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세계의 웨이퍼 그라인더 시장(2025-2035년)
Global Wafer Grinder Market 2025-2035
상품코드 : 1681033
리서치사 : Orion Market Research Pvt Ltd
발행일 : 2025년 03월
페이지 정보 : 영문 150 Pages
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한글목차

웨이퍼 그라인더 시장 규모는 2024년 7억 1,000만 달러에서 2035년에는 12억 3,500만 달러에 달할 것으로 예측되며, 예측 기간(2025-2035년) 동안 5.9%의 연평균 복합 성장률(CAGR)을 나타낼 것으로 예상됩니다. 스마트폰, IoT 기기 등 소형, 고성능 전자기기 수요로 인해 반도체 웨이퍼의 박형화가 요구되고 있습니다. 이러한 표준에 대응하기 위해서는 반도체 기술의 발전과 웨이퍼 연마 기술의 고도화가 필수적이며, 5G 및 IoT 용도의 성장, 자동차 및 항공우주 산업의 확대, 지속가능성과 에너지 효율에 대한 관심 증가는 정밀 웨이퍼 연삭 솔루션에 대한 수요를 더욱 촉진하고 있습니다. 친환경 생산을 지원하는 웨이퍼 그라인더가 인기를 끌고 있습니다.

전자 기기, 5G 기술, IoT의 부상으로 고성능 반도체에 대한 수요가 크게 증가하면서 웨이퍼 그라인더 시장도 크게 성장하고 있습니다. 반도체산업협회에 따르면 2024년 3월 세계 반도체 매출은 5,270억 달러로 회복되어 약 1조 개가 판매되었으며, 2024년까지 매년 두 자릿수 성장률을 기록하여 높은 수익성이 예상됩니다. 그 수요는 투자 증가와 높은 수익성 모두에 의해 강화되고 있습니다. 반도체 제조의 민간 투자는 CHIPS와 과학법 이후 미리 약속되어 있습니다. 미국은 CHIPS 제정 이후 지난 10년간 반도체 제조 능력을 3배로 증가시켜 세계 전체 설비투자의 28%를 차지했습니다.

첨단 기술 통합은 웨이퍼 박막화 정밀도와 생산 확장성을 높이기 위해 연삭 유닛과 플랫폼을 결합하는 것을 포함합니다. 예를 들어, Tokyo Electron은 2023년 11월에 300mm 웨이퍼 박막화 장비 "Ulucus G"를 출시했습니다. 이는 연삭과 LITHIUS Pro Z 플랫폼을 결합한 것으로, 더 적은 노력으로 더 높은 품질의 실리콘 웨이퍼를 더 적은 노력으로 양산하는 데 주안점을 두고 있습니다. 스크럽 세정 유닛, 스핀 습식 에칭 유닛, 웨이퍼 처리 유닛을 내장하고 있습니다.

세계의 웨이퍼 그라인더(Wafer Grinder) 시장에 대해 조사했으며, 시장 개요, 유형별/용도별/지역별 동향, 시장 진출기업 프로파일 등의 정보를 전해드립니다.

목차

제1장 보고서 요약

제2장 시장 개요와 인사이트

제3장 시장 결정 요인

제4장 경쟁 구도

제5장 세계의 웨이퍼 그라인더 시장(100만 달러), 유형별

제6장 세계의 웨이퍼 그라인더 시장(100만 달러), 용도별

제7장 지역 분석

제8장 기업 개요

LSH
영문 목차

영문목차

Wafer Grinder Market Size, Share & Trends Analysis Report by Type (Wafer Surface Grinder, and Wafer Edge Grinder), and by Application (Silicon Wafer, SiC Wafer, Sapphire Wafer, and Compound Semiconductors) Forecast Period (2024-2031)

Industry Overview

Wafer grinder market is projected to reach $1,235 million in 2035, from $710 million in 2024, witnessing a CAGR of 5.9% during the forecast period (2025-2035). The demand for compact, high-performance electronics, such as smartphones and IoT devices, necessitates thinner semiconductor wafers. Advancements in semiconductor technology and advanced wafer grinding technologies are essential for meeting the standards. The growth of 5G and IoT applications, expansion in automotive and aerospace industries, and a growing focus on sustainability and energy efficiency are additionally driving the demand for precision wafer grinding solutions. Wafer grinders that support eco-friendly production are gaining traction.

Market Dynamics

Rising Demand for Semiconductors

The rise in electronic devices, 5G technology, and IoT applications has significantly boosted the demand for high-performance semiconductors, and thus the market for wafer-grinding equipment. According to the Semiconductor Industry Association, in March 2024, global semiconductor sales rebounded to $527 billion, with nearly 1 trillion sold. It is expected the high profitability bodes well with double-digit growth annually in the year 2024. Its demand is augmented by both increased investment and high profitability. The semiconductor manufacturing private investments have been committed in advance after the CHIPS and Science Act. The US increased its semiconductor manufacturing capacity by tripling in just the last ten years since the enactment of CHIPS and taking in 28% of the entire global capital spending.

Advanced Technology Integration

Advanced technology integration involves combining grinding units with platforms to enhance wafer thinning precision and production scalability. For instance, in November 2023, Tokyo Electron launched Ulucus G, a 300mm wafer thinning system. It combines grinding with the LITHIUS Pro Z platform, with a focus on the production of higher-quality silicon wafers using less labor in mass production. It incorporates a scrub cleaning unit, spin wet etch unit, and single-wafer processing units.

Market Segmentation

The Silicon Wafer segment is projected to Hold the Largest Market Share

Silicon wafers are thin semiconductor-grade silicon slices utilized as the base for semiconductor devices and integrated circuits. The silicon wafer is manufactured via the process of polishing surfaces for microfabrication, slicing silicon crystals into wafers, and growing high-purity silicon crystals. Wafers are employed in microelectromechanical systems, optoelectronics, and photovoltaics, and play an important role in research and development.

Wafer Surface Grinder Segment to Hold a Considerable Market Share

Wafer surface grinders are devices that ensure wafer surfaces come out flat and smooth with minimum thickness deviation and can minimize surface roughness to adequately prepare wafers for later processes such as photolithography and etching. It usually comprises precision grinding wheels, advanced cooling systems, and can accommodate many sizes of wafers, and is used for surface planarization, reducing roughness, relieving stresses, and adhesion enhancement.

Regional Outlook

The global wafer grinder market is further segmented based on geography including North America (the US, and Canada), Europe (the UK, Germany, France, Italy, Spain, Germany, France, Russia, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, Australia and New Zealand, ASEAN Countries, and the Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America).

5G Technology Proliferation in the North America Region

The rapid growth of 5G technology is fostering an increase in demand for advanced semiconductors, especially precision wafer grinding for optimal device performance and energy efficiency. According to the 5G Americans, Org., in July 2024, the global adoption of 5G technology reached nearly two billion connections in Q1 2024, with 185 million new additions. North America emerges as the leader in 5G adoption with 32% of all wireless cellular connections. The region is additionally the growth driver, adding 22 million new connections to the operators' networks. Latin America showed growth in 4G LTE and 5G connections, with eight million new LTE connections and nine million new 5G connections, totaling 48 million 5G connections.

Asia-Pacific Holds Major Market Share

Asia-Pacific holds a significant share owing to the expansion of manufacturing capacity in Asia, particularly in China, Taiwan, and South Korea. According to the India Brand Equity Foundation (IBEF) by 2025, the Indian electronics manufacturing industry is anticipated to reach $520 billion, with a projected increase in demand for electronic products to $400 billion by FY25, up from $33 billion in FY20. The electronics system market is expected to grow 2.3 times from its FY19 size, reaching $160 billion by FY25. Electronic goods exports were $29.1 billion in FY24, up from $23.6 billion in FY23. The electronics design segment, growing at 20.1%, accounted for 22% of the ESDM market in FY19 and is expected to make 27% by FY25. As a major consumer electronics market in the Asia Pacific Region, India has significant expertise in electronic chip design and embedded software, aiming for $300 billion in electronics manufacturing and $120 billion in exports by 2025-26.

Market Players Outlook

The major companies serving the wafer grinder market include DISCO Corp., Ebara Corp., G&N GmbH, Infineon Technologies, Applied Material, Inc., Tokyo Electron Ltd., and others. The market players are increasingly focusing on business expansion and product development by applying strategies such as collaborations, mergers, and acquisitions to stay competitive in the market.

Recent Developments

The Report Covers:

Table of Contents

1. Report Summary

2. Market Overview and Insights

3. Market Determinants

4. Competitive Landscape

5. Global Wafer Grinder Market by Type ($ Million)

6. Global Wafer Grinder Market by Application ($ Million)

7. Regional Analysis

8. Company Profiles

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