세계의 은 소결 Die-Attach 재료 시장 : 시장 규모, 제조업체, 공급망, 판매 채널, 고객(2024-2030년)
Global Silver Sintering Die-Attach Materials Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2024-2030
상품코드:1566261
리서치사:QYResearch
발행일:2024년 10월
페이지 정보:영문
라이선스 & 가격 (부가세 별도)
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한글목차
세계 은 소결 Die-Attach 재료 시장 규모는 2024년 1억 8,641만 달러에서 2030년 2억 5,276만 달러에 달할 것으로 예상되며, 2024년부터 2030년까지 5.21%의 연평균 복합 성장률(CAGR)을 나타낼 전망입니다.
2023년 중국의 은 소결 다이터치 재료 시장 규모는 2,749만 달러, 미국과 유럽의 은 소결 다이터치 재료 시장 규모는 각각 4,595만 달러, 4,793만 달러입니다. 미국의 비중(매출 기준)은 2023년 25.74%, 중국과 유럽은 각각 15.40%와 26.85%, 중국의 비중은 2030년에 19.25%에 도달하여 분석 기간 동안 CAGR 8.45%를 견인할 것으로 예상됩니다. 아시아에서는 일본, 한국, 동남아시아가 주목해야 할 시장으로 향후 6년간 각각 5.96%, 5.16%, 2.81%의 연평균 복합 성장률(CAGR)을 나타낼 전망입니다.유럽의 은 소결 Die-Attach 재료의 경우 독일은 2030년까지 2,240만 달러에 달할 것으로 예상되며, 예측 기간 동안 3.97%의 연평균 복합 성장률(CAGR)을 나타낼 전망입니다.
은 소결 다이터치 재료의 세계 주요 기업으로는 Heraeus Electronics, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology, Shenzhen Facemoore Technology, Beijing Nanotop Electronic Technology 등이 있으며, 2023년 세계 5대 기업의 매출 점유율은 약 82.35%를 나타낼 것으로 예상됩니다.
이 보고서는 세계 은 소결 Die-Attach 재료 시장에 대해 조사했으며, 시장 개요와 함께 유형별/용도별/지역별 동향, 시장 진출기업 프로파일 등의 정보를 제공합니다.
목차
제1장 조사 대상 범위
은 소결 Die-Attach 재료 제품 서론
유형별 시장
용도별 시장
조사 목적
대상년
제2장 주요 요약
제3장 세계의 은 소결 Die-Attach 재료 제조업체별 동향
세계의 은 소결 Die-Attach 재료 TOP 제조업체(2019년-2024년), 판매별
세계의 은 소결 Die-Attach 재료 TOP 제조업체(2019년-2024년), 매출별
은 소결 Die-Attach 재료 가격(2019년-2024년), 제조업체별
경쟁 구도
은 소결 Die-Attach 재료 세계 생산 거점, 제품 유형별
제조업체의 합병과 인수, 확장 계획
제4장 기업 개요
Heraeus Electronics
Kyocera
Indium
Alpha Assembly Solutions
Henkel
Namics
Advanced Joining Technology
Shenzhen Facemoore Technology
Beijing Nanotop Electronic Technology
TANAKA Precious Metals
Nihon Superior
Nihon Handa
NBE Tech
Sumitomo Bakelite
Celanese
Solderwell Advanced Materials
Guangzhou Xianyi Electronic Technology
ShareX(Zhejiang) New Material Technology
Bando Chemical Industries
Shenzhen Jufeng Solder
제5장 유형별 분석 데이터
세계의 은 소결 Die-Attach 재료 판매(유형별)(2019년-2030년)
세계의 은 소결 Die-Attach 재료 매출(유형별)(2019-2030년)
세계의 은 소결 Die-Attach 재료 평균 판매 가격(유형별)(2019년-2030년)
제6장 용도별 분석 데이터
세계의 은 소결 Die-Attach 재료 판매(용도별)(2019년-2030년)
세계의 은 소결 Die-Attach 재료 매출(용도별)(2019-2030년)
세계의 은 소결 Die-Attach 재료 평균 판매 가격(용도별)(2019년-2030년)
제7장 북미
제8장 아시아태평양
제9장 유럽
제10장 라틴아메리카
제11장 중동 및 아프리카
제12장 공급망과 판매채널 분석
은 소결 Die-Attach 재료 산업 체인
은 소결 Die-Attach 재료 Upstream 분석
Downstream 분석(고객 분석)
판매 모델과 판매채널
제13장 은 소결 Die-Attach 재료 시장 역학
제14장 조사 결과와 결론
제15장 부록
LSH
영문 목차
영문목차
The global Silver Sintering Die-Attach Materials market is projected to reach US$ 252.76 million by 2030 from an estimated US$ 186.41 million in 2024, at a CAGR of 5.21% during 2024 and 2030.
China Silver Sintering Die-Attach Materials market size was US$ 27.49 million in 2023, while the US and Europe Silver Sintering Die-Attach Materials were US$ 45.95 million and US$ 47.93 million, severally. The proportion (Based on revenue) of the US was 25.74% in 2023, while China and Europe were 15.40% and 26.85% respectively, and it is predicted that China proportion will reach 19.25% in 2030, trailing a CAGR of 8.45% through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR 5.96%, 5.16% and 2.81% respectively for the next 6-year period. As for the Europe Silver Sintering Die-Attach Materials landscape, Germany is projected to reach US$ 22.40 million by 2030 trailing a CAGR of 3.97% over the forecast period.
The global key companies of Silver Sintering Die-Attach Materials include Heraeus Electronics, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology, Shenzhen Facemoore Technology and Beijing Nanotop Electronic Technology, etc. In 2023, the global five largest players hold a share approximately 82.35% in terms of revenue.
In 2023, Pressure Sintering segment accounted for a share of 56.03% (Based on revenue) in the global Silver Sintering Die-Attach Materials market. And this product segment is poised to reach US$ 138.76 million by 2030 from US$ 100.02 million in 2023.
In Silver Sintering Die-Attach Materials market, the Power Semiconductor Device segment holds an important share in terms of application, and it is expected to reach a revenue of US$ 136.37 million by 2030, at a CAGR of 4.49% during 2024 and 2030.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Silver Sintering Die-Attach Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Silver Sintering Die-Attach Materials.
The Silver Sintering Die-Attach Materials market size, estimations, and forecasts are provided in terms of sales volume (Kg) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Silver Sintering Die-Attach Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Silver Sintering Die-Attach Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and regions.
By Company
Heraeus Electronics
Kyocera
Indium
Alpha Assembly Solutions
Henkel
Namics
Advanced Joining Technology
Shenzhen Facemoore Technology
Beijing Nanotop Electronic Technology
TANAKA Precious Metals
Nihon Superior
Nihon Handa
NBE Tech
Sumitomo Bakelite
Celanese
Solderwell Advanced Materials
Guangzhou Xianyi Electronic Technology
ShareX (Zhejiang) New Material Technology
Bando Chemical Industries
Shenzhen Jufeng Solder
Segment by Type
Pressure Sintering
Pressure-less Sintering
Segment by Application
Power Semiconductor Device
RF Power Device
High Performance LED
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Southeast Asia
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America
Mexico
Brazil
Argentina
Rest of Latin America
Middle East & Africa
Middle East
Africa
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Sales (consumption), revenue of Silver Sintering Die-Attach Materials in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 3: Detailed analysis of Silver Sintering Die-Attach Materials manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Silver Sintering Die-Attach Materials sales, revenue, price, gross margin, sales by region, by Type, by Application, and recent development, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: APAC by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 10: Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 11: Middle East and Africa by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 13: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
