한글목차

세계의 열 분리 테이프 시장 전망은 반도체 제조, 전자 어셈블리, 자동차 시장에 기회가 있고 유망시되고 있습니다. 세계의 열 분리 테이프 시장은 2025-2031년 CAGR 6.8%로 성장할 것으로 예측되고 있습니다. 이 시장의 주요 촉진요인은 자동차 산업 수요 증가, 항공우주 용도 분야의 채용 증가, 전자 장비 제조에서의 사용 증가입니다.

• Lucintel의 예측에서는 유형별로 단면 테이프가 예측 기간 동안 높은 성장을 이룰 전망입니다.
• 용도 분야별로 전자 어셈블리가 가장 높은 성장이 예상됩니다.
• 지역별로는 아시아태평양이 예측 기간 가장 높은 성장이 예상됩니다.

150페이지 이상의 종합적인 보고서를 통해 비즈니스 의사 결정에 도움이 되는 귀중한 인사이트를 얻을 수 있습니다.

열 분리 테이프 시장의 새로운 동향

열 분리 테이프 시장은 빠른 속도로 추이하고 있으며, 새로운 동향은 제조업무의 고도화하는 요건에 대응에 초점을 맞추었습니다. 이러한 새로운 동향으로는 보다 넓은 온도 동작 범위의 테이프 작성, 정전기 방지 특성의 통합, 다양한 기판에 적합한 테이프 설계, 커스텀 테이프 솔루션의 채용 확대, 환경 재료 및 제조에 대한 초점 강화 등이 포함됩니다. 이러한 새로운 동향은 효율성 향상, 결함 최소화, 환경 실적 최소화를 목표로 합니다.

• 더 넓은 온도 작동 범위를 가진 테이프 창출 : 새로운 제조 공정은 다양한 온도 범위에 해당하는 경향이 있습니다. 가공시의 조작 온도 범위가 넓어도 안정된 점착력을 가지며, 가열해도 깨끗하게 박리할 수 있는 열 분리 테이프의 개발이 점점 중시되고 있습니다. 이로 인해 이러한 테이프의 범용성이 높아져 전자 기기의 납땜이나 베이킹 작업 등 고온의 제조 환경에서의 용도의 폭이 넓어집니다.
• 정전기 방지 특성 통합 : 정전기 방전(ESD)은 제조 중에 섬세한 전자 장치에 손상을 줄 수 있습니다. 새로운 동향은 ESD와 관련된 결함을 피하기 위해 열 분리 테이프에 정전기 방지 특성을 통합하는 것입니다. 이러한 테이프는 귀중한 전자 부품을 일시적으로 접착하고 취급할 때 보호하여 전자 기기 분야의 수율 향상과 제조 비용 절감을 가져옵니다.
• 다양한 기판에 대응하는 테이프 개발 : 전자기기 및 자동차 산업에서는 사용되는 재료가 다양해지고 있습니다. 열 분리 테이프는 고분자, 금속, 복합재 등 더 많은 유형의 기재에 잘 붙일 수 있는 반면, 잔류물이나 손상 없이 깨끗하게 박리하는 능력을 유지하는 것이 요구되고 있습니다. 이러한 호환성은 다양한 제조 공정에서 다용도를 높입니다.
• 맞춤형 테이프 솔루션의 출현 : 제조 공정이 점점 전문화됨에 따라 정밀한 용도에 적합한 맞춤형 열 분리 테이프 솔루션에 대한 수요가 증가하고 있습니다. 테이프 제조업체는 최종 사용자와 밀접하게 연계하여 특정 점착력, 박리 온도, 사이즈 등의 속성을 가진 테이프를 설계함으로써 전문적인 용도에 있어서의 성능과 효율을 최적화하여 공정 관리의 강화와 재료 낭비의 삭감을 추진하고 있습니다.
• 녹색 재료 및 제조에 대한 주목 증가 : 지속가능성은 모든 산업에서 점점 더 큰 과제가 되고 있습니다. 열 분리 테이프 산업에서는 바이오 폴리머 및 수성 접착제와 같은 친환경 소재를 사용한 테이프 처방과 제품의 전체 환경 실적를 최소화하는 보다 지속 가능한 제조 방법에 대한 주목이 높아지고 있습니다.

보다 넓은 온도 범위, 정전기 방지 특성, 기재 적합성의 다양성, 사용자 정의, 친환경 소재 등, 이러한 모든 새로운 개발은 열 분리 테이프 시장을 변화시키고 있습니다. 이들은 전자기기, 자동차 및 기타 제조업계의 변화하고 점점 더 까다로운 요구에 대응하기 위해 업계를 보다 성능에 중점을 두고 보다 다재다능하고 지속 가능한 솔루션으로 향하고 있습니다.

열 분리 테이프 시장의 최근 동향

열 분리 테이프 시장은 가열 시 깨끗하게 벗겨내는 일시적 접착 옵션을 제공하는 데 특화된 역동적인 산업입니다. 최근의 동향은 뛰어난 성능, 유연성, 첨단 제조 기술과의 통합을 목표로 하는 움직임을 반영합니다.

• 점착성 및 분리 특성 향상 : 공급업체는 가공 시 접착 강도와 가열 후 깨끗하고 잔류물이 없는 박리성을 최적으로 혼합한 열 분리 테이프를 제조하기 때문에 항상 한계에 도전하고 있습니다. 여기에는 벗길 때 깨지기 쉬운 기재에 손상을 주지 않고 안정적인 일시적인 접착을 가능하게 하는 첨단 접착 기술과 백킹 재료를 적용하는 등이 포함됩니다.
• 보다 얇고 유연한 테이프 : 전자 장치 분야의 소형화로 인해 얇고 추종성이 높은 임시 접착 솔루션이 필요합니다. 새로운 개발에서는 복잡한 형상이나 좁은 틈새에도 피트해, 컴팩트한 전자 기기와의 접착 및 박리가 가능한 초박형의 열 분리 테이프가 사용되고 있습니다.
• 유연한 전자기기 용도 확대 : 접이식 스크린이나 웨어러블 기기와 같은 성장하는 유연한 전자기기 시장에서는 유연하고 신뢰할 수 있는 임시 접착 테이프가 필요합니다. 최근의 진보에는 플렉서블 기판을 손상시키거나 변형시키지 않고 플렉서블 기판으로부터 깨끗하게 박리할 수 있는 이러한 용도에 맞는 열 분리 테이프가 있습니다.
• 깨끗한 박리 기술의 진보 : 잔류물이 없는 박리를 유지하는 것은 열 분리 테이프, 특히 반도체 제조와 같은 섬세한 용도에 매우 중요합니다. 최근의 개선은 점착제의 화학적 성질과 테이프 구조에 중점을 두고, 가열 박리 후의 잔류물이나 오염을 저감 혹은 제거하고 있습니다.
• 감지 기능 내장 테이프 개발 : 새로운 연구개발 분야는 열 분리 테이프에 감지 기능을 내장하는 것입니다. 이는 박리 전 공정 관리 및 품질 검사에 유용한 데이터를 제공하기 때문에 접착 중 온도 및 압력을 추적하는 센서가 내장된 테이프를 포함할 수 있습니다.

강력한 접착성과 박리성, 보다 얇고 유연한 테이프, 유연한 전자기기 용도, 깨끗한 박리 기술, 내장 센서 기능 등의 새로운 발전은 열 분리 테이프 시장에 큰 영향을 미치고 있습니다. 이들은 첨단 제조업의 변화하는 수요에 대응하는 보다 고도로 유연한 일시적 접착 솔루션의 개발을 촉진하고 있습니다.

목차

제1장 주요 요약

제2장 시장 개요

• 배경 및 분류
• 공급망

제3장 시장 동향 및 예측 분석

• 거시경제 동향 및 예측
• 업계의 촉진요인 및 과제
• PESTLE 분석
• 특허 분석
• 규제 환경

제4장 세계의 열 분리 테이프 시장 : 유형별

• 개요
• 유형별 매력 분석
• 단면 테이프 : 동향 및 예측(2019-2031년)
• 양면 테이프 : 동향 및 예측(2019-2031년)

제5장 세계의 열 분리 테이프 시장 : 용도별

• 개요
• 용도별 매력 분석
• 반도체 : 동향 및 예측(2019-2031년)
• 전자 어셈블리 : 동향 및 예측(2019-2031년)
• 자동차 : 동향 및 예측(2019-2031년)
• 기타 : 동향 및 예측(2019-2031년)

제6장 지역 분석

• 개요
• 지역별 세계의 열 분리 테이프 시장

제7장 북미의 열 분리 테이프 시장

• 개요
• 북미의 열 분리 테이프 시장 : 유형별
• 북미의 열 분리 테이프 시장 : 용도별
• 미국의 열 분리 테이프 시장
• 멕시코의 열 분리 테이프 시장
• 캐나다의 열 분리 테이프 시장

제8장 유럽의 열 분리 테이프 시장

• 개요
• 유럽의 열 분리 테이프 시장 : 유형별
• 유럽의 열 분리 테이프 시장 : 용도별
• 독일의 열 분리 테이프 시장
• 프랑스의 열 분리 테이프 시장
• 스페인의 열 분리 테이프 시장
• 이탈리아의 열 분리 테이프 시장
• 영국의 열 분리 테이프 시장

제9장 아시아태평양의 열 분리 테이프 시장

• 개요
• 아시아태평양의 열 분리 테이프 시장 : 유형별
• 아시아태평양의 열 분리 테이프 시장 : 용도별
• 일본의 열 분리 테이프 시장
• 인도의 열 분리 테이프 시장
• 중국의 열 분리 테이프 시장
• 한국의 열 분리 테이프 시장
• 인도네시아의 열 분리 테이프 시장

제10장 기타 지역의 열 분리 테이프 시장

• 개요
• 기타 지역의 열 분리 테이프 시장 : 유형별
• 기타 지역의 열 분리 테이프 시장 : 용도별
• 중동의 열 분리 테이프 시장
• 남미의 열 분리 테이프 시장
• 아프리카의 열 분리 테이프 시장

제11장 경쟁 분석

• 제품 포트폴리오 분석
• 운영 통합
• Porter's Five Forces 분석
  • 경쟁 기업간 경쟁 관계
  • 구매자의 협상력
  • 공급기업의 협상력
  • 대체품의 위협
  • 신규 참가업체의 위협
• 시장 점유율 분석

제12장 기회 및 전략 분석

• 밸류체인 분석
• 성장 기회 분석
  • 유형별 성장 기회
  • 용도별 성장 기회
• 세계 열 분리 테이프 시장에서의 새로운 동향
• 전략 분석
  • 신제품 개발
  • 인증 및 라이선싱
  • 합병, 인수, 계약, 제휴 및 합작 사업

제13장 밸류체인에서 주요 기업의 기업 프로파일

• 경쟁 분석
• Nitto Denko
• Semiconductor Equipment
• NDS
• Mitsui Chemicals
• Nitta Corporation
• Solar Plus Company
• DSK Technologies
• Force-One Applied Materials
• 3M
• Taiwan Gilliontec

제14장 부록

• List of Figures
• List of Tables
• Research Methodology
• Disclaimer
• Copyright
• Abbreviations and Technical Units
• About Us
• Contact Us

영문목차

The future of the global heat detachable tape market looks promising with opportunities in the semiconductor manufacturing, electronic assembly, and automotive markets. The global heat detachable tape market is expected to grow with a CAGR of 6.8% from 2025 to 2031. The major drivers for this market are the rising demand from the automotive industry, the growing adoption in aerospace applications, and the increasing use in electronics manufacturing.

• Lucintel forecasts that, within the type category, single-sided tape is expected to witness higher growth over the forecast period.
• Within the application category, electronic assembly is expected to witness the highest growth.
• In terms of region, APAC is expected to witness the highest growth over the forecast period.

Gain valuable insights for your business decisions with our comprehensive 150+ page report. Sample figures with some insights are shown below.

Emerging Trends in the Heat Detachable Tape Market

The heat detachable tape market is fast-paced, with emerging trends focusing on meeting the increasingly sophisticated requirements of manufacturing operations. These emerging trends involve creating tapes with broader temperature operating ranges, incorporating anti-static properties, designing tapes appropriate for varied substrates, increased adoption of custom tape solutions, and an enhanced focus on environmental materials and manufacturing. These emerging trends are looking to enhance efficiency, minimize defects, and minimize environmental footprint.

• Creation of Tapes with Broader Temperature Operation Ranges: New manufacturing processes tend to engage a wide range of temperatures. Increasing emphasis is being placed on creating heat releasable tapes with stable adhesion over a broader temperature range of operation during processing and still enable clean release when heated. This increases the versatility of these tapes and the range of uses for them in high-temperature manufacturing environments, including soldering and baking operations in electronics.
• Incorporation of Anti-Static Properties: Electrostatic discharge (ESD) can cause damage to sensitive electronic devices during fabrication. A new trend is the incorporation of anti-static properties in heat detachable tapes in order to avoid ESD-related defects. Such tapes protect precious electronic components while temporarily bonding and handling them, resulting in increased yields and lower manufacturing costs for the electronics sector.
• Development of Tapes Compatible with Various Substrates: Electronics and automotive industries utilize an increasing array of materials. There is a demand for heat removable tapes to stick successfully onto more varieties of substrates, such as polymers, metal, and composites, while maintaining the ability to remove cleanly without residue or damage. Such compatibility makes them more versatile across various manufacturing operations.
• Emergence of Customized Tape Solutions: As the processes in manufacturing become increasingly specialized, demand is growing for customized heat detachable tape solutions suited to precise applications. Tape makers are engaging very closely with end-users to design tapes of specific adhesion strengths, release temperatures, size, and other attributes to best enhance performance and efficiency in specialist applications, promoting enhanced process control and lower material wastage.
• Increasing Focus on Green Materials and Manufacturing: Sustainability is increasingly becoming a major issue in all industries. In the heat detachable tape industry, this means an increasing focus on formulating tapes with more green materials, like bio-based polymers and water-based adhesives, and more sustainable manufacturing methods to minimize the overall environmental footprint of these products.

All these new developments in broader temperature ranges, anti-static characteristics, variability in substrate compatibility, customization, and environmentally friendly materials are transforming the heat detachable tape market. They are compelling the industry to move towards more performance-oriented, more versatile, and more sustainable solutions to address the changing and increasingly demanding requirements of the electronics, automotive, and other manufacturing industries.

Recent Developments in the Heat Detachable Tape Market

The heat detachable tape market is a dynamic industry that specializes in delivering temporary bonding options with neat removal upon heating. Recent trends reflect a push towards better performance, flexibility, and integration with sophisticated manufacturing techniques.

• Improved Adhesion and Release Characteristics: Suppliers are constantly pushing boundaries to produce heat removable tapes that provide an optimal blend of adhesion strength at processing and clean, residue-free release after heating. This involves the application of sophisticated adhesive technology and backing materials that facilitate consistent temporary adhesion without causing damage to fragile substrates on removal.
• Thin and More Compliant Tapes: Miniaturization in the field of electronics calls for thin and more conformable temporary adhesive solutions. Emerging developments involve bringing into use ultra-thin heat removable tapes, which can fit complex geometries and tight crevices and bond and de-bond with compact electronic equipment.
• Flexible Electronics Applications Expansion: The growing flexible electronics market, such as foldable screens and wearable devices, requires flexible and dependable temporary bonding tapes. Some recent advancements involve heat removable tapes tailored to these applications with clean release from flexible substrates without damaging or deforming them.
• Clean Removal Technologies Advances: Maintaining residue-free removal is crucial for heat detachable tapes, particularly for delicate applications such as semiconductor fabrication. Recent improvements emphasize adhesive chemistry and tape architecture to reduce or even eliminate post-heating and detaching process residue or contamination.
• Development of Tapes with Embedded Sensing Features: A new field of research and development is the embedding of sensing features in heat detachable tapes. This may entail tapes with built-in sensors to track temperature or pressure throughout bonding with beneficial data for process control and quality checks prior to detachment.

Such new advancements in stronger adhesion and release, thinner and more flexible tapes, flexible electronics uses, clean removal technologies, and embedded sensing features are profoundly influencing the heat detachable tape market. They are inducing the development of more advanced and flexible temporary bonding solutions that address the changing demands of advanced manufacturing sectors.

Strategic Growth Opportunities in the Heat Detachable Tape Market

Strategic expansion in the heat detachable tape market is possible by highlighting the unique benefits of these tapes in various industrial uses where clean release and temporary bonding are paramount. By positioning their products in these areas, tape producers can take advantage of the unique selling points of their products.

• Increasing Application in Semiconductor Wafer Processing: In semiconductor processing, heat removable tapes play a vital role in wafer dicing and back grinding. Strategic expansion opportunities are in creating tapes with ultra-clean release characteristics and thermal resistance for the more demanding requirements of newer wafer processing methods and increasing demand for thinner and more sophisticated semiconductor devices.
• Growth Opportunity in Flexible Electronics Assembly: The assembly of flexible electronic devices, like foldable smartphones and wearable sensors, demands temporary bonding solutions capable of managing flexible substrates and offering clean removal without harming fragile parts. Designing heat detachable tapes tailored for these uses poses a considerable opportunity for growth.
• Increased Use in Automotive Refinish: Heat removable tapes are utilized in automotive refinish for masking surfaces that must remain unpainted. Opportunities for strategic growth include developing tapes capable of surviving the high heat of paint baking operations and providing clean, sharp paint edges when removed, enhancing the quality and efficiency of automotive finishing.
• Increasing Demand in Temporary Fixing for Medical Devices: Medical device manufacturing frequently consists of temporary sticking of parts for assembly or processing. Heat releasable tapes provide a hygienic and consistent solution in this case. Creating tapes tailor-made for the manufacture of medical devices, keeping in mind biocompatibility as well as cleanroom compatibility, is an increasing market segment.
• Additive Manufacturing Support Removal Potential: Additive manufacturing involves the need for support structures that must be removed once printed. Heat detachable tapes have the potential to bond these supports temporarily to the base part and enable easier and cleaner removal on heating as opposed to conventional mechanical techniques, offering a new growth potential.

Strategic growth prospects for the heat detachable tape market are noteworthy in semiconductor wafer processing, flexible electronics assembly, automotive painting, medical device manufacturing, and support removal in additive manufacturing. With a concentration on unique needs and advantages of heat detachable tapes used in these applications, manufacturers can spur market growth and innovation.

Heat Detachable Tape Market Driver and Challenges

The dynamics of the heat detachable tape market are influenced by several factors that drive demand for temporary bonding solutions with clean thermal release. These factors include technological advancements in adhesive and backing materials, economic development in industries such as electronics and automotive, and growing emphasis on sustainable manufacturing practices.

The factors responsible for driving the heat detachable tape market include:

1. Increasing Electronics Manufacturing Demand: The electronics sector's explosive expansion, especially in segments such as semiconductors, flexible displays, and advanced packaging, is a prime driver for heat detachable tapes, which find application in temporary bonding across many manufacturing processes.

2. Growing Complexity of Electronic Components: Miniaturization and added functionality in electronic components lead to the need for exacting and temporary bonding solutions that are easy to remove without harming sensitive components, spurring demand for sophisticated heat detachable tapes.

3. Use in Automotive Assembly and Painting: The application of heat removable tapes for masking purposes in painting and temporary holding during assembly operations is growing because they can ensure clean removal and enhance manufacturing efficiency.

4. Need for Clean and Residue-Free Release: In a lot of sensitive production processes, especially in optics and electronics, the need to remove temporary adhesives in a clean and residue-free fashion is critical, and heat releasable tapes are a favorable option.

5. Technological Innovations in Adhesive Products: Research and development of adhesive technologies continue to advance and produce heat detaching tapes with better adhesion strength, broadened temperature operation ranges, and cleaner release characteristics, broadening their use.

Challenges in the heat detachable tape market are:

1. Cost Sensitivity in Some Applications: Although performance is important, cost can be important, especially in high-volume production in price-sensitive markets. Heat detachable tapes may be more costly than conventional adhesive tapes and present a challenge to broader usage in some applications.

2. Limitations of Performance in Extreme Temperatures: Although the temperature range of operation of heat detachable tapes continues to enhance, extreme low or high temperatures are still the cause of certain limitations in the stability of adhesion and clean release, restraining their application in some harsh environments.

3. Ensuring Consistent and Reliable Release: It can be technically demanding to achieve consistent and reliable clean release on a variety of substrates and under diverse heating conditions. Inconsistent release can cause residue or damage, preventing the mass adoption of heat detachable tapes in important applications.

The heat detachable tape market is boosted by increasing needs of the electronics and auto industries for temporary and clean bonding solutions, backed by developments in adhesive technology. Challenges of cost sensitivity, performance at extreme temperatures, and maintaining consistent release, however, have to be overcome for the market to achieve its true potential over a wider range of applications.

List of Heat Detachable Tape Companies

• Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, heat detachable tape companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the heat detachable tape companies profiled in this report include:
• Nitto Denko
• Semiconductor Equipment
• NDS
• Mitsui Chemicals
• Nitta Corporation
• Solar Plus Company
• DSK Technologies
• Force-One Applied Materials
• 3M
• Taiwan Gilliontec

Heat Detachable Tape Market by Segment

The study includes a forecast for the global heat detachable tape market by type, application, and region.

Heat Detachable Tape Market by Type [Value from 2019 to 2031]:

• Single-Sided Tape
• Double-Sided Tape

Heat Detachable Tape Market by Application [Value from 2019 to 2031]:

• Semiconductor Manufacturing
• Electronics Assembly
• Automotive
• Others

Heat Detachable Tape Market by Region [Value from 2019 to 2031]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Heat Detachable Tape Market

The recent trends in the heat detachable tape market in the United States, China, Germany, India, and Japan are marked by growing demand from electronics production, especially for temporary bonding in wafer dicing of semiconductors, IC packaging, and assembly of flexible electronics. These tapes possess the key benefit of clean release when heated without causing damage to sensitive components. The market is also being driven by advances in adhesive technology, increasing complexity of electronic devices to be temporarily fixed, and the use by the automotive industry of greater volumes of temporary tapes in painting and assembly applications. Environmental regulations promoting residue-free removal are also taking effect.

• United States: The US market for detachable tapes used for heat is led by a robust electronics manufacturing industry, with semiconductors and advanced packaging. Some of the new developments involve the introduction of tapes with greater adhesion strength during processing and cleaner release at lower temperatures. There is also increased demand for tapes suited for automated assembly lines and tighter quality control practices in electronics manufacturing.
• China: China's huge electronics production base makes it an important market for heat removable tapes. Recent trends have seen the fast expansion of local tape producers providing more cost-effective solutions. There is also a growing emphasis on creating high-performance tapes that can satisfy the stringent needs of advanced semiconductor packaging and flexible display production.
• Germany: The automotive and industrial sectors are drivers of Germany's heat detachable tape market. Notably, the use of such tapes is being increasingly adopted for masking and temporary fixation in automotive painting and assembly operations. Highly temperature-resistant tapes with residue-free removal are high priorities to provide high-quality finishes and maximum manufacturing efficiency.
• India: India's electronics manufacturing base is growing, providing an emerging market for heat detachable tapes. Recent trends include rising consciousness of the value of these tapes in enhancing manufacturing efficiency and cutting rework in electronics assembly. There is also price sensitivity within the market, fueling demand for cost-efficient but dependable heat detachable tape solutions.
• Japan: Japan's semiconductor and advanced electronics sectors are major users of high-performance heat removable tapes. Recent advances have seen an emphasis on ultra-clean release tapes to avoid contamination of sensitive electronic devices.

Features of the Global Heat Detachable Tape Market

• Market Size Estimates: Heat detachable tape market size estimation in terms of value ($B).
• Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.
• Segmentation Analysis: Heat detachable tape market size by type, application, and region in terms of value ($B).
• Regional Analysis: Heat detachable tape market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
• Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the heat detachable tape market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape of the heat detachable tape market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

This report answers the following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the heat detachable tape market by type (single-sided tape and double-sided tape), application (semiconductor manufacturing, electronics assembly, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Market Overview

• 2.1 Background and Classifications
• 2.2 Supply Chain

3. Market Trends & Forecast Analysis

• 3.1 Macroeconomic Trends and Forecasts
• 3.2 Industry Drivers and Challenges
• 3.3 PESTLE Analysis
• 3.4 Patent Analysis
• 3.5 Regulatory Environment

4. Global Heat Detachable Tape Market by Type

• 4.1 Overview
• 4.2 Attractiveness Analysis by Type
• 4.3 Single-Sided Tape: Trends and Forecast (2019-2031)
• 4.4 Double-Sided Tape: Trends and Forecast (2019-2031)

5. Global Heat Detachable Tape Market by Application

• 5.1 Overview
• 5.2 Attractiveness Analysis by Application
• 5.3 Semiconductor Manufacturing: Trends and Forecast (2019-2031)
• 5.4 Electronics Assembly: Trends and Forecast (2019-2031)
• 5.5 Automotive: Trends and Forecast (2019-2031)
• 5.6 Others: Trends and Forecast (2019-2031)

6. Regional Analysis

• 6.1 Overview
• 6.2 Global Heat Detachable Tape Market by Region

7. North American Heat Detachable Tape Market

• 7.1 Overview
• 7.2 North American Heat Detachable Tape Market by Type
• 7.3 North American Heat Detachable Tape Market by Application
• 7.4 United States Heat Detachable Tape Market
• 7.5 Mexican Heat Detachable Tape Market
• 7.6 Canadian Heat Detachable Tape Market

8. European Heat Detachable Tape Market

• 8.1 Overview
• 8.2 European Heat Detachable Tape Market by Type
• 8.3 European Heat Detachable Tape Market by Application
• 8.4 German Heat Detachable Tape Market
• 8.5 French Heat Detachable Tape Market
• 8.6 Spanish Heat Detachable Tape Market
• 8.7 Italian Heat Detachable Tape Market
• 8.8 United Kingdom Heat Detachable Tape Market

9. APAC Heat Detachable Tape Market

• 9.1 Overview
• 9.2 APAC Heat Detachable Tape Market by Type
• 9.3 APAC Heat Detachable Tape Market by Application
• 9.4 Japanese Heat Detachable Tape Market
• 9.5 Indian Heat Detachable Tape Market
• 9.6 Chinese Heat Detachable Tape Market
• 9.7 South Korean Heat Detachable Tape Market
• 9.8 Indonesian Heat Detachable Tape Market

10. ROW Heat Detachable Tape Market

• 10.1 Overview
• 10.2 ROW Heat Detachable Tape Market by Type
• 10.3 ROW Heat Detachable Tape Market by Application
• 10.4 Middle Eastern Heat Detachable Tape Market
• 10.5 South American Heat Detachable Tape Market
• 10.6 African Heat Detachable Tape Market

11. Competitor Analysis

• 11.1 Product Portfolio Analysis
• 11.2 Operational Integration
• 11.3 Porter's Five Forces Analysis
  • Competitive Rivalry
  • Bargaining Power of Buyers
  • Bargaining Power of Suppliers
  • Threat of Substitutes
  • Threat of New Entrants
• 11.4 Market Share Analysis

12. Opportunities & Strategic Analysis

• 12.1 Value Chain Analysis
• 12.2 Growth Opportunity Analysis
  • 12.2.1 Growth Opportunities by Type
  • 12.2.2 Growth Opportunities by Application
• 12.3 Emerging Trends in the Global Heat Detachable Tape Market
• 12.4 Strategic Analysis
  • 12.4.1 New Product Development
  • 12.4.2 Certification and Licensing
  • 12.4.3 Mergers, Acquisitions, Agreements, Collaborations, and Joint Ventures

13. Company Profiles of the Leading Players Across the Value Chain

• 13.1 Competitive Analysis
• 13.2 Nitto Denko
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.3 Semiconductor Equipment
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.4 NDS
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.5 Mitsui Chemicals
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.6 Nitta Corporation
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.7 Solar Plus Company
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.8 DSK Technologies
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.9 Force-One Applied Materials
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.10 3M
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 13.11 Taiwan Gilliontec
  • Company Overview
  • Heat Detachable Tape Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing

14. Appendix

• 14.1 List of Figures
• 14.2 List of Tables
• 14.3 Research Methodology
• 14.4 Disclaimer
• 14.5 Copyright
• 14.6 Abbreviations and Technical Units
• 14.7 About Us
• 14.8 Contact Us