[시장보고서]반도체 드라이 스트립 장비 시장

반도체 드라이 스트립 장비 시장 - 예측(2026-2031년)

Semiconductor Dry Strip Equipment Market - Forecast from 2026 to 2031

상품코드 : 1918042

리서치사 : Knowledge Sourcing Intelligence

발행일 : 2026년 01월

페이지 정보 : 영문 140 Pages

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한글목차

샘플 요청 목록에 추가

반도체 드라이 스트립 장비 시장은 2025년 2억 8,337만 달러에서 2031년에는 3억 6,433만 6,000달러에 달하고, CAGR 4.28%로 성장할 것으로 예측됩니다.

반도체 드라이 스트립 시스템은 플라즈마 기반 공정을 통해 중요한 포토레지스트 및 에칭 후 잔류물을 제거하여 습식 화학 공정이 더 이상 적용되지 않는 섬세한 FEOL(Front End of Line) 및 BEOL(Back End of Line) 구조를 보호합니다. 보호합니다. 디바이스의 미세화, 새로운 채널 재료의 등장, 3D 구조의 보급에 따라 이러한 장비는 필수 불가결한 요소로 자리 잡고 있습니다. 주요 수요는 7nm 이하 노드에서 웨이퍼를 처리하는 로직 파운드리, 메모리 제조업체, 파워 디바이스 제조업체, 그리고 와이드 밴드갭 화합물 반도체의 빠른 스케일업에서 비롯됩니다.

주요 성장 요인

1. 세계 반도체 팹 생산능력 급증 로직, DRAM, 3D NAND, 파운드리 서비스의 지속적인 양산 확대는 웨이퍼 생산량 증가와 웨이퍼당 드라이스트립 공정 수 증가와 직결됩니다. 5G 인프라, 엣지 AI, 자동차 전장, 고성능 컴퓨팅의 병렬적 확장은 스트립 챔버의 전 공정 집중화를 지속적으로 추진하고 있습니다.

2. 멈추지 않는 소자 복잡성 및 미세화 GAA(Gate All Around) 나노 시트, CFET 아키텍처, 후면 공급, 첨단 패키징 기술은 스트립 사이클 수를 극적으로 증가시키는 동시에 원자 수준의 선택성 요구 사항을 부과합니다. 드라이 스트립 장비는 고유전율 절연체, 저유전율 재료, 신규 채널 반도체 재료의 열화 없이 손상 없는 폴리머 제거와 잔류물 없는 표면을 실현해야 합니다.

영문목차

Semiconductor Dry Strip Equipment Market is expected to grow at a 4.28% CAGR, achieving USD 364.336 million in 2031 from USD 283.370 million in 2025.

emiconductor dry strip systems perform critical photoresist and post-etch residue removal through plasma-based processes, preserving delicate front-end-of-line (FEOL) and back-end-of-line (BEOL) structures where wet chemistry is no longer viable. These tools have become indispensable as device geometries shrink, new channel materials emerge, and 3D architectures proliferate. Primary demand originates from logic foundries, memory manufacturers, and power-device fabricators processing wafers at <=7 nm nodes and below, alongside the rapid scale-up of wide-bandgap compound semiconductors.

Core Growth Drivers

1. Surging global semiconductor fab capacity Sustained volume expansion across logic, DRAM, 3D NAND, and foundry services directly correlates with higher wafer starts and increased dry-strip processing steps per wafer. The parallel ramp of 5G infrastructure, edge AI, automotive electronics, and high-performance computing continues to drive front-end loading of strip chambers.

2. Relentless device complexity and miniaturization Gate-all-around (GAA) nanosheets, CFET architectures, backside power delivery, and advanced packaging schemes dramatically increase the number of strip cycles while imposing atomic-level selectivity requirements. Dry strip tools must deliver damage-free polymer removal and residue-free surfaces without degrading high-k dielectrics, low-k materials, or novel channel semiconductors.

Fastest-Growing Segments

The compound semiconductor segment is the most dynamic portion of the dry strip equipment market:

Gallium Nitride (GaN): Accelerated adoption in RF front-end modules, fast chargers, and electric-vehicle traction inverters requires dedicated strip recipes that prevent surface pitting and gallium re-deposition. Specialized downstream plasma systems optimized for GaN-on-Si, GaN-on-SiC, and GaN-on-sapphire are seeing the strongest unit growth.
Silicon Carbide (SiC): The shift to 150 mm and 200 mm SiC platforms for 800 V+ EV powertrains and renewable-energy inverters demands robust high-temperature implant strip and post-etch cleaning processes that maintain basal plane integrity and minimize micro-pipe propagation.

Regional Dynamics

Asia-Pacific maintains overwhelming dominance, accounting for the majority of installed base and new tool shipments. Taiwan, South Korea, and Japan benefit from massive logic, memory, and power-device investments, reinforced by aggressive national semiconductor initiatives:

South Korea's Semiconductor Industry Promotion Plan
Japan's Rebirth of Japan's Electronics Industry strategy
Taiwan's continuing foundry and memory megafab expansions

These programs channel subsidies, tax incentives, and R&D funding directly into advanced-node and compound-semiconductor capacity, ensuring sustained pull-through demand for next-generation dry strip platforms.

North America retains a strategic position through design leadership and early adoption of advanced packaging and GAA technologies at Intel, AMD, and Qualcomm, but lags in raw manufacturing footprint.

Key Equipment Platforms

Lam Research GAMMA(R) family: Remains the volume leader for logic and memory with differentiated downstream microwave plasma technology offering high throughput, residue-free performance, and minimal device impact at advanced nodes.
Kao CLEANTHROUGH A-06 & A-19: Specialty chemical dry-film strippers targeting back-end photoresist removal with emphasis on speed (A-06) and amine-free environmental compliance (A-19).

Market Constraints

High system cost, extreme selectivity challenges with new materials (e.g., ruthenium, molybdenum, EUV resists), and the intrinsic cyclicality of semiconductor capex continue to moderate growth velocity despite strong underlying wafer-fab-equipment (WFE) intensity trends.

The confluence of logic/memory node scaling and the structural rise of GaN and SiC devices nevertheless positions semiconductor dry strip equipment for sustained mid-to-high single-digit annual growth, with compound-semiconductor-specific systems exhibiting the highest incremental demand through the remainder of the decade.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2021 to 2025 & forecast data from 2026 to 2031
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information), and Key Developments among others.

Semiconductor Dry Strip Equipment Market Segmentation:

By Semiconductor Type
Element Semiconductor
Compound Semiconductor
By Technology
Plasma Strip
Gas-Phased Reaction
By Application
Power Semiconductors
MEMS
CMOS Image Sensors
Others
By Geography
Americas
USA
Europe Middle East and Africa
Germany
France
United Kingdom
Others
Asia Pacific
China
Japan
South Korea
Taiwan
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study
2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY SEMICONDUCTOR TYPE

5.1. Introduction
5.2. Element Semiconductor
5.3. Compound Semiconductor

6. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY TECHNOLOGY

6.1. Introduction
6.2. Plasma Strip
6.3. Gas-Phased Reaction

7. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY APPLICATION

7.1. Introduction
7.2. Power Semiconductors
7.3. MEMS
7.4. CMOS Image Sensors
7.5. Others

8. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY GEOGRAPHY

8.1. Introduction
8.2. Americas
- 8.2.1. USA
8.3. Europe Middle East and Africa
- 8.3.1. Germany
- 8.3.2. France
- 8.3.3. United Kingdom
- 8.3.4. Others
8.4. Asia Pacific
- 8.4.1. China
- 8.4.2. Japan
- 8.4.3. South Korea
- 8.4.4. Taiwan
- 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis
9.2. Market Share Analysis
9.3. Mergers, Acquisitions, Agreements, and Collaborations
9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. Applied Materials Inc.
10.2. Axcelis Technologies Inc.
10.3. PSK Holdings Inc.
10.4. Lam Research Corporation
10.5. Mattson Technology Inc.
10.6. Tokyo Electron Limited
10.7. Grand Process Technology Co., Ltd.
10.8. Samco Inc.
10.9. ULVAC Inc.

11. APPENDIX

11.1. Currency
11.2. Assumptions
11.3. Base and Forecast Years Timeline
11.4. Key Benefits for the Stakeholders
11.5. Research Methodology
11.6. Abbreviations

LIST OF TABLE

한글목차

목차

제1장 주요 요약

제2장 시장 현황

제3장 비즈니스 상황

제4장 기술 전망

제5장 반도체 드라이 스트립 장비 시장 : 반도체 종류별

제6장 반도체 드라이 스트립 장비 시장 : 기술별

제7장 반도체 드라이 스트립 장비 시장 : 용도별

제8장 반도체 드라이 스트립 장비 시장 : 지역별

제9장 경쟁 환경과 분석

제10장 기업 개요

제11장 부록