2025, prompting electroplating solution companies to accelerate the development of chromium-free/low-chromium formulas.
Market Opportunities: Environmentally friendly electroplating solutions are experiencing rapid growth in the EU and North American markets, far outpacing traditional products.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging Electroplating Solution, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Packaging Electroplating Solution by region & country, by Type, and by Application.
The Semiconductor Packaging Electroplating Solution market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging Electroplating Solution.
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Packaging Electroplating Solution manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Semiconductor Packaging Electroplating Solution in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Semiconductor Packaging Electroplating Solution in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Packaging Electroplating Solution Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Packaging Electroplating Solution as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Copper Electroplating Solution
3.1.2 Tin Electroplating Solution
3.1.3 Silver Electroplating Solution
3.1.4 Gold Electroplating Solution
3.1.5 Nickel Electroplating Solution
3.1.6 Others
3.2 Global Semiconductor Packaging Electroplating Solution Sales Value by Type
3.2.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Semiconductor Packaging Electroplating Solution Sales Value, by Type (2020-2031)
3.2.3 Global Semiconductor Packaging Electroplating Solution Sales Value, by Type (%) (2020-2031)
3.3 Global Semiconductor Packaging Electroplating Solution Sales Volume by Type
3.3.1 Global Semiconductor Packaging Electroplating Solution Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Type (2020-2031)
3.3.3 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Type (%) (2020-2031)
3.4 Global Semiconductor Packaging Electroplating Solution Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Copper Pillar Bump
4.1.2 Redistribution Layer
4.1.3 Through Silicon Via
4.1.4 Other
4.2 Global Semiconductor Packaging Electroplating Solution Sales Value by Application
4.2.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Semiconductor Packaging Electroplating Solution Sales Value, by Application (2020-2031)
4.2.3 Global Semiconductor Packaging Electroplating Solution Sales Value, by Application (%) (2020-2031)
4.3 Global Semiconductor Packaging Electroplating Solution Sales Volume by Application
4.3.1 Global Semiconductor Packaging Electroplating Solution Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Application (2020-2031)
4.3.3 Global Semiconductor Packaging Electroplating Solution Sales Volume, by Application (%) (2020-2031)
4.4 Global Semiconductor Packaging Electroplating Solution Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Region
5.1.1 Global Semiconductor Packaging Electroplating Solution Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Semiconductor Packaging Electroplating Solution Sales Value by Region (2020-2025)
5.1.3 Global Semiconductor Packaging Electroplating Solution Sales Value by Region (2026-2031)
5.1.4 Global Semiconductor Packaging Electroplating Solution Sales Value by Region (%), (2020-2031)
5.2 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region
5.2.1 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region (2020-2025)
5.2.3 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region (2026-2031)
5.2.4 Global Semiconductor Packaging Electroplating Solution Sales Volume by Region (%), (2020-2031)
5.3 Global Semiconductor Packaging Electroplating Solution Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
5.4.2 North America Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
5.5.2 Europe Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
5.6.2 Asia Pacific Semiconductor Packaging Electroplating Solution Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
5.7.2 South America Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Semiconductor Packaging Electroplating Solution Sales Value, 2020-2031
5.8.2 Middle East & Africa Semiconductor Packaging Electroplating Solution Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Semiconductor Packaging Electroplating Solution Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Semiconductor Packaging Electroplating Solution Sales Value and Sales Volume
