The Global Thin Film Circuit Substrate Market Research Report Information by Material Type, by Thickness, by Application, and by Technology Forecast till 2035
상품코드:1882831
리서치사:Market Research Future
발행일:2025년 10월
페이지 정보:영문 162 Pages
라이선스 & 가격 (부가세 별도)
한글목차
박막 회로 기판 시장 규모는 2025년부터 2035년까지 연평균 복합 성장률(CAGR) 5.2%로 확대되어 예측 기간 종료 시점에 67억 7,128만 달러 규모에 이를 것으로 예측됩니다. 첨단 기술이라고도 불리는 박막 기판 채택은 CE 제품, 자동차, 항공우주, 통신, 의료기기 분야에서 컴팩트하고 신뢰성 높은 회로 성능을 보장하는 가장 좋은 방법입니다.
소형화 및 고성능 장치에 대한 요구
현대의 CE 제품은 고밀도 및 효율적인 회로 설계를 요구하고 있으며, 박막 기판은 필수 불가결한 존재가 되었습니다. 예를 들어, 기판 재료로 순수 알루미나 또는 질화 알루미늄을 사용하는 것은 장치의 열 관리 및 전기적 성능 측면에서 우수한 솔루션이 될 수 있습니다. 5G, AI, VR/AR의 보급으로 기판에 대한 수요는 앞으로도 계속 증가할 것입니다.
지역별 분석
북미와 유럽은 R&D 비용 증가, 차량용 전자제품의 발전, 정부 지원 반도체 이니셔티브를 통해 그 발걸음을 유지하고 있습니다. 또한, 아시아태평양은 광범위한 제조거점과 빠른 기술 발전으로 세계 시장에서 확고한 우위를 유지하고 있습니다. 남미, 중동 및 아프리카은 아직 개발 단계에 있는 시장으로 볼 수 있습니다.
기술적 우위 및 성장 요인
소형, 에너지 절약형 전자 어셈블리에 대한 수요가 증가함에 따라 박막 기판은 CE 제품, 자동차, 통신, 의료 등 다양한 분야에서 뚜렷한 우위를 발휘하고 있습니다. 또한, 우수한 열 관리, 전기 절연성, 기계적 강도를 갖추고 있어 미래 디바이스에 가장 적합한 기판으로 평가받고 있습니다. 증착 기술의 혁신과 알루미나, 질화알루미늄 등 첨단 소재의 등장으로 기판의 산업 분야에서의 역할이 크게 확대되고 있습니다.
주요 보고서 속성
2024년 시장 규모 : 36억 7,680만 달러
2035년 시장 규모 : 67억 7,128만 달러
CAGR(2025-2035년) : 5.2%(연평균)
기준 연도: 2024년
시장 예측 기간: 2025-2035년
세계의 박막 회로기판(Thin Film Circuit Board) 시장을 조사했으며, 시장 정의와 개요, 시장 성장에 영향을 미치는 각종 영향요인 분석, 시장 규모 추이와 예측, 각종 부문별/지역별/주요 국가별 분석, 경쟁 환경, 주요 기업 개요 등의 정보를 정리하여 전해드립니다.
The Thin Film Circuit Substrate Market will expand at a 5.2% CAGR between 2025 and 2035, ultimately valuing USD 6,771.28 million by the end of the forecast period. The use of thin film substrates, which are also called advanced technologies, is the best way to ensure the performance of compact and reliable circuits in consumer electronics, automotive, aerospace, telecom, and medical devices.
Miniaturization and High-Performance Device Requirements
The modern consumer electronics are very demanding and want high-density and efficient circuit designs, so thin film substrates have become indispensable. For example, the use of pure alumina or aluminum nitride as a substrate material is a superior solution for the device's thermal management and further electrical performance at the same time. The coming of 5G, AI, and VR/AR will only continue to increase the demand for substrate.
Segment-wise Classification Overview
Material Type
Polyimide - flexible film for portable devices
Glass - stable platform for optical circuits
FR-4 - standard insulated PCB material
Silicon - core base for semiconductor ICs
Ceramic - heat-resistant power substrate
Metal - strong conductor for electronics
Others - specialty engineered materials
Thickness
Thin Film (<25 µm) - ultra-compact electronics
Medium Film (25-100 µm) - versatile thickness
Thick Film (>100 µm) - rugged, heavy-duty systems
Application
Consumer Electronics - smartphones, wearables
Automotive - EV and ADAS electronics
Aerospace/Defense - mission-critical hardware
Telecommunications - 5G and high-speed systems
Healthcare - diagnostics and monitoring devices
Others - broader industrial use
Technology
PVD - uniform metal layer formation
CVD - high-purity thin-film creation
Printed/Hybrid - low-cost, scalable fabrication
Etching - accurate micro-design structuring
North America and Europe are keeping pace through increased R&D spending, advancements in automotive electronics, and government-backed semiconductor initiatives. At the same time, the Asia-Pacific region is holding a solid lead in the worldwide market because of its extensive manufacturing base and quick technological progress. South America and the Middle East, and Africa regions can be considered as the markets that are still in the development phase.
Technological Advantage and Growth Drivers
The demand for small, energy-efficient electronic assemblies is giving thin film substrates a clear advantage across various fields such as consumer electronics, automotive, telecom, and healthcare. Moreover, these substrates are considered the most suitable for future devices because of their excellent thermal management, electrical insulation, and mechanical strength. The role of substrates has expanded significantly in the industrial sector due to innovations in deposition technologies and advanced materials like alumina and aluminum nitride.
Key Report Attributes
Market Size 2024: USD 3676.8 Million
Market Size 2035: USD 6,771.28 Million
CAGR (2025-2035): 5.2%
Base Year: 2024
Market Forecast Period: 2025-2035
Market Segmentations Growth
By Material Type: Polyimide - 6.2%, Glass - 5.1%.
By Thickness: Thin Film - 5.6%, Medium Film - 5.1%.
By Application: Consumer Electronics - 5.1%, Automotive - 5.4%.
By Technology: Physical Vapor Deposition (PVD) - 5.2%, Chemical Vapor Deposition (CVD) - 5.3%.
TABLE OF CONTENTS
1 EXECUTIVE SUMMARY
1.1 MARKET OVERVIEW:
1.2 COMPETITIVE LANDSCAPE
1.3 FUTURE OUTLOOK
2 MARKET INTRODUCTION
2.1 DEFINITION
2.2 SCOPE OF THE STUDY
2.3 RESEARCH OBJECTIVE
2.4 MARKET STRUCTURE
3 RESEARCH METHODOLOGY
3.1 OVERVIEW
3.2 DATA FLOW
3.2.1 DATA MINING PROCESS
3.3 PURCHASED DATABASE:
3.4 SECONDARY SOURCES:
3.4.1 SECONDARY RESEARCH DATA FLOW:
3.5 PRIMARY RESEARCH:
3.5.1 PRIMARY RESEARCH DATA FLOW:
3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
3.6.1 CONSUMPTION NET TRADE APPROACH
3.6.2 REVENUE ANALYSIS APPROACH
3.7 DATA FORECASTING
3.7.1 DATA FORECASTING TECHNIQUE
3.8 DATA MODELING
3.8.1 MICROECONOMIC FACTOR ANALYSIS:
3.8.2 DATA MODELING:
3.9 TEAMS AND ANALYST CONTRIBUTION
4 MARKET DYNAMICS
4.1 INTRODUCTION
4.2 MARKET TRENDS AND GROWTH AFFECTING FACTORS
4.3 DRIVERS
4.3.1 INCREASING DEMAND FOR CONSUMER ELECTRONICS
4.3.2 ADVANCEMENTS IN SEMICONDUCTOR TECHNOLOGY
4.3.3 GROWTH IN RENEWABLE ENERGY APPLICATIONS
4.3.4 MINIATURIZATION OF ELECTRONIC DEVICES
4.3.5 RISING INVESTMENTS IN IOT AND SMART TECHNOLOGIES
4.4 RESTRAINTS
4.4.1 HIGH PRODUCTION COSTS
4.4.2 TECHNOLOGICAL COMPLEXITY
4.4.3 LIMITED AVAILABILITY OF RAW MATERIALS
4.4.4 MARKET SATURATION IN KEY REGIONS
4.4.5 REGULATORY CHALLENGES
4.5 OPPORTUNITY
4.5.1 EXPANSION IN AUTOMOTIVE ELECTRONICS
4.5.2 ENHANCEMENTS IN FLEXIBLE ELECTRONICS
4.5.3 INCREASED ADOPTION OF WEARABLE TECHNOLOGY
4.5.4 EMERGENCE OF 5G INFRASTRUCTURE
4.5.5 GROWTH OF MEDICAL ELECTRONICS APPLICATIONS
5 MARKET FACTOR ANALYSIS
5.1 SUPPLY CHAIN ANALYSIS
5.1.1 RAW MATERIAL PROCUREMENT
5.1.2 THIN FILM DEPOSITION & COATING
5.1.3 PATTERNING & ETCHING
5.1.4 SUBSTRATE FABRICATION & ASSEMBLY
5.1.5 INSPECTION & QUALITY VALIDATION
5.1.6 PACKAGING & CLEANROOM LOGISTICS
5.1.7 DISTRIBUTION
5.2 PORTER'S FIVE FORCES MODEL
5.2.1 THREAT OF NEW ENTRANTS - MODERATE
5.2.2 BARGAINING POWER OF SUPPLIERS - MODERATE TO HIGH
5.2.3 THREAT OF SUBSTITUTES - LOW TO MODERATE
5.2.4 BARGAINING POWER OF BUYERS - HIGH
5.2.5 INTENSITY OF RIVALRY - HIGH
6 THIN FILM CIRCUIT SUBSTRATE MARKET, BY MATERIAL TYPE
6.1 INTRODUCTION
6.2 MATERIAL TYPE
7 THIN FILM CIRCUIT SUBSTRATE MARKET, BY THICKNESS
7.1 INTRODUCTION
7.2 THIN FILM (BELOW 25 µM)
7.3 MEDIUM FILM (25 µM TO 100 µM)
7.4 THICK FILM (ABOVE 100 µM)
8 THIN FILM CIRCUIT SUBSTRATE MARKET, BY APPLICATION
8.1 INTRODUCTION
8.2 CONSUMER ELECTRONICS
8.3 AUTOMOTIVE
8.4 AEROSPACE AND DEFENSE
8.5 TELECOMMUNICATIONS
8.6 HEALTHCARE DEVICES
9 THIN FILM CIRCUIT SUBSTRATE MARKET, BY TECHNOLOGY
