플립칩 기술 시장 : 세계 산업 분석, 규모, 점유율, 성장, 동향, 예측(2024-2031년)

Flip Chip Technology Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2024-2031

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한글목차

Persistence Market Research는 이번에 세계의 플립칩 기술 시장에 관한 종합 보고서를 발표했습니다. 본 리포트에서는 촉진요인·동향·기회·과제 등 중요 시장 역학을 철저히 평가하고, 시장 구조에 관한 상세 인사이트을 제공하고 있습니다.

주요 인사이트

• 플립칩 기술 시장 규모(2024년) : 329억 달러
• 예측 시장 금액(2031년) : 466억 달러
• 세계 시장 성장률(CAGR 2024-2031년) : 5.1%

플립칩 기술 시장 - 조사 범위 :

플립칩 기술이란, 반도체 디바이스를 칩 패드상에 형성된 땜납 범프로 외부 회로에 접속하는 기술이며, 기존 와이어 본딩 방식에 비해 성능 향상과 소형화를 실현합니다. 이 기술은, CE(Consumer Electronics), 자동차, 통신, 산업 분야 등 다양한 용도에 대응하고 있습니다. 시장 성장 촉진력은, 고성능으로 컴팩트한 전자기기에 대한 수요의 증가, 포장 기술의 첨단 화, IoT나 AI용도의 채택 확대입니다.

시장 성장 촉진요인 :

플립칩 기술은 반도체 소자를 칩 패드 위에 형성된 솔더 범프로 외부 회로로 연결하는 기술로, 기존 와이어 본딩 방식에 비해 성능 향상과 소형화를 실현할 수 있는 기술입니다. 이 기술은 CE(Consumer Electronics), 자동차, 통신, 산업 분야 등 다양한 분야에 적용되고 있습니다. 시장 성장의 원동력은 고성능 소형 전자기기에 대한 수요 증가, 포장 기술의 발전, IoT 및 AI 용도의 채택 확대 등입니다.

시장 성장 촉진요인:

세계 플립칩 기술 시장은 CE(Consumer Electronics), 자동차, 통신 분야의 소형 전자제품에 대한 수요 증가, 사물인터넷(IoT) 기기의 보급 확대, 다양한 용도에서 AI의 통합 등 몇 가지 중요한 요인에 의해 주도되고 있으며, 시장 확대를 더욱 촉진하고 있습니다. 첨단 기판 및 상호 연결 재료의 개발과 같은 포장 기술의 기술적 발전은 전기적 성능과 열 관리의 개선을 가져와 시장 성장을 가속하고 있습니다. 또한 자동화 및 스마트 제조에 대한 관심이 높아지면서 산업 전반에 걸쳐 플립칩 기술을 채택할 수 있는 새로운 기회가 창출되고 있습니다.

시장 성장 억제요인 :

플립칩 기술 시장은 유망한 성장 전망에도 불구하고 높은 초기 비용, 기술적 복잡성, 특수 장비의 필요성이라는 문제에 직면해 있습니다. 플립칩 어셈블리의 정밀도와 신뢰성에 대한 엄격한 요구사항은 제조업체에 비용 부담을 가중시키고 시장 진입 장벽과 운영 비용에 영향을 미칩니다. 또한 현재 진행 중인 무역 마찰과 공급망 혼란은 특히 기술 인프라가 제한적인 신흥 경제국에서 시장 침투에 어려움을 겪고 있습니다. 이러한 경제적, 기술적 장벽을 극복하기 위해서는 업계 이해관계자와 정책 입안자들이 협력하여 첨단 포장 솔루션에 대한 접근을 촉진해야 합니다.

시장 기회 :

플립칩 기술 시장은 기술 혁신, 인구 동향, 진화하는 산업 수요로 인해 큰 성장 기회를 맞이하고 있습니다. 구리 기둥과 TSV(실리콘 관통 전극)와 같은 첨단 재료의 통합은 디바이스의 성능과 신뢰성을 향상시켜 시장의 폭을 넓힐 수 있습니다. 또한 웨어러블 전자, 의료기기, 항공우주 등 신흥 분야에서의 플립칩 기술 적용 확대는 기술 혁신과 시장 확대를 촉진하고 있습니다. 전략적 파트너십, R&D 투자, 비용 효율적인 플립칩 솔루션 도입은 새로운 비즈니스 기회를 활용하고 역동적인 포장 환경에서 시장 리더십을 유지하는 데 필수적입니다.

이 보고서에서 다룬 주요 질문

• 세계의 플립칩 기술 시장의 성장을 촉진하는 주요 요인은 무엇인가?
• 다양한 업계에서 플립칩 기술의 채택을 촉진하고 있는 용도와 최종사용자 분야는?
• 기술의 진보는 플립칩 기술 시장의 경쟁 구도를 어떻게 바꾸고 있는가?
• 플립칩 기술 시장에 기여하고 있는 주요 기업은 어디이며, 시장의 관련성을 유지하기 위해 어떤 전략을 채택하고 있는가?
• 세계의 플립칩 기술 시장 새로운 동향과 장래성은?

목차

제1장 개요

제2장 시장 개요

• 시장 범위/분류
• 시장의 정의/범위/제한

제3장 시장 배경

• 시장 역학
• 시나리오 예측
• 기회 맵 분석
• 투자 실현 가능성 매트릭스
• PESTLE과 Porter의 산업 분석
• 규제 상황
• 지역별 모시장 전망

제4장 세계의 플립칩 기술 시장 분석

• 과거 시장 규모 금액(백만 달러) 분석, 2019-2023년
• 현재 및 향후 시장 규모 금액(백만 달러) 예측, 2024-2031년
  • 전년대비 성장 동향 분석
  • 절대액 기회 분석

제5장 세계의 플립칩 기술 시장 분석 : 웨이퍼 범핑 프로세스별

• 서론/주요 조사 결과
• 과거 시장 규모 금액(백만 달러) 분석 : 웨이퍼 범핑 프로세스별, 2019-2023년
• 현재 및 향후 시장 규모 금액(백만 달러) 분석과 예측 : 웨이퍼 범핑 프로세스별, 2024-2031년
  • 동주
  • 무연
  • Tin/lead Eutectic Solder
  • Gold Stud+ Plated Solder
• 전년대비 성장 동향 분석 : 웨이퍼 범핑 프로세스별, 2019-2023년
• 절대액 기회 분석 : 웨이퍼 범핑 프로세스별, 2024-2031년

제6장 세계의 플립칩 기술 시장 분석 : 포장 기술별

• 서론/주요 조사 결과
• 과거 시장 규모 금액(백만 달러) 분석 : 포장 기술별, 2019-2023년
• 현재 및 향후 시장 규모 금액(백만 달러) 분석과 예측 : 포장 기술별, 2024-2031년
  • 2D IC
  • 2.5D IC
  • 3D IC
• 전년대비 성장 동향 분석 : 포장 기술별, 2019-2023년
• 절대액 기회 분석 : 포장 기술별, 2024-2031년

제7장 세계의 플립칩 기술 시장 분석 : 패키지 유형별

• 서론/주요 조사 결과
• 과거 시장 규모 금액(백만 달러) 분석 : 패키지 유형별, 2019-2023년
• 현재 및 향후 시장 규모 금액(백만 달러) 분석과 예측 : 패키지 유형별, 2024-2031년
  • FC BGA
  • FC PGA
  • FC LGA
  • FC QFN
  • FC SiP
  • FC CSP
• 전년대비 성장 동향 분석 : 패키지 유형별, 2019-2023년
• 절대액 기회 분석 : 패키지 유형별, 2024-2031년

제8장 세계의 플립칩 기술 시장 분석 : 제품별

• 서론/주요 조사 결과
• 과거 시장 규모 금액(백만 달러) 분석 : 제품별, 2019-2023년
• 현재 및 향후 시장 규모 금액(백만 달러) 분석과 예측 : 제품별, 2024-2031년
  • 메모리
  • LED
  • CMOS 이미지 센서
  • RF, 아날로그, 믹스 시그널, 파워 IC
  • CPU
  • SoC
  • GPU
• 전년대비 성장 동향 분석 : 제품별, 2019-2023년
• 절대액 기회 분석 : 제품별, 2024-2031년

제9장 세계의 플립칩 기술 시장 분석 : 용도별

• 서론/주요 조사 결과
• 과거 시장 규모 금액(백만 달러) 분석 : 용도별, 2019-2023년
• 현재 및 향후 시장 규모 금액(백만 달러) 분석과 예측 : 용도별, 2024-2031년
  • CE(Consumer Electronics)
  • 통신
  • 자동차
  • 산업 부문
  • 의료기기
  • 스마트 테크놀러지
  • 군·항공우주
• 전년대비 성장 동향 분석 : 용도별, 2019-2023년
• 절대액 기회 분석 : 용도별, 2024-2031년

제10장 세계의 플립칩 기술 시장 분석 : 지역별

• 서론
• 과거 시장 규모 금액(백만 달러) 분석 : 지역별, 2019-2023년
• 현재 시장 규모 금액(백만 달러) 분석과 예측 : 지역별, 2024-2031년
  • 북미
  • 라틴아메리카
  • 유럽
  • 아시아태평양
  • 중동 및 아프리카
• 시장의 매력 분석 : 지역별

제11장 북미의 플립칩 기술 시장 분석 : 국가별

제12장 라틴아메리카의 플립칩 기술 시장 분석 : 국가별

제13장 유럽의 플립칩 기술 시장 분석 : 국가별

제14장 아시아태평양의 플립칩 기술 시장 분석 : 국가별

제15장 중동 및 아프리카의 플립칩 기술 시장 분석 : 국가별

제16장 주요 국가의 플립칩 기술 시장 분석

• 미국
• 캐나다
• 브라질
• 멕시코
• 독일
• 영국
• 프랑스
• 스페인
• 이탈리아
• 중국
• 일본
• 한국
• 싱가포르
• 태국
• 인도네시아
• 호주
• 뉴질랜드
• GCC 국가
• 남아프리카공화국
• 이스라엘

제17장 시장 구조 분석

• 경쟁 대시보드
• 경쟁 벤치마킹
• 주요 기업의 시장 점유율 분석

제18장 경쟁 분석

• 경쟁 상세 정보
  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd
  • Intel Corp.
  • Value(USD Million) ed Microelectronics Corp.
  • ASE Group
  • Amkor Technology
  • Siliconware Precision Industries Co., Ltd.
  • DXP Enterprises
  • Temasek
  • Jiangsu Changjiang Electronics Technology Co., Ltd.

제19장 사용되는 전제 조건과 두자어

제20장 조사 방법

KSA

영문 목차

영문목차

Persistence Market Research has recently released a comprehensive report on the worldwide market for flip chip technology. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure.

Key Insights:

• Flip Chip Technology Market Size (2024E): USD 32.9 Billion
• Projected Market Value (2031F): USD 46.6 Billion
• Global Market Growth Rate (CAGR 2024 to 2031): 5.1%

Flip Chip Technology Market - Report Scope:

Flip chip technology involves connecting semiconductor devices to external circuitry with solder bumps deposited on the chip pads, offering enhanced performance and miniaturization compared to traditional wire bonding methods. This technology caters to various applications, including consumer electronics, automotive, telecommunications, and industrial sectors. Market growth is driven by the increasing demand for high-performance and compact electronic devices, advancements in packaging technologies, and the growing adoption of IoT and AI applications.

Market Growth Drivers:

The global flip chip technology market is propelled by several key factors, including the rising demand for miniaturized electronic devices in consumer electronics, automotive, and telecommunications sectors. The proliferation of IoT devices and the increasing integration of AI in various applications further drive market expansion. Technological advancements in packaging techniques, such as the development of advanced substrates and interconnect materials, offer improved electrical performance and thermal management, fostering market growth. Moreover, the growing trend towards automation and smart manufacturing creates new opportunities for flip chip technology adoption across industrial applications.

Market Restraints:

Despite promising growth prospects, the flip chip technology market faces challenges related to high initial costs, technical complexities, and the need for specialized equipment. The stringent requirements for precision and reliability in flip chip assembly impose cost burdens on manufacturers, affecting market entry barriers and operational expenses. Furthermore, the ongoing trade tensions and supply chain disruptions pose challenges for market penetration, particularly in emerging economies with limited technological infrastructure. Addressing these economic and technical barriers requires collaboration between industry stakeholders and policymakers to promote access to advanced packaging solutions.

Market Opportunities:

The flip chip technology market presents significant growth opportunities driven by technological innovations, demographic trends, and evolving industry needs. The integration of advanced materials, such as copper pillars and through-silicon vias (TSVs), enhances device performance and reliability, broadening the market scope. Furthermore, the expanding application of flip chip technology in emerging fields, such as wearable electronics, medical devices, and aerospace, stimulates innovation and market expansion. Strategic partnerships, investment in research and development, and the introduction of cost-effective flip chip solutions are essential to capitalize on emerging opportunities and sustain market leadership in the dynamic packaging landscape.

Key Questions Answered in the Report:

• What are the primary factors driving the growth of the flip chip technology market globally?
• Which applications and end-user segments are driving flip chip technology adoption across different industries?
• How are technological advancements reshaping the competitive landscape of the flip chip technology market?
• Who are the key players contributing to the flip chip technology market, and what strategies are they employing to maintain market relevance?
• What are the emerging trends and future prospects in the global flip chip technology market?

Competitive Intelligence and Business Strategy:

Leading players in the global flip chip technology market, including Intel Corporation, TSMC, and Amkor Technology, focus on innovation, product differentiation, and strategic partnerships to gain a competitive edge. These companies invest in R&D to develop advanced packaging solutions, including copper pillar bumping, wafer-level packaging, and 2.5D/3D integration, catering to diverse application needs and performance requirements. Collaborations with semiconductor manufacturers, equipment suppliers, and research institutions facilitate market access and promote technology adoption. Moreover, emphasis on quality control, supply chain management, and customer support fosters market growth and enhances client satisfaction in the rapidly evolving packaging landscape.

Key Companies Profiled:

• Taiwan Semiconductor Manufacturing Company Limited
• Samsung Electronics
• Intel Corp.
• ASE Group
• Amkor Technology
• Silicon ware Precision Industries Co., Ltd.
• DXP Enterprises
• Temasek
• Jiangsu Changjiang Electronics Technology Co., Ltd

Flip Chip Technology Market Segmentation:

By Wafer Bumping Process:

• Copper Pillar
• Lead-free
• Tin/Lead Eutectic Solder
• Gold Stud+ Plated Solder

By Packaging Technology:

• 2D IC
• 2.5D IC
• 3D IC

By Product:

• Memory
• LED
• CMOS Image Sensor
• RF, Analog, Mixed Signal, and Power IC
• CPU
• SoC
• GPU

By Packaging Type:

• FC BGA
• FC PGA
• FC LGA
• FC QFN
• FC SiP
• FC CSP

By Application:

• Consumer Electronics
• Telecommunication
• Automotive
• Industrial Sector
• Medical Devices
• Smart Technologies
• Military and Aerospace

By Region:

• North America
• Latin America
• Europe
• Asia Pacific
• Middle East and Africa

Table of Contents

1. Executive Summary

• 1.1. Global Market Outlook
• 1.2. Demand-side Trends
• 1.3. Supply-side Trends
• 1.4. Technology Roadmap Analysis
• 1.5. Analysis and Recommendations

2. Market Overview

• 2.1. Market Coverage / Taxonomy
• 2.2. Market Definition / Scope / Limitations

3. Market Background

• 3.1. Market Dynamics
  • 3.1.1. Drivers
  • 3.1.2. Restraints
  • 3.1.3. Opportunity
  • 3.1.4. Trends
• 3.2. Scenario Forecast
  • 3.2.1. Demand in Optimistic Scenario
  • 3.2.2. Demand in Likely Scenario
  • 3.2.3. Demand in Conservative Scenario
• 3.3. Opportunity Map Analysis
• 3.4. Investment Feasibility Matrix
• 3.5. PESTLE and Porter's Analysis
• 3.6. Regulatory Landscape
  • 3.6.1. By Key Regions
  • 3.6.2. By Key Countries
• 3.7. Regional Parent Market Outlook

4. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast, 2024-2031

• 4.1. Historical Market Size Value (US$ Million) Analysis, 2019-2023
• 4.2. Current and Future Market Size Value (US$ Million) Projections, 2024-2031
  • 4.2.1. Y-o-Y Growth Trend Analysis
  • 4.2.2. Absolute $ Opportunity Analysis

5. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Wafer Bumping Process

• 5.1. Introduction / Key Findings
• 5.2. Historical Market Size Value (US$ Million) Analysis By Wafer Bumping Process, 2019-2023
• 5.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Wafer Bumping Process, 2024-2031
  • 5.3.1. Copper Pillar
  • 5.3.2. Lead-free
  • 5.3.3. Tin/lead Eutectic Solder
  • 5.3.4. Gold Stud+ Plated Solder
• 5.4. Y-o-Y Growth Trend Analysis By Wafer Bumping Process, 2019-2023
• 5.5. Absolute $ Opportunity Analysis By Wafer Bumping Process, 2024-2031

6. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Packaging Technology

• 6.1. Introduction / Key Findings
• 6.2. Historical Market Size Value (US$ Million) Analysis By Packaging Technology, 2019-2023
• 6.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Packaging Technology, 2024-2031
  • 6.3.1. 2D IC
  • 6.3.2. 2.5D IC
  • 6.3.3. 3D IC
• 6.4. Y-o-Y Growth Trend Analysis By Packaging Technology, 2019-2023
• 6.5. Absolute $ Opportunity Analysis By Packaging Technology, 2024-2031

7. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Packaging Type

• 7.1. Introduction / Key Findings
• 7.2. Historical Market Size Value (US$ Million) Analysis By Packaging Type, 2019-2023
• 7.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Packaging Type, 2024-2031
  • 7.3.1. FC BGA
  • 7.3.2. FC PGA
  • 7.3.3. FC LGA
  • 7.3.4. FC QFN
  • 7.3.5. FC SiP
  • 7.3.6. FC CSP
• 7.4. Y-o-Y Growth Trend Analysis By Packaging Type, 2019-2023
• 7.5. Absolute $ Opportunity Analysis By Packaging Type, 2024-2031

8. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Product

• 8.1. Introduction / Key Findings
• 8.2. Historical Market Size Value (US$ Million) Analysis By Product, 2019-2023
• 8.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Product, 2024-2031
  • 8.3.1. Memory
  • 8.3.2. LED
  • 8.3.3. CMOS Image Sensor
  • 8.3.4. RF, Analog, Mixed Signal, and Power IC
  • 8.3.5. CPU
  • 8.3.6. SoC
  • 8.3.7. GPU
• 8.4. Y-o-Y Growth Trend Analysis By Product, 2019-2023
• 8.5. Absolute $ Opportunity Analysis By Product, 2024-2031

9. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Application

• 9.1. Introduction / Key Findings
• 9.2. Historical Market Size Value (US$ Million) Analysis By Application, 2019-2023
• 9.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Application, 2024-2031
  • 9.3.1. Consumer Electronics
  • 9.3.2. Telecommunication
  • 9.3.3. Automotive
  • 9.3.4. Industrial Sector
  • 9.3.5. Medical Devices
  • 9.3.6. Smart Technologies
  • 9.3.7. Military & Aerospace
• 9.4. Y-o-Y Growth Trend Analysis By Application, 2019-2023
• 9.5. Absolute $ Opportunity Analysis By Application, 2024-2031

10. Global Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Region

• 10.1. Introduction
• 10.2. Historical Market Size Value (US$ Million) Analysis By Region, 2019-2023
• 10.3. Current Market Size Value (US$ Million) Analysis and Forecast By Region, 2024-2031
  • 10.3.1. North America
  • 10.3.2. Latin America
  • 10.3.3. Europe
  • 10.3.4. Asia Pacific
  • 10.3.5. Middle East & Africa
• 10.4. Market Attractiveness Analysis By Region

11. North America Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Country

• 11.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2019-2023
• 11.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2024-2031
  • 11.2.1. By Country
    • 11.2.1.1. USA
    • 11.2.1.2. Canada
  • 11.2.2. By Wafer Bumping Process
  • 11.2.3. By Packaging Technology
  • 11.2.4. By Packaging Type
  • 11.2.5. By Product
  • 11.2.6. By Application
• 11.3. Market Attractiveness Analysis
  • 11.3.1. By Country
  • 11.3.2. By Wafer Bumping Process
  • 11.3.3. By Packaging Technology
  • 11.3.4. By Packaging Type
  • 11.3.5. By Product
  • 11.3.6. By Application
• 11.4. Key Takeaways

12. Latin America Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Country

• 12.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2019-2023
• 12.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2024-2031
  • 12.2.1. By Country
    • 12.2.1.1. Brazil
    • 12.2.1.2. Mexico
    • 12.2.1.3. Rest of Latin America
  • 12.2.2. By Wafer Bumping Process
  • 12.2.3. By Packaging Technology
  • 12.2.4. By Packaging Type
  • 12.2.5. By Product
  • 12.2.6. By Application
• 12.3. Market Attractiveness Analysis
  • 12.3.1. By Country
  • 12.3.2. By Wafer Bumping Process
  • 12.3.3. By Packaging Technology
  • 12.3.4. By Packaging Type
  • 12.3.5. By Product
  • 12.3.6. By Application
• 12.4. Key Takeaways

13. Europe Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Country

• 13.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2019-2023
• 13.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2024-2031
  • 13.2.1. By Country
    • 13.2.1.1. Germany
    • 13.2.1.2. United Kingdom
    • 13.2.1.3. France
    • 13.2.1.4. Spain
    • 13.2.1.5. Italy
    • 13.2.1.6. Rest of Europe
  • 13.2.2. By Wafer Bumping Process
  • 13.2.3. By Packaging Technology
  • 13.2.4. By Packaging Type
  • 13.2.5. By Product
  • 13.2.6. By Application
• 13.3. Market Attractiveness Analysis
  • 13.3.1. By Country
  • 13.3.2. By Wafer Bumping Process
  • 13.3.3. By Packaging Technology
  • 13.3.4. By Packaging Type
  • 13.3.5. By Product
  • 13.3.6. By Application
• 13.4. Key Takeaways

14. Asia Pacific Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Country

• 14.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2019-2023
• 14.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2024-2031
  • 14.2.1. By Country
    • 14.2.1.1. China
    • 14.2.1.2. Japan
    • 14.2.1.3. South Korea
    • 14.2.1.4. Singapore
    • 14.2.1.5. Thailand
    • 14.2.1.6. Indonesia
    • 14.2.1.7. Australia
    • 14.2.1.8. New Zealand
    • 14.2.1.9. Rest of Asia Pacific
  • 14.2.2. By Wafer Bumping Process
  • 14.2.3. By Packaging Technology
  • 14.2.4. By Packaging Type
  • 14.2.5. By Product
  • 14.2.6. By Application
• 14.3. Market Attractiveness Analysis
  • 14.3.1. By Country
  • 14.3.2. By Wafer Bumping Process
  • 14.3.3. By Packaging Technology
  • 14.3.4. By Packaging Type
  • 14.3.5. By Product
  • 14.3.6. By Application
• 14.4. Key Takeaways

15. Middle East & Africa Flip Chip Technology Market Analysis 2019-2023 and Forecast 2024-2031, By Country

• 15.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2019-2023
• 15.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2024-2031
  • 15.2.1. By Country
    • 15.2.1.1. GCC Countries
    • 15.2.1.2. South Africa
    • 15.2.1.3. Israel
    • 15.2.1.4. Rest of Middle East & Africa
  • 15.2.2. By Wafer Bumping Process
  • 15.2.3. By Packaging Technology
  • 15.2.4. By Packaging Type
  • 15.2.5. By Product
  • 15.2.6. By Application
• 15.3. Market Attractiveness Analysis
  • 15.3.1. By Country
  • 15.3.2. By Wafer Bumping Process
  • 15.3.3. By Packaging Technology
  • 15.3.4. By Packaging Type
  • 15.3.5. By Product
  • 15.3.6. By Application
• 15.4. Key Takeaways

16. Key Countries Flip Chip Technology Market Analysis

• 16.1. USA
  • 16.1.1. Pricing Analysis
  • 16.1.2. Market Share Analysis, 2024
    • 16.1.2.1. By Wafer Bumping Process
    • 16.1.2.2. By Packaging Technology
    • 16.1.2.3. By Packaging Type
    • 16.1.2.4. By Product
    • 16.1.2.5. By Application
• 16.2. Canada
  • 16.2.1. Pricing Analysis
  • 16.2.2. Market Share Analysis, 2024
    • 16.2.2.1. By Wafer Bumping Process
    • 16.2.2.2. By Packaging Technology
    • 16.2.2.3. By Packaging Type
    • 16.2.2.4. By Product
    • 16.2.2.5. By Application
• 16.3. Brazil
  • 16.3.1. Pricing Analysis
  • 16.3.2. Market Share Analysis, 2024
    • 16.3.2.1. By Wafer Bumping Process
    • 16.3.2.2. By Packaging Technology
    • 16.3.2.3. By Packaging Type
    • 16.3.2.4. By Product
    • 16.3.2.5. By Application
• 16.4. Mexico
  • 16.4.1. Pricing Analysis
  • 16.4.2. Market Share Analysis, 2024
    • 16.4.2.1. By Wafer Bumping Process
    • 16.4.2.2. By Packaging Technology
    • 16.4.2.3. By Packaging Type
    • 16.4.2.4. By Product
    • 16.4.2.5. By Application
• 16.5. Germany
  • 16.5.1. Pricing Analysis
  • 16.5.2. Market Share Analysis, 2024
    • 16.5.2.1. By Wafer Bumping Process
    • 16.5.2.2. By Packaging Technology
    • 16.5.2.3. By Packaging Type
    • 16.5.2.4. By Product
    • 16.5.2.5. By Application
• 16.6. United Kingdom
  • 16.6.1. Pricing Analysis
  • 16.6.2. Market Share Analysis, 2024
    • 16.6.2.1. By Wafer Bumping Process
    • 16.6.2.2. By Packaging Technology
    • 16.6.2.3. By Packaging Type
    • 16.6.2.4. By Product
    • 16.6.2.5. By Application
• 16.7. France
  • 16.7.1. Pricing Analysis
  • 16.7.2. Market Share Analysis, 2024
    • 16.7.2.1. By Wafer Bumping Process
    • 16.7.2.2. By Packaging Technology
    • 16.7.2.3. By Packaging Type
    • 16.7.2.4. By Product
    • 16.7.2.5. By Application
• 16.8. Spain
  • 16.8.1. Pricing Analysis
  • 16.8.2. Market Share Analysis, 2024
    • 16.8.2.1. By Wafer Bumping Process
    • 16.8.2.2. By Packaging Technology
    • 16.8.2.3. By Packaging Type
    • 16.8.2.4. By Product
    • 16.8.2.5. By Application
• 16.9. Italy
  • 16.9.1. Pricing Analysis
  • 16.9.2. Market Share Analysis, 2024
    • 16.9.2.1. By Wafer Bumping Process
    • 16.9.2.2. By Packaging Technology
    • 16.9.2.3. By Packaging Type
    • 16.9.2.4. By Product
    • 16.9.2.5. By Application
• 16.10. China
  • 16.10.1. Pricing Analysis
  • 16.10.2. Market Share Analysis, 2024
    • 16.10.2.1. By Wafer Bumping Process
    • 16.10.2.2. By Packaging Technology
    • 16.10.2.3. By Packaging Type
    • 16.10.2.4. By Product
    • 16.10.2.5. By Application
• 16.11. Japan
  • 16.11.1. Pricing Analysis
  • 16.11.2. Market Share Analysis, 2024
    • 16.11.2.1. By Wafer Bumping Process
    • 16.11.2.2. By Packaging Technology
    • 16.11.2.3. By Packaging Type
    • 16.11.2.4. By Product
    • 16.11.2.5. By Application
• 16.12. South Korea
  • 16.12.1. Pricing Analysis
  • 16.12.2. Market Share Analysis, 2024
    • 16.12.2.1. By Wafer Bumping Process
    • 16.12.2.2. By Packaging Technology
    • 16.12.2.3. By Packaging Type
    • 16.12.2.4. By Product
    • 16.12.2.5. By Application
• 16.13. Singapore
  • 16.13.1. Pricing Analysis
  • 16.13.2. Market Share Analysis, 2024
    • 16.13.2.1. By Wafer Bumping Process
    • 16.13.2.2. By Packaging Technology
    • 16.13.2.3. By Packaging Type
    • 16.13.2.4. By Product
    • 16.13.2.5. By Application
• 16.14. Thailand
  • 16.14.1. Pricing Analysis
  • 16.14.2. Market Share Analysis, 2024
    • 16.14.2.1. By Wafer Bumping Process
    • 16.14.2.2. By Packaging Technology
    • 16.14.2.3. By Packaging Type
    • 16.14.2.4. By Product
    • 16.14.2.5. By Application
• 16.15. Indonesia
  • 16.15.1. Pricing Analysis
  • 16.15.2. Market Share Analysis, 2024
    • 16.15.2.1. By Wafer Bumping Process
    • 16.15.2.2. By Packaging Technology
    • 16.15.2.3. By Packaging Type
    • 16.15.2.4. By Product
    • 16.15.2.5. By Application
• 16.16. Australia
  • 16.16.1. Pricing Analysis
  • 16.16.2. Market Share Analysis, 2024
    • 16.16.2.1. By Wafer Bumping Process
    • 16.16.2.2. By Packaging Technology
    • 16.16.2.3. By Packaging Type
    • 16.16.2.4. By Product
    • 16.16.2.5. By Application
• 16.17. New Zealand
  • 16.17.1. Pricing Analysis
  • 16.17.2. Market Share Analysis, 2024
    • 16.17.2.1. By Wafer Bumping Process
    • 16.17.2.2. By Packaging Technology
    • 16.17.2.3. By Packaging Type
    • 16.17.2.4. By Product
    • 16.17.2.5. By Application
• 16.18. GCC Countries
  • 16.18.1. Pricing Analysis
  • 16.18.2. Market Share Analysis, 2024
    • 16.18.2.1. By Wafer Bumping Process
    • 16.18.2.2. By Packaging Technology
    • 16.18.2.3. By Packaging Type
    • 16.18.2.4. By Product
    • 16.18.2.5. By Application
• 16.19. South Africa
  • 16.19.1. Pricing Analysis
  • 16.19.2. Market Share Analysis, 2024
    • 16.19.2.1. By Wafer Bumping Process
    • 16.19.2.2. By Packaging Technology
    • 16.19.2.3. By Packaging Type
    • 16.19.2.4. By Product
    • 16.19.2.5. By Application
• 16.20. Israel
  • 16.20.1. Pricing Analysis
  • 16.20.2. Market Share Analysis, 2024
    • 16.20.2.1. By Wafer Bumping Process
    • 16.20.2.2. By Packaging Technology
    • 16.20.2.3. By Packaging Type
    • 16.20.2.4. By Product
    • 16.20.2.5. By Application

17. Market Structure Analysis

• 17.1. Competition Dashboard
• 17.2. Competition Benchmarking
• 17.3. Market Share Analysis of Top Players
  • 17.3.1. By Regional
  • 17.3.2. By Wafer Bumping Process
  • 17.3.3. By Packaging Technology
  • 17.3.4. By Packaging Type
  • 17.3.5. By Product
  • 17.3.6. By Application

18. Competition Analysis

• 18.1. Competition Deep Dive
  • 18.1.1. Taiwan Semiconductor Manufacturing Company Limited
    • 18.1.1.1. Overview
    • 18.1.1.2. Product Portfolio
    • 18.1.1.3. Profitability by Market Segments
    • 18.1.1.4. Sales Footprint
    • 18.1.1.5. Strategy Overview
      • 18.1.1.5.1. Marketing Strategy
  • 18.1.2. Samsung Electronics Co., Ltd
    • 18.1.2.1. Overview
    • 18.1.2.2. Product Portfolio
    • 18.1.2.3. Profitability by Market Segments
    • 18.1.2.4. Sales Footprint
    • 18.1.2.5. Strategy Overview
      • 18.1.2.5.1. Marketing Strategy
  • 18.1.3. Intel Corp.
    • 18.1.3.1. Overview
    • 18.1.3.2. Product Portfolio
    • 18.1.3.3. Profitability by Market Segments
    • 18.1.3.4. Sales Footprint
    • 18.1.3.5. Strategy Overview
      • 18.1.3.5.1. Marketing Strategy
  • 18.1.4. Value (US$ Million)ed Microelectronics Corp.
    • 18.1.4.1. Overview
    • 18.1.4.2. Product Portfolio
    • 18.1.4.3. Profitability by Market Segments
    • 18.1.4.4. Sales Footprint
    • 18.1.4.5. Strategy Overview
      • 18.1.4.5.1. Marketing Strategy
  • 18.1.5. ASE Group
    • 18.1.5.1. Overview
    • 18.1.5.2. Product Portfolio
    • 18.1.5.3. Profitability by Market Segments
    • 18.1.5.4. Sales Footprint
    • 18.1.5.5. Strategy Overview
      • 18.1.5.5.1. Marketing Strategy
  • 18.1.6. Amkor Technology
    • 18.1.6.1. Overview
    • 18.1.6.2. Product Portfolio
    • 18.1.6.3. Profitability by Market Segments
    • 18.1.6.4. Sales Footprint
    • 18.1.6.5. Strategy Overview
      • 18.1.6.5.1. Marketing Strategy
  • 18.1.7. Siliconware Precision Industries Co., Ltd.
    • 18.1.7.1. Overview
    • 18.1.7.2. Product Portfolio
    • 18.1.7.3. Profitability by Market Segments
    • 18.1.7.4. Sales Footprint
    • 18.1.7.5. Strategy Overview
      • 18.1.7.5.1. Marketing Strategy
  • 18.1.8. DXP Enterprises
    • 18.1.8.1. Overview
    • 18.1.8.2. Product Portfolio
    • 18.1.8.3. Profitability by Market Segments
    • 18.1.8.4. Sales Footprint
    • 18.1.8.5. Strategy Overview
      • 18.1.8.5.1. Marketing Strategy
  • 18.1.9. Temasek
    • 18.1.9.1. Overview
    • 18.1.9.2. Product Portfolio
    • 18.1.9.3. Profitability by Market Segments
    • 18.1.9.4. Sales Footprint
    • 18.1.9.5. Strategy Overview
      • 18.1.9.5.1. Marketing Strategy
  • 18.1.10. Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 18.1.10.1. Overview
    • 18.1.10.2. Product Portfolio
    • 18.1.10.3. Profitability by Market Segments
    • 18.1.10.4. Sales Footprint
    • 18.1.10.5. Strategy Overview
      • 18.1.10.5.1. Marketing Strategy

19. Assumptions & Acronyms Used

20. Research Methodology

관련자료