한글목차

무선 접속 칩셋의 동향과 예측

세계의 무선 접속 칩셋 시장은 2024-2030년 CAGR 7.8%로, 2030년까지 추정 128억 달러에 달할 것으로 예상되고 있습니다. 이 시장의 주요 촉진요인은 고속 인터넷의 보급 확대, 자동차 업계에서 접속 수요의 증대, 무선 네트워크 기술의 진보에 수반하는 스마트홈 자동화의 인기 증가입니다. 세계의 무선 접속 칩셋 시장의 미래는 소비자, 기업, 모바일 핸드셋, 자동차, 산업 시장에서의 기회로 유망해 보입니다.

무선 접속 칩셋 시장 인사이트

Lucintel은 예측 기간 중에도 Wi-Fi 스탠드얼론이 최대 부문을 유지할 것으로 예측하고 있습니다. 다양한 업계에서 디지털화가 진행되며 경쟁력을 유지하고, 생산성을 향상시키며 우수한 고객 경험을 제공하기 위해 디지털 테크놀러지의 채택이 증가 합니다.

아시아태평양은 인터넷 서비스의 수요 증가, 5G 스마트폰의 가용성과 비용의 상승, 그리고 이 지역의 도시와 지방 양측에서 스마트폰의 급속한 보급에 의해 예측 기간 중 최고의 성장을 달성할 것으로 예상되고 있습니다.

자주 묻는 질문

Q.1 무선 접속 칩셋 시장 규모는?

A1.세계의 무선 접속 칩셋 시장은 2030년까지 추정 128억 달러에 달할 것으로 예상되고 있습니다.

Q.2 무선 접속 칩셋 시장의 성장 예측은?

A2.세계의 무선 접속 칩셋 시장은 2024-2030년 7.8%의 CAGR로 성장할 것으로 예상되고 있습니다.

Q.3 무선 접속 칩셋 시장의 성장에 영향을 미치는 주요 요인은 무엇인가?

A3.이 시장의 주요 촉진요인은 고속 인터넷의 보급 확대, 자동차 업계에서 접속 수요의 증대, 무선 네트워크 기술의 진보에 수반하는 스마트홈 자동화의 인기 증가입니다.

Q4.시장의 주요 부문은?

A4.세계의 무선 접속 칩셋 시장의 미래는 소비자, 기업, 모바일 핸드셋, 자동차, 산업 시장에서의 기회로 유망해 보입니다.

Q5.시장의 주요 기업은?

A5.주요 무선 접속 칩셋 회사의 일부는 다음과 같습니다.

• Broadcom
• Qualcomm Incorporated
• Mediatek
• Intel Corporation
• Texas Instruments Incorporated
• STMicroelectronics
• NXP Semiconductors
• On Semiconductor Corporation
• Infineon Technologies
• Microchip Technology

Q6.향후 최대가 되는 시장 부문은?

A6.Lucintel은 예측 기간 중에도 Wi-Fi 스탠드얼론이 최대 부문을 유지할 것으로 예측하고 있습니다. 다양한 업계에서 디지털화가 진행되며 경쟁력을 유지하고, 생산성을 향상시키며 우수한 고객 경험을 제공하기 위해 디지털 테크놀러지의 채택이 증가 합니다.

Q7.시장에서 향후 5년간 최대가 될 것으로 예상되는 지역은?

A7. 아시아태평양은 인터넷 서비스의 수요 증가, 5G 스마트폰의 가용성과 비용의 상승, 그리고 이 지역의 도시와 지방 양측에서 스마트폰의 급속한 보급에 의해 예측 기간 중 최고의 성장을 달성할 것으로 예상되고 있습니다.

Q8.리포트의 커스터마이즈는 가능한가?

A8.네, Lucintel은 추가 비용 없이 10%의 커스터마이즈를 제공합니다.

목차

제1장 주요 요약

제2장 세계의 무선 접속 칩셋 시장 : 시장 역학

• 서론, 배경, 분류
• 공급망
• 업계의 촉진요인과 과제

제3장 2018-2030년의 시장 동향과 예측 분석

• 거시경제 동향(2018-2023년)과 예측(2024-2030년)
• 세계의 무선 접속 칩셋 시장 동향(2018-2023년)과 예측(2024-2030년)
• 유형별 세계 무선 접속 칩셋 시장
  • Wi-Fi 스탠드얼론
  • Bluetooth 스탠드얼론
  • Wi-Fi와 Bluetooth 콤보
  • 저소비전력 무선 IC
• 최종 사용별 세계 무선 접속 칩셋 시장
  • 소비자
  • 기업
  • 모바일 핸드셋
  • 자동차
  • 산업용
  • 기타

제4장 2018-2030년의 지역별 시장 동향과 예측 분석

• 지역별 세계의 무선 접속 칩셋 시장
• 북미의 무선 접속 칩셋 시장
• 유럽의 무선 접속 칩셋 시장
• 아시아태평양의 무선 접속 칩셋 시장
• 기타 지역의 무선 접속 칩셋 시장

제5장 경쟁 분석

• 제품 포트폴리오 분석
• 운영상 통합
• Porter's Five Forces 분석

제6장 성장 기회와 전략적 분석

• 성장 기회 분석
  • 유형별 세계 무선 접속 칩셋 시장의 성장 기회
  • 최종 사용별 세계 무선 접속 칩셋 시장의 성장 기회
  • 지역별 세계의 무선 접속 칩셋 시장의 성장 기회
• 세계의 무선 접속 칩셋 시장의 새로운 동향
• 전략적 분석
  • 신제품 개발
  • 세계의 무선 접속 칩셋 시장 용량 확대
  • 세계의 무선 접속 칩셋 시장에서의 합병, 인수, 합병사업
  • 인증과 라이선싱

제7장 유력 기업의 기업 개요

• Broadcom
• Qualcomm Incorporated
• Mediatek
• Intel Corporation
• Texas Instruments Incorporated
• STMicroelectronics
• NXP Semiconductors
• On Semiconductor Corporation
• Infineon Technologies
• Microchip Technology

영문목차

Wireless Connectivity Chipset Trends and Forecast

The future of the global wireless connectivity chipset market looks promising with opportunities in the consumer, enterprise, mobile handsets, automotive, and industrial markets. The global wireless connectivity chipset market is expected to reach an estimated $12.8 billion by 2030 with a CAGR of 7.8% from 2024 to 2030. The major drivers for this market are growing penetration of high-speed internet, increasing demands for connectivity in the automobile industry and the growing popularity of smart home automation, along with the advancement of wireless network technologies.

A more than 150-page report is developed to help in your business decisions.

Wireless Connectivity Chipset by Segment

The study includes a forecast for the global wireless connectivity chipset by type, end use, and region.

Wireless Connectivity Chipset Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Wi-Fi Standalone
• Bluetooth Standalone
• Wi-Fi and Bluetooth Combo
• Low-Power Wireless Ic

Wireless Connectivity Chipset Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

• Consumer
• Enterprise
• Mobile Handsets
• Automotive
• Industrial
• Others

Wireless Connectivity Chipset Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Wireless Connectivity Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies wireless connectivity chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the wireless connectivity chipset companies profiled in this report include-

• Broadcom
• Qualcomm Incorporated
• Mediatek
• Intel Corporation
• Texas Instruments Incorporated
• STMicroelectronics
• NXP Semiconductors
• On Semiconductor Corporation
• Infineon Technologies
• Microchip Technology

Wireless Connectivity Chipset Market Insights

Lucintel forecasts that Wi-Fi standalone will remain the largest segment over the forecast period growing digitalization across various industries, as well as, growing adoption of digital technology in order to maintain competitiveness, boost productivity, and provide superior customer experiences.

APAC is expected to witness highest growth over the forecast period because of growing demand for internet services, rising 5G smartphone availability and cost, as well as the quick uptake of smartphones in both urban and rural locations in the region.

Features of the Global Wireless Connectivity Chipset Market

Market Size Estimates: Wireless connectivity chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Wireless connectivity chipset market size by type, end use, and region in terms of value ($B).

Regional Analysis: Wireless connectivity chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, end use, and regions for the wireless connectivity chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the wireless connectivity chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the wireless connectivity chipset market size?

Answer: The global wireless connectivity chipset market is expected to reach an estimated $12.8 billion by 2030.

Q.2 What is the growth forecast for wireless connectivity chipset market?

Answer: The global wireless connectivity chipset market is expected to grow with a CAGR of 7.8% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the wireless connectivity chipset market?

Answer: The major drivers for this market are growing penetration of high-speed internet, increasing demands for connectivity in the automobile industry and the growing popularity of smart home automation, along with the advancement of wireless network technologies.

Q4. What are the major segments for wireless connectivity chipset market?

Answer: The future of the global wireless connectivity chipset market looks promising with opportunities in the consumer, enterprise, mobile handsets, automotive, and industrial markets.

Q5. Who are the key wireless connectivity chipset market companies?

Answer: Some of the key wireless connectivity chipset companies are as follows.

• Broadcom
• Qualcomm Incorporated
• Mediatek
• Intel Corporation
• Texas Instruments Incorporated
• STMicroelectronics
• NXP Semiconductors
• On Semiconductor Corporation
• Infineon Technologies
• Microchip Technology

Q6. Which wireless connectivity chipset market segment will be the largest in future?

Answer: Lucintel forecasts that Wi-Fi standalone will remain the largest segment over the forecast period growing digitalization across various industries, as well as, growing adoption of digital technology in order to maintain competitiveness, boost productivity, and provide superior customer experiences.

Q7. In wireless connectivity chipset market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because of growing demand for internet services, rising 5G smartphone availability and cost, as well as the quick uptake of smartphones in both urban and rural locations in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the wireless connectivity chipset market by type (Wi-Fi standalone, bluetooth standalone, Wi-Fi and bluetooth combo, low-power wireless IC), end use (consumer, enterprise, mobile handsets, automotive, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Wireless Connectivity Chipset Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Wireless Connectivity Chipset Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Wireless Connectivity Chipset Market by Type
  • 3.3.1: Wi-Fi Standalone
  • 3.3.2: Bluetooth Standalone
  • 3.3.3: Wi-Fi and Bluetooth Combo
  • 3.3.4: Low-power Wireless IC
• 3.4: Global Wireless Connectivity Chipset Market by End Use
  • 3.4.1: Consumer
  • 3.4.2: Enterprise
  • 3.4.3: Mobile Handsets
  • 3.4.4: Automotive
  • 3.4.5: Industrial
  • 3.4.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Wireless Connectivity Chipset Market by Region
• 4.2: North American Wireless Connectivity Chipset Market
  • 4.2.2: North American Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
• 4.3: European Wireless Connectivity Chipset Market
  • 4.3.1: European Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
  • 4.3.2: European Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
• 4.4: APAC Wireless Connectivity Chipset Market
  • 4.4.1: APAC Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
  • 4.4.2: APAC Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
• 4.5: ROW Wireless Connectivity Chipset Market
  • 4.5.1: ROW Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
  • 4.5.2: ROW Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Wireless Connectivity Chipset Market by Type
  • 6.1.2: Growth Opportunities for the Global Wireless Connectivity Chipset Market by End Use
  • 6.1.3: Growth Opportunities for the Global Wireless Connectivity Chipset Market by Region
• 6.2: Emerging Trends in the Global Wireless Connectivity Chipset Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Wireless Connectivity Chipset Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Wireless Connectivity Chipset Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Broadcom
• 7.2: Qualcomm Incorporated
• 7.3: Mediatek
• 7.4: Intel Corporation
• 7.5: Texas Instruments Incorporated
• 7.6: STMicroelectronics
• 7.7: NXP Semiconductors
• 7.8: On Semiconductor Corporation
• 7.9: Infineon Technologies
• 7.10: Microchip Technology