¼¼°èÀÇ ÆÕ¸®½º IC ¼³°è ½ÃÀå ÀλçÀÌÆ® ¹× ¿¹Ãø(-2030³â)
Global Fabless IC Design Market Insights, Forecast to 2030
»óǰÄÚµå : 1532302
¸®¼­Ä¡»ç : QYResearch
¹ßÇàÀÏ : 2024³â 08¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹®
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 4,900 £Ü 6,814,000
PDF (Single User License) help
PDF º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 7,350 £Ü 10,222,000
PDF (Multi User License) help
PDF º¸°í¼­¸¦ µ¿ÀÏ »ç¾÷Àå¿¡¼­ 10¸í±îÁö ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. PDF ³»¿ëÀÇ ÅØ½ºÆ® µîÀ» Copy & Paste ÇÒ ¼ö ÀÖ½À´Ï´Ù. Àμ⠰¡´ÉÇϸç, Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 9,800 £Ü 13,629,000
PDF (Enterprise User License) help
PDF º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ÀÇ ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


¤± Add-on °¡´É: °í°´ÀÇ ¿äû¿¡ µû¶ó ÀÏÁ¤ÇÑ ¹üÀ§ ³»¿¡¼­ CustomizationÀÌ °¡´ÉÇÕ´Ï´Ù. ÀÚ¼¼ÇÑ »çÇ×Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.
¤± º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼Û±âÀÏÀº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

Çѱ۸ñÂ÷

¼¼°è ÆÕ¸®½º IC ¼³°è ½ÃÀå ±Ô¸ð´Â 2024³â 2,586¾ï ´Þ·¯¿¡¼­ 2030³â±îÁö 5,469¾ï ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, ¿¹Ãø ±â°£¿¡ CAGR·Î 13.29%ÀÇ ¼ºÀåÀÌ ¿¹»óµË´Ï´Ù.

º»»ç ¼ÒÀçÁö¿¡ ÀÇÇϸé, ¼¼°èÀÇ ÆÕ¸®½º IC ½ÃÀå¿¡¼­´Â ¹Ì±¹ ±â¾÷ÀÌ 2023³â¿¡ ¾à 71%ÀÇ Á¡À¯À²À» Â÷ÁöÇϰí ÀÖÀ¸¸ç, ¹Ì±¹ÀÇ ÁÖ¿ä IC ¼³°è ±â¾÷Àº NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc.(AMD), Marvell Technology Group, Monolithic Power Systems, Inc.(MPS), Cirrus Logic, Inc., Synaptics, Alegro MicroSystems, Semtech µîÀÔ´Ï´Ù. Áß±¹ ´ë¸¸ÀÇ IC ¼³°è ±â¾÷Àº 2023³â¿¡ ¾à 14.5%ÀÇ Á¡À¯À²À» °¡Áö°í ÀÖÀ¸¸ç ÁÖ¿ä ±â¾÷Àº MediaTek, Novatek Microelectronics Corp., Realtek Semiconductor Corporation, Himax Technologies, Global Unichip Corporation(GUC), Silicon Motion, Raydium, Silergy, Alchip Technologies, FocalTech, Elite Semiconductor Microelectronics Technology µîÀÔ´Ï´Ù. Áß±¹ÀÇ ÆÕ¸®½º IC ¼³°è ÇϿ콺µµ Áß¿äÇÑ ¿ªÇÒÀ» Çϰí ÀÖÀ¸¸ç, Áß±¹¿¡ º»»ç¸¦ µÐ ±â¾÷ÀÌ 2023³â ¼¼°èÀÇ ¾à 7%¸¦ Â÷ÁöÇß½À´Ï´Ù.

¼¼°è ÆÕ¸®½º IC ¼³°èÀÇ ÁÖ¿ä ±â¾÷Àº NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc.(AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp, Tsinghua Unigroup, Realtek Semiconductor Corporation µîÀÔ´Ï´Ù. 2023³â ¼¼°è ÆÕ¸®½º IC ¼³°è ±â¾÷ »óÀ§ 35°³»çÀÇ ¼öÀÍ Á¡À¯À²Àº ¾à 90%¿´½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ¼¼°èÀÇ Fabres IC ¼³°è ½ÃÀå¿¡ ´ëÇØ Á¶»ç ºÐ¼®ÇÏ¿© °¢ Áö¿ª ½ÃÀå ±Ô¸ð¿Í ¿¹Ãø, ±â¾÷ ÇÁ·ÎÆÄÀÏ, ½ÃÀå ¿ªÇÐ µîÀ» Á¦°øÇÕ´Ï´Ù.

¸ñÂ÷

Á¦1Àå º¸°í¼­ °³¿ä

Á¦2Àå ¼¼°èÀÇ ¼ºÀå µ¿Çâ

Á¦3Àå °æÀï ±¸µµ: ÁÖ¿ä ±â¾÷º°

Á¦4Àå ÆÕ¸®½º IC ¼³°èÀÇ ºÐ¼® µ¥ÀÌÅÍ: À¯Çüº°

Á¦5Àå ÆÕ¸®½º IC ¼³°èÀÇ ºÐ¼® µ¥ÀÌÅÍ: ¿ëµµº°

Á¦6Àå ºÏ¹Ì

Á¦7Àå À¯·´

Á¦8Àå ¾Æ½Ã¾ÆÅÂÆò¾ç

Á¦9Àå ³²¹Ì

Á¦10Àå Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦11Àå ÁÖ¿ä ±â¾÷ ÇÁ·ÎÆÄÀÏ

Á¦12Àå ¾Ö³Î¸®½ºÆ®ÀÇ ½ÃÁ¡/°á·Ð

Á¦13Àå ºÎ·Ï

JHS
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

The global Fabless IC Design market is projected to grow from US$ 258.6 billion in 2024 to US$ 546.9 billion by 2030, at a Compound Annual Growth Rate (CAGR) of 13.29% during the forecast period.

Based on the location of company headquarters, American companies hold a share about 71% of global Fabless IC market in 2023, key American IC design houses are NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), Marvell Technology Group, Monolithic Power Systems, Inc. (MPS), Cirrus Logic, Inc., Synaptics, Allegro MicroSystems, and Semtech, etc. China Taiwan IC design houses have a share about 14.5% in 2023, key enterprises include MediaTek, Novatek Microelectronics Corp., Realtek Semiconductor Corporation, Himax Technologies, Global Unichip Corporation (GUC), Silicon Motion, Raydium, Silergy, Alchip Technologies, FocalTech, and Elite Semiconductor Microelectronics Technology, etc. Chinese Fabless IC design houses also play important roles, in 2023, companies headquartered in China hold about 7% of global.

The global key companies of Fabless IC Design include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, and Realtek Semiconductor Corporation, etc. In 2023, the global top 35 Fabless IC Design houses had a share approximately 90% in terms of revenue.

Report Includes

This report presents an overview of global market for Fabless IC Design market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.

This report researches the key producers of Fabless IC Design, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Fabless IC Design, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East & Africa, and Other Countries.

This report focuses on the Fabless IC Design revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Fabless IC Design market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Fabless IC Design revenue, projected growth trends, production technology, application and end-user industry.

Descriptive company profiles of the major global players, including NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, and Realtek Semiconductor Corporation, etc.

Market Segmentation

By Company

NVIDIA

Qualcomm

Broadcom

Advanced Micro Devices. (AMD)

MediaTek

Marvell Technology Group

Novatek Microelectronics Corp.

Tsinghua Unigroup

Realtek Semiconductor Corporation

OmniVision Technology, Inc

Monolithic Power Systems. (MPS)

Cirrus Logic, Inc.

Socionext Inc.

LX Semicon

HiSilicon Technologies

Synaptics

Allegro MicroSystems

Himax Technologies

Semtech

Global Unichip Corporation (GUC)

Hygon Information Technology

GigaDevice

Silicon Motion

Ingenic Semiconductor

Raydium

Goodix Limited

Sitronix

Nordic Semiconductor

Silergy

Shanghai Fudan Microelectronics

Alchip Technologies

FocalTech

MegaChips Corporation

Elite Semiconductor

SGMICRO

Segment by Type

Analog ICs

Logic ICs

Microcontroller and Microprocessor ICs

Memory ICs

Segment by Application

Mobile Devices

PCs

Automotive

Industrial & Medical

Servers

Network Infrastructure

Appliances/Consumer Goods

Others

By Region

North America

United States

Canada

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

Europe

Germany

France

U.K.

Italy

Nordic Countries

Rest of Europe

Latin America

Mexico

Brazil

Middle East & Africa

Turkey

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Revenue of Fabless IC Design in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 3: Detailed analysis of Fabless IC Design companies' competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.

Chapter 7: Europe by Type, by Application and by country, revenue for each segment.

Chapter 8: China by Type, and by Application, revenue for each segment.

Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.

Chapter 10: Middle East & Africa by Type, by Application and by country, revenue for each segment.

Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Fabless IC Design revenue, gross margin, and recent development, etc.

Chapter 12: Analyst's Viewpoints/Conclusions

Table of Contents

1 Report Overview

2 Global Growth Trends

3 Competition Landscape by Key Players

4 Fabless IC Design Breakdown Data by Type

5 Fabless IC Design Breakdown Data by Application

6 North America

7 Europe

8 Asia Pacific

9 South America

10 Middle East & Africa

11 Key Players Profiles

12 Analyst's Viewpoints/Conclusions

13 Appendix

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â